IEC 62047-43:2024

IEC 62047-43 ®
Edition 1.0 2024-03
INTERNATIONAL
STANDARD
Semiconductor devices – Micro-electromechanical devices –
Part 43: Test method of electrical characteristics after cyclic bending
deformation for flexible micro-electromechanical devices

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IEC 62047-43 ®
Edition 1.0 2024-03
INTERNATIONAL
STANDARD
Semiconductor devices – Micro-electromechanical devices –

Part 43: Test method of electrical characteristics after cyclic bending

deformation for flexible micro-electromechanical devices

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99  ISBN 978-2-8322-8498-8

– 2 – IEC 62047-43:2024 © IEC 2024
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test piece . 7
4.1 General . 7
4.2 Shape of a test piece . 7
5 Test method . 9
5.1 Principle . 9
5.2 Test apparatus and instrumentation . 10
5.2.1 Test apparatus . 10
5.2.2 Instrumentation . 10
5.3 Procedure . 11
5.3.1 Testing conditions . 11
5.3.2 Selection of bending direction . 11
5.3.3 Determination of bending axes . 12
5.3.4 Measurement of test piece dimensions . 12
5.3.5 Measurement of folding distance . 12
5.3.6 Number of testing . 12
5.3.7 Instrumentation . 13
5.3.8 End of testing . 13
6 Test report . 13
6.1 General . 13
6.2 Bending direction(s) and in-plane locations of bending axes . 13
6.3 Dimensions of the test piece . 13
6.4 Performance degradation characteristics with the folding distance . 14
6.5 Testing conditions . 14
Annex A (informative) Example of P-S-N plot of flexible MEMS device . 16

Figure 1 – Schematic explanation of cyclic bending test . 7
Figure 2 – Schematic illustration of flexible MEMS test piece . 8
Figure 3 – Selection of bending axis . 9
Figure 4 – Folding procedures . 10
Figure 5 – 3-dimensional P-S-N plot . 14
Figure A.1 – Test piece – Printed wiring on paper substrate. 17
Figure A.2 – Test apparatus . 17
Figure A.3 – 3-dimensional P-S-N plot . 18
Figure A.4 – 2-dimensional P-S-N plot . 18

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 43: Test method of electrical characteristics after cyclic bending
deformation for flexible micro-electromechanical devices

FOREWORD
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IEC 62047-43 has been prepared by subcommittee 47F: Micro-electromechanical devices, of
IEC technical committee 47: Semiconductor devices. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
47F/459/FDIS 47F/464/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
– 4 – IEC 62047-43:2024 © IEC 2024
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
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devices – Micro-electromechanical devices, can be found on the IEC website.
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INTRODUCTION
In the recent trend toward ubiquitous sensor society and the world of internet of things, demand
and thus the market for softer electronic devices are quickly expanding. That is what flexible
micro-electromechanical devices are for, some of which are already released into the market.
Even a so-called foldable device is under development and will soon appear in the market.
However, to operate trillions of such devices for the comfort and safety of human beings, the
reliability of the individual devices is a critical concern. Especially in the case of flexible devices,
robustness against bending deformation is an important issue which will be shared among all
the producers and users of such devices. In addition, since such devices are bent usually not
only once but some numbers of cycles, information on performance deterioration along with the
number of cycles is also important.
In order to understand how safe a situation is, even after numbers of cycles, performance
deterioration behaviour of those devices
...