31 - ELECTRONICS
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IEC 61076-2-111:2025 This part of IEC 61076‑2 describes 4- to 6-way circular connectors with M12 screw-locking with current ratings 8, 12 or 16 A per contact and voltage ratings of 50 V AC / 60 V or 630 V according to their coding, that are typically used for power supply and power applications in industrial premises.
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IEC 60749-21:2025 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for “dip and look” solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification.
NOTE 1 This test method does not assess the effect of thermal stresses which can occur during the soldering process. More details can be found in IEC 60749‑15 or IEC 60749‑20.
NOTE 2 If a qualitative test method is preferred, the Wetting balance test method can be found in IEC 60068-2-69.
This edition includes the following significant technical changes with respect to the previous edition:
- revision to certain operating conditions in line with current working practices.
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IEC 60749-23:2025 specifies the test used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", can be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this document.
This edition includes the following significant technical changes with respect to the previous edition:
a) absolute stress test definitions and resultant test durations have been updated.
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IEC 60384-14-1:2025 forms the basis for a uniform procedure for a common international safety mark. It implements the approval schedule for safety tests in IEC 60384‑14, specifies a declaration of design for parameters relevant to safety and indicates conformance tests to be conducted on every lot prior to its release and requalification tests depending on changes to the declared design.
This edition includes the following significant technical changes with respect to the previous edition:
a) the tables for dimensions have been replaced with a guidance text in the document;
b) the possibility to give the requirements for the service in DC applications and in high humidity conditions have been added;
c) the changes in this document in comparison with the previous edition are given in Annex B.
This International Standard is to be used in conjunction with IEC 60384‑1 and IEC 60384‑14:2023.
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IEC 60384-14-2:2025 forms the basis for a uniform procedure for a common international safety mark. It implements the approval schedule for safety tests in IEC 60384‑14, specifies a declaration of design for parameters relevant to safety and indicates conformance tests to be conducted on every lot prior to its release and requalification tests depending on changes to the declared design.
This edition includes the following significant technical changes with respect to the previous edition:
a) the tables for dimensions have been replaced with a guidance text in the document,
b) the possibility to give the requirements for the service in DC applications and in high humidity conditions have been added.
c) the changes in this document in comparison with the previous edition are given in Annex B.
This International Standard is to be used in conjunction with IEC 60384‑1:2021 and IEC 60384‑14:2023.
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IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT). This document is applicable to non-destructive testing of metallized holes.
- Draft16 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61249-2-53:2025 specifies requirements for properties of PTFE unfilled reinforced laminated sheet of a thickness 0,05 mm up to 10,0 mm of defined flammability (vertical burning test), copper-clad. This part of IEC 61249 is applicable to the design, manufacture, use of PTFE unfilled reinforced laminated sheet of defined flammability (vertical burning test), copper-clad. Its flame resistance is defined in terms of the flammability requirements of 8.4.
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IEC 60749-24:2025 specifies unbiased highly accelerated stress testing (HAST). HAST is performed for the purpose of evaluating the reliability of non-hermetically packaged solid-state devices in humid environments. It is a highly accelerated test which employs temperature and humidity under non-condensing conditions to accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it. Bias is not applied in this test to ensure that the failure mechanisms potentially overshadowed by bias can be uncovered (e.g. galvanic corrosion).
This test is used to identify failure mechanisms internal to the package and is destructive.
This edition includes the following significant technical changes with respect to the previous edition:
a) rearrangement of clauses to reposition requirements;
b) addition of two notes to the post-test electrical procedures.
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IEC 60749-7:2025 specifies the testing and measurement of water vapour and other gas content of the atmosphere inside a metal or ceramic hermetically sealed device. The test is used as a measure of the quality of the sealing process and to provide information about the long-term chemical stability of the atmosphere inside the package. It is applicable to semiconductor devices sealed in such a manner but generally only used for high reliability applications such as military or aerospace.
Of particular interest is the measurement of the primary sealing gases (or lack thereof), the moisture content, the presence of bombing gases that are indicative of non-hermeticity (e.g. helium), oxygen to argon ratio indicative of room air ~ 20 to 1 (± 10 %), dissimilar concentration of internally sealed gases (e.g. nitrogen, helium) than originally sealed in the device package, the presence of leak test fluid (i.e. fluorocarbon, helium, air), and all other gases to determine if the device meets the specified moisture, hermeticity and other criteria. Also of interest is the measurement of all the other gases since they reflect upon the quality of the sealing process and provide information about the long-term chemical stability of the atmosphere inside the device. The presence of leak test fluorocarbon vapour in the internal gas analysis (IGA) is an indication of failure to meet leak test requirements of IEC 60749‑8.
This test is destructive.
This edition includes the following significant technical changes with respect to the previous edition:
a) This document has been re-written and rearranged to align with the text of MIL-STD-883, Method 1018.10.
b) Additional detail has been provided in the calibration requirements.
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IEC 60749-22-2:2025 establishes a means for determining the strength of a ball bond to a die or package bonding surface and can be performed on pre-encapsulation or post-encapsulation devices. This measure of bond strength is extremely important in determining two features:
a) the integrity of the metallurgical bond which has been formed, and
b) the quality of ball bonds to die or package bonding surfaces.
This test method covers thermosonic (ball) bonds made with small diameter wire from 15 µm to 76 µm (0,000 6" to 0,003").
This test method can only be used when the bonds are large enough to allow for proper contact with the shear test chisel and when there are no adjacent interfering structures that would hinder the movement of the chisel. For consistent shear results the ball height will be at least 4,0 µm (0,000 6 ") for ball bonds, which is the current state of the art for bond shear test equipment at the time of this revision.
This test method can also be used on ball bonds that have had their wire removed and on to which a second bond wire (typically a stitch bond) is placed. This is known as "stitch on ball" and "reverse bonding". See Annex A for additional information.
The wire bond shear test is destructive. It is appropriate for use in process development, process control, or quality assurance, or both.
This test method can be used on ultrasonic (wedge) bonds, however its use has not been shown to be a consistent indicator of bond integrity. See Annex B for information on performing shear testing on wedge bonds.
This test method does not include bond strength testing using wire bond pull testing. Wire bond pull testing is described in IEC 60749-22-1.
This first edition, together with the first edition of IEC 60749-22-1, cancels and replaces the first edition IEC 60749-22 published in 2002. This International Standard is to be used in conjunction with IEC 60749-22-1:2025.
This edition includes the following significant technical changes with respect to the previous edition:
a) Major update, including new techniques and use of new materials (e.g. copper wire) involving a complete rewrite as two separate subparts (this document and IEC 60749‑22‑1).
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IEC 61076-2:2025 establishes uniform specifications and technical information for circular connectors.
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IEC 60749-22-1:2025 provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and can be performed on unencapsulated or decapsulated devices. This test method can be performed on gold alloy, copper alloy, and silver alloy thermosonic (ball and stitch) bonds made of wire ranging in diameter from 15 µm to 76 µm (0,000 6" to 0,003"); and on gold alloy, copper alloy, and aluminium alloy ultrasonic (wedge) bonds made of wire ranging in diameter from 18 µm to 600 µm (0,000 7" to 0,024").
This wire bond pull test method is destructive. It is appropriate for use in process development, process control, or quality assurance.
This test method allows for two distinct methods of pulling wires:
a) One method incorporates the use of a hook that is placed under the wire and is then pulled.
b) One method requires that after the wire be cut, a clamp is placed on the wire connected to the bond to be tested, and this clamp is used to pull the wire.
This test method does not include bond strength testing using wire bond shear testing. Wire bond shear testing is described in IEC 60749-22-2.
This first edition, together with the first edition of IEC 60749-22-2:2025, cancels and replaces the first edition of IEC 60749-22 published in 2002.
This edition includes the following significant technical changes with respect to the previous edition:
a) Major update, including new techniques and use of new materials (e.g. copper wire) involving a complete rewrite as two separate subparts (this document and IEC 60749-22-2).
This International Standard is to be used in conjunction with IEC 60749-22-2:2025.
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IEC 62047-49:2025 specifies reliability test methods of electro-mechanical conversion characteristics of piezoelectric thin film on microcantilever, which is typical structure of micro sensors and micro actuators. In order to estimate the stability of the piezoelectric coefficient of the piezoelectric thin films with microscale structures in the operating conditions, this document reports the schema to determine the characteristic parameters for consumer, industry or any other applications of piezoelectric MEMS devices. This document applies to piezoelectric thin films on microcantilever fabricated by MEMS process.
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IEC 61249-2-52:2025 gives requirements for properties of the thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad in thicknesses of 0,05 mm up to 3,20 mm.
- Standard24 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 60384-14-1:2025 forms the basis for a uniform procedure for a common international safety mark. It implements the approval schedule for safety tests in IEC 60384‑14, specifies a declaration of design for parameters relevant to safety and indicates conformance tests to be conducted on every lot prior to its release and requalification tests depending on changes to the declared design. This edition includes the following significant technical changes with respect to the previous edition: a) the tables for dimensions have been replaced with a guidance text in the document; b) the possibility to give the requirements for the service in DC applications and in high humidity conditions have been added; c) the changes in this document in comparison with the previous edition are given in Annex B. This International Standard is to be used in conjunction with IEC 60384‑1 and IEC 60384‑14:2023.
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IEC 60384-14-2:2025 forms the basis for a uniform procedure for a common international safety mark. It implements the approval schedule for safety tests in IEC 60384‑14, specifies a declaration of design for parameters relevant to safety and indicates conformance tests to be conducted on every lot prior to its release and requalification tests depending on changes to the declared design. This edition includes the following significant technical changes with respect to the previous edition: a) the tables for dimensions have been replaced with a guidance text in the document, b) the possibility to give the requirements for the service in DC applications and in high humidity conditions have been added. c) the changes in this document in comparison with the previous edition are given in Annex B. This International Standard is to be used in conjunction with IEC 60384‑1:2021 and IEC 60384‑14:2023.
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IEC 61496-3:2025 specifies additional requirements for the design, construction and testing of non‑contact electro-sensitive protective equipment (ESPE) designed specifically to detect persons or parts of persons as part of a safety-related system, employing active opto-electronic protective devices responsive to diffuse reflection (AOPDDRs) for the sensing function. Special attention is directed to requirements which ensure that an appropriate safety-related performance is achieved. An ESPE can include optional safety-related functions, the requirements for which are given both in Annex A of this document and in Annex A of IEC 61496‑1:2020.
NOTE "Non-contact" means that physical contact is not required for sensing.
This document does not specify the dimensions or configurations of the detection zone and its disposition in relation to hazardous parts for any particular application, nor what constitutes a hazardous state of any machine. It is restricted to the functioning of the ESPE and how it interfaces with the machine.
AOPDDRs are devices that have either
- one or more detection zone(s) specified in two dimensions (AOPDDR-2D), or
- one or more detection zone(s) specified in three dimensions (AOPDDR-3D)
wherein radiation in the near infrared range is emitted by an emitting element(s). When the emitted radiation impinges on an object (for example, a person or part of a person), a portion of the emitted radiation is reflected to a receiving element(s) by diffuse reflection. This reflection is used to determine the position of the object.
Opto-electronic devices that perform only a single one-dimensional spot-like distance measurement, for example, optical proximity switches, are not covered by this document.
This document is limited to ESPE that do not require human intervention for detection. It is limited to ESPE that detect objects entering into or being present in a detection zone(s).
This document does not address those aspects required for complex classification or differentiation of the object detected.
This document does not address requirements and tests for outdoor application.
Excluded from this document are AOPDDRs employing radiation with the peak of wavelength outside the range 820 nm to 1 100 nm, and those employing radiation other than that generated by the AOPDDR itself. For sensing devices that employ radiation of wavelengths outside this range, this document can be used as a guide. This document is relevant for AOPDDRs having a minimum detectable object size in the range from 30 mm to 200 mm.
This document can be relevant to applications other than those for the protection of persons, for example, for the protection of machinery or products from mechanical damage. In those applications, different requirements can be appropriate, for example when the materials that are recognized by the sensing function have different properties from those of persons and their clothing.
This document does not deal with electromagnetic compatibility (EMC) emission requirements.
This fourth edition cancels and replaces the third edition published in 2018. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) some requirement clauses and test procedures have been adapted or removed because they have been consolidated in IEC 61496-1:2020 (e.g. 5.4.6.2 Light sources and Clause A.9);
b) change of the minimum probability of detection and fault detection requirements for Type 2 AOPDDR;
- Standard88 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61249-2-52:2025 gives requirements for properties of the thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad in thicknesses of 0,05 mm up to 3,20 mm.
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IEC TR 62715-6-41:2025 provides information about various rolling types of rollable displays. This document includes an overview of rollable display technology, their structure and applications.
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IEC 63150-2:2025 specifies terms and definitions, and test methods that can be used to evaluate and determine the performance characteristics of kinetic energy harvesting devices for human arm swing motion. Such kinetic energy harvesting devices often have a rotor with eccentric mass to efficiently capture kinetic energy at very low frequency range, but this document is not limited to rotational energy harvesters. These have different power generation mechanisms (such as electromagnetic, piezoelectric, electrostatic, triboelectric, etc.) with different working principles, and their performance is evaluated with motions relevant to human arm swing, in which large-amplitude low-frequency external mechanical excitations prevail.
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IEC 63150-3:2025 specifies terms and definitions, and test methods of impact-driven energy harvesting devices of which electric energy is generated by impact force of human walking or running motion under practical human motion. This document is applicable to impact-driven energy harvesting devices embedded in wearables, especially, shoe-mounted energy harvesters, whose main element of the power generation is the impact energy. This measuring method is independent of power generation principles (such as piezoelectric, electrostatic, triboelectric, electromagnetic, etc.). According to typical human motion, power generation performance is measured in the condition of large-amplitude and low-frequency external mechanical excitation.
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IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.
- Standard17 pagesEnglish languagesale 15% off
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- Standard34 pagesEnglish and French languagesale 15% off
IEC 61249-2-53:2025 specifies requirements for properties of PTFE unfilled reinforced laminated sheet of a thickness 0,05 mm up to 10,0 mm of defined flammability (vertical burning test), copper-clad. This part of IEC 61249 is applicable to the design, manufacture, use of PTFE unfilled reinforced laminated sheet of defined flammability (vertical burning test), copper-clad. Its flame resistance is defined in terms of the flammability requirements of 8.4.
- Standard19 pagesEnglish languagesale 15% off
- Standard20 pagesFrench languagesale 15% off
- Standard39 pagesEnglish and French languagesale 15% off
IEC 61496-3:2025 specifies additional requirements for the design, construction and testing of non‑contact electro-sensitive protective equipment (ESPE) designed specifically to detect persons or parts of persons as part of a safety-related system, employing active opto-electronic protective devices responsive to diffuse reflection (AOPDDRs) for the sensing function. Special attention is directed to requirements which ensure that an appropriate safety-related performance is achieved. An ESPE can include optional safety-related functions, the requirements for which are given both in Annex A of this document and in Annex A of IEC 61496‑1:2020. NOTE "Non-contact" means that physical contact is not required for sensing. This document does not specify the dimensions or configurations of the detection zone and its disposition in relation to hazardous parts for any particular application, nor what constitutes a hazardous state of any machine. It is restricted to the functioning of the ESPE and how it interfaces with the machine. AOPDDRs are devices that have either - one or more detection zone(s) specified in two dimensions (AOPDDR-2D), or - one or more detection zone(s) specified in three dimensions (AOPDDR-3D) wherein radiation in the near infrared range is emitted by an emitting element(s). When the emitted radiation impinges on an object (for example, a person or part of a person), a portion of the emitted radiation is reflected to a receiving element(s) by diffuse reflection. This reflection is used to determine the position of the object. Opto-electronic devices that perform only a single one-dimensional spot-like distance measurement, for example, optical proximity switches, are not covered by this document. This document is limited to ESPE that do not require human intervention for detection. It is limited to ESPE that detect objects entering into or being present in a detection zone(s). This document does not address those aspects required for complex classification or differentiation of the object detected. This document does not address requirements and tests for outdoor application. Excluded from this document are AOPDDRs employing radiation with the peak of wavelength outside the range 820 nm to 1 100 nm, and those employing radiation other than that generated by the AOPDDR itself. For sensing devices that employ radiation of wavelengths outside this range, this document can be used as a guide. This document is relevant for AOPDDRs having a minimum detectable object size in the range from 30 mm to 200 mm. This document can be relevant to applications other than those for the protection of persons, for example, for the protection of machinery or products from mechanical damage. In those applications, different requirements can be appropriate, for example when the materials that are recognized by the sensing function have different properties from those of persons and their clothing. This document does not deal with electromagnetic compatibility (EMC) emission requirements. This fourth edition cancels and replaces the third edition published in 2018. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) some requirement clauses and test procedures have been adapted or removed because they have been consolidated in IEC 61496-1:2020 (e.g. 5.4.6.2 Light sources and Clause A.9); b) change of the minimum probability of detection and fault detection requirements for Type 2 AOPDDR;
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IEC 62047-53:2025 defines the test methods for the performances of MEMS electrothermal transfer device.
The document is applicable to the MEMS electrothermal transfer devices used in airbags, petroleum and mineral detection, igniters and detonators.
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IEC 62007-2:2025 specifies measuring methods for characterizing semiconductor optoelectronic devices that are used in the field of fibre optic digital communication systems and subsystems. This third edition cancels and replaces the second edition published in 2009. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) Modification of the definition of “optical fibre pigtail” in 3.1.3;
b) Correction of an error in Formula (1) for relative intensity noise;
c) Correction of an error in Formula (5);
d) Correction of errors in the title of Figure 11 and the text of 4.9 (replaced "LD" with "LED");
e) Clarification of how to calculate the 1 dB compression in 4.9;
f) Corrections of the circuit diagrams in Figure 2, Figure 5, Figure 11, Figure 17, Figure 18, Figure 19, Figure 20, and Figure 21;
g) Clarification of the measurement setup in 5.10 (Figure 28).
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IEC 60747-6:2025 specifies product specific standards for terminology, letter symbols, essential ratings and characteristics (properties), measuring and test methods, requirements for type tests, routine tests, endurance tests and marking for the following discrete semiconductor devices:
- reverse blocking triode thyristors;
- reverse conducting (triode) thyristors;
- bidirectional triode thyristors (triacs);
- turn-off thyristors.
If no ambiguity is likely to result, any of the above will be referred to as thyristors.
This edition includes the following significant technical changes with respect to the previous edition:
a) the terms and definitions for partial thermal resistance junction-to-case and voltages related to ratings and characteristics (properties) have been added;
b) Clauses 3, 4, 5, 6 and 7 were amended with some deletions of information no longer in use and with some necessary additions.
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IEC 60747-2:2025 specifies product specific standards for terminology, letter symbols, essential ratings and characteristics (properties), measuring and test methods, requirements for type tests, routine tests, endurance tests and marking for the following discrete semiconductor devices:
- generic rectifier diodes;
- avalanche rectifier diodes;
- fast-switching rectifier diodes;
- Schottky barrier diodes.
If no ambiguity is likely to result, any of the above will be referred to as diodes.
This edition includes the following significant technical changes with respect to the previous edition:
a) the terms and definitions for partial thermal resistance junction-to-case have been added;
b) Clauses 3, 4, 5, 6 and 7 have been amended with some deletions of information no longer in use and with some necessary additions.
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IEC 60384-14-1:2025 forms the basis for a uniform procedure for a common international safety mark. It implements the approval schedule for safety tests in IEC 60384‑14, specifies a declaration of design for parameters relevant to safety and indicates conformance tests to be conducted on every lot prior to its release and requalification tests depending on changes to the declared design.
This edition includes the following significant technical changes with respect to the previous edition:
a) the tables for dimensions have been replaced with a guidance text in the document;
b) the possibility to give the requirements for the service in DC applications and in high humidity conditions have been added;
c) the changes in this document in comparison with the previous edition are given in Annex B.
This International Standard is to be used in conjunction with IEC 60384‑1 and IEC 60384‑14:2023.
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IEC 60384-14-2:2025 forms the basis for a uniform procedure for a common international safety mark. It implements the approval schedule for safety tests in IEC 60384‑14, specifies a declaration of design for parameters relevant to safety and indicates conformance tests to be conducted on every lot prior to its release and requalification tests depending on changes to the declared design.
This edition includes the following significant technical changes with respect to the previous edition:
a) the tables for dimensions have been replaced with a guidance text in the document,
b) the possibility to give the requirements for the service in DC applications and in high humidity conditions have been added.
c) the changes in this document in comparison with the previous edition are given in Annex B.
This International Standard is to be used in conjunction with IEC 60384‑1:2021 and IEC 60384‑14:2023.
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This document defines terms used in conjunction with, and the general principles of, test methods for determining the laser-induced damage threshold and for the assurance of optical laser components subjected to laser radiation.
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IEC TS 60825-20:2025 provides radiation safety requirements (normative) and guidelines (informative) for the consideration of faults for Class 1 laser devices with laser radiation directed towards the eyes or face. Requirements for the safety of the nominal emission are not in the scope of this document.
Examples:
− devices with laser light facial or ocular recognition;
− virtual reality headsets or glasses;
− devices with gesture tracking via eye or facial movements;
− driver surveillance cameras;
− full body scanners (including eyes, face, and body).
Products exempted from this document include:
− medical and ophthalmic devices;
− automotive (lidars), lamps;
− laser applications where the laser is used in a professional (non-consumer) setting and is intended for direct or long-time exposure of the eyes or face.
This document provides normative requirements and informative guidelines for:
− radiation safety analysis;
− production-line testing;
− hazard analysis for laser radiation emissions (using a modified safety-focused FMEA approach)
NOTE all subsequent references to FMEA in this document refers to this safety-focused FMEA approach.
− examples of typical failure modes and mitigation techniques
- Technical specification43 pagesEnglish languagesale 15% off
IEC 62007-2:2025 specifies measuring methods for characterizing semiconductor optoelectronic devices that are used in the field of fibre optic digital communication systems and subsystems. This third edition cancels and replaces the second edition published in 2009. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) Modification of the definition of “optical fibre pigtail” in 3.1.3; b) Correction of an error in Formula (1) for relative intensity noise; c) Correction of an error in Formula (5); d) Correction of errors in the title of Figure 11 and the text of 4.9 (replaced "LD" with "LED"); e) Clarification of how to calculate the 1 dB compression in 4.9; f) Corrections of the circuit diagrams in Figure 2, Figure 5, Figure 11, Figure 17, Figure 18, Figure 19, Figure 20, and Figure 21; g) Clarification of the measurement setup in 5.10 (Figure 28).
- Standard43 pagesEnglish languagesale 10% offe-Library read for1 day
IEC TR 62595-1-6:2025 is a technical report that provides general information for future standardization of quantum dot light converting unit (including quantum dot films and quantum dot diffuser plates) used in backlight units and provides examples of the effect of quantum dot light converting unit on the optical characteristics of backlight after environmental test.
- Technical report21 pagesEnglish languagesale 15% off
IEC 61249-2-52:2025 gives requirements for properties of the thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad in thicknesses of 0,05 mm up to 3,20 mm.
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- Standard21 pagesFrench languagesale 15% off
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IEC 60931-2:2025 applies to capacitors according to IEC 60931-1 and gives the requirements for the ageing test and destruction test for these capacitors.
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IEC 60931-1:2025 is applicable to both non-self-healing capacitor units and non-self-healing capacitor banks intended to be used, particularly, for power-factor correction of AC power systems having a rated voltage up to and including 1 000 V and frequencies 15 Hz to 60 Hz. This document also applies to capacitors intended for use in power filter circuits.
- Standard43 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 60122-2:2025 has been compiled in response to a generally expressed desire on the part of both users and manufacturers for guidelines to the use of quartz crystal units for filters and oscillators so that the crystal units may be used to their best advantage.
It draws attention to some of the more fundamental questions which will be considered by the user before it places its order for a unit for a new application, and in so doing will, it is hoped, help ensure against unsatisfactory performance, unfavourable cost and non-availability. It is not the function of this document to explain theory, nor to attempt to cover all the eventualities that can arise in practical circumstances. Lastly, it it is not considered as a substitute for close liaison between manufacturer and user.
Standard specifications, such as those of the IEC of which these guidelines form a part, and national specifications or detail specifications issued by manufacturers, will define the available combinations of the resonant characteristics and the temperature characteristic. These specifications are compiled to include a wide range of quartz crystal units with standardized performances. It cannot be over-emphasized that it is the responsibility of the user , wherever possible, to select the quartz crystal units from these specifications, when available, even if it can lead to making small modifications to the circuit to enable the use of standard resonators. This applies particularly to the selection of the nominal frequency.
This edition includes the following significant technical changes with respect to the previous edition:
a) addition of SC cut type and related requirements;
b) addition of ageing calculation and low level of drive requirements according to the general specification,
c) update of the frequency temperature curve according to the common cut requirements;
d) removal of infrequently used product types.
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This document defines terms used in conjunction with, and the general principles of, test methods for determining the laser-induced damage threshold and for the assurance of optical laser components subjected to laser radiation.
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NEW!IEC 61921:2017 is available as IEC 61921:2017 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61921:2017 is applicable to low-voltage AC shunt capacitor banks intended to be used for power factor correction purposes, possibly equipped with a built-in switchgear and controlgear apparatus capable of connecting to or disconnecting from the mains part(s) of the bank with the aim to correct its power factor. Low-voltage power factor correction banks if not otherwise indicated hereinafter and where applicable comply with the requirements of IEC 61439-1 and IEC 61439-2. This second edition cancels and replaces the first edition published in 2003. It constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: numerous changes regarding verification methods to align with IEC 61439-1; modification of marking; add routine verification of rated output; new Annex D with guidance on methods for temperature rise verification; update of normative references; general editorial review.
Keywords: low-voltage AC shunt capacitor banks
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NEW! IEC 61071:2017 is available as IEC 61071:2017 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61071:2017 applies to capacitors for power electronics applications. The operating frequency of the systems in which these capacitors are used is usually up to 15 kHz, while the pulse frequencies may be up to 5 to 10 times the operating frequency. The document distinguishes between AC and DC capacitors which are considered as components when mounted in enclosures. This document covers an extremely wide range of capacitor technologies for numerous applications, e.g. overvoltage protection, DC and filtering, switching circuits, energy storage, auxiliary inverters, etc. This second edition cancels and replaces the first edition published in 2007. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- Introduction of new terms and definitions;
- clarifications for surge discharge test;
- indications for measuring procedure during thermal stability test;
- clarifications for self-healing test;
- clarifications for endurance test;
- clarifications for destruction test;
- update of normative references;
- general editorial review.
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IEC 60931-2:2025 applies to capacitors according to IEC 60931-1 and gives the requirements for the ageing test and destruction test for these capacitors.
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IEC 60931-1:2025 is applicable to both non-self-healing capacitor units and non-self-healing capacitor banks intended to be used, particularly, for power-factor correction of AC power systems having a rated voltage up to and including 1 000 V and frequencies 15 Hz to 60 Hz. This document also applies to capacitors intended for use in power filter circuits.
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IEC 60122-2:2025 has been compiled in response to a generally expressed desire on the part of both users and manufacturers for guidelines to the use of quartz crystal units for filters and oscillators so that the crystal units may be used to their best advantage. It draws attention to some of the more fundamental questions which will be considered by the user before it places its order for a unit for a new application, and in so doing will, it is hoped, help ensure against unsatisfactory performance, unfavourable cost and non-availability. It is not the function of this document to explain theory, nor to attempt to cover all the eventualities that can arise in practical circumstances. Lastly, it it is not considered as a substitute for close liaison between manufacturer and user. Standard specifications, such as those of the IEC of which these guidelines form a part, and national specifications or detail specifications issued by manufacturers, will define the available combinations of the resonant characteristics and the temperature characteristic. These specifications are compiled to include a wide range of quartz crystal units with standardized performances. It cannot be over-emphasized that it is the responsibility of the user , wherever possible, to select the quartz crystal units from these specifications, when available, even if it can lead to making small modifications to the circuit to enable the use of standard resonators. This applies particularly to the selection of the nominal frequency. This edition includes the following significant technical changes with respect to the previous edition: a) addition of SC cut type and related requirements; b) addition of ageing calculation and low level of drive requirements according to the general specification, c) update of the frequency temperature curve according to the common cut requirements; d) removal of infrequently used product types.
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IEC TR 62433-4-1:2025 provides an overview of good practices to extract an ICIM-CI model from measurements and to build a numerical model of the PCB in which the ICIM-CI model is used to predict RF immunity of an IC in its application PCB.
This document also discusses factors which can be considered to obtain proper results in an ICIM-CI model extraction and use of the actual model at the PCB level.
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IEC 60068‑2-88:2025 establishes test methods for the resistance of electronic and electromechanical components, unpopulated circuit boards and assemblies to liquid cleaning media and cleaning processes, which are agreed between user and supplier for applications, where cleaning is required. These tests are not applicable to components, unpopulated circuit boards and assemblies, which are not intended to be subjected to cleaning processes.
Tests XD1 and XD2 primarily are intended for qualification testing of components and unpopulated circuit boards suitable for cleaning processes, but can be adopted as well to testing of material compatibility and specific cleaning media used in manufacturing processes of components and unpopulated circuit boards.
Test XD3 is intended to determine the resistance of electronic assemblies suitable for cleaning processes to the various cleaning processes to which they are exposed during manufacturing, including the effects of assembly and soldering processes.
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IEC 63366:2025 defines product category rules (PCR) for electrical and electronic products and systems (EEPS) to develop Type III environmental declarations for electrical and electronic products and systems (EEPS). It specifies the process and requirements on how to conduct life cycle assessment (LCA) in the context of environmental declarations.
This document provides common rules for:
a) LCA, including the requirements for developing default scenarios;
b) the LCA report;
c) the development of PSR.
This document provides further guidelines for environmental declarations.
The LCA principles and framework are based on ISO 14040 and ISO 14044, and are therefore out of scope of this document.
PCR is complemented by additional product-specific rules (PSR), which further define, for example, functional units and default scenarios in the product-specific context. Therefore, this document also provides guidance on how to develop PSR in corresponding technical committees.
This document has the status of a horizontal publication in accordance with IEC Guide 108. In accordance with IEC Guide 108, this generic essential horizontal standard is intended for use by product committees as a starting point in preparing PSR standards. Specific requirements developed by product committees in PSR standard take precedence over requirements in this standard.
When there is no PSR available in a product committee, this generic essential horizontal standard could be applied by LCA practitioners with recorded complementary specifications.
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IEC 60749-34-1:2025 describes a test method that is used to determine the capability of power semiconductor modules to withstand thermal and mechanical stress resulting from cycling the power dissipation of the internal semiconductors and the internal connectors. It is based on IEC 60749-34, but is developed specifically for power semiconductor module products, including insulated-gate bipolar transistor (IGBT), metal-oxide-semiconductor field-effect transistor (MOSFET), diode and thyristor.
If there is a customer request for an individual use or an application specific guideline (for example ECPE Guideline AQG 324), details of the test method can be based on these requirements if they deviate from the content of this document.
This test caused wear-out and is considered destructive.
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