SIST EN IEC 61760-1:2022

SLOVENSKI STANDARD
SIST EN IEC 61760-1:2022
01-junij-2022
Nadomešča:
SIST EN 61760-1:2006
Tehnologija površinske montaže - 1. del: Standardna metoda za specifikacijo
komponent za površinsko montažo (SMDs)
Surface mounting technology - Part 1: Standard method for the specification of surface
mounting components (SMDs)
Oberflächenmontagetechnik - Teil 1: Genormtes Verfahren zur Spezifizierung
oberflächenmontierbarer Bauelemente (SMDs)
Technique du montage en surface - Partie 1: Méthode de normalisation pour la
spécification des composants montés en surface (CMS)
Ta slovenski standard je istoveten z: EN IEC 61760-1:2020
ICS:
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN IEC 61760-1:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61760-1:2022

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SIST EN IEC 61760-1:2022


EUROPEAN STANDARD EN IEC 61760-1

NORME EUROPÉENNE

EUROPÄISCHE NORM
September 2020
ICS 31.240 Supersedes EN 61760-1:2006 and all of its amendments
and corrigenda (if any)
English Version
Surface mounting technology - Part 1: Standard method for the
specification of surface mounting components (SMDs)
(IEC 61760-1:2020)
Technique du montage en surface - Partie 1: Méthode Oberflächenmontagetechnik - Teil 1: Genormtes Verfahren
normalisée pour la spécification des composants montés en zur Spezifizierung oberflächenmontierbarer Bauelemente
surface (CMS) (SMDs)
(IEC 61760-1:2020) (IEC 61760-1:2020)
This European Standard was approved by CENELEC on 2020-08-18. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 61760-1:2020 E

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SIST EN IEC 61760-1:2022
EN IEC 61760-1:2020 (E)
European foreword
The text of document 91/1648/FDIS, future edition 3 of IEC 61760-1, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61760-1:2020.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-05-18
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2023-08-18
document have to be withdrawn
This document supersedes EN 61760-1:2006 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 61760-1:2020 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60062 NOTE Harmonized as EN 60062
IEC 60068-1 NOTE Harmonized as EN 60068-1
IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20
IEC 60068-2-69 NOTE Harmonized as EN 60068-2-69
IEC 60191-6-19 NOTE Harmonized as EN 60191-6-19
IEC 60352-5 NOTE Harmonized as EN 60352-5
IEC 60749 (series) NOTE Harmonized as EN 60749 (series)
IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1
IEC 61189-5-504 NOTE Harmonized as EN IEC 61189-5-504
IEC 62474 NOTE Harmonized as EN IEC 62474

2

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SIST EN IEC 61760-1:2022
EN IEC 61760-1:2020 (E)
Annex ZA
(normative)

Normative references to international publications with their
corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068 - Environmental testing - -
IEC 60068-2-2 - Environmental testing - Part 2-2: Tests - EN 60068-2-2 -
Test B: Dry heat
IEC 60068-2-21 - Environmental testing - Part 2-21: Tests - - -
Test U: Robustness of terminations and
integral mounting devices
IEC 60068-2-45 1980 Basic environmental testing procedures - EN 60068-2-45 1992
Part 2-45: Tests - Test XA and guidance:
Immersion in cleaning solvents
+ A1 1993 + A1 1993
IEC 60068-2-58 - Environmental testing - Part 2-58: Tests - EN 60068-2-58 -
Test Td: Test methods for solderability,
resistance to dissolution of metallization and
to soldering heat of surface mounting
devices (SMD)
IEC 60191-6 - Mechanical standardization of EN 60191-6 -
semiconductor devices - Part 6: General
rules for the preparation of outline drawings
of surface mounted semiconductor device
packages
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 60286-3 - Packaging of components for automatic EN IEC 60286-3 -
handling - Part 3: Packaging of surface
mount components on continuous tapes
3

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SIST EN IEC 61760-1:2022
EN IEC 61760-1:2020 (E)
Publication Year Title EN/HD Year
IEC 60286-4 - Packaging of components for automatic EN 60286-4 -
handling - Part 4: Stick magazines for
electronic components encapsulated in
packages of different forms
IEC 60286-5 - Packaging of components for automatic EN IEC 60286-5 -
handling - Part 5: Matrix trays
IEC 60286-6 - Packaging of components for automatic EN 60286-6 -
handling - Part 6: Bulk case packaging for
surface mounting components
IEC 60749-20 2008 Semiconductor devices - Mechanical and EN 60749-20 2009
climatic test methods - Part 20: Resistance
of plastic encapsulated SMDs to the
combined effect of moisture and soldering
heat
IEC 61188-6-4 - Printed boards and printed board EN IEC 61188-6-4 -
assemblies - Design and use - Part 6-4:
Land pattern design - Generic requirements
for dimensional drawings of surface
mounted components (SMD) from the
viewpoint of land pattern design
IEC 61340-5-1 - Electrostatics - Part 5-1: Protection of EN 61340-5-1 -
electronic devices from electrostatic
phenomena - General requirements
IEC 61340-5-3 - Electrostatics - Part 5-3: Protection of EN 61340-5-3 -
electronic devices from electrostatic
phenomena - Properties and requirements
classification for packaging intended for
electrostatic discharge sensitive devices
IEC 61760-2 - Surface mounting technology - Part 2: - -
Transportation and storage conditions of
surface mounting devices (SMD) -
Application guide
IEC 61760-4 - Surface mounting technology - Part 4: EN 61760-4 -
Classification, packaging, labelling and
handling of moisture sensitive devices
IEC 62090 - Product package labels for electronic EN 62090 -
components using bar code and
twodimensional symbologies
IPC/JEDEC - Moisture/Reflow Sensitivity Classification for - -
J-STD-020E Nonhermetic Solid State Surface Mount
Devices
IPC/JEDEC - Handling, Packing, Shipping and Use of - -
J-STD-033B Moisture/Reflow Sensitive Surface Mount
Devices

4

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SIST EN IEC 61760-1:2022




IEC 61760-1

®


Edition 3.0 2020-07




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE
colour

inside










Surface mounting technology –

Part 1: Standard method for the specification of surface mounting components

(SMDs)



Technique du montage en surface –

Partie 1: Méthode normalisée pour la spécification des composants montés en


surface (CMS)













INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.240 ISBN 978-2-8322-8588-6




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN IEC 61760-1:2022
– 2 – IEC 61760-1:2020 © IEC 2020
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 9
4 Requirements for component design and component specifications . 11
4.1 General requirement . 11
4.2 Component marking . 11
4.2.1 Marking of multipin components . 11
4.2.2 Marking of components with polarity . 11
4.2.3 Durability of component marking . 12
4.3 Component outline and design . 12
4.3.1 Drawing and specification . 12
4.3.2 Termination design . 13
4.3.3 Pick-up area requirements . 13
4.3.4 Bottom surface requirements . 14
4.3.5 Requirements for terminals . 15
4.3.6 Component height . 17
4.3.7 Component weight . 17
4.4 General requirements for components related to assembly technology . 17
4.4.1 Robustness of components . 17
4.4.2 Recommendation for land pattern design . 18
4.5 Cleanliness of components . 18
4.5.1 General remarks . 18
4.5.2 Particle contaminations . 19
4.5.3 Ionic contamination . 19
4.5.4 Other surface contamination . 19
4.6 Surface roughness . 19
4.7 Requirements related to packaging and transportation . 20
4.7.1 Packaging. 20
4.7.2 Labelling of product packaging . 20
4.7.3 Storage and transportation . 21
4.8 Component reliability assurance . 21
4.9 Compliance information . 21
4.9.1 General . 21
4.9.2 Material declaration . 21
4.9.3 Environmental regulatory compliance . 21
4.9.4 Considerations on the materials’ supply chain . 21
5 Assembly processes . 22
5.1 General . 22
5.2 Placement or insertion . 22
5.3 Mounting . 22
5.4 Cleaning (where applicable) . 22
5.4.1 Cleaning methods . 22
5.4.2 Typical cleaning conditions for assemblies . 22
5.5 Post assembly processes . 23

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SIST EN IEC 61760-1:2022
IEC 61760-1:2020 © IEC 2020 – 3 –
5.6 Removal and/or replacement of SMDs . 23
5.6.1 Removal and/or replacement of soldered SMDs . 23
5.6.2 Removal and/or replacement of glued SMDs . 24
6 Soldering . 24
6.1 General . 24
6.1.1 Mounting by soldering . 24
6.1.2 Securing the component on the substrate prior to soldering . 25
6.1.3 Reflow soldering . 25
6.1.4 Wave soldering . 26
6.1.5 Other soldering methods . 27
6.2 Process conditions . 27
6.2.1 General . 27
6.2.2 Reflow soldering . 27
6.2.3 Wave soldering . 29
6.3 Requirements for components and component specifications . 29
6.3.1 General . 29
6.3.2 Requirements for temperature sensitive devices . 30
6.3.3 Wettability . 30
6.3.4 Resistance to dissolution of metallization. 30
6.3.5 Resistance to soldering heat . 30
6.3.6 Resistance to vacuum during soldering . 31
6.3.7 Resistance to cleaning solvent. 31
6.3.8 Warpage during reflow soldering. 32
7 Conductive glue bonding . 32
7.1 Mounting . 32
7.2 Bonding strength test for the component glue interface test . 33
7.3 Requirements to components for conductive glue bonding . 34
7.3.1 Components for conductive glue bonding. 34
7.3.2 Cleanliness of the surface . 34
7.3.3 Terminal surface defects . 34
7.3.4 Outgassing of halogenic substances . 34
7.3.5 Coplanarity . 35
7.3.6 Stand-off . 35
7.3.7 Terminal dimensions and tolerances . 35
7.3.8 Resistance to curing heat . 35
8 Sintering . 36
8.1 General . 36
8.2 Typical process conditions . 37
8.3 Requirements for components and component specifications . 37
9 Solderless interconnection . 38
9.1 General . 38
9.2 Typical process conditions . 38
9.3 Requirements for components and component specifications . 39
Annex A (informative)  Details on compliance information . 40
A.1 Material declaration . 40
A.2 Environmental regulatory compliance . 41
A.3 Considerations on the materials' supply chain . 41
Bibliography . 43

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SIST EN IEC 61760-1:2022
– 4 – IEC 61760-1:2020 © IEC 2020

Figure 1 – Example of a component with marked specific orientation put in tape (top)
and tray (bottom) . 12
Figure 2 – Vacuum pipette, pick-up area and component compartment . 14
Figure 3 – Coplanarity of terminals . 15
Figure 4 – Stable seating of component . 15
Figure 5 – Unstable seating of component . 16
Figure 6 – Terminals arranged peripherally in two rows . 16
Figure 7 – Good contrast between component body and surroundings . 16
Figure 8 – Component weight and pipette suction strength . 17
Figure 9 – Process steps for soldering . 25
Figure 10 – Generic reflow temperature/time profile . 28
Figure 11 – Generic wave soldering temperature/time profile . 29
Figure 12 – Process steps for gluing . 33
Figure 13 – Stand-off definition . 35
Figure 14 – Sinter process on one side, both sides, and both sides including
presintering . 37

Table 1 – Typical roughness requirements . 20
Table 2 – Basic cleaning processes . 23
Table 3 – Examples of substances proposed to be included in risk evaluation and
customer reporting . 35
Table 4 – Examples of typical curing conditions . 36

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SIST EN IEC 61760-1:2022
IEC 61760-1:2020 © IEC 2020 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SURFACE MOUNTING TECHNOLOGY –

Part 1: Standard method for the specification
of surface mounting components (SMDs)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61760-1 has been prepared by IEC technical committee 91:
Surface mounting technology.
This third edition cancels and replaces the second edition published in 2006. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) inclusion of additional mounting methods: conductive glue bonding, sintering and
solderless interconnection.

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SIST EN IEC 61760-1:2022
– 6 – IEC 61760-1:2020 © IEC 2020
The text of this International Standard is based on the following documents:
FDIS Report on voting
91/1648/FDIS 91/1653/RVD

Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61760 series, published under the general title Surface mounting
technology, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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SIST EN IEC 61760-1:2022
IEC 61760-1:2020 © IEC 2020 – 7 –
INTRODUCTION
Specifications for electronic components have in the past been formulated for each
component family. The regulations for environmental tests have been selected from
IEC 60068 and other IEC and ISO publications. The intention for this procedure was that all
components, once installed in a piece of equipment, had to satisfy certain criteria.
The introduction and increasing use of different mounting processes on one assembly make it
necessary to extend the existing requirements to include those arising from processing during
assembly.
Nevertheless, there existed no harmonized standard that prescribes the content of a
component specification before the publication of IEC 61760-1. It is the purpose of this
document to define the general requirements for component specifications derived from the
assembly processes. T
...