ITIV - Electronics assembly technology and Environmental standardization

IEC 61249-2-52:2025 gives requirements for properties of the thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad in thicknesses of 0,05 mm up to 3,20 mm.

IEC 60068‑2-88:2025 establishes test methods for the resistance of electronic and electromechanical components, unpopulated circuit boards and assemblies to liquid cleaning media and cleaning processes, which are agreed between user and supplier for applications, where cleaning is required. These tests are not applicable to components, unpopulated circuit boards and assemblies, which are not intended to be subjected to cleaning processes.
Tests XD1 and XD2 primarily are intended for qualification testing of components and unpopulated circuit boards suitable for cleaning processes, but can be adopted as well to testing of material compatibility and specific cleaning media used in manufacturing processes of components and unpopulated circuit boards.
Test XD3 is intended to determine the resistance of electronic assemblies suitable for cleaning processes to the various cleaning processes to which they are exposed during manufacturing, including the effects of assembly and soldering processes.

IEC 63366:2025 defines product category rules (PCR) for electrical and electronic products and systems (EEPS) to develop Type III environmental declarations for electrical and electronic products and systems (EEPS). It specifies the process and requirements on how to conduct life cycle assessment (LCA) in the context of environmental declarations.
This document provides common rules for:
a) LCA, including the requirements for developing default scenarios;
b) the LCA report;
c) the development of PSR.
This document provides further guidelines for environmental declarations.
The LCA principles and framework are based on ISO 14040 and ISO 14044, and are therefore out of scope of this document.
PCR is complemented by additional product-specific rules (PSR), which further define, for example, functional units and default scenarios in the product-specific context. Therefore, this document also provides guidance on how to develop PSR in corresponding technical committees.
This document has the status of a horizontal publication in accordance with IEC Guide 108. In accordance with IEC Guide 108, this generic essential horizontal standard is intended for use by product committees as a starting point in preparing PSR standards. Specific requirements developed by product committees in PSR standard take precedence over requirements in this standard.
When there is no PSR available in a product committee, this generic essential horizontal standard could be applied by LCA practitioners with recorded complementary specifications.

IEC 60068-2-83:2025 is available as IEC 60068-2-83:2025 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60068-2-83:2025 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes.
NOTE Different solderability test methods for SMD are described in IEC 60068‑2‑58 and IEC 60068‑2‑69. IEC 60068‑2‑58 specifies visual evaluation using solder bath and reflow method, IEC 60068‑2‑69 specifies wetting balance evaluation using solder bath and solder globule method.
This edition includes the following significant technical change with respect to the previous edition:
a) revise Clause 5 to align with that in IEC 60068‑2‑20:2021.

IEC 82474-1:2025 specifies the requirements and guidance for the content, format and exchange relating to material declarations for products.
The main intended use of this document is to provide data up and down the supply chain that:
- allows organizations to assess products against material and substance requirements,
- allows organizations to assess process chemical substances used in manufacturing and other stages of the product life,
- allows organizations to use this information in their activities related to environmentally conscious design process and across all product life cycle stages,
- allows organisations to obtain information about material efficiency and circularity of their products.
This document specifies mandatory declaration requirements and also provides optional declaration requirements.
This document does not suggest any specific software solution to capture material declaration data in the supply chain. However, it provides a data format used to transfer information within the supply chain. Organizations can determine the most appropriate method to capture material declaration data without compromising data utility and quality. This document is intended to allow declaration based on engineering judgement, responder (supplier) material declarations, and/or sampling and testing.
This document has the status of a horizontal publication in accordance with IEC Guide 123.
This edition includes the following technical changes with respect to IEC 62474:2018 (edition 2):
a) Definitions were sharpened to fulfil needs from sectors other than electrical and electronic products and systems and new terms have been added that support new topics introduced such as webservice methods, material efficiency and circularity, and new reference list types.
b) A new subclause (4.6) covering process chemical declaration was included. This subclause covers requirements related to the information required about process chemical substances, the applicable processes where they are used, and the respective product life cycle phase(s).
c) A new clause (8) covering web services on material declaration was included. This clause covers requirements related to topics such as machine-machine communication, authentication service, and data representation.
d) Requirements and guidance for the development of reference lists such as query list (QL), and application/exemption lists (AL/EL) were included.
This document has been given the status of a horizontal document in accordance with ISO/IEC Directives, Part 1. It is published as a double logo standard,

IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).

This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.

IEC 62321-12:2023 specifies a reference test method for the simultaneous determination of polybrominated biphenyls, polybrominated diphenyl ethers, and four phthalates: di-isobutyl phthalate (DIBP), di-n-butyl phthalate (DBP), benzylbutyl phthalate (BBP), di-(2-ethylhexyl) phthalate (DEHP) in polymers of electrotechnical products.
The extraction technique described in this document is the ultrasonic-assisted extraction used for simultaneous extraction for sample preparation.
Gas chromatography-mass spectrometry (GC-MS) is considered as the reference technique for the measurement of the simultaneous determination of analytes in the range of 25 mg/kg to 2 000 mg/kg.
The test method using ultrasonic-assisted extraction followed by GC-MS detection has been evaluated by the tests of polypropylene (PP), polyvinylchloride (PVC), acrylonitrile butadiene styrene (ABS), acrylate rubber (ACM), polystyrene (PS), polyurethane (PU) and polyethylene (PE) materials.
This document has the status of a horizontal publication in accordance with IEC Guide 108.

IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.

IEC 61188-6-3:2024 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3.
This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
This first edition partially cancels and replaces the IEC 61188-5 series of International Standards.
The significant technical changes with respect to the previous edition are listed in the Introduction and further detailed information and calculations can be found in Annex A.

IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA).
This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.

IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

This part of IEC 62321 specifies two different techniques for the determination of TCEP tris(2-chloroethyl) phosphate (TCEP) in plastics, the GC-MS or LC-MS method; both of which are suitable for quantitative analysis.
These two techniques have been evaluated for use with polyurethane, Polyvinyl chloride and polyethylene materials containing TCEP between 200 mg/kg to 2 000 mg/kg. Use of the methods escribed in International Standard for other polymers and concentration ranges has not been specifically evaluated.
These test methods do not apply to plastics materials having a processing temperature higher than 230 ℃.
NOTE TCEP starts thermal decomposition at approximately 230 ℃. Polymer types which have a processing temperature into shapes of plastics (e.g. pellets, moulded parts, or sheets etc.) not exceeding the decomposition temperature can contain TCEP.
Py-TD-GC-MS is another technique, suitable for the screening of TCEP in plastics (See Annex A).

This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

IEC 63215-2:2023 applies to the die attach materials and joining system applied to discrete type power electronic devices.
This document specifies the temperature cycling test method which takes into account the actual usage conditions of discrete type power electronic devices to evaluate reliability of the die attach joint materials and joining system, and establishes a classification level for joining reliability (reliability performance index).
The test method specified in this document is not intended to evaluate power semiconductor devices themselves.
The test method specified in this document is not regarded as the one for use to guarantee the reliability of the power semiconductor device packages.
NOTE The test result obtained using this document will not be used as absolute quantitative data, but for intercomparison with the other die attach materials results using the same setup.

This International Standard covers finished fabrics woven from ‘‘E’’ glass electrical grade glass fibre yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by this specification are plain weave.
This specification determines the nomenclature, definitions, general and chemical requirements for the glass, and physical requirements for finished woven glass fibre fabrics.
Annex A of this standard provides a style designator for each finished fabric glass style, with specifications on yarn, fabric count, thickness and weight in both SI and US system.

IEC 62321-3-4:2023 specifies procedures for the screening of di-isobutyl phthalate (DIBP), di-n-butyl phthalate (DBP), benzyl butyl phthalate (BBP), di-(2-ethylhexyl) phthalate (DEHP) in polymers of electrotechnical products by using high performance liquid chromatography with ultraviolet detector (HPLC-UV), thin layer chromatography (TLC) and thermal desorption mass spectrometry (TD-MS).
High performance liquid chromatography with ultraviolet detector (HPLC-UV), thin layer chromatography (TLC) and thermal desorption mass spectrometry (TD-MS) techniques are described in the normative part of this document. Fourier transform infrared spectroscopy (FT-IR) is described in the informative annexes of this document.

This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.

This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.

This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).

IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.

This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.

This document specifies a marking
—   of electrical and electronic equipment (EEE) with a view to minimizing the disposal of waste EEE (WEEE) as unsorted waste and to facilitating its separate collection.
NOTE 1   This is in accordance with Article 14(4) of Directive 2012/19/EU (WEEE, recast)
—   that serves to clearly identify the producer of the equipment and
—   that the equipment has been put on the market after 13 August 2005.
NOTE 2   This is in accordance with Articles 12(3) and 15(2) of Directive 2012/19/EU (WEEE, recast)
—   that applies to categories of electrical and electronic equipment subject to WEEE collection, treatment, recovery and environmentally sound disposal as defined by European and national regulations, provided the equipment concerned is not part of another type of equipment that does not fall within the scope of above mentioned regulations.
NOTE 3   This is in accordance with Article 2 and Annexes I – IV of Directive 2012/19/EU (WEEE, recast) [1]
The definition of a technical carrier medium for machine based identifying the producer, such as a barcode, electronic data medium or microchip, is not covered by this document.

IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses.
This edition includes the following significant technical changes with respect to the previous edition:
a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.

This part of IEC 62321 provides strategies of sampling along with the mechanical preparation of samples from electrotechnical products. These samples can be used for analytical testing to determine the levels of certain substances as described in the test methods in other parts of the IEC 62321 series. Restrictions for substances will vary between geographic regions and can be updated on a regular basis. This document describes a generic process for obtaining and preparing samples prior to the determination of any substance of concern.
This document does not provide:
- full guidance on each and every product that could be classified as electrotechnical product. Since there is a huge variety of electrotechnical parts, with various structures and compositions, along with the continuous innovations in the industry, it is unrealistic to attempt to provide procedures for the disjointment of every type of part;
- guidance regarding other routes to gather additional information on certain substances in a product, although the information collected has relevance to the sampling strategies in this document;
- safe disassembly and mechanical disjointment instructions related to electrotechnical products (e.g. mercury-containing switches) and the recycling industry (e.g. how to handle CRTs or the safe removal of batteries). See IEC 62554 [1] 1 for the disjointment and mechanical sample preparation of mercury-containing fluorescent lamps;
- sampling procedures for packaging and packaging materials;
- analytical procedures to measure the levels of certain substances. This is covered by other standards (e.g. other parts of the IEC 62321 series), which are referred to as "test standards" in this document;
- guidelines for assessment of compliance.
This document has the status of a horizontal standard in accordance with IEC Guide 108 [2].

This part of IEC 62321 specifies the screening analysis of polybrominated biphenyls (PBBs), polybrominated diphenyl ethers (PBDEs), di-isobutyl phthalate (DIBP), di-n-butyl phthalate (DBP), benzylbutyl phthalate (BBP), di-(2-ethylhexyl) phthalate (DEHP), di-n-octyl phthalate (DNOP), di-isononyl phthalate (DINP), and di-isodecyl phthalate (DIDP) in polymers of electrotechnical products using the analytical technique of gas chromatography-mass spectrometry using a pyrolyser/thermal desorption accessory (Py/TD-GC-MS).
This test method has been evaluated through the analysis of PP (polypropylene), PS (polystyrene), and PVC (polyvinyl chloride) materials containing deca-BDE between 100 mg/kg and 1 000 mg/kg and individual phthalates between 100 mg/kg to 4 000 mg/kg as depicted in Annex J. Use of the methods described in this document for other polymer types, PBBs (mono-deca), PBDEs (mono-deca) and phthalates or concentration ranges other than those specified above has not been specifically evaluated.
This document has the status of a horizontal standard in accordance with IEC Guide 108 [1]1.

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (T_d) of base laminate materials using thermogravimetric analysis (TGA).

This part of IEC 62321 specifies two techniques for the determination of hexabromocyclododecane (HBCDD) in polymers of electrotechnical products.
The gas chromatography-mass spectrometry (GC-MS) test method is described in the normative part of this document. The GC-MS method is suitable for the determination of hexabromocyclododecane (HBCDD).
A method using high-pressure liquid chromatography-mass spectrometry (HPLC-MS) is given in informative Annex A.
These test methods have been evaluated for use with EPS (expanded polystyrene foam), XPS (extruded polystyrene foam) and ABS (acrylonitrile butadiene styrene) within the concentration ranges as specified in Table 1. The use of this method for other types of materials or concentration ranges outside those specified below has not been evaluated.
[Table 1]
This document has the status of a horizontal standard in accordance with IEC Guide 108.

This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this standard is to ensure that users of SMDs receive and store products tha can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".

IEC 60068-2-21:2021 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations and is also applicable to surface mount devices (SMDs).
This seventh edition cancels and replaces the sixth edition, published in 2006, and IEC 60068‑2‑77:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:

   
1. integration of parts of IEC 60068-2-77 (see Annex X); IEC 60068-2-77 is withdrawn with the publication of this document;

   
2. Annex X is added to show the correlation of the clauses and subclauses in this edition of IEC 60068-2-21 with the clauses in IEC 60068-2-21:2006 and IEC 60068-2-77:1999.

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.

IEC 60068-2-20:2021 is available as IEC 60068-2-20:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60068-2-20:2021 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068‑2‑58. This document provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this document include the solder bath method and soldering iron method. The objective of this document is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can be resistant to the heat load to which it is exposed during soldering. This edition includes the following significant technical changes with respect to the previous edition:
- update of and clarification of pre-conditioning (former "aging") and its relation to natural aging.

IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste).
This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes.
This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 µm or less).
Test methods for the characteristics of solder paste in this document are considering the effect of surface activation force due to the fine sized solder particles which could affect the test result by existing test methods.

IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.
IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

IEC 62430:2019 describes principles, specifies requirements and provides guidance for organizations intending to integrate environmental aspects into the design and development in order to minimize the adverse environmental impacts of their products.
This document applies to processes on how ECD (environmentally conscious design) are integrated into the design and development. This document applies to any organization, regardless of its size, type or sector.
This document does not provide requirements for assessing the conformity of individual products.
This horizontal standard is primarily intended for use by technical committees in the preparation of standards in accordance with the principles laid down in IEC Guide 108.
One of the responsibilities of a technical committee is, wherever applicable, to make use of horizontal standards in the preparation of its publications. The contents of this horizontal standard will not apply unless specifically referred to or included in the relevant publications.
IEC 62430:2019 cancels and replaces the first edition published in 2009. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) Scope is extended from electrotechnical product and systems to all products including services.
b) As a consequence of the scope expansion, non-electrotechnical products, services in particular, are taken into account to modify requirements.
c) Clause 6 is added as a guidance.

This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.
The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended.
Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology.

IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

IEC 61189-5-501:2021 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.

IEC 61189-5-502:2021 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of improperly used materials and processes that can lead to decreases in electrical resistance.

IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.
The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts).
The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering.

IEC 61189-5-504:2020 is a test method designed to determine the proportion of soluble ionic residues present upon a circuit board, electronic component or assembly. The conductivity of the solution used to dissolve the ionic residues is measured to evaluate the level of ionic residues.

This document defines product category rules (PCR) for electronic and electrical products and systems (EEPS).
It specifies the process and requirements on how to conduct life cycle assessment in the context of
environmental declarations.
PCR is complemented by additional product-specific rules (PSR), which further define e.g. functional units and
default scenarios in the product-specific context. Therefore, it also provides guidance on how to develop PSR
in corresponding technical committees.
This document provides common rules for:
a) life cycle assessment (LCA), including the requirements for developing default scenarios;
b) the LCA report;
c) the development of product specific rules.
This document provides further guidelines for environmental declarations.
The basic LCA principles and framework are based on the EN ISO 14040 series of standards (i.e EN ISO 14040
and ISO 14044), and therefore out of scope of the standard.

This document is applicable to the processes relating to the preparing for re-use of WEEE.
NOTE 1   This document covers the preparing for re-use of WEEE arising from electrical and electronic equipment as listed in Annex I and Annex III of Directive 2012/19/EU.
This document is applicable to preparing for re-use operators only and does not cover activities connected with used or second-hand equipment that have not become waste. It applies to all preparing for re-use operators, no matter their size or main focus of activity.
This document assists in quantifying re-use, recycling and recovery rates in conjunction with EN 50625 1.
In case of treatment operations (including the collection and logistics of WEEE) other than preparing for re-use, the EN 50625 series applies.
Preparing for re-use processes includes the removal of whole components or parts where they are intended to either be used in the repair of faulty equipment or sold as re-use parts.
The following EEE are not in the scope of this document:
- industrial monitoring and control instruments;
- in vitro diagnostic medical devices, medical devices or active implantable devices.
NOTE 2   Examples of industrial monitoring and control instruments include equipment intended for use in potentially explosive atmospheres, and monitoring and control equipment that performs a safety function as part of industrial control system.
NOTE 3   in vitro diagnostic medical devices, medical devices and active implantable devices have the capacity to collect and harbour pathogens, depending on the environment in which they operated. It is essential to follow clinically proven means for decontamination. Relevant Directives are 93/42/EEC and 98/79/EC.

NEW!IEC 61191-1:2018 is available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
- the term "assembly drawing" has been changed to "assembly documentation" throughout;
- references to IEC standards have been corrected;
- Clause 9 was completely rewritten;
- Annex B was removed because there are already procedures for circuit board assemblies.

IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.