IEC 62047-42:2022

IEC 62047-42 ®
Edition 1.0 2022-09
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 42: Measurement methods of electro-mechanical conversion characteristics
of piezoelectric MEMS cantilever

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IEC 62047-42 ®
Edition 1.0 2022-09
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Micro-electromechanical devices –

Part 42: Measurement methods of electro-mechanical conversion characteristics

of piezoelectric MEMS cantilever

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-5714-2

– 2 – IEC 62047-42:2022 © IEC 2022
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test bed of MEMS piezoelectric thin film . 7
4.1 General . 7
4.2 Functional blocks and components . 9
4.2.1 General . 9
4.2.2 Displacement meter . 10
4.2.3 Power source . 10
4.2.4 Electric measurement instrument . 10
5 Microcantilever under testing . 11
5.1 General . 11
5.2 Measurement principle . 11
5.3 Measuring procedures of converse transverse piezoelectric coefficient . 12
5.4 Measuring procedures of direct transverse piezoelectric coefficient . 12
6 Test report . 13
Annex A (informative) Example of measuring method of piezoelectric MEMS cantilever . 15
A.1 General . 15
A.2 Measurement procedure . 15
A.2.1 Structure of piezoelectric microcantilevers . 15
A.2.2 Microfabrication process . 15
A.2.3 Mechanical properties of piezoelectric and non-piezoelectric layers . 16
A.2.4 Electric properties and resonance frequency of microcantilever . 17
A.2.5 Input displacement of microcantilever for direct piezoelectric coefficient
d
e . 18
31,f
A.3 Measurement results . 19
A.3.1 Converse piezoelectric measurement . 19
A.3.2 Direct piezoelectric measurement . 19
A.4 Test report . 20
Bibliography . 22

Figure 1 – Test bed of piezoelectric MEMS unimorph cantilever . 7
Figure 2 – Setup for measurement of converse piezoelectric effect . 9
Figure 3 – Setup for measurement of direct piezoelectric effect . 10
Figure A.1 – Structure and photograph of piezoelectric microcantilevers under testing. 15
Figure A.2 – Fabrication process of piezoelectric microcantilevers . 16
Figure A.3 – Frequency response of tip displacement of each piezoelectric

microcantilevers . 18
Figure A.4 – Tip displacement and converse piezoelectric coefficient as a function of
applied voltage . 19
Figure A.5 – Direct piezoelectric coefficient as a function of input tip displacement of
piezoelectric microcantilevers . 19

Table 1 – Symbols and designations of test bed . 8

Table A.1 – Mechanical properties of piezoelectric layer . 16
Table A.2 – Mechanical properties of non-piezoelectric layer . 17
Table A.3 – Electric properties of microcantilever . 17
Table A.4 – Resonance frequencies of microcantilever . 17
d
Table A.5 – Input displacement for direct piezoelectric coefficient e . 18
31,f
Table A.6 – Test report . 20

– 4 – IEC 62047-42:2022 © IEC 2022
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 42: Measurement methods of electro-mechanical conversion
characteristics of piezoelectric MEMS cantilever

FOREWORD
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IEC 62047-42 has been prepared by subcommittee 47F: Micro-electromechanical systems, of
IEC technical committee 47: Semiconductor devices. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
47F/414/FDIS 47F/417/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
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at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
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• reconfirmed,
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– 6 – IEC 62047-42:2022 © IEC 2022
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 42: Measurement methods of electro-mechanical conversion
characteristics of piezoelectric MEMS cantilever

1 Scope
This part of IEC 62047 specifies measuring methods of electro-mechanical conversion
characteristics of piezoelectric thin film on microcantilever, which is typical str
...