31.180 - Printed circuits and boards
ICS 31.180 Details
Printed circuits and boards
Gedruckte Schaltungen. Leiterplatten
Cartes et circuits imprimes
Tiskana vezja (TIV) in tiskane plošče
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IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT). This document is applicable to non-destructive testing of metallized holes.
- Draft16 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61249-2-53:2025 specifies requirements for properties of PTFE unfilled reinforced laminated sheet of a thickness 0,05 mm up to 10,0 mm of defined flammability (vertical burning test), copper-clad. This part of IEC 61249 is applicable to the design, manufacture, use of PTFE unfilled reinforced laminated sheet of defined flammability (vertical burning test), copper-clad. Its flame resistance is defined in terms of the flammability requirements of 8.4.
- Draft19 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61249-2-52:2025 gives requirements for properties of the thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad in thicknesses of 0,05 mm up to 3,20 mm.
- Standard24 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61249-2-52:2025 gives requirements for properties of the thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad in thicknesses of 0,05 mm up to 3,20 mm.
- Standard24 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.
- Standard17 pagesEnglish languagesale 15% off
- Standard17 pagesFrench languagesale 15% off
- Standard34 pagesEnglish and French languagesale 15% off
IEC 61249-2-53:2025 specifies requirements for properties of PTFE unfilled reinforced laminated sheet of a thickness 0,05 mm up to 10,0 mm of defined flammability (vertical burning test), copper-clad. This part of IEC 61249 is applicable to the design, manufacture, use of PTFE unfilled reinforced laminated sheet of defined flammability (vertical burning test), copper-clad. Its flame resistance is defined in terms of the flammability requirements of 8.4.
- Standard19 pagesEnglish languagesale 15% off
- Standard20 pagesFrench languagesale 15% off
- Standard39 pagesEnglish and French languagesale 15% off
IEC 61249-2-52:2025 gives requirements for properties of the thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad in thicknesses of 0,05 mm up to 3,20 mm.
- Standard20 pagesEnglish languagesale 15% off
- Standard21 pagesFrench languagesale 15% off
- Standard41 pagesEnglish and French languagesale 15% off
IEC 62899-203-2:2025 specifies a method to measure the values of effective charge carrier mobility in printed semiconductive layers using space charge limited current (SCLC) mobility technique. The method described is intended to be used as a benchmark test to allow reproducible measurements at a given temperature of the apparent charge carrier mobility for comparison with devices that use different materials, material formulations and fabrication processes for a planar configuration. This document specifies the sample and equipment requirements, and describes the measurement technique, the data analysis procedure and the reporting protocol.
This document is suitable to test unipolar devices (i.e. hole-only or electron-only), where charge injection is efficient and where series resistance does not dominate the current-voltage curve. Therefore, it cannot be used for testing high-electron mobility devices where electron injection can be problematic, for testing highly doped materials where space charge limited current does not exist, or to evaluate mobility in applications that require lateral charge transport, such as in transistors.
- Standard18 pagesEnglish languagesale 15% off
IEC 62899-402-1:2025 specifies the measurement methods of the width of line pattern and spaces between the line patterns in printed electronics. These printed line patterns are treated as two-dimensional on a substrate. When the patterns are definitely affected by three-dimensional configurations, these are specified in measurement methods for vertical variance in printed electronics.
This edition includes the following significant technical changes with respect to the previous edition:
a) The title is changed from 'Printability – Measurement of qualities – Pattern width' to 'Printability – Measurement of qualities – Line pattern width'
b) The term 'pattern width' is specified as 'line pattern width'.
c) The measurement method of line pattern space is included.
d) The definition and measurement of inner/outer edge lines are removed.
- Standard16 pagesEnglish languagesale 15% off
IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).
- Standard16 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62899-401:2025 provides an overview of the IEC 62899-4XX series and explains its modular structure. The IEC 62899-4XX series establishes requirements for the printability of printed electronics. These requirements are stated as measurement of quality, reproducibility, analysis and compliance test methods, as well as measuring methods for environmental conditions. The IEC 62899-4XX series specifies the measurements and the requirements of both the quality and the reproducibility of printed patterns as the result of the interaction of printing plate, ink, substrate, and environmental condition. This edition includes the following significant technical changes with respect to the previous edition:
a) The published IEC 62899-4XX documents are listed in the Bibliography.
b) The definitions of printed electronics, printed pattern, and void are modified.
c) The term printing media is specified as printing plate.
d) The term pattern width is specified as line pattern width.
e) The term thickness is specified as thickness of printed line.
f) The definition of basic pattern is modified.
g) The structure of IEC 62899-4XX series is updated according to the present projected documents numbering.
- Standard11 pagesEnglish languagesale 15% off
IEC 62899-202-11:2025 specifies a measurement method of electrical resistance uniformity for large area printed conductive layers. The purpose of this method is to measure resistance uniformity of planar large area printed layers. This method cannot measure sheet resistance. The methods measure electrical resistance or electrical potential drop and use direct contact.
- Standard13 pagesEnglish languagesale 15% off
IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).
- Standard16 pagesEnglish languagesale 10% offe-Library read for1 day
This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.
- Standard12 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
- Standard13 pagesEnglish languagesale 10% offe-Library read for1 day
IEC TR 62899-250:2025 explores a new technological field to establish standardization activities in TC 119 (Printed electronics) in particular, and to contribute to the development and market expansion of wearable smart device (WSD) technology.
This edition includes the following significant technical changes with respect to the previous edition:
a) added classification of e-textile integrated type;
b) added Clause 5, “Verification of conclusions in IEC TR 62899-250:2016 (edition 1)”;
c) added explanation of 3D printed circuits;
d) introduced trends in standardization activities, especially those after the first edition publication;
e) added new issues that became clear after the first edition was published.
- Technical report17 pagesEnglish languagesale 15% off
IEC 61188-6-3:2024 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3.
This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
This first edition partially cancels and replaces the IEC 61188-5 series of International Standards.
The significant technical changes with respect to the previous edition are listed in the Introduction and further detailed information and calculations can be found in Annex A.
- Standard34 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).
- Standard25 pagesEnglish and French languagesale 15% off
IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA).
This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.
- Standard12 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 60194-2:2025 covers terms and definitions related to circuit board and electronic assembly technologies as well as other electronic technologies.
The terms have been classified according to the decimal classification code (DCC) and this DCC number appears just below the defined term. The DCC numbering is fully explained in Annex A.
A list of terms in alphabetical order with code number is provided in Annex B.
This edition includes the following significant technical changes with respect to the previous edition:
a) exclusion of 116 terms transferred to IEV;
b) inclusion of 9 new terms related to printed electronics and packaging technology;
c) revision of definitions of 23 terms reflecting current technology;
d) three "printed wiring" terms were removed;
e) reintroduction of identification codes for terms.
- Standard45 pagesEnglish languagesale 15% off
IEC 61188-6-3:2024 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3. This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4. This first edition partially cancels and replaces the IEC 61188-5 series of International Standards. The significant technical changes with respect to the previous edition are listed in the Introduction and further detailed information and calculations can be found in Annex A.
- Standard34 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.
- Standard12 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 60947-4-3:2020(E) applies to semiconductor controllers and semiconductor contactors for non-motor load intended to be connected to circuits, the rated voltage of which does not exceed 1 000 V AC.
It covers their use:
– for operations of changing the state of AC electric circuits between the ON-state and the OFF-state;
– with or without bypass switching devices;
– as controller, for reducing the amplitude of the RMS AC voltage.
This third edition cancels and replaces the second edition published in 2014. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) scope exclusions;
b) editorial correction of notes and hanging paragraphs;
c) safety aspects related to:
- general aspects;
- limited energy circuits;
- electronic circuits;
d) mention of dedicated wiring accessories;
e) power consumption measurement;
f) alignment to IEC 60947-1:2020;
g) alignment with IEC 60947-4-2 when appropriate.
- Standard94 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61188-6-3:2024 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3.
This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
This first edition partially cancels and replaces the IEC 61188-5 series of International Standards.
The significant technical changes with respect to the previous edition are listed in the Introduction and further detailed information and calculations can be found in Annex A.
- Standard62 pagesEnglish and French languagesale 15% off
IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA).
This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.
- Standard17 pagesEnglish and French languagesale 15% off
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
- Standard23 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
- Standard23 pagesEnglish languagesale 10% offe-Library read for1 day
This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.
- Standard12 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
- Standard40 pagesEnglish and French languagesale 15% off
IEC 61189-2-805:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.
- Standard20 pagesEnglish and French languagesale 15% off
IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
- Standard13 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62899-202-8:2024 provides a method for measuring the resistance difference of the printing direction of a printed conductive layer with wire-shaped or wire-type conducting materials. The method described in this document offers a measurement method and conditions for solution processed conductive films, fabricated by coating and printing process.
- Standard13 pagesEnglish languagesale 15% off
IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
- Standard21 pagesEnglish and French languagesale 15% off
IEC TS 62878-2-10:2024 provides a general specification for the design of cavity substrates.
- Technical specification9 pagesEnglish languagesale 15% off
This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
- Standard24 pagesEnglish languagesale 10% offe-Library read for1 day
This International Standard covers finished fabrics woven from ‘‘E’’ glass electrical grade glass fibre yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by this specification are plain weave.
This specification determines the nomenclature, definitions, general and chemical requirements for the glass, and physical requirements for finished woven glass fibre fabrics.
Annex A of this standard provides a style designator for each finished fabric glass style, with specifications on yarn, fabric count, thickness and weight in both SI and US system.
- Standard23 pagesEnglish languagesale 10% offe-Library read for1 day
This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
- Standard24 pagesEnglish languagesale 10% offe-Library read for1 day
This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.
- Standard11 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
- Standard42 pagesEnglish and French languagesale 15% off
IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.
- Standard292 pagesEnglish languagesale 15% off
This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).
- Standard11 pagesEnglish languagesale 10% offe-Library read for1 day
This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.
- Standard13 pagesEnglish languagesale 10% offe-Library read for1 day
This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.
- Standard11 pagesEnglish languagesale 10% offe-Library read for1 day
This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).
- Standard11 pagesEnglish languagesale 10% offe-Library read for1 day
This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.
- Standard13 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
- Standard16 pagesEnglish and French languagesale 15% off
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
- Standard19 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62899-202-10:2023 defines terminology and measurement methods for the resistance change of conductive ink layer(s) as a function of thermoplastic elongation. The method measures resistance changes in-situ or post-elongation.
This document is applicable to thermoformable substrates with conductive ink layers. The thermoformable substrates can have printed graphic ink as well and cover insulation layers.
- Standard26 pagesEnglish languagesale 15% off
IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.
- Standard14 pagesEnglish languagesale 15% off
IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).
- Standard16 pagesEnglish and French languagesale 15% off