SIST EN IEC 62228-7:2026

SLOVENSKI STANDARD
01-november-2026
Nadomešča:
SIST EN IEC 62228-7:2022
Integrirana vezja - Vrednotenje elektromagnetne združljivosti (EMC) oddajnikov-
sprejemnikov - 7. del: Oddajniki-sprejemniki CXPI (IEC 62228-7:2026)
Integrated circuits - EMC evaluation of transceivers - Part 7: CXPI transceivers (IEC
62228-7:2026)
Integrierte Schaltungen - Bewertung der elektromagnetischen Verträglichkeit von Sende-
Empfangsgeräten – Teil 7: CXPI-Sende-Empfangsgeräte (IEC 62228-7:2026)
Circuits intégrés - évaluation de la CEM des émetteurs-récepteurs - Partie 7: émetteurs-
récepteurs CXPI (IEC 62228-7:2026)
Ta slovenski standard je istoveten z: EN IEC 62228-7:2026
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
33.100.01 Elektromagnetna združljivost Electromagnetic compatibility
na splošno in general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 62228-7

NORME EUROPÉENNE
EUROPÄISCHE NORM September 2026
ICS 31.200 Supersedes EN IEC 62228-7:2022
English Version
Integrated circuits - EMC evaluation of transceivers - Part 7:
CXPI transceivers
(IEC 62228-7:2026)
Circuits intégrés - Évaluation de la CEM des émetteurs- Integrierte Schaltungen - Bewertung der
récepteurs - Partie 7: Émetteurs-récepteurs CXPI elektromagnetischen Verträglichkeit von Sende-
(IEC 62228-7:2026) Empfangsgeräten - Teil 7: CXPI-Sende-Empfangsgeräte
(IEC 62228-7:2026)
This European Standard was approved by CENELEC on 2026-08-17. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2026 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62228-7:2026 E

European foreword
The text of document 47A/1180/CDV, future edition 2 of IEC 62228-7, prepared by SC 47A "Integrated
circuits" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN IEC 62228-7:2026.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2027-09-30
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2029-09-30
document have to be withdrawn
This document supersedes EN IEC 62228-7:2022 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 62228-7:2026 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
CISPR 16-1-1 NOTE Approved as EN IEC 55016-1-1
IEC 61000-4-4 NOTE Approved as EN 61000-4-4
IEC 61000-4-5 NOTE Approved as EN 61000-4-5
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 61967-1 - Integrated circuits - Measurement of EN IEC 61967-1 -
electromagnetic emissions - Part 1:
General conditions and definitions
IEC 61967-4 - Integrated circuits - Measurement of EN IEC 61967-4 -
electromagnetic emissions - Part 4:
Measurement of conducted emissions - 1
ohm/150 ohm direct coupling method
IEC 62132-1 - Integrated circuits - Measurement of EN 62132-1 -
electromagnetic immunity - Part 1: General
conditions and definitions
IEC 62132-4 - Integrated circuits - Measurement of EN 62132-4 -
electromagnetic immunity 150 kHz to 1
GHz - Part 4: Direct RF power injection
method
IEC 62215-3 - Integrated circuits - Measurement of EN 62215-3 -
impulse immunity - Part 3: Non-
synchronous transient injection method
IEC 62228-1 - Integrated circuits - EMC evaluation of EN IEC 62228-1 -
transceivers - Part 1: General conditions
and definitions
ISO 7637-2 - Road vehicles - Electrical disturbances - -
from conduction and coupling - Part 2:
Electrical transient conduction along supply
lines only
ISO 10605 - Road vehicles - Test methods for electrical - -
disturbances from electrostatic discharge
ISO 20794-4 - Road vehicles - Clock extension peripheral - -
interface (CXPI) - Part 4: Data link layer
and physical layer
ISO 20794-7 - Road vehicles - Clock extension peripheral - -
interface (CXPI) - Part 7: Data link and
physical layer conformance test plan
EIA-198-1 - Ceramic Dielectric Capacitors Classes I, II, - -
III, and IV - Part 1: Characteristics and
Requirements
IEC 62228-7 ®
Edition 2.0 2026-07
INTERNATIONAL
STANDARD
Integrated circuits - EMC evaluation of transceivers -
Part 7: CXPI transceivers
ICS 31.200  ISBN 978-2-8327-1286-3

IEC 62228-7:2026-07(en)
IEC 62228-7:2026 © IEC 2026
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviated terms . 8
3.1 Terms and definitions . 8
3.2 Abbreviated terms . 8
4 General . 9
5 Test and operating conditions . 11
5.1 Supply and ambient conditions. 11
5.2 Test operation modes . 11
5.3 Test configuration . 12
5.3.1 General test configuration for functional test . 12
5.3.2 General test configuration for unpowered ESD test . 13
5.3.3 Coupling ports and coupling networks for functional tests . 13
5.3.4 Coupling ports and coupling networks for unpowered ESD tests . 14
5.3.5 Power supply with decoupling network . 15
5.4 Test signals . 15
5.4.1 General . 15
5.4.2 Test signals for normal operation mode . 15
5.4.3 Test signal for wake-up from sleep mode . 17
5.5 Evaluation criteria . 18
5.5.1 General . 18
5.5.2 Evaluation criteria in functional operation modes during exposure to
disturbances . 18
5.5.3 Evaluation criteria in unpowered condition after exposure to
disturbances . 20
5.5.4 Status classes . 21
6 Test and measurement . 21
6.1 Emission of RF disturbances . 21
6.1.1 Test method . 21
6.1.2 Test setup . 21
6.1.3 Test procedure and parameters . 22
6.2 Immunity to RF disturbances . 22
6.2.1 Test method . 22
6.2.2 Test setup . 23
6.2.3 Test procedure and parameters . 24
6.3 Immunity to impulses . 26
6.3.1 Test method . 26
6.3.2 Test setup . 26
6.3.3 Test procedure and parameters . 27
6.4 Electrostatic discharge (ESD) . 30
6.4.1 Test method . 30
6.4.2 Test setup . 30
6.4.3 Test procedure and parameters . 32
7 Test report . 32
Annex A (normative) CXPI test circuits . 33
IEC 62228-7:2026 © IEC 2026
A.1 General . 33
A.2 CXPI test circuit for functional tests on standard type-A CXPI transceiver ICs . 33
A.3 CXPI test circuit for functional tests on standard type-B CXPI transceiver ICs . 36
A.4 CXPI test circuit for functional tests on ICs with embedded CXPI transceiver . 38
A.5 CXPI test circuit for unpowered ESD test on a standard type-A CXPI
transceiver IC . 41
A.6 CXPI test circuit for unpowered ESD test on a standard type-B CXPI
transceiver IC . 41
Annex B (normative) Test circuit boards. 43
B.1 Test circuit board for functional tests . 43
B.2 ESD test . 44
Annex C (informative) Examples for test limits for CXPI transceiver in automotive
application . 45
C.1 General . 45
C.2 Emission of RF disturbances . 45
C.3 Immunity to RF disturbances . 46
C.4 Immunity to impulse . 47
C.5 Electrostatic discharge (ESD) . 48
Annex D (informative) Example of setting for test signals . 49
Annex E (informative) Points to note for impulse immunity measurement for functional
status class A . 51
IC
E.1 General . 51
E.2 Points to note when testing pulse 1 . 51
Bibliography . 53

Figure 1 – PHY sub-layers overview and CXPI transceiver types . 10
Figure 2 – General test configuration for tests in functional operation modes . 12
Figure 3 – General test configuration for unpowered ESD test . 13
Figure 4 – Coupling ports and networks for functional tests . 13
Figure 5 – Coupling ports and networks for unpowered ESD tests . 14
Figure 6 – Test signal types for standard type-A CXPI transceiver ICs . 16
Figure 7 – Test signal types for standard type-B CXPI transceiver ICs . 17
Figure 8 – Wake-up signal types for standard CXPI transceiver ICs . 18
Figure 9 – Principle drawing of the maximum deviation in an I-V characteristic . 20
Figure 10 – Test setup for measurement of RF disturbances. 21
Figure 11 – Test setup for DPI tests . 23
Figure 12 – Test setup for impulse immunity tests. 27
Figure 13 – Test setup for direct ESD tests . 31
Figure A.1 – General drawing of the circuit diagram of the test network for standard
type-A CXPI transceiver ICs for functional tests . 35
Figure A.2 – General drawing of the circuit diagram of the test network for standard
type-B CXPI transceiver ICs for functional tests . 37
Figure A.3 – General drawing of the circuit diagram of the test network for ICs with
embedded CXPI transceiver for functional tests using standard type-A CXPI
transceiver IC as Node 1 . 39
IEC 62228-7:2026 © IEC 2026
Figure A.4 – General drawing of the circuit diagram of the test network for ICs with
embedded CXPI transceiver for functional tests using IC with embedded CXPI
transceiver as Node 1 . 40
Figure A.5 – A general drawing of the test circuit diagram for testing direct ESD of
CXPI transceiver in unpowered mode . 41
Figure A.6 – A general drawing of the test circuit diagram for testing direct ESD of
CXPI standard Type-B transceiver in unpowered mode . 42
Figure B.1 – Example of IC interconnections of CXPI signal . 43
Figure B.2 – Example of ESD test board for CXPI transceiver ICs . 44
Figure C.1 – Example of limits for RF emission – CXPI . 45
Figure C.2 – Example of limits for RF emission – VBAT . 45
Figure C.3 – Example of limits for RF immunity for functional status class A – CXPI . 46
IC
Figure C.4 – Example of limits for RF immunity for functional status class A – VBAT . 46
IC
Figure C.5 – Example of limits for RF immunity for functional status class C or D –
IC IC
CXPI . 47
Figure C.6 – Example of limits for RF immunity for functional status class C or D –
IC IC
VBAT . 47
Figure D.1 – Example of signal setting for standard type-A in two transceiver
configuration . 49
Figure D.2 – Example of signal setting for standard type-B in two transceiver
configuration . 50
Figure E.1 – Relationship between ISO 7637-2 pulse 1 and transceiver VBAT supply . 51
Figure E.2 – Transceiver VBAT supply image when t time is shortened . 52
Table 1 – Types for CXPI transceiver . 9
Table 2 – Overview of required measurement and tests . 10
Table 3 – Supply and ambient conditions for functional operation . 11
Table 4 – Definition of coupling ports and coupling network components for functional
tests . 14
Table 5 – Definitions of coupling ports for unpowered ESD tests . 15
Table 6 – Communication test signal TX1 . 15
Table 7 – Communication test signal TX2 . 16
Table 8 – Communication test signal TX3 . 17
Table 9 – Wake-up test signal TX4 . 18
Table 10 – Evaluation criteria for standard type-A in functional operation modes . 19
Table 11 – Evaluation criteria for standard type-B in functional operation modes . 19
Table 12 – Evaluation criteria for ICs with embedded CXPI transceiver in functional
operation modes . 20
Table 13 – Parameters for emission measurements . 22
Table 14 – Settings for the RF measurement equipment . 22
Table 15 – Specifications for DPI tests . 24
Table 16 – Required DPI tests for functional status class A evaluation of standard
IC
type-A . 25
Table 17 – Required DPI tests for functional status class A evaluation of standard
IC
type-B . 25
IEC 62228-7:2026 © IEC 2026
Table 18 – Required DPI tests for functional status class A evaluation of ICs with
IC
embedded CXPI transceiver. 25
Table 19 – Required DPI tests for functional status class C , D1 or D2 evaluation
IC IC IC
of standard CXPI transceiver ICs and ICs with embedded CXPI transceiver . 26
Table 20 – Specifications for impulse immunity tests . 28
Table 21 – Parameters for impulse immunity tests . 28
Table 22 – Required impulse immunity tests for functional status class A evaluation
IC
of standard type-A . 29
Table 23 – Required impulse immunity tests for functional status class A evaluation
IC
of standard type-B . 29
Table 24 – Required impulse immunity tests for functional status class A evaluation
IC
of ICs with embedded CXPI transceiver . 29
Table 25 – Required impulse immunity tests for functional status class C , D1 or
IC IC
D2 evaluation of standard CXPI transceiver ICs and ICs with embedded CXPI
IC
transceiver . 30
Table 26 – Specifications for direct ESD tests . 32
Table B.1 – Parameter ESD test circuit board . 44
Table C.1 – Example of limits for impulse immunity for functional status
class C or D . 47
IC IC
IEC 62228-7:2026 © IEC 2026
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
Integrated circuits - EMC evaluation of transceivers -
Part 7: CXPI transceivers
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
respect thereof. As of the date of publication of this document, IEC had not received notice of (a) patent(s), which
may be required to implement this document. However, implementers are cautioned that this may not represent
the latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC
shall not be held responsible for identifying any or all such patent rights.
IEC 62228-7 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical
committee 47: Semiconductor devices. It is an International Standard.
This second edition cancels and replaces the first edition published in 2022. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) change transceiver terms and definitions from master to commander and slave to responder
in 3.1.5 and 3.1.6.
b) change test configuration for embedded transceiver in 5.3.1 and add on Figure A.4
accordingly.
c) change the definition of TX2 test signal for type-B transceiver in 5.4.2.
d) add examples for test limits in Annex C.
IEC 62228-7:2026 © IEC 2026
The text of this International Standard is based on the following documents:
Draft Report on voting
47A/1180/CDV 47A/1195/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 62228 series, published under the general title Integrated circuits -
EMC evaluation of transceivers, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
– reconfirmed,
– withdrawn, or
– revised.
IEC 62228-7:2026 © IEC 2026
1 Scope
This part of IEC 62228 specifies test and measurement methods for the EMC evaluation of
CXPI transceiver ICs under network condition. It defines test configurations, test conditions,
test signals, failure criteria, test procedures, test setups and test boards. This specification is
applicable for standard CXPI transceiver ICs and ICs with embedded CXPI transceiver and
covers
– the emission of RF disturbances;
– the immunity against RF disturbances;
– the immunity against impulses;
– the immunity against electrostatic discharges (ESD).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61967-1, Integrated circuits - Measurement of electromagnetic emissions - Part 1: General
conditions and definitions
IEC 61967-4, Integrated circuits - Measurement of electromagnetic emissions - Part 4:
Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method
IEC 62132-1, Integrated circuits - Measurement of electromagnetic immunity - Part 1: General
conditions and definitions
IEC 62132-4, Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz
- Part 4: Direct RF power injection method
IEC 62215-3, Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous
transient injection method
IEC 62228-1, Integrated circuits - EMC evaluation of transceivers - Part 1: General conditions
and definitions
ISO 7637-2, Road vehicles - Electrical disturbances from conduction and coupling - Part 2:
Electrical transient conduction along supply lines only
ISO 10605, Road vehicles - Test methods for electrical disturbances from electrostatic
discharge
ISO 20794-4, Road vehicles - Clock extension peripheral interface (CXPI) - Part 4: Data link
layer and physical layer
ISO 20794-7, Road vehicles - Clock extension peripheral interface (CXPI) - Part 7: Data link
and physical layer conformance test plan
EIA‑198-1, Ceramic Dielectric Capacitors Classes I, II, III, and IV - Part 1: Characteristics and
Requirements
IEC 62228-7:2026 © IEC 2026
3 Terms, definitions and abbreviated terms
For the purposes of this document, the terms and definitions given in IEC 62228-1, IEC 61967-1
and IEC 62132-1 and the following apply.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
– IEC Electropedia: available at https://www.electropedia.org/
– ISO Online browsing platform: available at https://www.iso.org/obp
3.1 Terms and definitions
3.1.1
global pin
pin that carries a signal or power which enters or leaves the application board without any active
component in between
3.1.2
standard CXPI transceiver IC
standalone CXPI transceiver according to ISO 20794-4 or IC with integrated CXPI transceiver
cell with access to CXPI RXD and TXD signal
3.1.3
IC with embedded CXPI transceiver
IC with integrated CXPI transceiver cell and CXPI protocol handler, with or without access to
CXPI RXD and TXD signal
3.1.4
mandatory components
components needed for proper function of IC as specified by the IC manufacturer
3.1.5
commander node
node that provides schedule management (including ReqTypeId transmission), the primary
clock and optionally the sleep message transmission management
3.1.6
responder node
node other than commander node connected to the CXPI network
3.1.7
ReqTypeId
request type identifier, parameter that enables the polling method for dedicated measurement
data and/or control data
3.2 Abbreviated terms
ASSP application specific standard product
CRC cyclic redundancy check
CXPI clock extension peripheral interface
DLL data link layer
EN enable
FI frame information
IBS inter byte space
NRZ non-return to zero
IEC 62228-7:2026 © IEC 2026
PCB printed circuit board
PID protected identifier
PMA physical media attachment
PS physical signalling
RXD receive data
TXD transmit data
PWM pulse width modulation
RX PMA receiver interface signal
PWM
RXD PS receiver interface signal
NRZ
TX PMA transmit interface signal
PWM
TXD PS transmit interface signal
NRZ
UART universal asynchronous receiver/transmitter
V
ESD voltage level of ESD testing
4 General
The intention of this document is to evaluate the EMC performance of CXPI transceiver ICs
under application conditions in a minimal network. CXPI transceiver ICs are generally classified
into three types, as listed in Table 1.
Figure 1 shows a sample configuration of each type of CXPI transceiver IC. The overview of
the PHY sublayers follows ISO 20794-4. Standard type-A comprises a CXPI transceiver IC that
contains the PS sublayer and the PMA sublayer. Standard type-B contains only the PMA
sublayer. The embedded type includes a microcontroller or ASSP function, in addition to the
functions of standard type-A. The PMA sublayer transmits and receives communication data on
the bus-line in the PWM signal format. The PS sublayer has the clock generation function, the
encoding and decoding of CXPI frames and the bit-wise collision resolution logic. The
microcontroller or ASSP transmits and receives communication data in the NRZ signal format
according to the specifications of the application.
Table 1 – Types for CXPI transceiver
Transceiver classification CXPI transceiver type Communication sublayer implementation
Standard type-A With PMA and PS sublayer
Standard CXPI transceiver IC
Standard type-B With PMA sublayer only
IC with embedded CXPI transceiver Embedded type With PMA, PS sublayer and DLL

IEC 62228-7:2026 © IEC 2026
Key
1 TXD
NRZ
2 RXD
NRZ
3 TX
PWM
4 RX
PWM
5 CXPI network
6 clock (commander node only, provided externally or from micro controller)
7 standard type-A
8 standard type-B
9 embedded type
10 PS
11 PMA
12 microcontroller or ASSP etc. including DLL
Figure 1 – PHY sub-layers overview and CXPI transceiver types
The evaluation of the EMC characteristics of CXPI transceivers shall be performed in functional
operation modes under network conditions for RF emission, RF immunity and impulse immunity
tests, and on a single unpowered transceiver IC for electrostatic discharge tests.
The aim of these tests is to determine the EMC performance on dedicated global pins of the
CXPI transceiver that are considered EMC relevant in the application. For a standard CXPI
transceiver IC and an IC with an embedded CXPI transceiver, these pins are VBAT and CXPI.
The test methods used for EMC characterization are based on the international standards for
IC EMC tests and are described in Table 2.
Table 2 – Overview of required measurement and tests
Transceiver mode Required test Test method Evaluation Operation mode
150 Ω direct coupling
RF emission Spectrum Normal
(IEC 61967-4)
Normal
DPI
RF immunity Function
Functional (powered)
(IEC 62132-4) Sleep
Non-synchronous transient Normal
injection
Impulse immunity Function
Sleep
(IEC 62215-3)
Contact discharge
Passive (unpowered) ESD
Damage Unpowered
(ISO 10605)
IEC 62228-7:2026 © IEC 2026
The RF emission, RF immunity and impulse immunity test methods are selected for the
evaluation of EMC characteristic of transceivers in functional (powered) modes. These three
test methods are based on the same approach using conductive coupling. Therefore, it is
possible to use the same test board for all tests in functional operation mode, which reduces
the effort required and increases the reproducibility and comparability of test results.
The ESD test is performed on passive (unpowered) transceiver IC on a separate test board.
A general drawing of a schematic with details of the CXPI transceiver test network for the
targeted EMC tests is described in Annex A. All measurements and tests should be done with
soldered transceivers on test boards as described in Annex B, to ensure application like
conditions and avoid setup effects by sockets.
Annex C provides example test limits and levels for CXPI transceivers in automotive application.
In general, the test definition is done for standard CXPI transceiver ICs. For ICs with embedded
CXPI transceivers some adaptations are necessary which are described in this document.
Specific adaptations shall be made individually for the dedicated IC but shall follow the general
definitions identified.
5 Test and operating conditions
5.1 Supply and ambient conditions
For all tests and measurements under operating conditions, the settings are based on systems
with a 12 V power supply, which is the main application for CXPI transceivers. If a transceiver
is designed or targeted for a higher power supply voltage, the test conditions and test targets
shall be adapted and documented accordingly. The defined supply and ambient conditions for
functional operation are given in Table 3. Although the standard voltage of VCC is 5 V, other
ext
voltages such as 3,3 V can be supplied depending on the product.
Table 3 – Supply and ambient conditions for functional operation
Parameter Value
a
(14 ± 0,2) V (default)
Voltage supply VBAT
ext
a
(5 ± 0,1) V (default), (3,3 ± 0,1) V
Voltage supply VCC
ext
Test temperature (23 ± 5) °C
a
V means voltage at external terminal on the test board as shown e.g. in Figure A.1.
ext
For RF emission measurements, the ambient noise floor shall be at least 6 dB below the applied
target limit and documented in the test report.
Unpowered ESD tests shall be carried out without any supply voltage, and the requirements of
ISO 10605 climatic environmental conditions shall be applied.
5.2 Test operation modes
The CXPI transceiver ICs shall be tested in powered functional operation modes and in the
unpowered mode. The functional operation modes are normal mode and sleep mode.
IEC 62228-7:2026 © IEC 2026
5.3 Test configuration
5.3.1 General test configuration for functional test
The test configuration in general consists of CXPI transceivers with mandatory components and
additional components for filtering and decoupling (CXPI node) in a minimal test network,
ext
where filtered power supplies, signals, monitoring probes and coupling networks are connected
as shown in Figure 2. Node 1 is defined as the commander node, and Node 2 is defined as the
responder node.
Figure 2 – General test configuration for tests in functional operation modes
For evaluation of RF emission, RF immunity and the impulse immunity characteristics of a CXPI
transceiver in functional operation mode, a minimal CXPI test network consisting of two CXPI
transceiver ICs shall be used. Depending on the type of transceiver, the following network
configurations are defined:
– two transceivers of the same type in case of standard CXPI transceiver IC (DUT), or
– one IC with embedded CXPI transceiver (DUT) and one standard CXPI transceiver IC, or
two transceivers of the same type of embedded CXPI transceiver IC (DUT).
NOTE In specific cases or for analyses, a deviation from this setup can be agreed between the users of this
document and noted in the test report.
The CXPI network termination and bus filter including ESD suppression devices (e.g. Zener
diode), if used, shall comply with the time constant defined in ISO 20794-4. If an optional ESD
suppression device is used (e.g. to achieve a certain ESD or impulse immunity level) it shall be
used for all other tests of this document and documented in the test report.
A general drawing of a schematic with details of the CXPI transceiver test network for the
targeted EMC tests is described in Annex A.
IEC 62228-7:2026 © IEC 2026
5.3.2 General test configuration for unpowered ESD test
The general test configuration for unpowered ESD test of CXPI transceiver ICs consists of a
single CXPI transceiver IC with mandatory external components and additional components for
filtering and decoupling on a test board with discharge coupling networks as shown in Figure 3.

Figure 3 – General test configuration for unpowered ESD test
5.3.3 Coupling ports and coupling networks for functional tests
The coupling ports and coupling networks are used to transfer disturbances to or from the test
network with a defined transfer characteristic. The schematic of the coupling ports, networks
and pins are shown in Figure 4. The values of the components depend on the test method and
are defined in Table 4. The tolerance of the components should be 1 % or less.

Key
1 coupling ports
2 coupling networks
3 pin networks (including all external mandatory components for the respective pin)
4 RF connector
Figure 4 – Coupling ports and networks for functional tests
IEC 62228-7:2026 © IEC 2026
Table 4 – Definition of coupling ports and coupling network components
for functional tests
Port Type Purpose Component
R , R C , C R , R
CP1 CP2 CP1 CP2 CP1t CP2t
EMI1 RF emission measurement on CXPI 12
...