SIST EN IEC 62228-7:2022

SLOVENSKI STANDARD
01-junij-2022
Integrirana vezja - Vrednotenje elektromagnetne združljivosti (EMC) oddajnikov-
sprejemnikov - 7. del: Oddajniki-sprejemniki CXPI (IEC 62228-7:2022)
Integrated circuits - EMC evaluation of transceivers - Part 7: CXPI transceivers (IEC
62228-7:2022)
Integrierte Schaltungen - Bewertung der elektromagnetischen Verträglichkeit von Sende-
Empfangsgeräten – Teil 7: CXPI-Sende-Empfangsgeräte (IEC 62228-7:2022)
Circuits intégrés - Évaluation de la CEM des émetteurs-récepteurs - Partie 7: Émetteurs-
récepteurs CXPI (IEC 62228-7:2022)
Ta slovenski standard je istoveten z: EN IEC 62228-7:2022
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 62228-7

NORME EUROPÉENNE
EUROPÄISCHE NORM April 2022
ICS 31.200
English Version
Integrated circuits - EMC evaluation of transceivers - Part 7:
CXPI transceivers
(IEC 62228-7:2022)
Circuits intégrés - Évaluation de la CEM des émetteurs- Integrierte Schaltungen - Bewertung der
récepteurs - Partie 7: Émetteurs-récepteurs CXPI elektromagnetischen Verträglichkeit von Sende-
(IEC 62228-7:2022) Empfangsgeräten - Teil 7: CXPI-Sende-Empfangsgeräte
(IEC 62228-7:2022)
This European Standard was approved by CENELEC on 2022-03-29. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62228-7:2022 E

European foreword
The text of document 47A/1130/FDIS, future edition 1 of IEC 62228-7, prepared by SC 47A
"Integrated circuits" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN IEC 62228-7:2022.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022-12-29
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2025-03-29
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 62228-7:2022 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
CISPR 16-1-1 NOTE Harmonized as EN IEC 55016-1-1
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61967-1 - Integrated circuits - Measurement of EN IEC 61967-1 -
electromagnetic emissions - Part 1: General
conditions and definitions
IEC 61967-4 - Integrated circuits - Measurement of EN IEC 61967-4 -
electromagnetic emissions - Part 4:
Measurement of conducted emissions - 1
ohm/150 ohm direct coupling method
IEC 62132-1 - Integrated circuits - Measurement of EN 62132-1 -
electromagnetic immunity - Part 1: General
conditions and definitions
IEC 62132-4 2006 Integrated circuits - Measurement of EN 62132-4 2006
electromagnetic immunity 150 kHz to 1 GHz
- Part 4: Direct RF power injection method
IEC 62215-3 - Integrated circuits - Measurement of impulse EN 62215-3 -
immunity - Part 3: Non-synchronous
transient injection method
IEC 62228-1 - Integrated circuits - EMC evaluation of EN IEC 62228-1 -
transceivers - Part 1: General conditions and
definitions
ISO 7637-2 - Road vehicles - Electrical disturbances from - -
conduction and coupling - Part 2: Electrical
transient conduction along supply lines only
ISO 10605 - Road vehicles - Test methods for electrical - -
disturbances from electrostatic discharge
ISO 20794-4 - Road vehicles - Clock extension peripheral - -
interface (CXPI) - Part 4: Data link layer and
physical layer
IEC 62228-7 ®
Edition 1.0 2022-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – EMC evaluation of transceivers –

Part 7: CXPI transceivers
Circuits intégrés – Évaluation de la CEM des émetteurs-récepteurs –

Partie 7: Émetteurs-récepteurs CXPI

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-1083-2

– 2 – IEC 62228-7:2022 © IEC 2022
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviated terms . 8
3.1 Terms and definitions . 8
3.2 Abbreviated terms . 8
4 General . 9
5 Test and operating conditions . 11
5.1 Supply and ambient conditions. 11
5.2 Test operation modes . 11
5.3 Test configuration . 12
5.3.1 General test configuration for functional test . 12
5.3.2 General test configuration for unpowered ESD test . 13
5.3.3 Coupling ports and coupling networks for functional tests . 13
5.3.4 Coupling ports and coupling networks for unpowered ESD tests . 14
5.3.5 Power supply with decoupling network . 15
5.4 Test signals . 15
5.4.1 General . 15
5.4.2 Test signals for normal operation mode . 15
5.4.3 Test signal for wake-up from sleep mode . 17
5.5 Evaluation criteria . 18
5.5.1 General . 18
5.5.2 Evaluation criteria in functional operation modes during exposure to
disturbances . 18
5.5.3 Evaluation criteria in unpowered condition after exposure to
disturbances . 20
5.5.4 Status classes . 21
6 Test and measurement . 21
6.1 Emission of RF disturbances . 21
6.1.1 Test method . 21
6.1.2 Test setup . 21
6.1.3 Test procedure and parameters . 22
6.2 Immunity to RF disturbances . 22
6.2.1 Test method . 22
6.2.2 Test setup . 23
6.2.3 Test procedure and parameters . 24
6.3 Immunity to impulses . 26
6.3.1 Test method . 26
6.3.2 Test setup . 26
6.3.3 Test procedure and parameters . 27
6.4 Electrostatic discharge (ESD) . 30
6.4.1 Test method . 30
6.4.2 Test setup . 30
6.4.3 Test procedure and parameters . 32
7 Test report . 32
Annex A (normative) CXPI test circuits . 33
A.1 General . 33

IEC 62228-7:2022 © IEC 2022 – 3 –
A.2 CXPI test circuit for functional tests on standard type-A CXPI transceiver ICs . 33
A.3 CXPI test circuit for functional tests on standard type-B CXPI transceiver ICs . 36
A.4 CXPI test circuit for functional tests on ICs with embedded CXPI transceiver . 38
A.5 CXPI test circuit for unpowered ESD test on a standard type-A CXPI
transceiver IC . 39
A.6 CXPI test circuit for unpowered ESD test on a standard type-B CXPI
transceiver IC . 40
Annex B (normative) Test circuit boards. 42
B.1 Test circuit board for functional tests . 42
B.2 ESD test . 43
Annex C (informative) Examples for test limits for CXPI transceiver in automotive
application . 44
C.1 General . 44
C.2 Emission of RF disturbances . 44
C.3 Immunity to RF disturbances . 44
C.4 Immunity to impulse . 44
C.5 Electrostatic discharge (ESD) . 44
Annex D (informative) Example of setting for test signals . 45
Annex E (informative) Points to note for impulse immunity measurement for functional
status class A . 47
IC
E.1 General . 47
E.2 Points to note when testing Pulse 1 . 47
Bibliography . 49

Figure 1 – PHY sub-layers overview and CXPI transceiver types . 10
Figure 2 – General test configuration for tests in functional operation modes . 12
Figure 3 – General test configuration for unpowered ESD test . 13
Figure 4 – Coupling ports and networks for functional tests . 13
Figure 5 – Coupling ports and networks for unpowered ESD tests . 14
Figure 6 – Principal drawing of the maximum deviation in the I-V characteristic . 20
Figure 7 – Test setup for measurement of RF disturbances . 21
Figure 8 – Test setup for DPI tests. 23
Figure 9 – Test setup for impulse immunity tests . 27
Figure 10 – Test setup for direct ESD tests . 31
Figure A.1 – General drawing of the circuit diagram of the test network for standard
type-A CXPI transceiver ICs for functional tests . 35
Figure A.2 – General drawing of the circuit diagram of the test network for standard

type-B CXPI transceiver ICs for functional tests . 37
Figure A.3 – General drawing of the circuit diagram of the test network for ICs with
embedded CXPI transceiver for functional tests . 39
Figure A.4 – A general drawing of the test circuit diagram for testing direct ESD of
CXPI transceiver in unpowered mode . 40
Figure A.5 – A general drawing of the test circuit diagram for testing direct ESD of

CXPI standard Type-B transceiver in unpowered mode . 41
Figure B.1 – Example of IC interconnections of CXPI signal . 42
Figure B.2 – Example of ESD test board for CXPI transceiver ICs . 43
Figure D.1 – Example of signal setting for standard type-A in 2 transceiver
configuration . 45

– 4 – IEC 62228-7:2022 © IEC 2022
Figure D.2 – Example of signal setting for standard type-B in 2 transceiver
configuration . 46
Figure E.1 – Relationship between ISO 7637-2 Pulse 1 and transceiver VBAT supply . 47
Figure E.2 – Transceiver VBAT supply image when t time is shortened . 48
Table 1 – Types for CXPI transceiver . 9
Table 2 – Overview of required measurement and tests . 10
Table 3 – Supply and ambient conditions for functional operation . 11
Table 4 – Definition of coupling ports and coupling network components for functional

tests . 14
Table 5 – Definitions of coupling ports for unpowered ESD tests . 15
Table 6 – Communication test signal TX1 . 16
Table 7 – Communication test signal TX2 . 17
Table 8 – Communication test signal TX3 . 17
Table 9 – Wake-up test signal TX4 . 18
Table 10 – Evaluation criteria for standard type-A in functional operation modes . 19
Table 11 – Evaluation criteria for standard type-B in functional operation modes . 19
Table 12 – Evaluation criteria for ICs with embedded CXPI transceiver in functional
operation modes . 20
Table 13 – Parameters for emission measurements . 22
Table 14 – Settings for the RF measurement equipment . 22
Table 15 – Specifications for DPI tests . 24
Table 16 – Required DPI tests for functional status class AIC evaluation of standard
type-A . 25
Table 17 – Required DPI tests for functional status class AIC evaluation of standard

type-B . 25
Table 18 – Required DPI tests for functional status class AIC evaluation of ICs with
embedded CXPI transceiver. 25
Table 19 – Required DPI tests for functional status class CIC, D1IC or D2IC evaluation
of standard CXPI transceiver ICs and ICs with embedded CXPI transceiver . 26
Table 20 – Specifications for impulse immunity tests . 28
Table 21 – Parameters for impulse immunity tests . 28
Table 22 – Required impulse immunity tests for functional status class AIC evaluation

of standard type-A . 29
Table 23 – Required impulse immunity tests for functional status class AIC evaluation
of standard type-B . 29
Table 24 – Required impulse immunity tests for functional status class AIC evaluation
of ICs with embedded CXPI transceiver . 29
Table 25 – Required impulse immunity tests for functional status class CIC, D1IC or
D2IC evaluation of standard CXPI transceiver ICs and ICs with embedded CXPI
transceiver . 30
Table 26 – Specifications for direct ESD tests . 32
Table B.1 – Parameter ESD test circuit board . 43
Table C.1 – Example of limits for impulse immunity for functional status
class C or D . 44
IC IC
IEC 62228-7:2022 © IEC 2022 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
EMC EVALUATION OF TRANSCEIVERS –

Part 7: CXPI transceivers
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
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6) All users should ensure that they have the latest edition of this publication.
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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62228-7 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical
committee 47: Semiconductor devices. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
47A/1130/FDIS 47A/1133/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 6 – IEC 62228-7:2022 © IEC 2022
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 62228 series, published under the general title Integrated circuits –
EMC evaluation of transceivers, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

IEC 62228-7:2022 © IEC 2022 – 7 –
INTEGRATED CIRCUITS –
EMC EVALUATION OF TRANSCEIVERS –

Part 7: CXPI transceivers
1 Scope
This part of IEC 62228 specifies test and measurement methods for the EMC evaluation of
CXPI transceiver ICs under network condition. It defines test configurations, test conditions,
test signals, failure criteria, test procedures, test setups and test boards. This specification is
applicable for standard CXPI transceiver ICs and ICs with embedded CXPI transceiver and
covers
• the emission of RF disturbances,
• the immunity against RF disturbances,
• the immunity against impulses and
• the immunity against electrostatic discharges (ESD).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions – Part 1: General
conditions and definitions
IEC 61967-4, Integrated circuits – Measurement of electromagnetic emissions – Part 4:
Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
IEC 62132-1, Integrated circuits – Measurement of electromagnetic immunity – Part 1: General
conditions and definitions
IEC 62132-4:2006, Integrated circuits – Measurement of electromagnetic immunity 150 kHz to
1 GHz – Part 4: Direct RF power injection method
IEC 62215-3, Integrated circuits – Measurement of impulse immunity – Part 3:
Non-synchronous transient injection method
IEC 62228-1, Integrated circuits – EMC evaluation of transceivers – Part 1: General conditions
and definitions
ISO 7637-2, Road vehicles – Electrical disturbances from conduction and coupling – Part 2:
Electrical transient conduction along supply lines only
ISO 10605, Road vehicles – Test methods for electrical disturbances from electrostatic
discharge
ISO 20794-4, Road vehicles – Clock extension peripheral interface (CXPI) – Part 4: Data link
layer and physical layer
– 8 – IEC 62228-7:2022 © IEC 2022
ISO 20794-7:2020, Road vehicles – Clock extension peripheral interface (CXPI) – Part 7: Data
link and physical layer conformance test plan
3 Terms, definitions and abbreviated terms
For the purposes of this document, the terms and definitions given in IEC 62228-1, IEC 61967-1
and IEC 62132-1, as well as the following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1 Terms and definitions
3.1.1
global pin
pin that carries a signal or power, which enters or leaves the application board without any
active component in between
3.1.2
standard CXPI transceiver IC
standalone CXPI transceiver according to ISO 20794-4 or IC with integrated CXPI transceiver
cell with access to CXPI RXD and TXD signal
3.1.3
IC with embedded CXPI transceiver
IC with integrated CXPI transceiver cell and CXPI protocol handler but without access to CXPI
RXD or TXD signal
3.1.4
mandatory components, pl
components needed for proper function of IC as specified by the IC manufacturer
3.2 Abbreviated terms
ASSP application specific standard product
CRC cyclic redundancy check
CXPI Clock Extension Peripheral Interface
DLL data link layer
EN enable
FI frame information
IBS inter byte space
NRZ non-return to zero
PCB printed circuit board
PID protected identifier
PMA physical media attachment
PS physical signalling
PWM pulse width modulation
RX output signal for receiver in CXPI bus-line driver
PWM
RXD output signal for receiver in CXPI codec circuit
NRZ
IEC 62228-7:2022 © IEC 2022 – 9 –
TX input signal for transmitter in CXPI bus-line driver
PWM
TXD input signal for transmitter in CXPI codec circuit
NRZ
UART universal asynchronous receiver / transmitter

4 General
The intention of this document is to evaluate the EMC performance of CXPI transceiver ICs
under application conditions in a minimal network. CXPI Transceiver ICs are generally classified
into three types, as listed in Table 1.
Figure 1 shows a sample configuration of each type of CXPI transceiver IC. The overview of
the PHY sublayers is following ISO 20794-4. Standard type-A comprises a CXPI transceiver IC
that contains the PS sublayer and the PMA sublayer. Standard type-B contains only the PMA
sublayer. The Embedded type includes a microcontroller or ASSP function, in addition to the
functions of Standard type-A. The PMA sublayer transmits and receives communication data
on the bus line in the PWM signal format. The PS sublayer has the clock generation function,
the encoding and decoding of CXPI frames and the bit-wise collision resolution logic. The
microcontroller or ASSP transmits and receives the communication data in the NRZ signal
format according to the specifications of the application.
Table 1 – Types for CXPI transceiver
Communication sublayer
Transceiver classification CXPI transceiver type
implementation
Standard type-A with PMA and PS sublayer
Standard CXPI transceiver IC
Standard type-B with PMA sublayer only
IC with embedded CXPI transceiver Embedded type with PMA, PS sublayer and DLL

– 10 – IEC 62228-7:2022 © IEC 2022

Key
1 TXD
NRZ
2 RXD
NRZ
3 TX
PWM
4 RX
PWM
5 CXPI network
6 Clock (master node only, provided externally or from micro controller)
7 Standard type-A
8 Standard type-B
9 Embedded type
10 PMA
11 PS
12 Microcontroller or ASSP etc. including DLL
Figure 1 – PHY sub-layers overview and CXPI transceiver types
The evaluation of the EMC characteristics of CXPI transceivers shall be performed in functional
operation modes under network conditions for RF emission, RF immunity and impulse immunity
tests, and on a single unpowered transceiver IC for electrostatic discharge tests.
The aim of these tests is to determine the EMC performance of the CXPI transceiver on
dedicated global pins, which are considered as EMC relevant in the application. For a standard
CXPI transceiver IC and an IC with an embedded CXPI transceiver, these pins are VBAT and
CXPI.
The test methods used for EMC characterization are based on the international standards for
IC EMC tests and are described in Table 2.
Table 2 – Overview of required measurement and tests
Functional
Transceiver mode Required test Test method Evaluation
operation mode
150 Ω direct
coupling
RF emission Spectrum Normal
(IEC 61967-4)
DPI Normal
Functional
RF immunity Function
(powered)
(IEC 62132-4) Sleep
Non-synchronous Normal
transient injection
Impulse immunity Function
Sleep
(IEC 62215-3)
Contact discharge
Passive
ESD Damage Unpowered
(unpowered)
(ISO 10605)
IEC 62228-7:2022 © IEC 2022 – 11 –
The RF emission, RF immunity and impulse immunity test methods are selected for the
evaluation of EMC characteristic of transceivers in functional (powered) modes. These three
test methods are based on the same approach using conductive coupling. Therefore, it is
possible to use the same test board for all tests in functional operation mode, which reduces
the effort required and increases the reproducibility and comparability of test results.
The ESD test is performed on passive (unpowered) transceiver IC on a separate test board.
All measurements and tests should be done with soldered transceivers on test boards as
described in Annex B, to ensure application like conditions and avoid setup effects by sockets.
Annex C provides example test limits and levels for CXPI transceivers in automotive application.
In general, the test definition is done for standard CXPI transceiver ICs. For ICs with embedded
CXPI transceivers some adaptations are necessary which are described in this document.
Specific adaptations shall be done individually for the dedicated IC but shall follow the general
definitions identified.
5 Test and operating conditions
5.1 Supply and ambient conditions
For all tests and measurements under operating conditions, the settings are based on systems
with a 12 V power supply, which is the main application for CXPI transceivers. If a transceiver
is designed or targeted for a higher power supply voltage, the test conditions and test targets
shall be adapted and documented accordingly. The defined supply and ambient conditions for
functional operation are given in Table 3. Although the standard voltage of VCC is 5 V, other
ext
voltages such as 3,3 V may be supplied depending on the product.
Table 3 – Supply and ambient conditions for functional operation
Parameter Value
Voltage supply VBAT (14 ± 0,2) V (default)
ext
Voltage supply VCC (5 ± 0,1) V (default), (3,3 ± 0,1) V
ext
Test temperature (23 ± 5) °C
For RF emission measurements, the ambient noise floor shall be at least 6 dB below the applied
target limit and documented in the test report.
Unpowered ESD tests shall be carried out without any supply voltage, and the requirements of
ISO 10605 climatic environmental conditions shall be applied.
5.2 Test operation modes
The CXPI transceiver ICs shall be tested in powered functional operation modes and in the
unpowered mode. The functional operation modes are normal mode and sleep mode.

– 12 – IEC 62228-7:2022 © IEC 2022
5.3 Test configuration
5.3.1 General test configuration for functional test
The test configuration in general consists of CXPI transceivers with mandatory external
node) in a minimal test
components and components for filtering and decoupling (CXPI
ext
network, where filtered power supplies, signals, monitoring probes and coupling networks are
connected as shown in Figure 2. Node 1 is defined as the master node, and Node 2 is defined
as the slave node.
Figure 2 – General test configuration for tests in functional operation modes
For evaluation of RF emission, RF immunity and the impulse immunity characteristics of a CXPI
transceiver in functional operation mode, a minimal CXPI test network consisting of two CXPI
transceiver ICs shall be used. Depending on the type of transceiver the following network
configurations are defined:
• two transceivers of same type in case of standard CXPI transceiver IC (DUT), or
• one IC with embedded CXPI transceiver (DUT) and one standard CXPI transceiver IC.
NOTE In specific cases or for analyses, a deviation from this setup can be agreed between the users of this
document and will be noted in the test report.
The CXPI network termination and bus filter including ESD suppression devices (e.g. zener
diode) if used, shall comply with the time constant defined in ISO 20794-4. If an optional ESD
suppression device is used (e.g. to achieve a certain ESD or impulse immunity level) it shall be
used for all other tests of this document and documented in the test report.
A general drawing of a schematic with more details of the CXPI transceiver test network is given
in Annex A.
IEC 62228-7:2022 © IEC 2022 – 13 –
5.3.2 General test configuration for unpowered ESD test
The general test configuration for unpowered ESD test of CXPI transceiver ICs consists of a
single CXPI transceiver IC with mandatory external components and components for filtering
on a test board with discharge coupling networks as shown in Figure 3.

Figure 3 – General test configuration for unpowered ESD test
5.3.3 Coupling ports and coupling networks for functional tests
The coupling ports and coupling networks are used to transfer disturbances to or from the test
network with a defined transfer characteristic. The schematic of the coupling ports, networks
and pins are shown in Figure 4. The values of the components depend on the test method and
are defined in Table 4. The tolerance of the components should be 1 % or less.

Key
1 Coupling ports
2 Coupling networks
3 Pin networks (including all external mandatory components for the respective pin)
4 RF connector
Figure 4 – Coupling ports and networks for functional tests

– 14 – IEC 62228-7:2022 © IEC 2022
Table 4 – Definition of coupling ports and coupling
network components for functional tests
Port Type Purpose Component
R , R C , C R , R
CP1 CP2 CP1 CP2 CP1t CP2t
EMI1 RF emission measurement on CXPI 120 Ω 4,7 nF 51 Ω
CP1 RF1 RF coupling for test on CXPI 0 Ω 4,7 nF not used
IMP1 Impulse coupling on CXPI 0 Ω 1,0 nF not used
EMI2 RF emission measurement on VBAT 120 Ω 6,8 nF 51 Ω
CP2 RF2 RF coupling for test on VBAT 0 Ω 6,8 nF not used
IMP2 Impulse coupling on VBAT 0 Ω Shorted not used

The test configurations with coupling ports and coupling networks connected to the CXPI test
network are given in the general drawing of schematics in Figure A.1 for standard type-A CXPI
transceiver ICs, in Figure A.2 for standard type-B CXPI transceiver ICs and in Figure A.3 for
ICs with embedded CXPI transceiver.
The characterization of the coupling ports and coupling networks is carried out as follows:
The magnitude of insertion losses (S21 measurement) between the ports CP1, CP2 and the
respective transceiver signal pads on the test board shall be measured and documented in the
test report. For this characterization, the coupling port shall be configured for the RF immunity
or emission test and the CXPI transceiver ICs shall be removed. All other components which
are directly connected to the coupling port (e.g. filter to power supply or loads) remain on the
test board.
5.3.4 Coupling ports and coupling networks for unpowered ESD tests
The coupling ports and coupling networks used for unpowered direct ESD tests connect the
discharge points to the CXPI transceiver IC test circuitry. The schematic and definitions of the
coupling ports, networks and pins are given in Figure 5 and Table 5.

Key
1 Coupling ports
2 Coupling networks
3 Pin networks (including all external mandatory components for the respective pin)
4 Discharge point
Figure 5 – Coupling ports and networks for unpowered ESD tests

IEC 62228-7:2022 © IEC 2022 – 15 –
Table 5 – Definitions of coupling ports for unpowered ESD tests
Port Type Purpose Component
a
CP1 ESD1 ESD coupling on CXPI
Metal trace for galvanic connection
a
CP2 ESD2 ESD coupling on VBAT
Metal trace for galvanic connection
a
The optional resistors R1 and R2 with R ≥ 200 kΩ are used to avoid static pre-charge at the discharge point
caused by the ESD generator. Sparking over at these resistors at high test levels shall be avoided. If a static
pre-charge is prevented by the ESD generator construction, these resistors are not needed. Alternatively, an
external resistor can be used to remove the pre-charge on each discharge point before each single test.

5.3.5 Power supply with decoupling network
In the general test configurations, decoupling circuits shall be added to the supply lines such
as VBAT and VCC.
See Annex A for an example of decoupling circuits on a test configuration with two CXPI
transceiver ICs.
5.4 Test signals
5.4.1 General
Depending on the transceiver type, different test signals are defined for communication in
normal operation mode and wake-up from sleep mode.
5.4.2 Test signals for normal operation mode
The commu
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