SIST EN IEC 61188-6-3:2025

SLOVENSKI STANDARD
01-april-2025
Plošče tiskanih vezij in sestavi plošč tiskanih vezij - Zasnova in uporaba - 6-3. del:
Razmestitev priključkov - Opis razmestitve priključkov skozi luknje komponent
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern
design - Description of land pattern for through hole components (THT)
Leiterplatten und Flachbaugruppen – Konstruktion und Anwendung – Teil 6-3:
Anschlussflächengestaltung – Beschreibung von Anschlussflächen für Komponenten der
Steckmontage (THT)
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-3:
Conception de la zone de report - Description de la zone de report pour les composants
à trous traversants (THT)
Ta slovenski standard je istoveten z: EN IEC 61188-6-3:2025
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61188-6-3

NORME EUROPÉENNE
EUROPÄISCHE NORM January 2025
ICS 31.180; 31.190 Supersedes EN 61188-5-2:2003 (partially);
EN 61188-5-3:2007 (partially);
EN 61188-5-4:2007 (partially);
EN 61188-5-5:2007 (partially);
EN 61188-5-6:2003 (partially);
EN 61188-5-8:2008 (partially)
English Version
Circuit boards and circuit board assemblies - Design and use -
Part 6-3: Land pattern design - Description of land pattern for
through hole components (THT)
(IEC 61188-6-3:2024)
Cartes imprimées et cartes imprimées équipées - Leiterplatten und Flachbaugruppen - Konstruktion und
Conception et utilisation - Partie 6-3: Conception de la zone Anwendung - Teil 6-3: Anschlussflächengestaltung -
de report - Description de la zone de report pour les Beschreibung von Anschlussflächen für Komponenten der
composants à trous traversants (THT) Steckmontage (THT)
(IEC 61188-6-3:2024) (IEC 61188-6-3:2024)
This European Standard was approved by CENELEC on 2025-01-13. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2025 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61188-6-3:2025 E

European foreword
The text of document 91/1982/FDIS, future edition 1 of IEC 61188-6-3, prepared by TC 91 "Electronics
assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC
as EN IEC 61188-6-3:2025.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2026-01-31
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2028-01-31
document have to be withdrawn
This document partially supersedes EN 61188-5-2:2003, EN 61188-5-3:2007, EN 61188-5-4:2007, EN
61188-5-5:2007, EN 61188-5-6:2003 and EN 61188-5-8:2008 and all of their amendments and
corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61188-6-3:2024 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 61188-6-2 NOTE Approved as EN IEC 61188-6-2
IEC 61191-1 NOTE Approved as EN IEC 61191-1
IEC 61191-2 NOTE Approved as EN 61191-2
IEC 61191-3 NOTE Approved as EN 61191-3
IEC 61191-4 NOTE Approved as EN 61191-4
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 60352-5 2020 Solderless connections - Part 5: Press-in EN IEC 60352-5 2020
connections - General requirements, test
methods and practical guidance

IEC 61188-6-3 ®
Edition 1.0 2024-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Circuit boards and circuit board assemblies – Design and use –

Part 6-3: Land pattern design – Description of land pattern for through hole

components (THT)
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –

Partie 6-3: Conception de la zone de report – Description de la zone de report

pour les composants à trous traversants (THT)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180, 31.190 ISBN 978-2-8327-0069-3

– 2 – IEC 61188-6-3:2024 © IEC 2024
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 8
4 Description of a through hole component . 9
4.1 Component body . 9
4.2 Component leads . 9
5 Padstack . 10
5.1 Description . 10
5.2 Pad types . 10
5.2.1 General . 10
5.2.2 General . 10
5.2.3 Solder mask pads . 10
5.2.4 Outer layer pads . 11
5.2.5 Thermal pads . 11
5.2.6 Anti-pads . 11
5.3 Pad shapes . 11
5.4 Holes – Considerations for plated-through hole dimensioning . 11
5.5 Annular ring . 12
6 Requirements on lands for solder joints . 12
6.1 General . 12
6.2 Land/Pad dimensioning for leaded terminals . 14
6.3 Land shape for typical terminal shapes . 14
Annex A (informative) Determination, assessment and calculation of land pattern . 15
A.1 Consideration of creating holes . 15
A.1.1 General . 15
A.1.2 Punched . 15
A.1.3 Drilled . 16
A.1.4 Milled . 16
A.1.5 Laser drilled. 16
A.1.6 preformed / printed . 17
A.2 Determination of THT component assembly . 17
A.2.1 General . 17
A.2.2 Manual assembly . 17
A.2.3 Automated assembly . 18
A.2.4 Press fit component assembly . 18
A.3 Determination of the soldering process . 18
A.3.1 General . 18
A.3.2 Manual soldering . 18
A.3.3 Reflow soldering . 18
A.3.4 Wave soldering . 18
A.3.5 Other soldering processes . 18
A.4 Process flow to determine THT land pattern values . 19
A.4.1 Purpose . 19
A.4.2 Hole creation process . 20

IEC 61188-6-3:2024 © IEC 2024 – 3 –
A.4.3 Drill tolerance . 21
A.4.4 Solder gap . 21
A.4.5 Copper foil . 23
A.4.6 Layer positioning . 23
A.4.7 Circuit board stack-up . 24
A.4.8 Land size (pad-size) . 24
A.4.9 Examples to be enclosed . 25
Bibliography . 31

Figure 1 – Leaded component . 9
Figure 2 – Round lead .
...