31.080.99 - Other semiconductor devices
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Other semiconductor devices
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IEC 62047-48:2024 specifies the requirements and testing method to determine the solution concentration by optical absorption using MEMS fluidic device.
- Standard16 pagesEnglish languagesale 15% off
IEC 63203-402-2:2024 specifies test methods for measuring and evaluating the performance, reliability, and accuracy of the step counting feature in any wearable device that can count steps (e.g. activity and fitness trackers, smart bands, smart shoes, and smart insoles).
These standard test methods exclude the evaluation of data associated with travel distance or calorie consumption.
- Standard21 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62047-43:2024 specifies the test method of electrical characteristics after cyclic bending deformation for flexible electromechanical devices. These devices include passive micro components and active micro components on the flexible film or embedded in the flexible film. The desired in-plane dimensions of the device for the test method ranges typically from 1 mm to 300 mm and the thickness ranges from 10 μm to 1 mm, but these are not limiting values. The test method is so designed as to understand and further visualize the entire performance deterioration behaviour after cyclic bending deformation in a concept of 3D (P-S-N: Performance - Severity of bending - Number of cycles) plot over the loading space of severity of bending and number of repeated cycles. This document is essential to estimate safety margin over the operation period under a certain level of cyclic bending deformation and indispensable for reliable design of the product employing these devices.
- Standard18 pagesEnglish languagesale 15% off
IEC 63203-402-3:2024 specifies terms, a measurement protocol, and a test to evaluate the accuracy of wearables that measure heart rate with a photoplethysmography (PPG) sensor. While this document can be used to measure a variety of different devices claiming to report heart rate, care will be taken when testing in countries that differentiate between heart rate and pulse rate. This measurement protocol is not intended to evaluate medical devices associated with the IEC 60601 series or ISO 80601 series.
- Standard19 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62047-44:2024 describes terminology, definitions and test methods that are used to evaluate and determine the dynamic performance of MEMS (Micro-Electromechanical Systems) resonant electric‑field‑sensitive devices. It also specifies sample requirements and test equipment for dynamic performances of MEMS resonant electric‑field‑sensitive devices. The statements made in this document are also applicable to MEMS resonant electric‑field‑sensitive devices with various driving mechanisms such as electrostatic, electrothermal, electromagnetic, piezoelectric, etc.
- Standard19 pagesEnglish languagesale 15% off
IEC 60747-5-16:2023 specifies the measuring method of flat-band voltage of single GaN-based light emitting diode (LED) die or package without phosphor, based on the photocurrent (PC) spectroscopy. White LEDs for lighting applications are out of the scope of this part of IEC 60747.
- Standard17 pagesEnglish languagesale 15% off
IEC 60747-18-5:2023(E) specifies the evaluation method for light responsivity characteristics of lens-free CMOS photonic array sensor package modules by incident angle of light. This document includes the test setup, test procedure, test item, and test report for lens-free CMOS photonic array sensor package modules.
- Standard12 pagesEnglish languagesale 15% off
IEC 60747-18-4:2023(E) specifies the evaluation method for noise characteristics of lens-free CMOS photonic array sensors. This document includes the measurement setup, test procedure, test items, evaluation method, and test report for noise characteristics of lens-free CMOS photonic array sensors.
- Standard14 pagesEnglish languagesale 15% off
This part of IEC 63364-1 provides terms, test method, and report of sound variation detection system based on IoT. It provides the evaluation method for each part of the sound variation detection system based on IoT in the block diagram, the characterization parameters, symbols, test setups and the conditions. In addition, this document defines the configuration items and criteria of standard space and firing situation for the quality evaluation measurement of sound field variation detection system with IoT.
- Standard14 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62951-8:2023 (E) defines terms and specifies the test method for evaluating the stretchability, flexibility, and stability of flexible resistive memory. The test method descriptions include experimental procedures and the equipment to be used. It also includes general requirements for test conditions such as the temperature and relative humidity of the testing environment. The test method described in this document focuses on stability evaluation rather than reliability.
- Standard14 pagesEnglish languagesale 15% off
This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit attenuators.
- Standard44 pagesEnglish languagesale 10% offe-Library read for1 day
This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit limiters.
- Standard39 pagesEnglish languagesale 10% offe-Library read for1 day
This part of IEC 63203-801 specifies low complexity Medium Access Control (MAC) for SmartBAN.
As the use of wearables and connected body sensor devices grows rapidly in the Internet of Things (IoT), Wireless Body Area Networks (BAN) facilitate the sharing of data in smart environments such as smart homes, smart life etc. In specific areas of digital healthcare, wireless connectivity between the edge computing device or hub coordinator and the sensing nodes requires a standardized communication interface and protocols.
The present document describes the MAC specifications:
- Channel Structure,
- MAC Frame Formats,
- MAC functions.
- Standard41 pagesEnglish languagesale 10% offe-Library read for1 day
This part of IEC 63203-801 specifies the ultra-low power physical layer (PHY) Smart BAN.
As the use of wearables and connected body sensor devices grows rapidly in the Internet of Things (IoT), Wireless Body Area Networks (BAN) facilitate the sharing of data in smart environments such as smart homes, smart life etc. In specific areas of digital healthcare, wireless connectivity between the edge computing device or hub coordinator and the sensing nodes requires a standardized communication interface and protocols.
The present document describes the Physical Layer (PHY) specifications:
- packet formats;
- modulation;
- forward error correction
- Standard16 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 63203-402-1:2022 specifies test methods for wearable glove-type motion sensors to measure finger movements. The measurement methods include goniometric parameters related to the finger postures and flexion dynamics. Glove-type motion sensors are the type of gloves considered within the scope of this document for testing and measurement. This document describes direct and indirect measurement methods. In the direct measurement method, the angles of the joints of each finger are directly measured by a goniometer. The indirect method uses a measurement device such as a servomotor-based angle-measuring device. This document is applicable to angle measurement of all gloves with glove-type motion sensors without limitation of the device technology or size.
- Standard18 pagesEnglish languagesale 10% offe-Library read for1 day
NEW!IEC 62031:2018 is available as IEC 62031:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62031:2018 specifies general and safety requirements for light-emitting diode (LED) modules: - non-integrated LED modules (LEDni modules) and semi-integrated LED modules (LEDsi modules) for operation under constant voltage, constant current or constant power; - Integrated LED modules (LEDi modules) for use on DC supplies up to 250 V or AC supplies up to 1 000 V at 50 Hz or 60 Hz. This second edition cancels and replaces the first edition published in 2008, Amendment 1:2012 and Amendment 2:2014. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a. the scope was clarified as well as the wording in several other clauses; b. the normative references were updated; c. the definitions for "replaceable LED module", "non-replaceable LED module" and "non-user replaceable LED module" were introduced while other definitions covered by IEC 62504 have been removed; d. the marking clause was restructured and a table added to provide an informative overview; e. the marking requirements for built-in LED modules were changed; f. the entry for the marking with the working voltage was revised; g. the provisions for terminals and heat management were revised; h. Annex B was deleted; i. information for luminaire design with regard to working voltage and water contact was introduced; j. an abnormal temperature test was introduced.
- Standard26 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62951-9:2022(E) specifies the test methods for evaluating the performance of unipolar-type one transistor one resistor (1T1R) resistive memory cells. The performance test methods in this document include read, forming, SET, RESET, endurance and retention. This document is applicable to flexible devices as well as rigid resistive memory devices without any limitations prone to device technology and size.
- Standard18 pagesEnglish languagesale 15% off
IEC 63364-1:2022 specifies terms, the test method, and the report of sound variation detection system based on IoT. It provides the evaluation method for each part of the sound variation detection system based on IoT in the block diagram, the characterization parameters, symbols, test setups and the conditions. In addition, this document defines the configuration items and criteria of standard space and firing situation for the quality evaluation measurement of sound field variation detection system with IoT.
- Standard24 pagesEnglish and French languagesale 15% off
IEC 60747-16-8:2022 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit limiters.
- Standard73 pagesEnglish and French languagesale 15% off
IEC 60747-16-7:2022 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit attenuators.
- Standard83 pagesEnglish and French languagesale 15% off
IEC TR 63357:2022(E) describes standardization roadmap of fault test methods for integrated circuits used in automotive vehicles. Since automotive vehicles are exposed in harsh environment such as very low or high temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment. There are several fault test methods and related issues to be standardized.
Semiconductor devices used in automotive vehicles are exposed in harsh environment of very high or very low temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment Evaluation results following this fault test methods will provide robustness of the semiconductor device.
- Technical report14 pagesEnglish languagesale 15% off
IEC 62047-42:2022 specifies measuring methods of electro-mechanical conversion characteristics of piezoelectric thin film on microcantilever, which is typical structure of actual micro sensors and micro actuators. In order to obtain actual and precise piezoelectric coefficient of the piezoelectric thin films with microdevice structures, and this document reports the schema to determine the characteristic parameters for consumer, industry or any other applications of piezoelectric devices. This document applies to piezoelectric thin films on microcantilever fabricated by MEMS process.
- Standard22 pagesEnglish languagesale 15% off
IEC 6074716-6:2019 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.
- Standard28 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 63068-4:2022(E) provides a procedure for identifying and evaluating defects in as-grown 4H-SiC (Silicon Carbide) homoepitaxial wafer by systematically combining two test methods of optical inspection and photoluminescence (PL). Additionally, this document exemplifies optical inspection and PL images to enable the detection and categorization of defects in SiC homoepitaxial wafers.
- Standard25 pagesEnglish languagesale 15% off
In general, dynamic ON-resistance testing is a measure of charge trapping phenomena in GaN power transistors. This publication describes the guidelines for testing dynamic ON-resistance of GaN lateral power transistor solutions. The test methods can be applied to the following:
a) GaN enhancement and depletion-mode discrete power devices [1]
b) GaN integrated power solutions
c) the above in wafer and package levels
Wafer level tests are recommended to minimize parasitic effects when performing high precision measurements. For package level tests, the impact of package thermal characteristics should be considered so as to minimize any device under test (DUT) self-heating implications.
The prescribed test methods may be used for device characterization, production testing, reliability evaluations and application assessments of GaN power conversion devices. This document is not intended to cover the underlying mechanisms of dynamic ON-resistance and its symbolic representation for product specifications.
- Standard16 pagesEnglish languagesale 10% offe-Library read for1 day
In general, dynamic ON-resistance testing is a measure of charge trapping phenomena in GaN power transistors. This publication describes the guidelines for testing dynamic ON-resistance of GaN lateral power transistor solutions. The test methods can be applied to the following: a) GaN enhancement and depletion-mode discrete power devices [1] b) GaN integrated power solutions c) the above in wafer and package levels Wafer level tests are recommended to minimize parasitic effects when performing high precision measurements. For package level tests, the impact of package thermal characteristics should be considered so as to minimize any device under test (DUT) self-heating implications. The prescribed test methods may be used for device characterization, production testing, reliability evaluations and application assessments of GaN power conversion devices. This document is not intended to cover the underlying mechanisms of dynamic ON-resistance and its symbolic representation for product specifications.
- Standard16 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 60747-5-14:2022(E) specifies the measuring method of the surface temperature of single LED die or package, based on the thermoreflectance (TR) method. TR is the effect that the reflectance of light changes with the temperature of a substance. This part measures relative change in the reflectance of light from a metal film deposited nearby on the metallurgical pn junction as the relative change in the LED junction temperature. The surface temperature can be approximated as the junction temperature when the thermal resistance effect between the metal surface and the pn junction is negligibly small.
- Standard21 pagesEnglish languagesale 15% off
IEC 63373:2022 In general, dynamic ON-resistance testing is a measure of charge trapping phenomena in GaN power transistors. IEC 63373:2022 provides guidelines for testing dynamic ON-resistance of GaN lateral power transistor solutions. The test methods can be applied to the following:
a) GaN enhancement and depletion-mode discrete power devices;
b) GaN integrated power solutions;
c) the above in wafer and package levels.
The prescribed test methods can be used for device characterization, production testing, reliability evaluations and application assessments of GaN power conversion devices. This document is not intended to cover the underlying mechanisms of dynamic ON-resistance and its symbolic representation for product specifications.
- Standard28 pagesEnglish and French languagesale 15% off
IEC 60747-5-15:2022(E) specifies the measuring methods of flat-band voltage of single GaN‑based light emitting diode (LED) die or package without phosphor, based on the electroreflectance (ER) spectroscopy. White LEDs for lighting applications are out of the scope of this part of IEC 60747-5.
- Standard14 pagesEnglish languagesale 15% off
2021-05-26: This A11 includes the updated Annexes ZA & ZZ, it will allow citation of EN IEC 62031:2020, published without the link to LVD directive
- Amendment4 pagesEnglish languagesale 10% offe-Library read for1 day
2021-05-26: This A11 includes the updated Annexes ZA & ZZ, it will allow citation of EN IEC 62031:2020, published without the link to LVD directive
- Amendment4 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 63244-1:2021 provides general requirements and specifications of the semiconductor devices for the performance and reliability evaluations of wireless power transfer and charging systems. For the performance evaluations, this part covers various characterization parameters and symbols, general system diagrams, and test setups and test conditions. This document also describes classifications of the wireless power transfer technologies.
- Standard37 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62830-8:2021(E) specifies terms, definitions, symbols, test, and evaluation methods used to determine the performance characteristics of flexible and stretchable supercapacitor for practical use in low power electronics such as energy storage devices for energy harvesting, flexible and stretchable electronics, low-power devices, IoT applications, etc. This document is applicable to all the flexible and stretchable supercapacitor for consumers and manufacturers, without any limitations of device technology and size.
- Standard36 pagesEnglish languagesale 15% off
IEC TR 60747-5-12:2021(E) discusses the terminology and the measuring methods of optoelectronic efficiencies of single light emitting diode (LED) chip or package without phosphor. White LEDs for lighting applications are out of the scope of this part.
This technical report provides guidance on
- terminology of optoelectronic efficiencies of single LED chip or package without phosphor, such as the power efficiency (PE), the external quantum efficiency (EQE), the voltage efficiency (VE), the light extraction efficiency (LEE), the internal quantum efficiency (IQE), the injection efficiency (IE), and the radiative efficiency (RE);
- test methods of optoelectronic efficiencies of the PE, the EQE, the VE, the LEE, and the IQE;
- review of various IQE measurement methods reported so far in view of accuracy and practical applicability;
- the measuring method of the LED IQE based on the temperature-dependent electroluminescence (TDEL);
- the measuring method of the LED IQE based on the room-temperature reference-point method (RTRM);
- the measuring method of the radiative and nonradiative currents of an LED;
- the relationship between the IQE and the VE, which leads to introduction of a new LED efficiency, the active efficiency (AE) as AE = VE × IQE.
- Technical report88 pagesEnglish languagesale 15% off
IEC 63244-1:2021 provides general requirements and specifications of the semiconductor devices for the performance and reliability evaluations of wireless power transfer and charging systems. For the performance evaluations, this part covers various characterization parameters and symbols, general system diagrams, and test setups and test conditions.
This document also describes classifications of the wireless power transfer technologies.
- Standard65 pagesEnglish and French languagesale 15% off
IEC 62047-40:2021(E) specifies the test conditions and methods of micro-electromechanical inertial shock switch threshold. This document applies to normally open micro-electromechanical inertial shock switch.
- Standard11 pagesEnglish languagesale 15% off
IEC 62969-4:2018 specifies a method of directly fault injection test for automotive semiconductor sensor interface that can be used to support the conformance assurance in the vehicle communications interface.
- Standard21 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 60747-5-6:2021 is available as IEC 60747-5-6:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60747-5-6:2021 specifies the terminology, the essential ratings and characteristics, the measuring methods and the quality evaluations of light emitting diodes (LEDs) for general industrial applications such as signals, controllers, sensors, etc.
LEDs for lighting applications are out of the scope of this part of IEC 60747.
LEDs are classified as follows:
- LED package;
- LED flat illuminator;
- LED numeric display and alpha-numeric display;
- LED dot-matrix display;
- infrared-emitting diode (IR LED);
- ultraviolet-emitting diode (UV LED).
LEDs with a heat spreader or having a terminal geometry that performs the function of a heat spreader are within the scope of this part of IEC 60747.
An integration of LEDs and controlgears, integrated LED modules, semi-integrated LED modules, integrated LED lamps or semi-integrated LED lamps, are out of the scope of this part of IEC 60747. This edition includes the following significant technical changes with respect to the previous edition:
- ultraviolet-emitting diodes (UV LED) and their related technical contents were added;
- power efficiency (ηPE) as part of electrical and optical characteristics were added;
- new measuring methods related to thermal resistance were added;
- hydrogen sulphide corrosion test was added to quality evaluation;
- some standards were added to the bibliography.
- Standard94 pagesEnglish languagesale 15% off
- Standard198 pagesEnglish languagesale 15% off
IEC 62047-38:2021(E) specifies a test method for measuring the adhesion strength of metal powder paste in the electrical interconnection between micro-electromechanical systems (MEMS) and a circuit board. The typical examples of metal powder paste are anisotropic conductive paste, solder paste, and nanoscale metallic inks. This testing method is valid for metal powder diameters from 10 µm and 500 µm.
In this test method, a uniaxial compression load is applied to metal powder paste using a glass lens simulating an actual MEMS device; then, the adhesion strength is measured by retracting the lens. This test method is proper when the adhesion strength should be analyzed by considering the actual contact area between the MEMS device and metal powder particles.
- Standard12 pagesEnglish languagesale 15% off
IEC 60747-5-13:2021 provides the accelerated test method to assess effects of the tarnishing of silver and silver alloys used for LED packages due to hydrogen sulphide. Particularly, this test method is intended to give information on silver and silver alloy tarnishing effects to the luminous/radiant flux maintenance of LED packages. Additionally, this test method can give information on electric performances of LED packages due to corrosion of silver and silver alloys.
The object of this test is to determine the influence of atmospheres containing hydrogen sulphide on parts of LED packages made of: silver or silver alloy; silver or silver alloy protected with another layer; other metals covered with silver or silver alloy.
Testing other degradations that are susceptible to affect luminous/radiant flux maintenance and/or electric performance (e.g. degradation of copper or silicone parts) is not the object of this test. This test might not be suitable as a general corrosion test, i.e. it might not predict the behaviour of flux and/or electric characteristics and connections in industrial atmospheres. This document is applicable to LED packages for lighting applications only if referenced by an IEC SC 34A document.
- Standard19 pagesEnglish languagesale 15% off
IEC 62047-41:2021 specifies the terminology, essential ratings and characteristics, and measuring methods of RF (Radio Frequency) MEMS (Micro-Electro-Mechanical Systems) circulators and isolators.
- Standard65 pagesEnglish and French languagesale 15% off
IEC 62969-3:2018 describes terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of mechanical shock driven piezoelectric energy harvesting devices for automotive vehicle sensor applications. This document is also applicable to energy harvesting devices for motorbikes, automobiles, buses, trucks and their respective engineering subsystems applications without any limitations of device technology and size.
- Standard27 pagesEnglish languagesale 10% offe-Library read for1 day
IEC TS 60747-19-2:2021 provides a guideline of indication of specifications of a low-power sensor being a device or a module allowing autonomous power supply operation, which contributes to the low-power design of a smart sensing unit. Here, the smart sensing unit comprises a smart sensor, a terminal module, and a power supply, which can send output data of the smart sensor to the outside. This part also provides a guideline of indication of specifications of the power supply to drive the smart sensor(s) in the smart sensing unit. Based on these, the three components of the smart sensing unit can be easily selected and combined from the point-of-view of newly designed, low-power, smart sensing units.
- Technical specification20 pagesEnglish languagesale 15% off
IEC 62969-2:2018 specifies procedures and definitions for measuring the efficiency of the wireless power transmission system for the automotive vehicles sensors. This document deals with the power range below 500 mW.
- Standard13 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 63229:2021(E) gives guidelines for the definition and classification of defects in GaN epitaxial film grown on SiC substrate. They are identified and described on the basis of examples, mainly by schematic illustrations, optical microscope images, and transmission electron microscope images for these defects. This document covers only defects in as-grown GaN epitaxial film on SiC substrate and does not include defects caused by subsequent processes.
- Standard21 pagesEnglish languagesale 15% off
IEC 62830-7:2021 defines terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of linear sliding mode triboelectric energy harvesting devices for practical use. This document is applicable to energy harvesting devices for consumer, general industries, military and aerospace applications without any limitations on device technology and size.
- Standard62 pagesEnglish and French languagesale 15% off
IEC Corrected Version
- Corrigendum3 pagesEnglish and French languagesale 10% offe-Library read for1 day
IEC 62830-5:2021 specifies the test method for measuring generated electric power from flexible thermoelectric devices under bending conditions. This document provides terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance of flexible thermoelectric devices. This document also describes the test conditions such as temperature, temperature difference, contact conditions, insulation and bending radius of flexible thermoelectric devices. This document is applicable to flexible energy harvesting devices for flexible semiconductor devices.
- Standard32 pagesEnglish and French languagesale 15% off
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IEC 62969-1:2017(E) provides general requirements for performance evaluations and environmental conditions for the power interface of automotive vehicle sensors. For performance evaluations, various electrical performances such as voltage drop from power source to automotive sensors, AC noises and voltage level are included. For environmental conditions, various test conditions such as temperature, humidity and vibration are included. In addition, terms, definitions, symbols and configurations are covered in this part.
- Standard20 pagesEnglish languagesale 10% offe-Library read for1 day
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