IEC 61967-8:2023

IEC 61967-8 ®
Edition 2.0 2023-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions –
Part 8: Measurement of radiated emissions – IC stripline method

Circuits intégrés – Mesure des émissions électromagnétiques –
Partie 8: Mesure des émissions rayonnées – Méthode de la ligne TEM à plaques
(stripline) pour circuit intégré

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IEC 61967-8 ®
Edition 2.0 2023-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions –

Part 8: Measurement of radiated emissions – IC stripline method

Circuits intégrés – Mesure des émissions électromagnétiques –

Partie 8: Mesure des émissions rayonnées – Méthode de la ligne TEM à plaques

(stripline) pour circuit intégré

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-6932-9

– 2 – IEC 61967-8:2023 © IEC 2023
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General . 7
5 Test conditions . 7
5.1 General . 7
5.2 Supply voltage . 7
5.3 Frequency range . 7
6 Test equipment . 8
6.1 General . 8
6.2 RF measuring instrument . 8
6.3 Preamplifier . 8
6.4 IC stripline . 8
6.5 50 Ω termination . 8
7 Test set-up . 8
7.1 General . 8
7.2 Test configuration . 9
7.3 EMC test board (PCB) . 9
8 Test procedure . 9
8.1 General . 9
8.2 Ambient conditions. 9
8.3 Operational check . 10
8.4 Verification of IC stripline RF characteristic . 10
8.5 Test technique . 10
9 Test report . 11
9.1 General . 11
9.2 Measurement conditions . 11
10 IC Emissions reference levels . 11
Annex A (normative) IC stripline description . 12
A.1 General . 12
A.2 Characteristic impedance of stripline arrangements . 13
A.3 Conversion for different active conductor heights . 14
A.4 Example for IC stripline arrangement . 14
Annex B (informative) Specification of emission levels . 15
B.1 Scope . 15
B.2 General . 15
B.3 Specification of emission levels . 15
B.4 Presentation of results . 15
Bibliography . 17

Figure 1 – IC stripline test set-up . 9
Figure A.1 – Cross-section view of an example of an unshielded IC stripline . 12
Figure A.2 – Cross-section view of an example of an IC stripline with housing . 12
Figure A.3 – Example of IC stripline with housing . 14

Figure B.1 – Emission characterization levels . 16

Table A.1 – Maximum DUT dimensions for 6,7 mm IC stripline open version. 13
Table A.2 – Maximum DUT dimensions for 6,7 mm IC stripline closed version . 13

– 4 – IEC 61967-8:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –

Part 8: Measurement of radiated emissions –
IC stripline method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61967-8 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical
committee 47: Semiconductor devices. It is an International Standard.
This second edition cancels and replaces the first edition published in 2011. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) frequency range of 150 kHz to 3 GHz was deleted from the scope;
b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements
are fulfilled.
The text of this International Standard is based on the following documents:
Draft Report on voting
47A/1152/FDIS 47A/1153/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts of the IEC 61967 series, under the general title Integrated circuits –
Measurement of electromagnetic emissions can be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

– 6 – IEC 61967-8:2023 © IEC 2023
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –

Part 8: Measurement of radiated emissions –
IC stripline method
1 Scope
This part of IEC 61967 defines a method for measuring the electromagnetic radiated emission
from an integrated circuit (IC) using an IC stripline. The IC being evaluated is mounted on an
EMC test board (PCB) between the active conductor and the ground plane of the IC stripline
arrangement.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050-131, International Electrotechnical Vocabulary (IEV) – Part 131: Circuit theory
IEC 60050-161, International Electrotechnical Vocabulary (IEV) – Chapter 161: Electro-
magnetic compatibility
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions – Part 1: General
conditions and definitions
IEC 61000-4-20, Electromagnetic compatibility (EMC) – Part 4-20: Testing and measurement
techniques – Emission and immunity testing in transverse electromagnetic (TEM) waveguides
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 61967-1,
IEC 60050-131 and IEC 60050-161, and the following apply.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
3.1
transverse electromagnetic mode
TEM mode
waveguide mode in which the components of the electric and magnetic fields in the propagation
direction are much less than the primary field components across any transverse cross-section
3.2
TEM waveguide
open or closed transmission line system, in which a wave is propagating in the transverse
electromagnetic mode to produce a specified field for testing purposes

3.3
IC stripline
TEM waveguide, consisting of an active conductor placed on a defined spacing over an enlarged
ground plane, connected to a port structure on either end and an optional shielded enclosure
Note 1 to entry: This arrangement guides a wave propagation in the transverse electromagnetic mode to produce
a specific field for testing purposes between the active conductor and the enlarged ground plane. As enlarged ground
plane the ground plane of the standard EMC test board according to IEC 61967-1 should be used. An optional
shielding enclosure may be used for fixing the IC stripline configuration and for shielding purposes. This leads to a
closed version of the IC stripline in opposite to the open version without shielding enclosure. For further information,
see Annex A.
3.4
two-port TEM waveguide
TEM waveguide with input/output measurement ports at both ends
3.5
characteristic impedance
magnitude of the ratio of the voltage between the active conductor and the corresponding
ground plane to the current on either conductor for any constant phase wave-front
Note 1 to entry: The characteristic impedance is independent of the voltage/current magnitudes and depends only
on the cross-sectional geometry of the transmission line. TEM waveguides are typically designed to have a 50 Ω
characteristic impedance. For further information and equation to stripline arrangements, see Annex A.
3.6
primary field component
electric field component aligned with the intended test polarization
Note 1 to entry: For example, in IC stripline, the active conductor is parallel to the horizontal floor, and the primary
mode electric field vector is vertical at the transverse centre of the IC stripline.
4 General
This test method is based on the TEM wave guide measurement principle according to
IEC 61000-4-20. A stripline set-up is used to measure the RF emission of ICs. The RF voltage
at the stripline port is related to the electromagnetic radiation potential of the IC and will be
measured using a spectrum analyzer or measuring receiver. The intent of this test method is to
provide a quantitative measure of the RF emissions from ICs for comparison or other evaluation.
5 Test conditions
5.1 General
The test conditions shall meet the requirements as described in IEC 61967-1. In addition, the
following test conditions described in 5.2 and 5.3 shall apply.
5.2 Supply voltage
The supply voltage shall be as specified by the IC manufacturer. If the users of this procedure
agree to other values, they shall be documented in the test report.
5.3 Frequency range
The effective frequency range for the IC stripline is 150 kHz to 6 GHz in combination with the
VSWR characteristic ≤ 1,25 for f ≤ 3 GHz and ≤ 1,4 for f > 3 GHz. The upper frequency can be
extended if the IC stripline does not exhibit significant higher order modes over the frequency
range being measured.
NOTE The given VSWR value of 1,4 is based on evolving technical solutions for IC striplines. For accuracy reasons
the VSWR value is targeted as low as possible (e.g. 1,3).

– 8 – IEC 61967-8:2023 © IEC 2023
6 Test equipment
6.1 General
The test equipment shall meet the requirements as described in IEC 61967-1. In addition, the
test equipment requirements described in 6.2 to 6.5 shall apply.
6.2 RF measuring instrument
A spectrum analyzer or EMI receiver shall be used. The resolution bandwidth shall be 9 kHz for
EMI receivers or 10 kHz for spectrum analyzers in the frequency range from 150 kHz to 30 MHz
and respectively 120 kHz or 100 kHz above 30 MHz according to IEC 61967-1. Measurements
shall be made with a peak detector and presented in units of dBµV [for 50 Ω system: (dBm
readings) + 107 = dBµV]. For spectrum analyzers, the frequency band of interest shall be swept
in calibrated or coupled mode (auto sweep).
6.3 Preamplifier
Optionally, a 20 dB to 30 dB gain, low noise preamplifier can be used. If used, the preamplifier
shall be connected directly to the measurement port of the IC stripline using the appropriate
50 Ω coaxial adapter.
6.4 IC stripline
Two-port TEM waveguide, consisting of an active conductor placed on a defined spacing over
an enlarged ground plane, connected to a port structure on either end and an optional shielded
enclosure. The spacing between active conductor and ground plane of the IC stripline has a
default value of 6,7 mm. Other spacing can be used but shall be noted in the test report.
NOTE A conversion factor allows comparisons between IC stripline arrangements with different spacing between
active conductor and ground plane (see Annex A).
This IC stripline arrangement guides wave propagation in the transverse electromagnetic mode
to produce a specific field for testing purposes between the active conductor and the enlarged
ground plane. As enlarged ground plane, the ground plane of the standard EMC test board
according to IEC 61967-1 should be used. The EMC test board controls the geometry and
orientation of the operating IC relative to the IC stripline and eliminates any connecting leads
within the IC stripline (these are on the backside of the board, which is opposite to the IC
stripline). An optional shielding enclosure may be used for fixing the IC stripline configuration
and for shielding purposes. This leads to a closed version of the IC stripline as opposed to the
open version without shielding enclosure.
For further information, see Annex A.
6.5 50 Ω termination
A 50 Ω termination with a VSWR less than 1,1 for f ≤ 3 GHz and ≤ 1,2 for f > 3 GHz up to the
maximum used frequency shall be used for the IC stripline 50 Ω port not connected to the RF
measuring instrument.
7 Test set-up
7.1 General
The test set-up shall meet the requirements as described in IEC 61967-1. In addition, the
following test set-up requirements shall apply.

7.2 Test configuration
See Figure 1 for IC stripline test configuration. One of the 50 Ω ports is terminated with a 50 Ω
load. The remaining 50 Ω port is connected to the spectrum analyzer through the optional
preamplifier.
Figure 1 – IC stripline test set-up
For further information and cross-section view of the IC stripline arrangement, see Annex A.
7.3 EMC test board (PCB)
The DUT shall be mounted on a PCB according to IEC 61967-1 and in this document. In cases
where IEC 61967-1 and this document are in conflict, the requirements of this document shall
apply.
The EMC test board is provided with the appropriate measurement or monitoring points to
ensure the correct DUT operation. It controls the geometry and orientation of the DUT relative
to the active conductor and eliminates in case of a closed version of the IC stripline, any
connecting leads within the housing (these are on the backside of the board, which is outside
the housing).
8 Test procedure
8.1 General
These default test conditions are intended to assure a consistent test environment. If the users
of this procedure agree to other conditions, they shall be documented in the test report.
8.2 Ambient conditions
The definitions for ambient temperature and general condition of IEC 61967-1 are valid.
The ambient RF noise level shall be verified to be at least 6 dB below the lowest emission
level(s) to be measured. The DUT shall be installed in the test set-up, as used for testing. The
DUT shall not be activated (e.g. power supply voltage disabled). A scan shall be made to
measure the ambient noise. A description of the ambient conditions shall be a part of the test
report.
– 10 – IEC 61967-8:2023 © IEC 2023
If the measured noise floor is excessive, e.g. due to external ambient noises or the noise floor
of the measurement system itself, shielded enclosure should be used. The noise floor
measurement system can be improved by using a lower noise preamplifier.
8.3 Operational check
Energize the DUT and complete an operational check to assure proper function of the device
(i.e. Run IC test code).
8.4 Verification of IC stripline RF characteristic
For verification of the IC stripline RF characteristic, the VSWR value of the empty IC stripline
with 50 Ω load termination at the second port shall be measured and documented in the test
report. The value shall be in accordance with 5.3.
In addition, it is recommended to check also the DUT loaded IC stripline. Before testing, the IC
stripline resonances should be determined in accordance with IEC 61000-4-20 with the test
set-up including DUT installed and powered off.
P
 
output
A 10×log ≤ 1 dB
 
tloss 10
(1)
 
PP−
fwd refl
 
where
A is the transmission loss of loaded IC stripline [dB];
tloss
P is the reflected power at input port [W];
refl
P is the forward power at input port [W];
fwd
P is the measured power at output port [W].
output
Measurements carried out at frequencies where the VSWR and transmission losses A
tloss
exceed the maximum tolerated values shall be ignored.
8.5 Test technique
With the EMC test board energized and the DUT being operated in the intended test mode,
measure the RF emissions over the desired frequency band.
When using a spectrum analyzer, enable the "Max Hold" function and allow the analyzer to
perform a minimum of three sweeps while the IC code loop executes. The sweep time shall be
greater than the IC code loop execution time.
NOTE The "Max Hold" setting on a spectrum analyzer maintains the maximum level of each trace data point and
updates each point if a new maximum level is detected in successive sweeps.
When using a receiver, the dwell time for each test frequency shall be greater than or equal to
two times the IC code loop execution time and record the maximum level detected.
Four separate emissions measurements are performed resulting in four sets of data. The first
measurement is made with the EMC test board mounted in an arbitrary orientation in the test
setup. The second measurement is made with the EMC test board rotated 90 degrees from the
orientation in the first measurement. For each of the third and fourth measurements, the EMC
test board is rotated again to ensure emissions are measured from all four possible orientations.
The four sets of data shall be documented in the test report.
=
9 Test report
9.1 General
The test report shall be in accordance with the requirements of IEC 61967-1. In addition, the
following test report requirements shall apply.
9.2 Measurement conditions
All measurement conditions shall be documented in the test report.
10 IC Emissions reference levels
IC emissions acceptance levels, if any, are to be agreed upon between the manufacturers and
the users of ICs and may be selected using the reference level scheme in Annex B. These
reference levels apply to measurements over the frequency range of 150 kHz to the maximum
used measurement frequency in units of dBµV.

– 12 – IEC 61967-8:2023 © IEC 2023
Annex A
(normative)
IC stripline description
A.1 General
The IC stripline offers a broadband method of measuring either immunity of a DUT to fields
generated within the IC stripline or radiated emission from a DUT placed within the IC stripline.
It eliminates the use of conventional antennas with their inherent measurement limitations of
bandwidth, non-linear phase, directivity and polarization. The IC stripline is a special kind of
transmission line that propagates a TEM wave. This wave is characterized by transverse
orthogonal electric (E) and magnetic (H) fields, which are perpendicular to the direction of
propagation along the length of the IC stripline or transmission line. This field simulates a planar
field generated in free space with impedance of 377 Ω. The TEM mode has no low frequency
cut-off. This allows the IC stripline to be used at frequencies as low as desired. The TEM mode
also has linear phase and constant amplitude response as a function of frequency. This makes
it possible to use the IC stripline to generate or detect a field intensity in a defined way. The
upper useful frequency for an IC stripline is limited by distortion of the test signal caused by
resonances and multi-moding that occur within the IC stripline. These effects are a function of
the physical size and shape of the IC stripline.
The IC stripline is of a size and shape, with impedance matching at the input and output feed
points of the IC stripline that limits the VSWR to the values given in 5.3. In principle there are
two versions of IC stripline possible – open and closed version. The open version uses the
common stripline configuration (Figure A.1). At the closed version a shielding case is added
(Figure A.2). The active conductor of the IC stripline is tapered at each end to adapt to
conventional 50 Ω coaxial connectors. The requested EMC test board can be based on a TEM
cell board according to IEC 61967-1. The first resonance is demonstrated by a high VSWR over
a narrow frequency range. An IC stripline verified for field generation to a maximum frequency
will also be suitable for emission measurements to this frequency.

Figure A.1 – Cross-section view of an example of an unshielded IC stripline

Figure A.2 – Cross-section view of an example of an IC stripline with housing

The maximum usable DUT size is limited by the IC stripline dimensions. The ratio of DUT
package height to IC stripline height is recommended to one third but shall not exceed one half
according to IEC 61000-4-20. In x-y dimension, the package shall not exceed the width of active
conductor by more than 10 %.
NOTE D field simulations have shown that an uniform field (not more than +0 dB and not less than -3 dB) is present
outside the active conductor width geometrical boundary up to a package size which exceeds the width of the active
conductor by 10 % at a half of active conductor height [1] .
The limitation values for the 6,7 mm IC stripline for example are given in Table A.1 and
Table A.2. The active conductor width for the closed version is dependent on the distance
between active conductor and housing. The complete setup shall fulfill the definitions of 8.4.
Table A.1 – Maximum DUT dimensions for 6,7 mm IC stripline open version
Active conductor 6,7 mm
DUT
IC stripline open version
z dimension (height) 6,7 mm ≤ 3,35 mm
x-y dimension (width) 33 mm ≤ 36,3 mm

Table A.2 – Maximum DUT dimensions for 6,7 mm IC stripline closed version
Active conductor 6,7 mm DUT
IC stripline closed
version
z dimension (height) 6,7 mm ≤ 3,35 mm
x-y dimension (width) 24 mm ≤ 26,4 mm

A.2 Characteristic impedance of stripline arrangements
The nominal, characteristic impedance of an open version of IC stripline can be calculated as
follows [1], if 1 < w/h ≤ 10:
120×π
Z=
w hh  (A.1)
+2,42−0,44× + 1−
 
h ww
 
where
Z is the characteristic impedance [Ω], typical 50 Ω;
w is the width [m] of active conductor;
h is the height [m] between the active conductor and ground plane.
For the closed version of the IC stripline, the influence of housing shall be taken into account.
This correction depends on the housing geometry. For spherical housing surface, an analytical
formula for the characteristic impedance cannot be provided, empirical investigations are
necessary. The characteristic impedance of those stripline arrangements shall be verified by
measurement.
___________
Numbers in square brackets refer to the Bibliography.

– 14 – IEC 61967-8:2023 © IEC 2023
A.3 Conversion for different active conductor heights
A conversion factor (X) to correlate measuring results of IC striplines with different heights to
the default IC stripline height of 6,7 mm can be calculated by:

h
X 20× log
(A.2)

h
2
where
X is the conversion factor [dB] to IC stripline 6,7 mm height type results;
h is the active conductor height of specific type;
h is the active conductor height of 6,7 mm type.
For example the conversion factor for an IC stripline with h = 8 mm is X = 1,54 dB. That means
1,54 dB shall be added to the measured voltage in dBµV at the measurement port of the 8 mm
height IC stripline.
A.4 Example for IC stripline arrangement
An example for IC stripline with housing is given in Figure A.3. The housing x-y dimensions are
defined by the used EMC test board (IEC 61967-1: 100 mm × 100 mm). The housing in
z direction should be as far as possible from the active conductor but avoid resonances and
multi-moding in the frequency range of interest.

Figure A.3 – Example of IC stripline with housing

=
Annex B
(informative)
Specification of emission levels
B.1 Scope
This Annex B provides a method of specifying the emission level profiles of integrated circuits.
B.2 General
This Annex B is not meant to be a product specification. However, using the concept described
in this document and by careful application and agreement between manufacturer and user, it
is possible to develop a description of the RF emissions behavior for a specific integrated circuit
in one of three (x-y-z) field orientations.
B.3 Specification of emission levels
The diagram in Figure B.1 represents a scheme that facilitates classification of emission levels
for ICs. In order to be able to use the classification as defined in IEC 61967-2 [3] values are to
be calculated using
h

ICstripline
A=B+×20 log
 (B.1)

h
TEM

where
A is the converted result for comparison with reference levels;
B is the measurement result of spectrum analyzer or EMI receiver;
h is the septum height TEM cell of 45 mm (default);
TEM
h is the active conductor height of 6,7 mm (default).
IC stripline
B.4 Presentation of results
The typical description of the maximum emission level consists of two letters and one number
always following the same sequence. If one of the three slopes is not needed, the corresponding
letter or number will be omitted.
The capital letter is first and represents the position of the horizontal line with zero dB per
decade slope. Second is the number, which defines the position of the -20 dB per decade slope.
The third and small letter defines the position of the -40 dB per decade slope.
Such defined maximum emission levels with the described notation offer a standardized way to
communicate maximum emission levels unambiguously.

– 16 – IEC 61967-8:2023 © IEC 2023

Figure B.1 – Emission characterization levels

Bibliography
[1] Körber, Klotz, Müller, Müllerwiebus, Trebeck: IC- Stripline for Susceptibility and
Emission Testing of ICs, EMC COMPO 2009
[2] M. V. Schneider, "Microstrip Lines for Microwave Integrated Circuits" The Bell System
Technical Journal, vol. 48, pp. 1421–1444, May 1969
[3] IEC 61967-2, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz
to 1 GHz – Part 2: Measurement of radiated emissions – TEM cell and wideband TEM
cell method
___________
– 18 – IEC 61967-8:2023 © IEC 2023
SOMMAIRE
AVANT-PROPOS . 20
1 Domaine d’application . 22
2 Références normatives . 22
3 Termes et définitions . 22
4 Généralités . 23
5 Conditions d’essai . 23
5.1 Généralités . 23
5.2 Tension d’alimentation . 23
5.3 Plage de fréquences . 24
6 Appareillage d’essai . 24
6.1 Généralités . 24
6.2 Appareil de mesure RF . 24
6.3 Préamplificateur . 24
6.4 Stripline pour CI . 24
6.5 Terminaison de 50 Ω . 25
7 Montage d’essai . 25
7.1 Généralités . 25
7.2 Configuration d’essai . 25
7.3 Carte d’essai CEM (carte à circuit imprimé) . 25
8 Procédure d’essai . 26
8.1 Généralités . 26
8.2 Conditions ambiantes. 26
8.3 Vérification opérationnelle . 26
8.4 Vérification des caractéristiques RF de la stripline pour CI . 26
8.5 Technique d’essai . 27
9 Rapport d’essai . 27
9.1 Généralités . 27
9.2 Conditions de mesure . 27
10 Niveaux de référence des émissions du CI . 27
Annexe A (normative) Description de la stripline pour CI. 28
A.1 Généralités . 28
A.2 Impédance caractéristique des conceptions de stripline . 30
A.3 Conversion pour différentes hauteurs de conducteurs actifs . 30
A.4 Exemple de conception d’une stripline pour CI . 31
Annexe B (informative) Spécification des niveaux d’émission. 32
B.1 Domaine d’application . 32
B.2 Généralités . 32
B.3 Spécification des niveaux d’émission . 32
B.4 Présentation des résultats. 32
Bibliographie .
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