IEC 62047-52:2026

IEC 62047-52 ®
Edition 1.0 2026-03
INTERNATIONAL
STANDARD
Semiconductor devices - Micro-electromechanical devices -
Part 52: Biaxial tensile testing method for stretchable MEMS
ICS 31.080.99  ISBN 978-2-8327-1095-1

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CONTENTS
FOREWORD . 2
1 Scope . 4
2 Normative references . 4
3 Terms, definitions and symbols . 4
4 Designations . 5
5 Test piece . 5
5.1 General . 5
5.2 Shape of a test piece . 6
5.3 Measurement of dimensions . 6
6 Testing method and test apparatus . 6
6.1 Test principle . 6
6.2 Test apparatus . 6
6.3 Test procedure. 6
7 Test report . 8
Annex A (informative) Examples of biaxial tensile testing results of stretchable Si
devices . 9
A.1 General . 9
A.2 Biaxial tensile testing results of single crystalline silicon structure . 9
Annex B (informative) Examples of biaxial tensile testing results of kirigami-based
stretchable electronic devices . 10
B.1 General . 10
B.2 Biaxial tensile testing results of kirigami electronic circuits . 10
Bibliography . 12

Figure 1 – Cruciform test piece for biaxial tensile testing . 5
Figure 2 – Schematic of a biaxial tensile testing apparatus . 7
Figure A.1 – Biaxial tensile testing of single crystalline silicon kirigami . 9
Figure B.1 – Biaxial tensile testing of kirigami structure with electrical circuits . 10
Figure B.2 – Changes of electrical resistance during biaxial stretching . 11

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
Semiconductor devices -
Micro-electromechanical devices -
Part 52: Biaxial tensile testing method for stretchable MEMS

FOREWORD
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IEC 62047-52 has been prepared by subcommittee 47F: Micro-electromechanical systems, of
IEC technical committee 47: Semiconductor devices. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
47F/505/CDV 47F/519A/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
– reconfirmed,
– withdrawn, or
– revised.
1 Scope
This part of IEC 62047 specifies a testing method for measuring device performance and failure
strain under biaxial tensile deformation in stretchable MEMS materials. The typical examples
of the stretchable MEMS materials are flexible single crystalline silicon structures, MEMS circuit
boards, interconnected MEMS on a stretchable substrate. The test piece has a cruciform
geometry and the test piece thickness ranges from 1 μm to 100 μm with the same thickness as
the actual devices. Since the failure strain can vary depending on loading conditions like
uniaxial tension and equi-biaxial tension, a biaxial load is applied to a cruciform test piece with
varying strain ratio between two perpendicular loading directions.
2 Normative references
There are no normative references in this document.
3 Terms, definitions and symbols
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
– IEC Electropedia: available at https://www.electropedia.org/
– ISO Online browsing platform: available at https://www.iso.org/obp
3.1.1
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