31 - ELECTRONICS
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IEC 61340-5-1:2024 applies to organizations that: manufacture, process, assemble, install, package, label, service, test, inspect, transport, or otherwise handle electrical or electronic parts, assemblies and equipment with withstand voltages greater than or equal to 100 V human body model (HBM) and 200 V charge device model (CDM). Also, protection from isolated conductors is addressed by limiting the voltage on isolated conductors to less than 35 V. ESDS with lower withstand voltages can require additional control elements or adjusted limits. Processes designed to handle items that have lower ESD withstand voltage(s) can still claim compliance to this document. This document provides the requirements for an ESD control program. IEC TR 61340-5-2 provides guidance on the implementation of this document. This document does not apply to electrically initiated explosive devices, flammable liquids, gases, and powders. The purpose of this document is to provide the administrative and technical requirements for establishing, implementing, and maintaining an ESD control program (hereinafter referred to as the “program”). This edition includes the following significant technical changes with respect to the previous edition:
a) definitions have been added to the document;
b) updates to product qualification requirements;
c) subclause 5.3.3 now includes a reference to groundable static control garment systems;
d) Table 2 was replaced;
e) subclause 5.3.4.2 was updated to define what an insulator is;
f) subclause 5.3.4.3 was updated to include a definition for isolated conductor;
g) Table 3 was updated, technical items added, including a reference to IEC 61340-5-4 for compliance verification testing;
h) Table 4 was added as a summary of the requirements in IEC 61340-5-3 and to include requirements for compliance verification of packaging;
i) Annex A was replaced: the former Annex is no longer required. Annex A are examples of tailoring.
- Standard24 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
- Standard23 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 60384-21:2024 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric with a defined temperature coefficient (dielectric Class 1), intended for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included but are covered by IEC 60384-14. The object of this document is to specify preferred ratings and characteristics and to select from IEC 60384-1:2021 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of capacitor. Test severities and requirements specified in detail specifications referring to this sectional specification provide specific test severities and requirements of an equal or higher performance level. Further information on the conception of generic, sectional and detail specifications can be found in the Introduction of IEC 60384-1:2021.
This edition includes the following significant technical changes with respect to the previous edition:
a) the document has been completely restructured to comply with the ISO/IEC Directives, Part 2 and to make it more useable; tables, figures and references have been revised accordingly; Annex X contains all cross-references of changes in clause/subclause numbers;
b) the terms have been replaced by the letter symbols in Table 3;
c) code of temperature coefficient and tolerance of C0G, U2J have been added in Table 4, Table 6, Table 8, Table 9, Table 11, Table 13, Table 16 and Annex B;
d) the requirement in 5.5.2(visual examination) has been repeated in 5.9.3, 5.10.5, 5.11.4, 5.11.4, 5.13.7, 5.14.5 and 5.15.5;
e) the deflection D in the very robust designs has been added in 5.9.1;
f) Annex B has been changed informative into normative;
g) Clause C.5 (Test schedule for quality conformance inspection) has been newly added to withdraw the blank detail specification: IEC 60384-21-1.
- Standard147 pagesEnglish languagesale 15% off
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IEC 60384-22:2024 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits.
Capacitors for electromagnetic interference suppression are not included but are covered by IEC 60384-14. The object of this document is to specify preferred ratings and characteristics and to select from IEC 60384-1:2021 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of capacitor. Test severities and requirements specified in detail specifications referring to this sectional specification provide specific test severities and requirements of an equal or higher performance level. Further information on the conception of generic, sectional and detail specifications can be found in the Introduction of IEC 60384-1:2021.
This edition includes the following significant technical changes with respect to the previous edition:
a) The document has been completely restructured to comply with the ISO/IEC Directives, Part 2 and to make it more useable; tables, figures and references have been revised accordingly.
b) The requirements of reference temperature 25 °C has been added in Table 5, Table 9, Table 10, Table 12, Table 14 and Table 17.
c) The table of temperature characteristics of capacitance for the reference temperature 25 °C have been added in Table C.1, Table C.2 and Table C.3.
d) The requirement in 5.5.2 (visual examination) has been repeated in 5.9.3, 5.10.6, 5.11.4, 5.12.6, 5.13.8, 5.14.6 and 5.15.6.
e) The deflection D in the very robust designs has been added in 5.9.1.
f) Annex C has been changed informative into normative.
g) Clause D.5 (Test schedule for quality conformance inspection) has been newly added to withdraw the blank detail specification: IEC 60384-22-1.
- Standard167 pagesEnglish languagesale 15% off
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IEC 62522:2024 is available as IEC 62522:2024 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62552:2024 provides a stable and reproducible procedure to calibrate the wavelength and power output of a tuneable laser against reference instrumentation such as optical power meters and optical wavelength meters (including optical frequency meters) that have been previously traceably calibrated.
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IEC 60317-68:2017 specifies the requirements of enamelled rectangular aluminium winding wire of class 120 with a sole coating based on polyvinyl acetal resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The range of nominal conductor dimensions covered by this standard is
- width: min. 2,0 mm - max. 16,0 mm;
- thickness: min. 0,80 mm - max. 5,60 mm.
Wires of grade 1 and grade 2 are included in this part of IEC 60317 and apply to the complete range of conductors. The specified combinations of width and thickness as well as the specific ratio width/thickness are given in IEC 60317-0-9:2015.
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IEC 60317-35:2013 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on poly-urethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is:
- Grade 1B: 0,020 mm up to and including 0,800 mm;
- Grade 2B: 0,020 mm up to and including 0,800 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 1992, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- new 3.2.2 containing general notes on winding wire, formerly a part of the scope;
- revision to references to IEC 60317-0-1:2013 to clarify that their application is normative;
- modification to Clause 15 to remove specific wire specimen sizes;
- consolidation of 17.1 and 17.2 of the solderability requirements;
- new Clause 23, Pin hole test. Key words: requirements of solderable enamelled round copper winding wire, class 155, dual coating
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IEC 61643-332:2024 describes the theory of operation, principles for the selection and application of MOVs to be connected to power lines or telecommunication or signalling circuits, up to 1 000 V AC or 1 500 V DC. These SPCs are designed to protect apparatus or personnel, or both, from high transient voltages. This document applies to MOVs having two electrodes and voltage dependents elements with or without disconnectors. It does not apply to assemblies that include MOVs and their influence on the MOV's characteristics. This standard specifically discusses the zinc-oxide type of MOVs.
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IEC 62047-48:2024 specifies the requirements and testing method to determine the solution concentration by optical absorption using MEMS fluidic device.
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IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
- Standard23 pagesEnglish languagesale 10% offe-Library read for1 day
This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.
- Draft9 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61643-332:2024 describes the theory of operation, principles for the selection and application of MOVs to be connected to power lines or telecommunication or signalling circuits, up to 1 000 V AC or 1 500 V DC. These SPCs are designed to protect apparatus or personnel, or both, from high transient voltages. This document applies to MOVs having two electrodes and voltage dependents elements with or without disconnectors. It does not apply to assemblies that include MOVs and their influence on the MOV's characteristics. This standard specifically discusses the zinc-oxide type of MOVs.
- Standard63 pagesEnglish languagesale 10% offe-Library read for1 day
IEC TR 62500:2024 which is a Technical Report, considers the targets assigned to highly severe stress tests for operating margins research and robustness improvement of avionics equipment, their basic principles, their scope of application and their implementation process. It is primarily intended for avionics programme managers, electronic equipment project managers, designers, test managers, and dependability team.
This document provides guidance which can apply to all avionics programmes and is of primary interest to the original equipment manufacturers (OEMs) in charge of designing, developing and producing equipment built for these programmes, for obtaining early equipment maturity.
This document can be used in conjunction with IEC 62429, IEC 62506, or both, with regard to dependability aspects related to equipment consisting of hardware with embedded software.
- Technical report37 pagesEnglish languagesale 15% off
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
- Standard40 pagesEnglish and French languagesale 15% off
IEC 61189-2-805:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.
- Standard20 pagesEnglish and French languagesale 15% off
IEC 60352-9:2024 provides guidelines for welding and testing of ultrasonically welded connections and includes requirements, tests and practical guidance information.
Ultrasonic welding is a form of cold friction welding that is becoming increasingly popular in many industries. This type of welding uses ultrasonic vibration to join materials together, creating a bond that is both strong and reliable. Ultrasonic welding has been identified as a process in ISO 4063-41 by the International Organization for Standardization (ISO).
The process of ultrasonic welding relies on high frequency ultrasound waves being used to create frictional heat at the connection point. High temperature is not required for this special method of welding, making it one of the most cost-effective ways to join two materials together.
It also requires fewer steps than traditional methods, meaning it can be completed quickly and with minimal resources.
Ultrasonic welding has been around for decades but only recently has become more widely utilized due to advances in technology and its availability at lower cost. It can be used on many different materials including plastics, rubbers, metals, textiles, and composites. Due to its precision and strong bonds it creates, it has become extremely popular in manufacturing processes such as automotive industry, electronics industry, furniture production and even medical device production.
This document covers ultrasonically welded connections made with stranded or flexible wires (class 2, 5 or 6 per IEC 60228) of copper or copper alloy, as well as of aluminium or aluminium alloy. These welded metal-to-metal connections shall employ wires with cross-sectional area of 0,08 mm2 to 160 mm2 and shall not exceed a total cross-sectional area, in case of wire bundle, of 200 mm2. For aluminium or aluminium alloy wires, the minimum required cross-sectional area is 2,5 mm2.
Additionally, information on materials, data from industrial experience and test procedures are included to ensure electrically stable connections under prescribed environmental conditions.
Lastly, this document aims to achieve comparable results when using ultrasonic welding equipment with similar performance and specifications as specified by the termination manufacturer.
- Standard71 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61169-70:2024, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) of HD-BNC series RF coaxial connectors together with the pro forma blank detail specification. HD-BNC series connectors with characteristic impedance of 75 Ω are used with RF cables or micro-strips in microwave, telecommunication, wireless and other fields. The operating frequency limit is up to 18 GHz.
It also prescribes mating face dimensions for general purpose connectors, gauging information and tests selected from IEC 61169-1, applicable to all detail specifications relating to series HD-BNC RF connectors.
This specification indicates the recommended performance characteristics to be considered when writing a detail specification and it covers test schedules and inspection requirements for assessment levels M and H.
- Standard26 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61643-332:2024 describes the theory of operation, principles for the selection and application of MOVs to be connected to power lines or telecommunication or signalling circuits, up to 1 000 V AC or 1 500 V DC. These SPCs are designed to protect apparatus or personnel, or both, from high transient voltages. This document applies to MOVs having two electrodes and voltage dependents elements with or without disconnectors. It does not apply to assemblies that include MOVs and their influence on the MOV's characteristics. This standard specifically discusses the zinc-oxide type of MOVs.
- Standard127 pagesEnglish and French languagesale 15% off
This part of IEC 60939 covers passive filters used to attenuate unwanted radio-frequency
signals (such as noise or interference) generated from electromagnetic sources.
Both single and multi-channel filters within one enclosure or which are built on a printed circuit
board forming a compact entity are included within the scope of this document.
Filters constructed of capacitive elements where the inductance is inherent in the construction
of the filter are within the scope of this document. Similarly, filters constructed of inductive
elements where the capacitance is inherent in the construction of the filter are also within the
scope of this document. It is up to the manufacturer to state whether a given component is to
be designed as a capacitor, an inductor or a filter. Filters can include also other components
such as resistors and/or varistors or similar components.
This document applies to passive filter units for electromagnetic interference suppression for
which safety tests are appropriate. This implies that filters specified according to this document
will either be connected to mains supplies, when compliance with the mandatory tests of
Table B.1 is necessary, or used in other circuit positions where the equipment specification
specifies that some or all of these safety tests are required.
This document applies to passive filter units, which will be connected to an AC mains or other
supply (DC or AC) with a nominal voltage not exceeding 1 000 V AC, with a nominal frequency
not exceeding 400 Hz, or 1 500 V DC.
NOTE For AC use, IEC 60384-14 applies to capacitors which will be connected to AC mains with a nominal
frequency not exceeding 100 Hz.
This document covers appliance filters (US) but does not cover facility filters, cord-connected
filters or direct plug-in filters. These other filters will be covered by another sectional
specification.
- Standard84 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
- Draft10 pagesEnglish languagesale 10% offe-Library read for1 day
- Amendment9 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61169-70:2024, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) of HD-BNC series RF coaxial connectors together with the pro forma blank detail specification. HD-BNC series connectors with characteristic impedance of 75 Ω are used with RF cables or micro-strips in microwave, telecommunication, wireless and other fields. The operating frequency limit is up to 18 GHz. It also prescribes mating face dimensions for general purpose connectors, gauging information and tests selected from IEC 61169-1, applicable to all detail specifications relating to series HD-BNC RF connectors. This specification indicates the recommended performance characteristics to be considered when writing a detail specification and it covers test schedules and inspection requirements for assessment levels M and H.
- Standard26 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 63171-1:2024 is part of the IEC 63171 series which is a set of International Standards covering shielded or unshielded free and fixed connectors for balanced single-pair data transmission with current carrying capacity.
IEC 63171 is the general requirements and tests part (general specifications) of the whole series. Subsequent parts, such as this Part 1, are product detail specifications of the series IEC 63171 and do not duplicate information given in IEC 63171, but list only additional requirements. Each subsequent part is identified by a type of connector covered with the same number identifying the part. Some parts can describe more embodiments, with different connectors geometries (rectangular, circular), sharing the core element and the relevant features.
This part of IEC 63171 covers two-way, shielded or unshielded, free and fixed connectors known as Type 1, for balanced single-pair data transmission with frequencies up to 600 MHz and with current carrying capacity up to 2,0 A at 60 °C.
It specifies the common dimensions, and provides the mechanical, electrical, signal integrity, and environmental characteristics, the reliability specifications and corresponding tests for these connectors.
For the complete specifications regarding a connector of this series, both the general specification and the relevant detail specification are therefore required.
For the qualification of a connector of this series, both the general specification and the relevant detail specification shall be met.
This second edition cancels and replaces the first edition published in 2020. This edition constitutes a technical revision and includes the following significant technical changes with respect to the previous edition:
* Information on obtaining a license agreement was updated.
* Connector characteristics and test requirements were aligned with IEC 63171:2021 where applicable.
* Added requirements for Polarizing method (5.6.4) and Dynamic stress (5.6.5) to align with IEC 63171:2021.
* Added test group BP - Moisture (6.7.3.4) to align with IEC 63171:2021.
- Standard21 pagesEnglish languagesale 15% off
IEC 60352-9:2024 provides guidelines for welding and testing of ultrasonically welded connections and includes requirements, tests and practical guidance information. Ultrasonic welding is a form of cold friction welding that is becoming increasingly popular in many industries. This type of welding uses ultrasonic vibration to join materials together, creating a bond that is both strong and reliable. Ultrasonic welding has been identified as a process in ISO 4063-41 by the International Organization for Standardization (ISO). The process of ultrasonic welding relies on high frequency ultrasound waves being used to create frictional heat at the connection point. High temperature is not required for this special method of welding, making it one of the most cost-effective ways to join two materials together. It also requires fewer steps than traditional methods, meaning it can be completed quickly and with minimal resources. Ultrasonic welding has been around for decades but only recently has become more widely utilized due to advances in technology and its availability at lower cost. It can be used on many different materials including plastics, rubbers, metals, textiles, and composites. Due to its precision and strong bonds it creates, it has become extremely popular in manufacturing processes such as automotive industry, electronics industry, furniture production and even medical device production. This document covers ultrasonically welded connections made with stranded or flexible wires (class 2, 5 or 6 per IEC 60228) of copper or copper alloy, as well as of aluminium or aluminium alloy. These welded metal-to-metal connections shall employ wires with cross-sectional area of 0,08 mm2 to 160 mm2 and shall not exceed a total cross-sectional area, in case of wire bundle, of 200 mm2. For aluminium or aluminium alloy wires, the minimum required cross-sectional area is 2,5 mm2. Additionally, information on materials, data from industrial experience and test procedures are included to ensure electrically stable connections under prescribed environmental conditions. Lastly, this document aims to achieve comparable results when using ultrasonic welding equipment with similar performance and specifications as specified by the termination manufacturer.
- Standard71 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62977-2-7:2024 specifies standard measuring conditions and measurement methods for determining the optical characteristics of tiled displays which consist of multiple display modules in order to form one screen. These methods apply to emissive and transmissive direct view flat displays that render real 2D images with all modules lying in the same plane. The methods are applicable in environments where the measuring conditions can be controlled, such as laboratory and production testing.
NOTE The measurement results are not specific values for the products. They can vary according to the measurement method and light measuring device (LMD) used in the calibration.
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IEC 60939-3:2024 is available as IEC 60939-3:2024 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60939-3:2024 covers passive filters used to attenuate unwanted radio-frequency signals (such as noise or interference) generated from electromagnetic sources. Both single and multi-channel filters within one enclosure or which are built on a printed circuit board forming a compact entity are included within the scope of this document. This document applies to passive filter units for electromagnetic interference suppression for which safety tests are appropriate. This implies that filters specified according to this document will either be connected to mains supplies, when compliance with the mandatory tests of Table B.1 is necessary, or used in other circuit positions where the equipment specification specifies that some or all of these safety tests are required. This document applies to passive filter units, which will be connected to an AC mains or other supply (DC or AC) with a nominal voltage not exceeding 1 000 V AC, with a nominal frequency not exceeding 400 Hz, or 1 500 V DC. Note: For AC use, IEC 60384-14 applies to capacitors which will be connected to AC mains with a nominal frequency not exceeding 100 Hz. This document covers appliance filters (US) but does not cover facility filters, cord-connected filters or direct plug-in filters. These other filters will be covered by another sectional specification. This edition includes the following significant technical changes with respect to the previous edition: a) separated clauses for safety and performance tests; b) added note for use of multiple X capacitors bridging basic insulation in 3 phase filters; c) characteristics and conditions to substitute X and Y capacitors are now described in a separate Subclause 4.1; d) creepage and clearance tables updated and in line with the latest editions of IEC 60938-2 and IEC 60664-1; e) allowing voltage measurement for inductance measurements (7.3); f) added requirements for marking depending on remaining energy after disconnection; g) added content of CTL DSH 2044:2016 for temperature test of IEC filters; h) added note about temperature rise required specimens for safety testing; i) changed index of capacitors in Annex A to avoid confusion between index name and capacitor class; j) moved tests from group 1A to 2. Now, samples in group 1A need to be submitted without potting; k) revision of all parts of the document has taken place based on the ISO/IEC Directives, Part 2:2021, and harmonization with other similar kinds of documents. Annex X contains all cross-references of changes in clause/subclause numbers.
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IEC 63203-402-2:2024 specifies test methods for measuring and evaluating the performance, reliability, and accuracy of the step counting feature in any wearable device that can count steps (e.g. activity and fitness trackers, smart bands, smart shoes, and smart insoles).
These standard test methods exclude the evaluation of data associated with travel distance or calorie consumption.
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IEC 62047-43:2024 specifies the test method of electrical characteristics after cyclic bending deformation for flexible electromechanical devices. These devices include passive micro components and active micro components on the flexible film or embedded in the flexible film. The desired in-plane dimensions of the device for the test method ranges typically from 1 mm to 300 mm and the thickness ranges from 10 μm to 1 mm, but these are not limiting values. The test method is so designed as to understand and further visualize the entire performance deterioration behaviour after cyclic bending deformation in a concept of 3D (P-S-N: Performance - Severity of bending - Number of cycles) plot over the loading space of severity of bending and number of repeated cycles. This document is essential to estimate safety margin over the operation period under a certain level of cyclic bending deformation and indispensable for reliable design of the product employing these devices.
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IEC 63203-402-2:2024 specifies test methods for measuring and evaluating the performance, reliability, and accuracy of the step counting feature in any wearable device that can count steps (e.g. activity and fitness trackers, smart bands, smart shoes, and smart insoles). These standard test methods exclude the evaluation of data associated with travel distance or calorie consumption.
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IEC 62899-202-8:2024 provides a method for measuring the resistance difference of the printing direction of a printed conductive layer with wire-shaped or wire-type conducting materials. The method described in this document offers a measurement method and conditions for solution processed conductive films, fabricated by coating and printing process.
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IEC TS 60825-19:2024 specifies the velocity-dependent closest points of human access (VCPHA) for the classification of moving platform laser products when considering the movement of the platform with respect to a stationary frame of reference. This presupposes that the inherent kinetic hazard of the moving platform creates a zone in which persons would not be reasonably expected to be located. Additionally, it takes neighbouring moving platforms into account by defining stationary and moving apertures. This document is applicable to all laser products whose laser apertures are on a moving platform.
Laser products are sometimes used on moving platforms. Currently the standard IEC 60825-1:2014 considers only a stationary aperture; it does not address the situations where the emitting aperture is mounted on a platform, such as a vehicle, that can be in motion. Failure to consider the effects of the motion of the platform can result in overly restrictive assessment of the hazard.
Although accounting for a platform’s movement during the assessment of a laser product’s classification can lead to less restrictive measurement conditions, it is important not to overlook that there can be apertures, even on other moving platforms, moving at a relative speed of zero or close to zero with respect to the moving platform laser product being classified.
- Technical specification15 pagesEnglish languagesale 15% off
IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
- Standard21 pagesEnglish and French languagesale 15% off
IEC 63203-402-3:2024 specifies terms, a measurement protocol, and a test to evaluate the accuracy of wearables that measure heart rate with a photoplethysmography (PPG) sensor. While this document can be used to measure a variety of different devices claiming to report heart rate, care will be taken when testing in countries that differentiate between heart rate and pulse rate. This measurement protocol is not intended to evaluate medical devices associated with the IEC 60601 series or ISO 80601 series.
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This document defines the performances and contact arrangements for threaded ring coupling circular connectors, fire resistant or non-fire resistant, intended for use in a temperature range from -65 °C to 175 °C or 200 °C continuous.
- Standard54 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61169-70:2024, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) of HD-BNC series RF coaxial connectors together with the pro forma blank detail specification. HD-BNC series connectors with characteristic impedance of 75 Ω are used with RF cables or micro-strips in microwave, telecommunication, wireless and other fields. The operating frequency limit is up to 18 GHz.
It also prescribes mating face dimensions for general purpose connectors, gauging information and tests selected from IEC 61169-1, applicable to all detail specifications relating to series HD-BNC RF connectors.
This specification indicates the recommended performance characteristics to be considered when writing a detail specification and it covers test schedules and inspection requirements for assessment levels M and H.
- Standard48 pagesEnglish and French languagesale 15% off
This document specifies the characteristics of hermetic jam-nut mounted receptacles in the family of circular electrical connectors coupled by threaded ring.
It applies to the class defined in Table 4.
For plugs and protective covers, see EN 2997-008 and EN 2997-009 respectively. For spare jam-nuts and O-rings, see EN 2997-012 and EN 2997-013 respectively.
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This document specifies the characteristics of jam-nut mounted receptacles in the family of circular electrical connectors coupled by threaded ring.
It applies to the class defined in Table 4.
For contacts, filler plugs, and rear accessories associated with this receptacle, see EN 2997-002. For plugs and protective covers, see EN 2997-008 and EN 2997-009 respectively. For spare jam-nuts and o-rings, see EN 2997-012 and EN 2997-013 respectively.
- Standard12 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 63203-402-3:2024 specifies terms, a measurement protocol, and a test to evaluate the accuracy of wearables that measure heart rate with a photoplethysmography (PPG) sensor. While this document can be used to measure a variety of different devices claiming to report heart rate, care will be taken when testing in countries that differentiate between heart rate and pulse rate. This measurement protocol is not intended to evaluate medical devices associated with the IEC 60601 series or ISO 80601 series.
- Standard19 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 60352-9:2024 provides guidelines for welding and testing of ultrasonically welded connections and includes requirements, tests and practical guidance information.
Ultrasonic welding is a form of cold friction welding that is becoming increasingly popular in many industries. This type of welding uses ultrasonic vibration to join materials together, creating a bond that is both strong and reliable. Ultrasonic welding has been identified as a process in ISO 4063-41 by the International Organization for Standardization (ISO).
The process of ultrasonic welding relies on high frequency ultrasound waves being used to create frictional heat at the connection point. High temperature is not required for this special method of welding, making it one of the most cost-effective ways to join two materials together.
It also requires fewer steps than traditional methods, meaning it can be completed quickly and with minimal resources.
Ultrasonic welding has been around for decades but only recently has become more widely utilized due to advances in technology and its availability at lower cost. It can be used on many different materials including plastics, rubbers, metals, textiles, and composites. Due to its precision and strong bonds it creates, it has become extremely popular in manufacturing processes such as automotive industry, electronics industry, furniture production and even medical device production.
This document covers ultrasonically welded connections made with stranded or flexible wires (class 2, 5 or 6 per IEC 60228) of copper or copper alloy, as well as of aluminium or aluminium alloy. These welded metal-to-metal connections shall employ wires with cross-sectional area of 0,08 mm2 to 160 mm2 and shall not exceed a total cross-sectional area, in case of wire bundle, of 200 mm2. For aluminium or aluminium alloy wires, the minimum required cross-sectional area is 2,5 mm2.
Additionally, information on materials, data from industrial experience and test procedures are included to ensure electrically stable connections under prescribed environmental conditions.
Lastly, this document aims to achieve comparable results when using ultrasonic welding equipment with similar performance and specifications as specified by the termination manufacturer.
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IEC 62047-44:2024 describes terminology, definitions and test methods that are used to evaluate and determine the dynamic performance of MEMS (Micro-Electromechanical Systems) resonant electric‑field‑sensitive devices. It also specifies sample requirements and test equipment for dynamic performances of MEMS resonant electric‑field‑sensitive devices. The statements made in this document are also applicable to MEMS resonant electric‑field‑sensitive devices with various driving mechanisms such as electrostatic, electrothermal, electromagnetic, piezoelectric, etc.
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IEC TS 63337:2024 provides requirements, test conditions and tests to validate characteristics including the service life of customized DC-link film capacitors for use in motor vehicle components.
Standard DC-link capacitors qualified according to other IEC standards or AEC-Q200 are excluded from the scope of this document.
The requirements, test conditions and tests listed in this document apply to customized film capacitors developed for use in motor vehicle power electronics for the application as a DC-link capacitor in HV applications or in the intermediate circuit of the 48 V on-board electrical system.
These qualification requirements can be expanded or adapted for the application of technologically innovative designs, if necessary. The content and scope of supplements is therefore to be specified and documented in coordination between the responsible parties prior to sourcing.
Power electronics in the motor vehicle need to be tested in accordance with the environmental qualification standards of the vehicle manufacturers.
The tests in this document do not replace the tests specified in the Component Requirement Specifications for complete vehicle components or additional or deviating further requirements, test conditions and tests described therein.
This document contains no tests to validate the thermal interface between capacitors, power electronics and the cooling system on the component level.
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This part of IEC 62321 specifies two different techniques for the determination of
tris(2-chloroethyl) phosphate (TCEP) in plastics, the GC-MS or LC-MS method, both of which
are applicable to quantitative analysis.
These two techniques are applicable to use with polyurethane, polyvinylchloride, and
polyethylene materials containing TCEP between 200 mg/kg to 2 000 mg/kg.
These test methods do not apply to plastic materials having a processing temperature higher
than 230 °C.
GC-MS using a pyrolyser/thermal desorption accessory (Py/TD-GC-MS) technique is described
in Annex A and can be used for the screening of TCEP in plastics.
NOTE TCEP starts thermal decomposition at approximately 230 °C. Polymer types that have a processing
temperature into shapes of plastics (e.g. pellets, moulded parts or sheets) not exceeding the decomposition
temperature can contain TCEP.
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IEC 60939-3:2024 is available as IEC 60939-3:2024 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60939-3:2024 covers passive filters used to attenuate unwanted radio-frequency signals (such as noise or interference) generated from electromagnetic sources. Both single and multi-channel filters within one enclosure or which are built on a printed circuit board forming a compact entity are included within the scope of this document. This document applies to passive filter units for electromagnetic interference suppression for which safety tests are appropriate. This implies that filters specified according to this document will either be connected to mains supplies, when compliance with the mandatory tests of Table B.1 is necessary, or used in other circuit positions where the equipment specification specifies that some or all of these safety tests are required. This document applies to passive filter units, which will be connected to an AC mains or other supply (DC or AC) with a nominal voltage not exceeding 1 000 V AC, with a nominal frequency not exceeding 400 Hz, or 1 500 V DC. Note: For AC use, IEC 60384-14 applies to capacitors which will be connected to AC mains with a nominal frequency not exceeding 100 Hz. This document covers appliance filters (US) but does not cover facility filters, cord-connected filters or direct plug-in filters. These other filters will be covered by another sectional specification.
This edition includes the following significant technical changes with respect to the previous edition:
a) separated clauses for safety and performance tests;
b) added note for use of multiple X capacitors bridging basic insulation in 3 phase filters;
c) characteristics and conditions to substitute X and Y capacitors are now described in a separate Subclause 4.1;
d) creepage and clearance tables updated and in line with the latest editions of IEC 60938-2 and IEC 60664-1;
e) allowing voltage measurement for inductance measurements (7.3);
f) added requirements for marking depending on remaining energy after disconnection;
g) added content of CTL DSH 2044:2016 for temperature test of IEC filters;
h) added note about temperature rise required specimens for safety testing;
i) changed index of capacitors in Annex A to avoid confusion between index name and capacitor class;
j) moved tests from group 1A to 2. Now, samples in group 1A need to be submitted without potting;
k) revision of all parts of the document has taken place based on the ISO/IEC Directives, Part 2:2021, and harmonization with other similar kinds of documents. Annex X contains all cross-references of changes in clause/subclause numbers.
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IEC TR 60068-3-15:2024 describes vacuum-assisted soldering considering the thermal profiling, soldering methods, suitability of the components and vacuum features of soldering systems. It is based on practical experiences from manufacturers, component, material, and soldering systems suppliers. It supports manufacturers by providing information about the functionality of vacuum and effect of vacuum on components performance.
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IEC 63145-22-20:2024 specifies the standard measuring conditions and measurement methods for determining the image quality of augmented reality (AR) type eyewear displays. This document applies to see-through type (AR glasses) eyewear displays using virtual image optics.
See-through type displays (VR glasses), contact lens-type displays, and retina direct projection displays are out of the scope of this document.
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IEC 62629-52-1:2024 specifies the standard measurement methods and measurement conditions for determining the optical properties of aerial displays. This document excludes image quality of aerial displays, such as modulation transfer function (MTF) and resolution measurements.
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This part of IEC 60143 specifies the testing of thyristor controlled series capacitor (TCSC)
installations used in series with transmission lines. This document also addresses issues that
consider ratings for TCSC thyristor valve assemblies, capacitors, and reactors as well as TCSC
control characteristics, protective features, cooling system and system operation.
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This part of IEC 60749 provides a steady-state temperature and humidity bias life test to
evaluate the reliability of non-hermetic packaged semiconductor devices in humid
environments.
This test method is considered destructive.
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IEC 63203-402-2:2024 specifies test methods for measuring and evaluating the performance, reliability, and accuracy of the step counting feature in any wearable device that can count steps (e.g. activity and fitness trackers, smart bands, smart shoes, and smart insoles).
These standard test methods exclude the evaluation of data associated with travel distance or calorie consumption.
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