IEC 61967-1:2018

IEC 61967-1 ®
Edition 2.0 2018-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Integrated circuits – Measurement of electromagnetic emissions –
Part 1: General conditions and definitions
Circuits intégrés – Mesure des émissions électromagnétiques –
Partie 1: Conditions générales et définitions
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing 21 000 terms and definitions in
Technical Specifications, Technical Reports and other English and French, with equivalent terms in 16 additional
documents. Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical
iPad. Vocabulary (IEV) online.

IEC publications search - webstore.iec.ch/advsearchform IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a 67 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and

CISPR.
IEC Just Published - webstore.iec.ch/justpublished

Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.

Catalogue IEC - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
Application autonome pour consulter tous les renseignements
Le premier dictionnaire en ligne de termes électroniques et
bibliographiques sur les Normes internationales,
électriques. Il contient 21 000 termes et définitions en anglais
Spécifications techniques, Rapports techniques et autres
et en français, ainsi que les termes équivalents dans 16
documents de l'IEC. Disponible pour PC, Mac OS, tablettes
langues additionnelles. Egalement appelé Vocabulaire
Android et iPad.
Electrotechnique International (IEV) en ligne.

Recherche de publications IEC -
Glossaire IEC - std.iec.ch/glossary
webstore.iec.ch/advsearchform
67 000 entrées terminologiques électrotechniques, en anglais
La recherche avancée permet de trouver des publications IEC et en français, extraites des articles Termes et Définitions des
en utilisant différents critères (numéro de référence, texte, publications IEC parues depuis 2002. Plus certaines entrées
comité d’études,…). Elle donne aussi des informations sur les antérieures extraites des publications des CE 37, 77, 86 et
projets et les publications remplacées ou retirées. CISPR de l'IEC.

IEC Just Published - webstore.iec.ch/justpublished Service Clients - webstore.iec.ch/csc
Restez informé sur les nouvelles publications IEC. Just Si vous désirez nous donner des commentaires sur cette
Published détaille les nouvelles publications parues. publication ou si vous avez des questions contactez-nous:
Disponible en ligne et aussi une fois par mois par email. sales@iec.ch.

IEC 61967-1 ®
Edition 2.0 2018-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Integrated circuits – Measurement of electromagnetic emissions –
Part 1: General conditions and definitions
Circuits intégrés – Mesure des émissions électromagnétiques –
Partie 1: Conditions générales et définitions
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-6284-9
– 2 – IEC 61967-1:2018 © IEC 2018
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test conditions . 10
4.1 General . 10
4.2 Ambient conditions. 10
4.2.1 General . 10
4.2.2 Ambient temperature . 11
4.2.3 Ambient RF field strength . 11
4.2.4 Other ambient conditions . 11
4.2.5 IC stability over time . 11
5 Test equipment . 11
5.1 General . 11
5.2 Shielding . 11
5.3 RF measuring instrument . 11
5.3.1 General . 11
5.3.2 Measuring receiver . 11
5.3.3 Spectrum analyser . 12
5.3.4 Other RBW for narrowband emissions . 12
5.3.5 Emission type, detector type and sweep speed . 12
5.3.6 Video bandwidth . 12
5.3.7 Verification of calibration for the RF measuring instrument . 12
5.4 Frequency range . 13
5.5 Preamplifier or attenuator . 13
5.6 System gain . 13
5.7 Other components . 13
6 Test set-up . 13
6.1 General . 13
6.2 Test circuit board . 13
6.3 IC pin loading. 13
6.4 Power supply requirements – Test board power supply . 14
6.5 IC specific considerations . 14
6.5.1 IC supply voltage . 14
6.5.2 IC decoupling . 14
6.5.3 Activity of IC . 14
6.5.4 Guidelines regarding IC operation . 14
7 Test procedure . 15
7.1 Ambient RF noise check . 15
7.2 Operational check . 15
7.3 Specific procedures . 15
8 Test report . 15
8.1 General . 15
8.2 Ambient RF noise . 15
8.3 Description of device . 15
8.4 Description of set-up . 16

8.5 Description of software . 16
8.6 Data presentation . 16
8.6.1 General . 16
8.6.2 Graphical presentation . 16
8.6.3 Measurement data . 16
8.6.4 Data processing . 16
8.7 RF emission limits . 16
8.8 Interpretation of results . 16
8.8.1 Comparison between IC(s) using the same test method . 16
8.8.2 Comparison between different test methods . 16
8.8.3 Correlation to module test methods . 16
Annex A (informative) Test method comparison tables . 17
Annex B (informative) Flow chart of a counter test code . 19
Annex C (informative) Description of worst-case application software . 20
Annex D (informative) General test board description . 21
D.1 General . 21
D.2 Board description – Mechanical . 21
D.3 Board description – Electrical . 21
D.4 Ground planes . 21
D.5 Package pins . 22
D.5.1 General . 22
D.5.2 DIL packages . 22
D.5.3 SOP, PLCC, QFP packages . 22
D.5.4 PGA packages . 22
D.5.5 BGA packages . 22
D.6 Via diameters . 22
D.7 Via distance . 22
D.8 Additional components . 22
D.9 Supply decoupling. 22
D.9.1 General . 22
D.9.2 IC decoupling capacitors . 23
D.9.3 Power supply decoupling for the test board . 23
D.10 I/O load . 23
Bibliography . 25

Figure B.1 – Test code flow chart . 19
Figure D.1 – Example of an emission test board . 24

Table 1 – Measuring receiver bands and resolution bandwidth (RBW) default settings . 11
Table 2 – Spectrum analyser bands and RBW default settings . 12
Table 3 – IC pin loading recommendations . 14
Table A.1 – Conducted emission . 17
Table A.2 – Radiated emission . 18
Table D.1 – Position of vias over the board . 21

– 4 – IEC 61967-1:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –

Part 1: General conditions and definitions

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61967-1 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
This second edition cancels and replaces the first edition published in 2002. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) the frequency range of 150 kHz to 1 GHz has been deleted from the title;
b) the frequency step above 1 GHz has been added to Table 1, Table 2 and to 5.4;
c) Table A.1 has been divided into two tables, and IEC 61967-8 has been added to Table A.2
of Annex A;
d) the general test board description has been moved to Annex D.

The text of this International Standard is based on the following documents:
FDIS Report on voting
47A/1062/FDIS 47A/1066/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 61967 series, under the general title Integrated circuits –
Measurement of electromagnetic emissions, can be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – IEC 61967-1:2018 © IEC 2018
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –

Part 1: General conditions and definitions

1 Scope
This part of IEC 61967 provides general information and definitions on the measurement of
conducted and radiated electromagnetic disturbances from integrated circuits. It also provides
a description of measurement conditions, test equipment and set-up as well as the test
procedures and content of the test reports. Test method comparison tables are included in
Annex A to assist in selecting the appropriate measurement method(s).
The object of this document is to describe general conditions in order to establish a uniform
testing environment and to obtain a quantitative measure of RF disturbances from integrated
circuits (IC). Critical parameters that are expected to influence the test results are described.
Deviations from this document are noted explicitly in the individual test report. The
measurement results can be used for comparison or other purposes.
Measurement of the voltage and current of conducted RF emissions or radiated RF
disturbances, coming from an integrated circuit under controlled conditions, yields information
about the potential for RF disturbances in an application of the integrated circuit.
The applicable frequency range is described in each part of IEC 61967.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
CISPR 16-1-1, Specification for radio disturbance and immunity measuring apparatus and
Methods – Part 1-1: Radio disturbance and immunity measuring apparatus – Measuring
apparatus
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
artificial network
AN
network presenting a reference load impedance (simulated) to the DUT (e.g. extended power
or communication lines) across which the RF disturbance voltage is measured and which
isolates the apparatus from the power supply or loads in a given frequency range

Note 1 to entry: This note applies to the French language only.
3.2
associated equipment
transducers (e.g. probes, networks and antennae) connected to a measuring receiver or test
generator, also transducers used in the signal or disturbance transmission path between a
DUT and measuring equipment or a (test-) signal generator
3.3
broadband disturbance
broadband emission
electromagnetic disturbance which has a bandwidth greater than that of a particular
measuring apparatus, receiver or susceptible device
Note 1 to entry: For some purposes, particular spectral components of a broadband disturbance may be
considered as narrowband disturbances.
Note 2 to entry: Emission that has a bandwidth greater than that of a particular measuring apparatus or receiver.
[SOURCE: IEC 60050-161:1990, 161-06-11, modified – Note 2 to entry and the second
preferred term "broadband emission" have been added.]
3.4
common mode voltage
asymmetrical disturbance voltage
mean of the phasor voltages appearing between each conductor and a specified reference,
usually earth or frame
[SOURCE: IEC 60050-161:1990, 161-04-09, modified – The word "disturbance" has been
added to the admitted term.]
3.5
common mode current
vector sum of the currents flowing through two or more conductors at a specified cross-
section of a mathematical plane intersected by these conductors
3.6
conducted emission
transient and/or other disturbance observed on the external terminals of a device during its
normal operation
3.7
continuous disturbance
electromagnetic disturbance the effects of which on a particular device or equipment cannot
be resolved into a succession of distinct effects
Note 1 to entry: RF disturbance with a duration of more than 200 ms at the IF-output of a measuring receiver that
causes a deflection on the meter of a measuring receiver in quasi-peak detection mode that does not decrease
immediately.
[SOURCE: IEC 60050-161:1990, 161-02-11, modified – Note 1 to entry has been added.]
3.8
DUT
device under test
device, equipment or system being evaluated
Note 1 to entry: As used in this document, DUT refers to a semiconductor device being tested.
Note 2 to entry: This note applies to the French language only.

– 8 – IEC 61967-1:2018 © IEC 2018
3.9
die shrink
reduction of die size by using an advanced fabrication process including finer lithography
node and masks
3.10
differential mode current
in a two-conductor cable, or for two particular conductors in a multi-conductor cable, half the
magnitude of the difference of the phasors representing the currents in each conductor
[SOURCE: IEC 60050-161:1990, 161-04-38]
3.11
differential mode voltage
voltage between any two of a specified set of active conductors
[SOURCE: IEC 60050-161:1990, 161-04-08, modified – The second preferred term
"symmetrical voltage" has been removed.]
3.12
discontinuous disturbance
electromagnetic disturbance, the effects of which on a particular device or equipment can be
resolved into a succession of distinct effects
Note 1 to entry: It is recognised that this definition does not characterise the disturbance independently of the
effect that it produces. As a practical matter, any measure of a disturbance should be relatable to its effect on a
susceptible device.
Note 2 to entry: For counted clicks, disturbance with a duration of less than 200 ms at the IF-output of a
measuring receiver, which causes a transient deflection on the meter of a measuring receiver in quasi-peak
detection mode.
[SOURCE: IEC 60050-161:1990, 161-02-28, modified – Note 2 to entry has been added.]
3.13
electrically small PCB
printed circuit board with length and width shorter than λ/2, for example 100 mm to 150 mm
at 1 GHz
3.14
EMC
electromagnetic compatibility
ability of an apparatus or system to function satisfactorily in its electromagnetic environment
without introducing intolerable electromagnetic disturbances to anything in that environment
3.15
electromagnetic emission
phenomenon by which electromagnetic energy emanates from a source
3.16
electromagnetic radiation
radiated emission
1) phenomenon by which energy in the form of electromagnetic waves emanates from a
source into space
2) energy transferred through space in the form of electromagnetic waves
[SOURCE: IEC 60050-161:1990, 161-01-10, modified – The second preferred term "radiated
emission" has been added and the Note to entry has been omitted.]

3.17
emission limit
specified maximum emission level of a source of electromagnetic
disturbance
[SOURCE: IEC 60050-161:1990, 161-03-12]
3.18
ground reference plane
flat conductive surface whose potential is used as a common reference
[SOURCE: IEC 60050-161:2014, 161-04-36, modified – The term "reference-ground plane"
has been changed to "ground reference plane", the definition has been condensed and the
notes to entry, omitted.]
3.19
lead frame
supporting structure for the silicon die that interfaces the external pins to the die
3.20
measuring receiver
receiver for the measurement of disturbances with different detectors
Note 1 to entry: The bandwidth of the receiver should be as specified in CISPR 16-1-1.
3.21
narrowband emission
electromagnetic disturbance, or spectral component thereof, which has a bandwidth less than
or equal to that of a particular measuring apparatus, receiver or susceptible device
Note 1 to entry: Emission with bandwidth less than that of a particular measuring apparatus or receiver.
[SOURCE: IEC 60050-161:1990, 161-06-13, modified – The term "narrowband disturbance"
has been changed to "narrowband emission" and Note 1 to entry has been added.]
3.22
peak detector
detector, the output voltage of which is the peak value of the applied signal
[SOURCE: IEC 60050-161:1990, 161-04-24]
3.23
preamp noise floor
inherent thermal noise generated by the first stage amplifier that limits the signal resolution of
the measurement system
3.24
receiver terminal voltage
antenna voltage
voltage generated by a source of radio disturbance and measured in dB (µV) by a radio
disturbance measuring instrument conforming to the requirements of CISPR 16
Note 1 to entry: External voltage measured in dB (µV) at the input of a radio interference measuring instrument
conforming to the requirements of CISPR 16-1-1.
[SOURCE: CISPR 25:2008, 3.8, modified – Note 1 to entry has been added.]

– 10 – IEC 61967-1:2018 © IEC 2018
3.25
reference point
specific port or point on the test set-up where the measurement of the sampled parameter is
made
3.26
repetition rate
number of surges, spikes, or pulses per unit of time
3.27
radio frequency ambient
RF ambient
electromagnetic environment
totality of electromagnetic phenomena existing at a given location
[SOURCE: IEC 60050-161:1990, 161-01-01, modified – The preferred terms "radio
frequency ambient" and "RF ambient" have been added and Note 1 to entry has been
removed.]
3.28
shielded enclosure
mesh or sheet metallic housing designed expressly for the purpose of separating
electromagnetically the internal and external environment
[SOURCE: IEC 60050-161:1990, 161-04-37, modified – The second preferred term
"screened room" has been omitted.]]
3.29
significant IC change
changes that may influence the electromagnetic emissions of an IC
Note 1 to entry: Examples include changes to a new device, new manufacturer or process line, die shrink, new
package type, significant manufacturing process, internal/external clock, I/O drive capability.
3.30
system gain
gain (or attenuation) of the measurement path between the reference point and the input of
the RF measuring instrument
3.31
test plan
document provided by the test requester to define the tests to be carried out, the object of the
testing, the DUT operating status, the conditions for the test and performance objectives
Note 1 to entry: The test plan completely guides the implementation of the test, by reference to the standard test
procedure, or by detailing revisions or additions for the specific DUT.
4 Test conditions
4.1 General
These default test conditions are intended to ensure a consistent test environment. If other
values are agreed by the users of this procedure, they shall be documented in the test report.
4.2 Ambient conditions
4.2.1 General
The following ambient conditions shall be met.

4.2.2 Ambient temperature
The ambient temperature during the test shall be 23 °C ± 5 °C for repeatability. IC emissions
may vary with temperature.
4.2.3 Ambient RF field strength
The ambient RF noise level shall be at least 6 dB below the lowest emission level(s) to be
measured. This shall be verified before measurements of the IC are made. The DUT shall be
installed in the test set-up, as used for testing. The DUT shall not be activated (for example,
the power supply voltage shall be disconnected). A scan shall be made to measure the
residual noise. A description of the ambient RF noise level shall be part of the test report.
4.2.4 Other ambient conditions
All other ambient conditions that can affect the result shall be stated in the individual test
report.
4.2.5 IC stability over time
The functional behaviour of the IC shall be stable over time so that two measurements,
separated by an interval of time, shall yield the same results within the expected variation of
the measurement technique.
5 Test equipment
5.1 General
The equipment described in Clause 5 is common to all test procedures described in this
document. Specific equipment shall be itemized in the individual test procedures.
5.2 Shielding
The necessary shielding depends upon the specific test method and the ambient noise level.
A shielded room may be required to provide a controlled ambient noise level for emission
measurements. A non-shielded set-up can be used if ambient noise levels are at least 6 dB
below the lowest level to be measured.
5.3 RF measuring instrument
5.3.1 General
Either measuring receivers or spectrum analysers can be used (see Tables 1 and 2 for default
settings). The measuring receiver, if used, shall meet the bandwidth requirements as stated in
CISPR 16-1-1.
5.3.2 Measuring receiver
Table 1 – Measuring receiver bands and resolution bandwidth (RBW) default settings
Frequency range 150 kHz to 30 MHz ≥ 30 MHz
Measuring receiver RBW at 6 dB 9 kHz 120 kHz

– 12 – IEC 61967-1:2018 © IEC 2018
5.3.3 Spectrum analyser
Table 2 – Spectrum analyser bands and RBW default settings
Frequency range 150 kHz to 30 MHz ≥ 30 MHz
Spectrum analyser RBW at 3 dB 10 kHz 100 kHz

5.3.4 Other RBW for narrowband emissions
Where the RF emissions can be verified as being narrowband, and the measurement
technique requires a lower noise floor for resolution of the measured signals from the ambient
RF noise, a reduced RBW can be used.
5.3.5 Emission type, detector type and sweep speed
A determination of whether the emissions are predominately narrowband or broadband can be
made by measuring at the default bandwidth and at the next narrower (one-third) increment of
bandwidth. If the measured level of peak values of the spectrum is reduced by 5 dB or more
when the bandwidth is reduced by one-third, then the emissions can be considered to be
predominately broadband.
Examples of narrowband sources are digital ICs operated by a synchronous clock. They will
typically produce a continuous emission spectrum dominated by clock harmonics and
fractions. For this reason, the detector chosen will not influence the readings. The peak
detector shall be used for narrowband sources.
Examples of possible broadband sources are ICs producing a non-continuous spectrum such
as converters and non-synchronous logic. These devices shall be measured, preferably using
the peak detector with the sweep speed set to reflect the modulation rate, according to the
following formula:
V ≤×RBW× f
sm
where
V is the sweep speed in MHz/s;
s
f is the resolution bandwidth in MHz;
RBW
f is the modulation frequency in Hz, defined as the lowest repetition rate of a software
m
routine or other IC operating parameter that may affect the measured RF emissions.
The sweep speed used shall be selected in such a way that a slower sweep speed will not
result in a significant change in the measured emissions.
5.3.6 Video bandwidth
The video bandwidth (VBW) shall be at least three times the RBW when a spectrum analyser
is used for measurements.
5.3.7 Verification of calibration for the RF measuring instrument
The calibration of the RF measuring instrument shall be verified by comparison with an
independent calibrated instrument, traceable to a recognized standard body, if absolute levels
are to be reported.
5.4 Frequency range
The recommended frequency range is 150 kHz to 1 GHz, but this may be extended if the
specific procedure is usable over an extended frequency range. The range of interest may be
smaller when, by function, the IC produces emissions only in that reduced range.
The applicable frequency range is described in each part of IEC 61967.
5.5 Preamplifier or attenuator
If necessary, a preamp or attenuator, either internal or external, can be used. The noise figure
of the preamplifier or attenuator shall be less than 10 dB. The minimum resolution for
calibration of the preamplifier is 10 points per decade.
5.6 System gain
The gain (or attenuation) between the reference point and the input of the RF measuring
instrument shall be verified to within an accuracy of ±0,5 dB.
5.7 Other components
The characteristics of cables, connectors and terminators not in the measurement path
between the reference point and the input of the RF measuring instrument that can, however,
affect the measurement result, shall be verified over the intended frequency range.
6 Test set-up
6.1 General
Tests shall take place according to a test plan, which shall be included in the test report. This
report shall also include:
a) a circuit diagram of the application (supply decoupling, bus load, peripheral ICs, etc.);
b) a description of the PCB on which the IC is applied (layout);
c) actual operating conditions of the IC (supply voltage, output signals, etc.);
d) a description of the type of software exercising the IC(s), if applicable.
All variations shall be included in the test report. Connection to auxiliary equipment shall not
influence the test results.
Other particular requirements are described in the individual test procedure.
6.2 Test circuit board
The test PCB to be used depends on the specific measurement method. The specifications of
a general basic test board for this family of standards are described in Annex D of this
document. The test PCB should be designed in accordance with these general specifications
and with the additional specifications as required for the individual measurement methods.
Any deviation from this description shall be stated in the individual test reports.
For the comparison of measurement results from different devices it is necessary to use a
similar PCB design, as close as possible within the same measurement method.
6.3 IC pin loading
If no other loads are required by a specific test method, the pins of the DUT shall be loaded
according to the following default value table, with exceptions as noted.

– 14 – IEC 61967-1:2018 © IEC 2018
Table 3 – IC pin loading recommendations
IC pin type Pin loading
Analogue
– Supply As stated by the manufacturer (or as required)
– Input 10 kΩ to ground (Vss) unless the IC is internally terminated
– Output signal 10 kΩ to ground (Vss) unless the IC is internally terminated
– Output power Nominal loading as stated by the manufacturer
Digital
– Supply As stated by the manufacturer (or as required)
– Input Ground (Vss) or 10 kΩ to supply (Vdd) if impossible to ground, unless the IC
is internally terminated
– Output 47 pF to ground (Vss)
Control
– Input Ground (Vss) or 10 kΩ to supply (Vdd) if impossible to ground, unless the IC
is internally terminated
– Output As stated by the manufacturer
– Bi-directional 47 pF to ground (Vss)
– Analogue As stated by the manufacturer (or as required)

Pins that do not fall into any of the listed categories shall be loaded as functionally required
and stated in the test report. These are recommended default values; if other values are more
appropriate for a particular IC, they may be substituted for the values in Table 3 and shall be
stated in the test report.
6.4 Power supply requirements – Test board power supply
The DUT shall be powered from a source with low conducted RF emissions that conform to
the RF ambient requirements. If a battery is used, it shall meet the IC requirements and the
voltage level shall be checked periodically to maintain a consistent operating environment. An
AC power supply can be used if it meets the low RF emissions requirement. All power supply
lines to the DUT shall be adequately filtered according to the IC manufacturer's
recommendations.
6.5 IC specific considerations
6.5.1 IC supply voltage
The supply voltage(s) shall be as specified by the IC manufacturer with a tolerance of ±5 %.
6.5.2 IC decoupling
To obtain reproducible data of measurement, appropriate decoupling should be accomplished
on the test board. See Clause D.9.
6.5.3 Activity of IC
Attempts should be made to fully exercise all available functions that significantly contribute
to the emissions of the IC.
6.5.4 Guidelines regarding IC operation
The intent is to describe the parameters to be controlled in order to ensure test repeatability
for the particular IC function or type as agreed between the manufacturer and the user.

If a programmable integrated circuit is to be tested, software that flows in a continuous loop
shall be written to ensure that measurements are repeatable. The type of software used to
exercise the IC (minimum, typical or worst-case) shall be documented in the test report. The
IC shall be exercised using one of the following software levels:
a) minimum – implement counter function:
used for basic tests and comparisons, see Annex B;
b) typical – normal operating or production code:
used for representative testing, exercise microprocessor and I/O on a "normal" basis using
the production code;
c) worst-case – exercise all I/O:
used for diagnostic purposes, see Annex C.
7 Test procedure
7.1 Ambient RF noise check
Measure ambient RF noise levels to ensure that any ambient signals present are at least 6 dB
below the target reference level. The data collected shall be part of the test report. If the
ambient RF noise is excessive, check the integrity of the overall system, especially the
interconnecting cables and connectors. If necessary, use a shielded enclosure, a lower noise
preamplifier or a narro
...