I11 - Imaginarni 11

IEC 62228-5:2021(E) specifies test and measurement methods for EMC evaluation of Ethernet transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for transceiver of the Ethernet systems  100BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD1; 100BASE-TX according to ISO/IEC/IEEE 8802-3; 1000BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD4  and covers  the emission of RF disturbances; the immunity against RF disturbances; the immunity against impulses; the immunity against electrostatic discharges (ESD).

IEC 61076-3-122:2021 covers 8-way, shielded, free and fixed rectangular connectors for I/O and data transmission with frequencies up to 500 MHz. It is intended to specify the common dimensions, mechanical, electrical and environmental characteristics and tests for this family of connectors. Connectors complying with this document provide an ingress protection level of IP20; however, they are particularly suited for industrial environments with a high level of vibration. There are two classes of connectors defined in this document, indicated by "class A" and "class B" which are distinguished by some electrical and mechanical characteristics to meet the particular sets of requirements of some industrial applications. Class A meets the requirements defined in Ed.1 of this document. With the two classes A and B, the two codings Type I and II, and the two sets of transmission requirements according to the component categories Cat 5 and Cat 6A as defined in ISO/IEC 11801-1, this document specifies 2 × 2 × 2 = 8 variants. All connectors covered by this document feature a current-carrying capacity beyond the minimum requirement of 0,75 A per pin for an ambient temperature of 60° C as defined in ISO/IEC 11801 1. This second edition cancels and replaces the first edition published in 2017. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) Title modified. b) Introduction of two sets of requirements for connectors of "class A" and "class B" where class A matches the requirements defined in the previous edition. c) Definition of new performance requirements for frequencies up to 500 MHz in addition to the performance requirements up to 100 MHz provided with the previous edition. d) Re-structuring to reflect the commonalities of and differences between connector Type I and Type II. e) Revision of drawings to clarify some dimensions. e) The derating diagram has been corrected to align it with the upper limiting temperature in the climatic category, with no reduction of performance for the target applications.

This part of IEC 60384 applies to fixed capacitors for direct current, with metallized electrodes
and polyethylene-terephthalate dielectric for use in electronic equipment.
These capacitors have a possibility of "self-healing properties" depending on conditions of use.
They are primarily intended for applications where the AC component is small with respect to
the rated voltage. Two performance grades of capacitors are covered: grade 1 for long-life
application and grade 2 for general application.
Capacitors for electromagnetic interference suppression and surface mount fixed metallized
polyethylene-terephthalate film dielectric DC capacitors are not included, but are covered by
IEC 60384-14 and IEC 60384-19, respectively.
The object of this document is to prescribe preferred ratings and characteristics and to select
from IEC 60384-1 the appropriate quality assessment procedures, tests and measuring
methods, and to give general performance requirements for this type of capacitor. Test
severities and requirements prescribed in detail specifications referring to this sectional
specification are of equal or higher performance level, because lower performance levels are
not permitted.

This part of IEC 61587 specifies security aspects and security performance levels of the
mechanical construction of indoor cabinets in accordance with IEC 60917 (all parts) and
IEC 60297 (all parts). This document does not address vandalism.
NOTE Protection against vandalism is typically controlled by user-specific requirements.

No scope available

This part of IEC 61967 specifies a method to measure the conducted electromagnetic emission
(EME) of integrated circuits by direct radio frequency (RF) current measurement with a
1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These
methods ensure a high degree of reproducibility and correlation of EME measurement results.

This document specifies requirements, methods of testing and required test results where
standards are needed to provide a basic level of protection against cyber incidents (i.e.
malicious attempts, which actually or potentially result in adverse consequences to equipment,
their networks or the information that they process, store or transmit) for:
a) shipborne radio equipment forming part of the global maritime distress and safety system
(GMDSS) mentioned in the International Convention for Safety of Life at Sea (SOLAS) as
amended, and by the Torremolinos International Convention for the Safety of Fishing
Vessels as amended, and to other shipborne radio equipment, where appropriate;
b) shipborne navigational equipment mentioned in the International Convention for Safety of
Life at Sea (SOLAS) as amended, and by the Torremolinos International Convention for the
Safety of Fishing Vessels as amended,
c) other shipborne navigational aids, and Aids to Navigation (AtoN), where appropriate.
The document is organised as a series of modules dealing with different aspects. The document
considers both normal operation of equipment and the maintenance of equipment. For each
module, a statement is provided indicating whether the module applies during normal operation
or in maintenance mode.
Communication initiated from navigation or radiocommunication equipment outside of items a),
b) and c) above, for example ship side to other ship or shore side, are outside of the scope of
this document.
This document does not address cyber-hygiene checks, for example anti-malware scanning,
etc., performed outside of the cases defined in this document.

This document covers shielded and unshielded free and fixed connectors, circular or
rectangular, for balanced single-pair data transmission, with current-carrying capacity.
It specifies the IEC 63171 series' common mechanical, electrical and transmission
characteristics and environmental requirements, as well as required test specifications.
This document does not describe a specific mating interface. Detail specifications of mating
interfaces complying with this document can be found in the family of detail specification
standards IEC 63171-X (type X).
Within their own type, the shielded and unshielded connectors are interoperable for their
transmission performance and can be exchanged; though the shielded version has improved
alien crosstalk and coupling attenuation properties.

This part of IEC 61924 specifies the minimum requirements for the design, manufacture,
integration, methods of testing and required test results for an integrated navigation system
(INS) to comply with the International Maritime Organization (IMO) requirements of Resolution
MSC.252(83), as amended by Resolution MSC.452(99). In addition, it takes account of IMO
Resolution A.694(17) to which IEC 60945 is associated. When a requirement in this document
is different from IEC 60945, the requirement of this document takes precedence.
For bridge alert management, IMO Resolution MSC.302(87) supersedes IMO Resolution
MSC.252(83). Accordingly, this document incorporates references to IEC 62923-1 and
IEC 62923-2 which are associated with Resolution MSC.302(87) for requirements and tests,
where applicable. This document indicates which requirements and associated tests of
MSC.252(83) have been superseded by MSC.302(87).
NOTE All text of this document whose wording is identical to that in IMO Resolution MSC.252(83), as amended by
MSC.452(99), is printed in italics and the Resolution and paragraph number indicated between brackets.

In recent years, a number of representatives have been appointed by the CEN/CENELEC Governing Bodies (AGs, CAs, BTs) to represent the interests of CEN/CENELEC in external groups (e.g. European Commission Expert groups) and specific events (e.g. UN/EC, conferences).
Given the important role that these representatives play, it is necessary to define their roles and responsibilities and make them aware of the expected commitment, in order to ensure that they:
- act in line with the CEN and CENELEC Strategy 2030 (and subsequent strategies beyond 2020);
- are informed of the policies, priorities and positions of the organizations (CEN, CENELEC or CEN-CENELEC) they represent;
- understand the message and priorities to be conveyed;
- provide effective and efficient reporting and feedback to the CEN/CENELEC Governing Bodies.
To this end, once appointed, the representative is to abide by the stipulations of the guidance document as included in Annex A, which identifies a set of basic practices to be followed to ensure proper coordination, reporting and follow-up.
The list of appointed representatives is kept by CCMC. Regular updates will be provided to the CEN/CENELEC Governing Bodies.
Note: This Guide does not apply to the appointment of elected CEN and CENELEC Officers.

This document supports understanding, adoption and use of EN 16234 (all parts) e-Competence Framework (e-CF) - A common European Framework for ICT Professionals in all sectors which provides a common reference of 41 ICT professional competences as required and applied in the Information and Communication Technology (ICT) professional work environment, using a common language for competences, skills, knowledge and proficiency levels that can be understood across Europe.
This document supports Information and Communication Technology (ICT) stakeholders dealing with ICT professional competences from multiple perspectives, in particular:
-   ICT service, demand and supply organisations;
-   ICT professionals, managers and human resource (HR) departments;
-   educational institutions, learning program and certification providers of all types including Vocational and Educational Training (VET), Higher Education (HE) and Continuous Professional Development (CPD);
-   social partners (trade unions and employer associations);
-   professional associations, accreditation, validation and assessment bodies;
-   market analysts and policy makers;
-   other organisations and stakeholders in public and private sectors across Europe,
to adopt, apply and use the framework in their environment.

This Technical Report describes the methodology grounding for the development of the e-Competence Framework published as EN 16234-1. It supports methodological understanding of the e-CF by all interested parties and seeks to satisfy the needs of stakeholders from a competence frameworks construction or research environment.

This document provides a series of practical case studies supporting understanding, adoption and use of EN 16234 (all parts) e-Competence Framework (e-CF) - A common European Framework for ICT Professionals in all sectors which provides a common reference of 41 ICT professional competences as required and applied at the Information and Communication Technology (ICT) professional work environment, using a common language for competences, skills, knowledge and proficiency levels that can be understood across Europe.
This document supports Information and Communication Technology (ICT) stakeholders dealing with ICT Professional competences from multiple perspectives, in particular:
-   ICT service, demand and supply organisations;
-   ICT professionals, managers and human resource (HR) departments;
-   educational institutions, learning program and certification providers of all types including Vocational and Educational Training (VET), Higher Education (HE) and Continuous Professional Development (CPD);
-   social partners (trade unions and employer associations);
-   professional associations, accreditation, validation and assessment bodies;
-   market analysts and policy makers;
-   other organizations and stakeholders in public and private sectors across Europe,
to adopt, apply and use the framework in their environment.

IEC 61828:2020 - provides definitions for the transmitted field characteristics of focusing and nonfocusing transducers for applications in medical ultrasound; - relates these definitions to theoretical descriptions, design, and measurement of the transmitted fields of focusing transducers; - gives measurement methods for obtaining defined field characteristics of focusing and nonfocusing transducers; - specifies beam axis alignment methods appropriate for focusing and nonfocusing transducers. IEC 61828:2021 relates to focusing ultrasonic transducers operating in the frequency range appropriate to medical ultrasound (0,5 MHz to 40 MHz) for both therapeutic and diagnostic applications. It shows how the characteristics of the transmitted field of transducers can be described from the point of view of design, as well as measured by someone with no prior knowledge of the construction details of a particular device. The transmitted ultrasound field for a specified excitation is measured by a hydrophone in either a standard test medium (for example, water) or in a given medium. This document applies only to media where the field behaviour is essentially like that in a fluid (i.e. where the influence of shear waves and elastic anisotropy is small), including soft tissues and tissue-mimicking gels. Any aspects of the field that affect their theoretical description or are important in design are also included. These definitions would have use in scientific communications, system design and description of the performance and safety of systems using these devices. IEC 61828:2021 incorporates definitions from other related standards where possible, and supplies more specific terminology, both for defining focusing characteristics and for providing a basis for measurement of these characteristics. IEC 61828:2021 cancels and replaces the first edition published in 2001. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) Clause 6 on Measurement procedures has been replaced by Clause 6: "Acoustic field measurement: equipment" and Clause 7: "Measurement procedure" and related definitions. b) Reorganization of definitions and measurement section to accommodate specific sets of measurements for focusing, nonlinearity, beam axis alignment, beam area, beam maximum, numerical projection, plane wave, high intensity therapeutic ultrasound, multiple sources, spatial impulse response and compound plane waves. Clause 3 has been moved to Annex B. c) The normative references have been updated and the Bibliography has been expanded from 8 to 40 references. d) Twelve figures have been updated and seven new figures (B.1, B.3, B.7, B.10, B.11, B.12, B.13, B.14) have been added to facilitate measurements and be consistent with measurement terminology. e) New measurements have been added for time delays, arrays, plane waves and spatial impulse response. f) Annex A has been expanded to provide general guidance on pulsed waves, system responses, focusing gains and minimum beamwidth estimation. g) New annexes have been added: • Annex B (informative) Rationale for focusing and nonfocusing definitions • Annex E (informative) Uncertainties; • Annex F (informative) Transducer and hydrophone positioning systems; •

IEC Corrected Version

IEC 60352-7:2020 is available as IEC 60352-7:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60352-7:2020 is applicable to spring clamp connections made with stripped wire without further preparation:
- solid conductors of 0,32 mm to 3,7 mm nominal diameter (0,08 mm2 to 10 mm2 cross‑section), or
- stranded conductors of 0,08 mm2 to 10 mm2 cross-section, or
- flexible conductors of 0,08 mm2 to 10 mm2 cross-section,
according to IEC 60228 or IEC 60189-3 for use in electrical and electronic equipment and components.
Information on materials and data from industrial experience is included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this document is to determine the suitability of spring clamp connections under specified mechanical, electrical and atmospheric conditions. This second edition cancels and replaces the first edition of IEC 60352-7, published in 2002. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) correction of the two flow charts in Figure 6 and Figure 7,
b) split the content into more clauses for better separation between full test schedule and basic test schedule,
c) relocating the content of former Clause 6 Practical guidance into an informative Annex A, as now common in the IEC 60352 series for solderless connections,
d) clarification on conductor types with reference to classes defined in IEC 60228.

IEC 62435-7:2020 on long-term storage applies to micro-electromechanical devices (MEMS) in long-term storage that can be used as part of obsolescence mitigation strategy. Long-term storage refers to a duration that may be more than 12 months for products scheduled for storage. Philosophy, good working practice, and general means to facilitate the successful long-term storage of electronic components are also addressed.

2021-01-15 - IEC Corrected Version.

This document describes basic, common minimum functional requirements and recommendations for an accessible and usable built environment, following the Design for All/Universal Design principles which will facilitate equitable and safe use for a wide range of users, including persons with disabilities.
The requirements and recommendations given in this document are applicable across the full spectrum of the built environment.
These functional accessibility and usability requirements and recommendations are relevant to the design, construction, refurbishment or adaptation, and maintenance of built environments including outdoor pedestrian and urban areas.
NOTE 1   Design for All and Universal Design share a similar inclusive design philosophy. "Universal Design" means the design of products, environments, programmes and services to be usable by all people, to the greatest extent possible, without the need for adaptation or specialized design. "Universal Design" does not exclude assistive devices for particular groups of persons with disabilities where this is needed.
NOTE 2   Terms such as "design for all", "universal design", "accessible design", "barrier-free design", "inclusive design" and "transgenerational design" are often used interchangeably with the same meaning.
NOTE 3   This document does not cover management and maintenance issues, but provides basic information in Annex B.
NOTE 4 All figures are provided as examples. They are described by their title and key and do not provide additional information. Some figures show negative examples to be avoided; these are identified by the insertion of a red cross on them. A list of all the figures included is this standard is given in the informative Annex C.

This part of IEC 60384 specifies preferred ratings and characteristics, selects from
IEC 60384-1:2016 the appropriate quality assessment procedures, tests and measuring
methods, and gives general performance requirements for this type of capacitor. Test
severities and requirements specified in detail specifications referring to this sectional
specification are of an equal or higher performance level. Lower performance levels are not
permitted.
This part of IEC 60384 applies to fixed direct current capacitors, using as dielectric a
polypropylene film with electrodes of thin metal foils. The capacitors covered by this
document are intended for use in electronic equipment.
Capacitors for electromagnetic interference suppression are not included, but are covered by
IEC 60384-14.

2020-12-25 - IEC Corrected Version

Standardisation Request M/543 requires the following: "Definition of parameters and methods relevant for assessing durability, upgradability and ability to repair, re-use and re-manufacture of products". Hence, this Technical Report "Definitions related to material efficiency" will constitute a collection of common terms used in deliverables prepared in accordance with M/543. The purpose of such a collection is to provide a single definition of key terms used in different deliverables from the CEN-CENELEC TC10.
The source of the terms and definitions can be documents developed in the various working groups of the CEN-CENELEC TC10 or any text referenced by such documents.
In case of discrepancies between multiple definitions for the same term, this Technical report will recommend a preferred definition.

The standard defines the transfer of electronic documents between stakeholders in the insurance industry (for
example between insurer and intermediary).
The standard specifies:
 the semantic process for the transfer of documents (for example insurance policy, claim notification,
correspondence) that may be transferred as an attached file and
 a limited number of meta data describing the document (for example type of document, identification of
insurer, intermediary and client, policy number, claim number).

This part of IEC 60645 specifies a means of describing the physical characteristics, in terms of
electrical waveforms, of audiometric reference and test signals of short duration and methods
for their measurement.
The object of this document is to ensure that audiometric stimuli of short duration are specified
and measured in the same way and that the calibration of equipment using such signals is
carried out using defined methods.
This document does not describe the method of use of short-duration test signals.

This part of IEC 60603-7 covers 8-way, unshielded, free and fixed connectors and is intended
to specify the common dimensions (interface dimensions), mechanical, electrical and
environmental characteristics and tests for the family of IEC 60603-7-x connectors.
These connectors are intermateable (according to IEC 61076-1 level 2) and interoperable with
other IEC 60603-7 series connectors.

This document specifies the requirements of the test procedures to be applied for recurrent tests of current-using electrical equipment and appliances for the verification of the effectiveness of the protective measures and the permissible limits for product compliance.
This procedure is applicable to current-using electrical equipment connected to final circuits. They can be either pluggable equipment type A connected to final circuits at work places via a plug or permanently connected equipment, with a rated voltage above 25 V AC and 60 V DC up to 1 000 V AC and 1 500 V DC, and currents up to 63A.
This document does not cover:
—    Test after repair defined in FprEN 50678;
—    type tests, routine tests, sample tests, special tests and acceptance tests for product safety nor for product functional requirements.
This document does not apply to:
—    devices and equipment that are part of the fixed electrical installations defined in HD 60364 (all parts);
—    uninterruptible Power Supply (UPS), photovoltaic inverters and power converters, e.g. AC/DC converters;
—    charging stations for electro-mobility;
—    stationary power supplies (generators);
—    programmable Logic Controllers (PLC);
—    power Drives;
—    devices for EX-zones or for mining applications in general;
—    products already covered by standards addressing similar topics such as:
—    medical equipment covered by EN 60601 1. For these devices, EN 62353 applies;
—    arc welding equipment covered by EN 60974 1. For these devices, EN 60974 4 applies;
—    Machinery covered by EN 60204 1. For these devices, EN 60204 1 applies.

This part of IEC 61076 describes circular connectors with M8 screw locking typically used for
data and power transmissions in industrial applications. These connectors consist of fixed and
free connectors that are either rewireable or non-rewireable. Data transmission performance
is for Category 5 up to 100 MHz.
Two coded versions, identified as D-coded and P-coded, are provided that differ by their pin
size and optionally by number of poles, hence by the function provided for field applications.
Male connectors have round contacts Ø 0,8 mm for D-coded, and Ø 1 mm for P-coded
connectors.
The coding provided by this document prevents the mating of accordingly coded male or
female connectors to any other similarly sized interfaces covered by other standards.
NOTE M8 is the dimension of the thread of the screw-locking mechanism of these circular connectors.

This part of IEC 60747 specifies the terminology, essential ratings, characteristics, safety test
and the measuring methods of magnetic coupler and capacitive coupler.
It specifies the principles and requirements of insulation and isolation characteristics for
magnetic and capacitive couplers for basic insulation and reinforced insulation.

The objective of this part of IEC 62433 is to describe the extraction flow for deriving an
immunity macro-model of an Integrated Circuit (IC) against conducted Electrostatic Discharge
(ESD) according to IEC 61000-4-2 and Electrical Fast Transients (EFT) according to
IEC 61000-4-4.
The model addresses physical damages due to overvoltage, thermal damage and other failure
modes. Functional failures can also be addressed.
This model allows the immunity simulation of the IC in an application. This model is commonly
called "Integrated Circuit Immunity Model Conducted Pulse Immunity", ICIM-CPI.
The described approach is suitable for modelling analogue, digital and mixed-signal ICs.
Several terminals of an IC can be part of a single model (e.g. input, output and supply pins).
The implementation of the model is capable of representing the non-linear behaviour of
overvoltage protection circuits.
The model can be implemented for the use in different software tools for circuit simulation in
time-domain. The described modelling approach allows simulating device failure due to ESD
or EFT at component and system level considering all components necessary for the immunity
simulation of an IC, such as a PCB or external protection elements.
This document demonstrates, in detail, the construction of models in a defined XML-based
format which is suitable for the exchange of models without any deeper knowledge of the
semiconductor circuit. However, the model functionality can be implemented in different
formats including, but not limited to, tables, SPICE[1] 1 netlists, hardware description
languages such as VHDL-AMS [2] and Verilog-AMS [3].
This document provides:
• the description of ICIM-CPI macro-model elements representing electrical, thermal or
logical behaviour of the IC.
• a universal data exchange format based on XML.

This document provides guidance on addressing research and innovation (R&I) in European standardization activities and deliverables.
Secretaries and chairpersons of CEN/CENELEC Technical Bodies as well as CEN/CENELEC national members are encouraged to actively promote the application of this document.

This European Standard establishes the requirements and tests for cover plates and cover tapes used for the mechanical protection, identification and warning of the location of buried cables or buried conduits.

This part of IEC 60749 provides a means of assessing the resistance to soldering heat of
semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is
destructive.

This CEN-CENELEC Guide provides mechanisms and details the characteristics and development process of the CEN/CENELEC deliverable known as the 'CEN/CENELEC Workshop Agreement'.

This part of IEC 60749 establishes a standard procedure for determining the preconditioning
of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs
representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this
document prior to being submitted to specific in-house reliability testing (qualification and/or
reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).
NOTE 1 Correlation of moisture-induced stress sensitivity conditions (or moisture sensitivity levels (MSL)) in
accordance with IEC 60749-20 and this document and the actual reflow conditions used are dependent upon
identical temperature measurement by both the semiconductor manufacturer and the board assembler. Therefore,
the temperature at the top of the package on the hottest moisture sensitive SMD during assembly is monitored to
ensure that it does not exceed the temperature at which the components are evaluated.
NOTE 2 For the purpose of this document, SMD is restricted to include only plastic-encapsulated SMDs and other
packages made with moisture-permeable materials.

The contents of the corrigendum of September 2020 have been included in this copy.

This part of IEC 62966, dedicated to aisle containment techniques for information technology
(IT) equipment typically used in data centres, describes the quantification of its air tightness, in
particular the air loss ratio that describes the content of the volumetric flow not used for cooling
the IT equipment. This ratio provides an index of efficiency, being inversely proportional to
efficiency (the lower this ratio, the higher the efficiency). This document provides methods to
measure an aisle containment air leakage rate and defines a classification system for aisle
containment leakage.
This document defines:
a) the measurement of the air leakage of the individual components of an aisle containment;
b) a method for calculating the air leakage of an aisle containment based on its individual
components;
c) a method for calculating the air leakage rate of an aisle containment in relation to the utilised
IT equipment;
d) a classification system for aisle containment leakage.

This part of IEC 60749 describes a test used to determine whether encapsulated solid state
devices used for through-hole mounting can withstand the effects of the temperature to which
they are subjected during soldering of their leads by using wave soldering.
In order to establish a standard test procedure for the most reproducible methods, the solder
dip method is used because of its more controllable conditions. This procedure determines
whether devices are capable of withstanding the soldering temperature encountered in printed
wiring board assembly operations, without degrading their electrical characteristics or internal
connections.
This test is destructive and may be used for qualification, lot acceptance and as a product
monitor.
The heat is conducted through the leads into the device package from solder heat at the
reverse side of the board. This procedure does not simulate wave soldering or reflow heat
exposure on the same side of the board as the package body.

This part of IEC 63041 is applicable to piezoelectric physical sensors mainly used in the field
of process control, wireless monitoring, dynamics, thermodynamics, vacuum engineering, and
environmental sciences. This document provides users with technical guidelines as well as
basic knowledge of common physical sensors.
Piezoelectric sensors covered herein are those applied to the detection and measurement of
physical quantities such as force, pressure, torque, viscosity, temperature, film thickness,
acceleration, vibration, and tilt angle.

This part of IEC 61076 specifies circular connectors with an inner push‑pull locking
mechanism of a size derived from and thus being compatible with M12 screw‑locking
connectors and with mating interfaces according to IEC 61076‑2‑101, IEC 61076‑2‑109,
IEC 61076‑2‑111 and IEC 61076‑2‑113.
A female fixed connector with inner push-pull locking according to this document is
intermateable with a correspondingly coded male free connector with M12 screw-locking
according to IEC 61076-2-101, IEC 61076-2-109, IEC 61076-2-111 or IEC 61076-2-113.
NOTE 1 M12 is the dimension of the thread of the screw‑locking mechanism of circular connectors with M12
screw‑locking.
This document covers both:
a) power connectors with current ratings up to 16 A and voltage ratings up to 630 V, typically
used for power supply of electrical equipment used in industrial premises, and
b) connectors for data and signal transmission with frequencies up to 500 MHz.
NOTE 2 The power connectors are not suitable as power distribution socket-outlets in electrical installations of
buildings.
These connectors consist of both fixed and free connectors, either rewirable or non‑rewirable,
with M12 inner push‑pull locking as explained above. Male connectors have round contacts
from Ø0,6 mm up to Ø1,5 mm.
This document covers various types of connectors identified by their "codings" with different
contact arrangement, not mutually interchangeable.
The design of the inner push‑pull mechanism prevents the unintended mating of the male
inner push‑pull free connector with the female connector with M12 screw‑locking even for
identical coding.
Some styles of free connectors with female contacts covered in this document are equipped
with both inner and outer push-pull locking for intermateability also with correspondingly
coded male fixed or free connectors according to IEC 61076-2-010.

This part of IEC 60747 specifies the terminology, essential ratings, characteristics, safety
tests, as well as the measuring methods for photocouplers.
NOTE The term "optocoupler" can also be used instead of "photocoupler".

This part of IEC 60352 is applicable to solderless press-in connections for use in electrical
and electronic equipment and components.
The press-in connection consists of a termination having a suitable press-in zone which is
inserted into a hole of a board.
Information on materials and data from industrial experience is included in addition to the test
procedures to provide electrically stable connections under specified environmental conditions.
The object of this document is to determine the suitability of press-in connections under
mechanical, electrical and atmospheric conditions as specified by the manufacturer of the
press-in termination and to provide a means of comparing test results when the tools used to
make the connections are of different designs or manufacture.

This document specifies standard aspect ratios for logarithmic or level characteristics
expressed in decibels versus a logarithmic frequency axis and ranges for the radius of polar
diagrams of level. Applications include hard copy printouts, electronic files (e.g., PDF files),
scientific publications, screen displays in computer programs and apps, as well as graphs in
standards.
Informative examples of graphs that conform to the requirements in this document are found in
Annex A.
Although outside the scope of this document, graphs with a linear y-axis versus logarithmic
frequency (e.g., phase, group delay, etc.) often accompany the standard aspect ratio graphs of
level described in the normative part of this document. These are described in informative
Annex B.

This part of the IEC 62435 series on long-term storage is applied to passive electronic devices
in long-term storage that can be used as part of obsolescence mitigation strategy. Longterm
storage refers to a duration that can be more than 12 months for product scheduled for
storage. Storage typically begins when components are packed at the originating supplier
where the pack date or date code are assigned to the product. It is the responsibility of the
distributor and the customer to control and manage the aging inventory upon receipt of the
dated product. Alternatively, a supplier-customer agreement can be established to manage
the aging inventory. Philosophy, good working practice, and general means to facilitate the
successful long-term storage of electronic components are also addressed.

This part of IEC 60749 specifies the procedural requirements for performing valid endurance,
retention and cross-temperature tests based on a qualification specification. Endurance and
retention qualification specifications (for cycle counts, durations, temperatures, and sample
sizes) are specified in JESD47 or are developed using knowledge-based methods such as in
JESD94.

This document is applicable to
– therapy equipment using extracorporeally induced non-focused or weakly focused pressure
pulses;
– therapy equipment producing extracorporeally induced non-focused or weakly focused
mechanical energy,
where the pressure pulses are released as single events of duration up to 25 μs.
This document does not apply to
– therapy equipment using focusing pressure pulse sources such as extracorporeal
lithotripsy equipment;
– therapy equipment using other acoustic waveforms like physiotherapy equipment, low
intensity ultrasound equipment and HIFU/HITU equipment.
This document specifies
– measurable parameters which are used in the declaration of the acoustic output of
extracorporeal equipment producing a non-focused or weakly focused pressure pulse
field,
– methods of measurement and characterization of non-focused or weakly focused
pressure pulse fields.
NOTE 1 The parameters defined in this document do not – at the time of publication – allow quantitative statements
to be made about clinical efficacy and possible hazard. In particular, it is not possible to make a statement about the
limits for these effects.
NOTE 2 Figure B.1 to Figure B.10 and Figure 2 to Figure 4 are useful to understand the geometry of the field
applied in this document.
This document has been developed for equipment intended for use in pressure pulse therapy,
for example therapy of orthopaedic pain like shoulder pain, tennis elbow pain, heel spur pain,
muscular trigger point therapy, lower back pain, etc. It is not intended to be used for
extracorporeal lithotripsy equipment (as described in IEC 61846), physiotherapy equipment
using other waveforms (as described in IEC 61689) and HIFU/HITU equipment (see
IEC 60601-2-62 and IEC TR 62649).

This part of IEC 60512, when required by the detail product specification, is used for testing
connectors or solderless connections within the scope of technical committee 48. It may also be
used for similar devices when specified in a detail product specification.
The object of this document is to detail a standard method for subjecting solderless
connections to thermal stress conditioning by cyclic current loading.

TAN - // IEC Corrigendum

IEC 60352-4:2020 is applicable to non-accessible ID connections for which the tests and measurements according to Clauses 6 through 8 are suitable and which are made with: – appropriately designed ID terminations; – wires having solid round conductors of 0,25 mm to 3,6 mm nominal diameter; – wires having stranded conductors of 0,05 mm2 to 10 mm2 cross-sectional area; for use in electrical and electronic equipment and components. Information on materials and data from industrial experience is included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. There are different designs and materials for ID terminations in use. For this reason, only fundamental parameters of the termination are specified, while the performance requirements of the wire and the complete connection are specified in full detail. The purpose of this document is: – to determine the suitability of non-accessible ID connections under specified mechanical, electrical and atmospheric conditions; – to provide a means of comparing test results when the tools used to make the connections, if any, are of different designs or manufacture. This second edition cancels and replaces the first edition, published in 1994, and its Amendment 1 (2000). This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) Transferred Clauses 9 to 13 into Annex A (informative). b) The figures were re-drawn for clarity.

This part of IEC 61969 specifies a set of basic environmental requirements and tests, as well
as safety aspects for outdoor enclosures under conditions of non-weather protected locations
above ground.
The purpose of this document is to define a minimum level of environmental performance in
order to meet requirements of storage, transport and final installation. The intention is to
establish basic environmental performance criteria for outdoor enclosure compliance.