IEC TR 63357:2022

IEC TR 63357 ®
Edition 1.0 2022-10
TECHNICAL
REPORT
colour
inside
Semiconductor devices – Standardization roadmap of fault test method for
automotive vehicles
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IEC TR 63357 ®
Edition 1.0 2022-10
TECHNICAL
REPORT
colour
inside
Semiconductor devices – Standardization roadmap of fault test method for

automotive vehicles
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-5766-1

– 2 – IEC TR 63357:2022 © IEC 2022
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Background . 7
4.1 Motivation . 7
4.2 Technologies on fault test methods . 9
4.2.1 Joint test action group (JTAG) . 9
4.2.2 Design for test (DFT) . 9
4.2.3 Design for manufacturability (DFM) . 10
4.2.4 Scan test . 10
5 Standardization roadmap of fault test methods for automotive vehicles . 12
Bibliography . 14

Figure 1 – Conceptual diagram of environment for semiconductor devices used in
automotive vehicles . 7
Figure 2 – Regulations on automotive RADAR . 8
Figure 3 – Frequency bands for wireless communications . 8
Figure 4 – Non-scan and scan cells . 11

Table 1 – Standards of frequency band used for V2X . 9
Table 2 – Standardization roadmap of fault test methods for semiconductor devices
used in automotive vehicles . 13

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES – STANDARDIZATION ROADMAP
OF FAULT TEST METHOD FOR AUTOMOTIVE VEHICLES

FOREWORD
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IEC TR 63357 has been prepared by the IEC technical committee 47: Semiconductor devices.
It is a Technical Report.
The text of this Technical Report is based on the following documents:
Draft Report on voting
47/2677/DTR 47/2714/RVDTR
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this Technical Report is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
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at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.

– 4 – IEC TR 63357:2022 © IEC 2022
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SEMICONDUCTOR DEVICES – STANDARDIZATION ROADMAP
OF FAULT TEST METHOD FOR AUTOMOTIVE VEHICLES

1 Scope
This Technical Report describes standardization roadmap of fault test methods for integrated
circuits used in automotive vehicles. Since automotive vehicles are exposed in harsh
environment such as very low or high temperature, vibration, high frequency signals, etc.
Therefore, they are tested for possible faults which can be caused by harsh environment. There
are several fault test methods and related issues to be standardized.
Semiconductor devices used in automotive vehicles are exposed in harsh environment of very
high or very low temperature, vibration, high frequency signals, etc. Therefore, they are tested
for possible faults which can be caused by harsh environment Evaluation results following this
fault test methods will provide robustness of the semiconductor device.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050-192, International Electrotechnical Vocabulary (IEV) – Part 192: Dependability
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60050-192 apply, as
well as the following.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
automatic test pattern generation
ATPG
method/technology used to find an input (or test) sequence that, when applied to a digital circuit,
enables automatic test equipment to distinguish between the correct circuit behavior and the
faulty circuit behavior caused by defects
Note 1 to entry: The generated patterns are used to test semiconductor devices after manufacture, or to assist with
determining the cause of failure. The effectiveness of ATPG is measured by the number of modeled defects, or fault
models, detectable and by the number of generated patterns. These metrics generally indicate test quality (higher
with more fault detections) and test application time (higher with more patterns).
3.2
error
discrepancy between an observed or measured value or condition, and the true, specified or
theoretically correct value or condition

– 6 – IEC TR 63357:2022 © IEC 2022
[IEC 60050-192:2015, 192-03-02, modified – The words "a computed, observed or measured"
have been replaced by "an observed or measured" and the notes to entry have been removed.]
3.3
failure
loss of ability to perform as required
[IEC 60050-192:2015, 192-03-01, modified – The specific use as well as the three
existing notes have been removed.]
3.4
fault
inability to perform as required, due to an internal state
[IEC 60050-192:2015, 192-04-01, modified – The specific use has been deleted,
as well as the four existing notes.]
3.5
fault coverage
proportion of faults that can be detected, under given conditions
[IEC 60050-192:2015, 192-07-24]
3.6
fault detection
event by which the presence of a fault becomes apparent
[IEC 60050-192:2015, 192-06-18, modified – The note has been removed.]
3.7
fault model
definition of a possible fault type which gives incorrect values at any speed or at-speed, and
sensitized by performing only one operation or multiple operations sequentially
3.8
fault simulation
simulation of DUT in the presence of faults to evaluate the quality of a test set, usually in terms
of fault coverage
3.9
permanent fault
fault that will remain unless it is removed by some intervention
Note 1 to entry: The "intervention" may be modification or maintenance.
[IEC 60050-192:2015, 192-04-04, modified – The specific use and the secon
...