31.200 - Integrated circuits. Microelectronics

See the scope of IEC 62566-2:2020. Adoption of IEC 62566-2:2020 is to be done without modification.

IEC 62433-6:2020 describes the extraction flow for deriving an immunity macro-model of an Integrated Circuit (IC) against conducted Electrostatic Discharge (ESD) according to IEC 61000-4-2 and Electrical Fast Transients (EFT) according to IEC 61000-4-4. The model addresses physical damages due to overvoltage, thermal damage and other failure modes. Functional failures can also be addressed. This model allows the immunity simulation of the IC in an application. This model is commonly called "Inte...view more

The contents of the corrigendum of September 2020 have been included in this copy.

IEC 62433-6:2020 describes the extraction flow for deriving an immunity macro-model of an Integrated Circuit (IC) against conducted Electrostatic Discharge (ESD) according to IEC 61000-4-2 and Electrical Fast Transients (EFT) according to IEC 61000-4-4.
The model addresses physical damages due to overvoltage, thermal damage and other failure modes. Functional failures can also be addressed. This model allows the immunity simulation of the IC in an application. This model is commonly called "Int...view more

TAN - // IEC Corrigendum

This standard specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.

This part of IEC 62228 specifies test and measurement methods for EMC evaluation of CAN
transceiver ICs under network condition. It defines test configurations, test conditions, test
signals, failure criteria, test procedures, test setups and test boards. It is applicable for CAN
standard transceivers, CAN transceivers with partial networking functionality and CAN
transceivers with flexible data rate capability and covers
• the emission of RF disturbances,
• the immunity against RF disturb...view more

This part of IEC 62433 specifies the framework and methodology for EMC IC macro-modelling.
Terms that are commonly used in IEC 62433 (all parts), different modelling approaches,
requirements and data-exchange format for each model category that is standardized in this
series are defined in this document.

This part of IEC 62228 specifies test and measurement methods for EMC evaluation of CAN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for CAN standard transceivers, CAN transceivers with partial networking functionality and CAN transceivers with flexible data rate capability and covers - the emission of RF disturbances, - the immunity against RF disturbances,...view more

IEC 62433-1:2019(E) specifies the framework and methodology for EMC IC macro-modelling. Terms that are commonly used in IEC 62433 (all parts), different modelling approaches, requirements and data-exchange format for each model category that is standardized in this series are defined in this document. IEC 62433-1 cancels and replaces IEC TS 62433-1 published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to I...view more

This part of IEC 61967 provides general information and definitions on the measurement of
conducted and radiated electromagnetic disturbances from integrated circuits. It also provides
a description of measurement conditions, test equipment and set-up as well as the test
procedures and content of the test reports. Test method comparison tables are included in
Annex A to assist in selecting the appropriate measurement method(s).
The object of this document is to describe general conditions i...view more

IEC 62228-3:2019 specifies test and measurement methods for EMC evaluation of CAN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for CAN standard transceivers, CAN transceivers with partial networking functionality and CAN transceivers with flexible data rate capability and covers
- the emission of RF disturbances,
- the immunity against RF disturbances,
- ...view more

IEC 62433-1:2019 specifies the framework and methodology for EMC IC macro-modelling. Terms that are commonly used in IEC 62433 (all parts), different modelling approaches, requirements and data-exchange format for each model category that is standardized in this series are defined in this document.
IEC 62433-1 cancels and replaces IEC TS 62433-1 published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to IEC...view more

This part of IEC 61967 provides general information and definitions on the measurement of conducted and radiated electromagnetic disturbances from integrated circuits. It also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. Test method comparison tables are included in Annex A to assist in selecting the appropriate measurement method(s). The object of this document is to describe general conditions in ord...view more

IEC 61967-1:2018 is available as IEC 61967-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61967-1:2018 provides general information and definitions on the measurement of conducted and radiated electromagnetic disturbances from integrated circuits. It also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test...view more

IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
Power devices, RF devices and micro-electromechanical systems (MEMS) are not in the scope of this document.

This part of IEC 62228 provides general information and definitions for electromagnetic
compatibility (EMC) evaluation of integrated circuits (IC) with transceivers for wired network
applications under network condition. It defines general test conditions, general test setups
and test and measurement methods are applied to all parts of IEC 62228.

IEC 62228-1:2018(E) provides general information and definitions for electromagnetic compatibility (EMC) evaluation of integrated circuits (IC) with transceivers for wired network applications under network condition. It defines general test conditions, general test setups and test and measurement methods are applied to all parts of IEC 62228.