SIST EN IEC 61967-8:2023

SLOVENSKI STANDARD
01-september-2023
Integrirana vezja - Meritve elektromagnetnega sevanja - 8. del: Merjenje sevanega
oddajanja - Metoda z IC na tračnem valovodu (IEC 61967-8:2023)
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement
of radiated emissions - IC stripline method (IEC 61967-8:2023)
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 8:
Messung der abgestrahlten Aussendungen - IC-Streifenleiterverfahren (IEC 61967-
8:2023)
Circuits intégrés - Mesure des émissions électromagnétiques - Partie 8: Mesure des
émissions rayonnées - Méthode de la ligne TEM à plaques (stripline) pour CI (IEC 61967
-8:2023)
Ta slovenski standard je istoveten z: EN IEC 61967-8:2023
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61967-8

NORME EUROPÉENNE
EUROPÄISCHE NORM June 2023
ICS 31.200 Supersedes EN 61967-8:2011
English Version
Integrated circuits - Measurement of electromagnetic emissions -
Part 8: Measurement of radiated emissions - IC stripline method
(IEC 61967-8:2023)
Circuits intégrés - Mesure des émissions Integrierte Schaltungen - Messung von
électromagnétiques - Partie 8: Mesure des émissions elektromagnetischen Aussendungen - Teil 8: Messung der
rayonnées - Méthode de la ligne TEM à plaques (stripline) abgestrahlten Aussendungen - IC-Streifenleiterverfahren
pour circuit intégré (IEC 61967-8:2023)
(IEC 61967-8:2023)
This European Standard was approved by CENELEC on 2023-06-07. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61967-8:2023 E

European foreword
The text of document 47A/1152/FDIS, future edition 2 of IEC 61967-8, prepared by SC 47A
"Integrated circuits" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN IEC 61967-8:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-03-07
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-06-07
document have to be withdrawn
This document supersedes EN 61967-8:2011 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
This document has been prepared under a Standardization Request given to CENELEC by the
European Commission and the European Free Trade Association.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61967-8:2023 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 61967-2 NOTE Approved as EN 61967-2
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60050-131 - International Electrotechnical Vocabulary - - -
Part 131: Circuit theory
IEC 60050-161 - International Electrotechnical Vocabulary. - -
Chapter 161: Electromagnetic compatibility
IEC 61000-4-20 - Electromagnetic compatibility (EMC) - Part EN IEC 61000-4-20 -
4-20: Testing and measurement
techniques - Emission and immunity
testing in transverse electromagnetic
(TEM) waveguides
IEC 61967-1 - Integrated circuits - Measurement of EN IEC 61967-1 -
electromagnetic emissions - Part 1:
General conditions and definitions

IEC 61967-8 ®
Edition 2.0 2023-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions –

Part 8: Measurement of radiated emissions – IC stripline method

Circuits intégrés – Mesure des émissions électromagnétiques –

Partie 8: Mesure des émissions rayonnées – Méthode de la ligne TEM à plaques

(stripline) pour circuit intégré

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-6932-9

– 2 – IEC 61967-8:2023 © IEC 2023
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General . 7
5 Test conditions . 7
5.1 General . 7
5.2 Supply voltage . 7
5.3 Frequency range . 7
6 Test equipment . 8
6.1 General . 8
6.2 RF measuring instrument . 8
6.3 Preamplifier . 8
6.4 IC stripline . 8
6.5 50 Ω termination . 8
7 Test set-up . 8
7.1 General . 8
7.2 Test configuration . 9
7.3 EMC test board (PCB) . 9
8 Test procedure . 9
8.1 General . 9
8.2 Ambient conditions. 9
8.3 Operational check . 10
8.4 Verification of IC stripline RF characteristic . 10
8.5 Test technique . 10
9 Test report . 11
9.1 General . 11
9.2 Measurement conditions . 11
10 IC Emissions reference levels . 11
Annex A (normative) IC stripline description . 12
A.1 General . 12
A.2 Characteristic impedance of stripline arrangements . 13
A.3 Conversion for different active conductor heights . 14
A.4 Example for IC stripline arrangement . 14
Annex B (informative) Specification of emission levels . 15
B.1 Scope . 15
B.2 General . 15
B.3 Specification of emission levels . 15
B.4 Presentation of results . 15
Bibliography . 17

Figure 1 – IC stripline test set-up . 9
Figure A.1 – Cross-section view of an example of an unshielded IC stripline . 12
Figure A.2 – Cross-section view of an example of an IC stripline with housing . 12
Figure A.3 – Example of IC stripline with housing . 14

IEC 61967-8:2023 © IEC 2023 – 3 –
Figure B.1 – Emission characterization levels . 16

Table A.1 – Maximum DUT dimensions for 6,7 mm IC stripline open version. 13
Table A.2 – Maximum DUT dimensions for 6,7 mm IC stripline closed version . 13

– 4 – IEC 61967-8:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –

Part 8: Measurement of radiated emissions –
IC stripline method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61967-8 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical
committee 47: Semiconductor devices. It is an International Standard.
This second edition cancels and replaces the first edition published in 2011. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) frequency range of 150 kHz to 3 GHz was deleted from the scope;
b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements
are fulfilled.
IEC 61967-8:2023 © IEC 2023 – 5 –
The text of this International Standard is based on the following documents:
Draft Report on voting
47A/1152/FDIS 47A/1153/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts of the IEC 61967 series, under the general title Integrated circuits –
Measurement of electromagnetic emissions can be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

– 6 – IEC 61967-8:2023 © IEC 2023
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –

Part 8: Measurement of radiated emissions –
IC stripline method
1 Scope
This part of IEC 61967 defines a method for measuring the electromagnetic radiated emission
from an integrated circuit (IC) using an IC stripline. The IC being evaluated is mounted on an
EMC test board (PCB) between the active conductor and the ground plane of the IC stripline
arrangement.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050-131, International Electrotechnical Vocabulary (IEV) – Part 131: Circuit theory
IEC 60050-161, International Electrotechnical Vocabulary (IEV) – Chapter 161: Electro-
magnetic compatibility
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions – Part 1: General
conditions and definitions
IEC 61000-4-20, Electromagnetic compatibility (EMC) – Part 4-20: Testing and measurement
techniques – Emission and immunity testing in transverse electromagnetic (TEM) waveguides
3 Terms and definitions
For the purposes of
...