oSIST prEN IEC 61760-1:2025

SLOVENSKI STANDARD
01-september-2025
Tehnologija površinske montaže - 1. del: Standardna metoda za specifikacijo
komponent za površinsko montažo (SMDs)
Surface mounting technology - Part 1: Standard method for the specification of surface
mounting components (SMDs).
Technique du montage en surface - Partie 1: Méthode normalisée pour la spécification
des composants pour montage en surface (CMS)
Ta slovenski standard je istoveten z: prEN IEC 61760-1:2025
ICS:
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

91/2048/CDV
COMMITTEE DRAFT FOR VOTE (CDV)

PROJECT NUMBER:
IEC 61760-1 ED4
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2025-07-18 2025-10-10
SUPERSEDES DOCUMENTS:
91/1970/CD, 91/2033/CC
IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Osamu IKEDA
OF INTEREST TO THE FOLLOWING COMMITTEES: HORIZONTAL FUNCTION(S):

TC 40,TC 47,TC 86
ASPECTS CONCERNED:
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft
for Vote (CDV) is submitted for parallel voting.
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Countries” clauses to be included should this proposal proceed. Recipients are reminded that the CDV stage is
the final stage for submitting ISC clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).

TITLE:
Surface mounting technology - Part 1: Standard method for the specification of surface
mounting components (SMDs).
PROPOSED STABILITY DATE: 2030
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IEC CDV 61760-1 ED4 © IEC 2025

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CONTENTS
FOREWORD . 7
INTRODUCTION . 9
1 Scope . 10
2 Normative references . 10
3 Terms and definitions . 12
4 Requirements for component design and component specifications . 14
4.1 General requirement . 14
4.2 Classification of electronic assemblies . 14
4.2.1 Level A: General electronics products . 14
4.2.2 Level B: Dedicated service electronics products . 14
4.2.3 Level C: High-performance electronics products . 14
4.3 Component marking and labelling . 14
4.3.1 General . 14
4.3.2 Marking of multipin components. 14
4.3.3 Marking of components with polarity . 14
4.3.4 Durability of component marking . 15
4.4 Component outline and design . 15
4.4.1 Drawing and specification . 15
4.4.2 Termination design . 16
4.4.3 Pick-up area requirements . 16
4.4.4 Bottom surface requirements . 17
4.4.5 Requirements for terminals . 17
4.4.6 Component height . 19
4.4.7 Component weight . 20
4.4.8 Creepage and clearance distances - insulation coordination . 20
4.5 General requirements for components related to assembly technology . 21
4.5.1 Robustness of components . 21
4.5.2 Recommendation for land pattern design . 22
4.6 Cleanliness of components . 22
4.6.1 General remarks . 22
4.6.2 Particle contaminations. 22
4.6.3 Ionic contamination . 22
4.6.4 Other surface contamination . 22
4.7 Surface roughness . 23
4.8 Requirements related to packaging and transportation . 23
4.8.1 Packaging . 23
4.8.2 Labelling of product packaging . 23
4.8.3 Storage and transportation . 24
4.9 Thermal and electrical performance . 24
4.9.1 Relevant parameters . 24
4.9.2 Applicable standards . 24
4.10 Component reliability assurance . 24
4.11 Compliance information . 25
4.11.1 General . 25
4.11.2 Material declaration . 25
4.11.3 Environmental regulatory compliance . 25
4.11.4 Considerations on the materials’ supply chain . 25
IEC CDV 61760-1 ED4 © IEC 2025

5 Assembly processes . 25
5.1 General . 25
5.2 Placement or insertion . 25
5.3 Mounting . 25
5.4 Cleaning (where applicable) . 26
5.4.1 Purpose . 26
5.4.2 Cleaning methods . 26
5.4.3 Typical cleaning conditions for assemblies . 26
5.5 Post assembly processes . 27
5.6 Removal and/or replacement of SMDs . 28
5.6.1 Removal and/or replacement of soldered SMDs . 28
5.6.2 Removal and/or replacement of glued SMDs . 28
6 Soldering . 29
6.1 General . 29
6.1.1 Mounting by soldering . 29
6.1.2 Securing the component on the substrate prior to soldering . 29
6.1.3 Reflow soldering . 30
6.1.4 Wave soldering . 31
6.1.5 Other soldering methods . 31
6.2 Process conditions . 31
6.2.1 General . 31
6.2.2 Commonly used solder alloys . 32
6.2.3 Reflow soldering . 32
6.2.4 Wave soldering . 34
6.3 Requirements for components and component specifications . 34
6.3.1 General . 34
6.3.2 Requirements for temperature sensitive devices . 35
6.3.3 Solderability . 35
6.3.4 Resistance to dissolution of metallization . 36
6.3.5 Resistance to soldering heat . 36
6.3.6 Resistance to vacuum during soldering . 36
6.3.7 Resistance to cleaning media and processes . 37
6.3.8 Warpage during reflow soldering . 38
6.3.9 Rework of soldered components . 38
7 Conductive glue bonding . 39
7.1 Mounting . 39
7.2 Bonding strength test for the component glue interface test . 39
7.3 Requirements to components for conductive glue bonding . 40
7.3.1 Components for conductive glue bonding . 40
7.3.2 Cleanliness of the surface . 40
7.3.3 Terminal surface defects . 40
7.3.4 Outgassing of halogenic substances . 40
7.3.5 Coplanarity . 41
7.3.6 Stand-off . 41
7.3.7 Terminal dimensions and tolerances . 41
7.3.8 Resistance to curing heat . 42
8 Sintering . 42
8.1 General . 42
IEC CDV 61760-1 ED4 © IEC 2025

8.2 Typical process conditions for wet silver-sintering processes . 43
8.3 Requirements for components and component specifications . 43
9 Solderless interconnection . 44
9.1 General . 44
9.2 Typical process conditions . 44
9.3 Requirements for components and component specifications . 44
9.4 Rework of components with solderless interconnections . 45
Annex A (informative) Details on compliance information . 46
A.1 Material declaration . 46
A.2 Environmental regulatory compliance . 47
A.3 Considerations on the materials' supply chain . 48
Annex B (informative) Sustainability . 49
B.1 General . 49
B.2 Programs to support sustainable products and production . 49
B.2.1 Eco-design of products (electronic equipment) (e.g., European Eco-
design Directive 2009/125/EC [33]). 49
B.2.2 LCA, Life Cycle Assessment (or analysis) (e.g., ISO 14040 and ISO
14044:2006) . 49
B.2.3 PCF, Product Carbon Footprint . 49
B.2.4 GHG (Greenhouse Gases (including CO )) emissions in manufacturing . 50
B.2.5 Energy Usage in the production . 50
B.2.6 Recycling, Recovering and Repair (e.g., WEEE Directive 2012/19/EU
[34] and 2018/849/EU [35]) . 50
B.2.7 Sustainability of work conditions . 50
Bibliography . 51

Figure 1 – Example of a component with marked specific orientation put in tape (top)
and tray (bottom) . 15
Figure 2 – Vacuum pipette, pick-up area and component compartment . 17
Figure 3 – Coplanarity of terminals . 18
Figure 4 – Stable seating of component . 18
Figure 5 – Unstable seating of component . 18
Figure 6 – Terminals arranged peripherally in two rows . 19
Figure 7 – Good contrast between component body and surroundings . 19
Figure 8 – Component weight and pipette suction strength . 20
Figure 9 – . 29
Figure 10 – Process steps for soldering . 29
Figure 11 – Generic reflow temperature/time profile . 33
Figure 12 – Generic wave soldering temperature/time profile . 34
Figure 13 – Process steps for gluing . 39
Figure 14 – Stand-off definition . 41
Figure 15 – Sinter process on one side, both sides, and both sides including
presintering. 43

Table 1 – Typical roughness requirements . 23
Table 2 – Basic cleaning processes . 27
IEC CDV 61760-1 ED4 © IEC 2025

Table 3 – Examples of substances proposed to be included in risk evaluation and
customer reporting . 41
Table 4 – Examples of typical curing conditions . 42

IEC CDV 61760-1 ED4 © IEC 2025

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
Surface mounting technology –
Part 1: Standard method for the specification of surface mounting
components (SMDs).
FOREWORD
a) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical
Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt
with may participate in this preparatory work. International, governmental and non-governmental organizations
liaising with the IEC also participate in this preparation. IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two
organizations.
b) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
c) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
d) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
e) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
f) All users should ensure that they have the latest edition of this publication.
g) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
h) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
i) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61760–1 has been prepared by IEC technical committee 91: Surface
mounting technology.
This third edition cancels and replaces the second edition published in 2006. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless
interconnection.
The text of this International Standard is based on the following documents:
FDIS Report on voting
91/1648/FDIS 91/1653/RVD
IEC CDV 61760-1 ED4 © IEC 2025

Full information on the voting for the approval of this International Standard can be found in the
report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61760 series, published under the general title Surface mounting
technology, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
NOTE The 'colour inside' logo on the cover page of this publication indicates that it contains colours which
are considered to be useful for the correct understanding of its contents. Users should therefore print this
document using a colour printer.
IEC CDV 61760-1 ED4 © IEC 2025

INTRODUCTION
Specifications for electronic components have in the past been formulated for each component
family. The regulations for environmental tests have been selected from IEC 60068 and other
IEC and ISO publications. The intention for this procedure was that all components, once
installed in a piece of equipment, had to satisfy certain criteria.
The introduction and increasing use of different mounting processes on one assembly make it
necessary to extend the existing requirements to include those arising from processing during
assembly.
Nevertheless, there existed no harmonized standard that prescribes the content of a component
specification before the publication of this document. It is the purpose of this document to define
the general requirements for component specifications derived from the assembly processes.
This is done in three steps.
In the first step, general requirements for component specifications and component design
related to the handling and placement of the component on the substrate are given ( Clause 4).
In the second step, the requirements related to assembly processes are given (Clause 5). In
the third step, additional requirements resulting from specific mounting methods are given
(Clause 6 to Clause 9).
Mixed technology boards, i.e. boards containing through-hole components and SMDs, require
additional consideration with respect to the through-hole components. These may be subject to
the same requirements as the SMDs. Persons responsible for drafting specifications for "non-
surface mounting components" wishing to include a statement on their ability to withstand
surface mounting conditions should use the classifications and tests set out in the present
document.
IEC CDV 61760-1 ED4 © IEC 2025

1 Scope
This part of IEC 61760 defines requirements for component specifications of electronic
components that are intended for usage in surface mounting technology. To this end, it specifies
a reference set of process conditions and related test conditions to be considered when
compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the
same placement, mounting and subsequent processes (e.g. cleaning, inspection) during
assembly. This document defines tests and requirements that need to be part of any SMD
component's general, sectional or detail specification. In addition, this document provides
component users and manufacturers with a reference set of typical process conditions used in
surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to
components with leads intended for mounting on a circuit board, including solderless
interconnection technology. Cases for which this is appropriate are indicated in the relevant
subclauses.
NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface -mounting
process and the components do not undergo a soldering operation. Such components are included in this document
because the mounting of components for solderless interconnetion commonly occurs after the mounting of SMDs.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60068 (all parts), Environmental testing
IEC 60068–2–2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068–2–21, Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices
IEC 60068-2-45:1980/AMD1:1993, Amendment 1 - Basic environmental testing procedures -
Part 2-45: Tests - Test XA and guidance: Immersion in cleaning solvents
IEC 60068–2–58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface mounting
devices (SMDs)
IEC 60191–6, Mechanical standardization of semiconductor devices – Part 6: General rules for
the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60194–2, Printed boards design, manufacture and assembly – Vocabulary – Part 2:
Common usage in electronic technologies as well as printed board and electronic assembly
technologies
IEC 60286-3, Packaging of components for automatic handling - Part 3: Packaging of surface
mount components on continuous tapes
IEC 60286–3, Packaging of components for automatic handling – Part 3: Packaging of surface
mount components on continuous tapes
IEC CDV 61760-1 ED4 © IEC 2025

IEC 60286-4, Packaging of components for automatic handling - Part 4: Stick magazines for
electronic components encapsulated in packages of different forms
IEC 60286–5, Packaging of components for automatic handling – Part 5: Matrix trays
IEC 60286–6, Packaging of components for automatic handling – Part 6: Bulk case packaging
for surface mounting components
IEC 60664-1:2020, Insulation coordination for equipment within low-voltage supply systems -
Part 1: Principles, requirements and tests
IEC 60749-20, Semiconductor devices - Mechanical and climatic test methods - Part 20:
Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 61188–6–4, Printed boards and printed board assemblies – Design and use – Part 6-4:
Land pattern design – Generic requirements for dimensional drawings of surface mounted
components (SMD) from the viewpoint of land pattern design
IEC 61340–5–1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC 61340–5–3, Electrostatics – Part 5-3: Protection of electronic devices from electrostatic
phenomena – Properties and requirements classification for packaging intended for
electrostatic discharge sensitive devices
IEC 61760–2, Surface mounting technology – Part 2: Transportation and storage conditions of
surface mounting devices (SMD) – Application guide
IEC 61760–4, Surface mounting technology – Part 4: Classification, packaging, labelling and
handling of moisture sensitive devices
IEC 62090, Product package labels for electronic components using bar code and two-
dimensional symbologies
IEC 62474:2018, Material declaration for products of and for the electrotechnical industry
ISO 8785, Geometrical Product Specification (GPS) — Surface imperfections — Terms,
definitions and parameters
ISO 14040, Environmental management — Life cycle assessment — Principles and framework
ISO 14044:2006, Environmental management — Life cycle assessment — Requirements and
guidelines
IEC 60068-2-88, ENVIRONMENTAL TESTING - Part 2-88: Tests – Test XD: Resistance of
components and assemblies to liquid cleaning media

IPC-2221, Generic Standard on Printed Board Design
IPC-7711/7721, Rework, Modification and Repair of Electronic Assemblies
IPC-9797, Press-fit standard for automotive requirements and other high-reliability applications
IPC/JEDEC J-STD 020, Moisture/Reflow Sensitivity Classification for Non-hermetic Surface
Mount Devices (SMDs)
IEC CDV 61760-1 ED4 © IEC 2025

IPC/JEDEC J-STD-033, Handling, Packaging, Shipping, and Use of Moisture/Reflow Sensitive
Surface Mount Devices
3 Terms and definitions
For the purposes of this document, the terms and definitions of IEC 60194–2 and the following
apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
adhesive
substance such as glue or cement used to bond objects together
Note 1 to entry: In surface mounting technology different gluing systems are used:
– nonconductive adhesive (only for mechanical connection);
– electrically conductive adhesive (for electrical and mechanical connection);
– thermally conductive adhesive (for thermal and mechanical connection);
– combination of electrically and thermally conductive adhesive.
Most used adhesives are thermal curing systems, but there are also UV -curing systems in use.
3.2
centring force
force required by the pick-up tooling to centre a surface mounting device in its proper location
on a substrate
3.3
compliant press-fit pin
press-fit pin with at least one compliant press-fit zone designed to be be inserted into a plated-
through hole of a circuit board
3.4
compliant press-fit zone
specifically shaped section of a press-fit pin which is elastically and plastically deformed during
pin insertion
Note 1 to entry: A compliant press-fit zone is characterized by its base material, surface finish and geometry.
3.5
coplanarity
distance in height between the lowest and highest leads when the component is in its seating
plane
3.6
dewetting
condition that results when molten solder coats a surface and then recedes to leave irregularly
shaped mounds of solder that are separated by areas that are covered with a thin film of solder
and with the basis metal not exposed
3.7
dissolution of metallization
process of dissolving metal or a plated metal alloy, usually by introduction of chemicals
IEC CDV 61760-1 ED4 © IEC 2025

Note 1 to entry: For the purposes of this document, the dissolution of metallization also includes dissolution by
exposure to molten solder.
3.8
immersion attitude
positioning of an object when immersed in a solder bath
3.9
lead-free component
component where lead content in the materials is equal to or less than 0,1 % by weight per
material used
3.10
Montreal protocol
agreement by industrialized nations, at a meeting held in Montreal, Canada, to eliminate
chlorofluorocarbons from all processes by 1995
3.11
pick-up force
dynamic force exerted on the body of a component – generally from above – and its seating
plane during the pick-up of the component (e.g. from a tape or tray)
Note 1 to entry: The maximum level is normally taken into account.
3.12
placement force
dynamic force exerted on the component body (generally from above) and its seating plane
Note 1 to entry: This occurs during the period between the component’s first contact with the substrate (or the
soldering paste or adhesive etc.) and its coming to rest. The maximum level is normally taken into account.
3.13
resistance to soldering heat
ability of a component to withstand the effects of the heat generated by the soldering process
3.14
seating plane
surface on which a component rests
3.15
solder meniscus
contour of a solder shape that is the result of the surface tension forces that take place during
wetting
3.16
stand-off
distance between seating plane of the component and the seating plane of the terminations
3.17
substrate
basic material that forms the support structure of an electronic circuit
3.18
SMD
surface mounting component
surface mounting device
electronic component designed for mounting on to terminal pads or conducting tracks on the
surface of substrate
IEC CDV 61760-1 ED4 © IEC 2025

3.19
wetting
physical phenomenon in which surface tension of a liquid, usually when in contact with solids,
is reduced to the point where the liquid diffuses and makes intimate contact with the entire
substrate surface in the form of a thin layer
4 Requirements for component design and component specifications
4.1 General requirement
A component specification for SMDs shall, in addition to the requirements listed in 4.3 to 4.11,
contain specifications of the relevant tests and requirements from Clause 5 to Clause 9.
4.2 Classification of electronic assemblies
This document recognizes that electrical and elelctronic assemblies are subject to
classifications by intended end-item use. Three general end-product levels have been
established to reflect differences in producibility, functional performance requirements , and
verification (inspection/test) frequency.
It should be recognized that there may be overlaps of equipment between levels. The user of
the assemblies is responsible for determining the level to which the product belongs. The
contract shall specify the level required and indicate any exceptions or a dditional requirements
to the parameters, where appropriate.
4.2.1 Level A: General electronics products
Includes consumer products, some computer and computer peripherals, and hardware suitable
for applications where the major requirement is function of the completed assembly.
4.2.2 Level B: Dedicated service electronics products
Includes communications equipment, sophisticated business machines, and instruments where
high performance and extended life is required, and for which uninterrupted service is desired
but not mandatory. Typically, the end-use environment would not cause failures.
4.2.3 Level C: High-performance electronics products
Includes all equipment where continued performance or performance-on-demand is mandatory.
Equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh,
and the equipment shall function when required, such as life support systems and other critical
systems.
4.3 Component marking and labelling
4.3.1 General
In general, marking should identify 2nd level terminal finish or material and should follow J-
STD-609 [1]. This is critical because assembly reflow operations can be dependent on the
specific solder alloys per Clause 6.1.3.
4.3.2 Marking of multipin components
Pin 1 (see Figure 1) shall be clearly marked on a multipin component (e.g. SO-IC, QFP).
4.3.3 Marking of components with polarity
For components with polarity, the polarity of the component shall be clearly marked on the
component (e.g. for electrolytic capacitors).
IEC CDV 61760-1 ED4 © IEC 2025

4.3.4 Durability of component marking
Specifications shall require that the specified component marking shall remain legible after the
tests specified in 6.3.7 have been performed. This test shall be performed after completion of
the relevant test for resistance to soldering heat or for solderability, as specified in the
component specification.
Key
D direction of unreeling
T tray
1 pin 1 of the component
Figure 1 – Example of a component with marked specific orientation put in tape (top)
and tray (bottom)
4.4 Component outline and design
4.4.1 Drawing and specification
Drawings, including bottom-view, top-view and side-view drawings, of the component showing
all dimensions and tolerances of its body and terminals shall be part of the component
specification. The drawings shall include reference to the positioning of the component body
and terminals on the mounting land pattern. If conductive surfaces are not planar, their three -
dimensional geometry shall be clearly specified with the relevant tolerances. An example is the
presence of grooves on thermal pads of QFP.
In any 2D drawing or 3D data, conductive parts and/or surfaces and insulating parts/surfaces
shall be clearly distinguished, at least for the bottom and the sides of components, as well as
for movable parts. This requirement applies both to the disassembled and the assembled
condition for parts requiring a final assembly step after mounting on a substrate (e.g. if a
connector contains spring-loaded retainers whose position and/or angle changes upon mating).
The locations and dimensions of conductive parts/surfaces shall be specified, even if they are
not intended for establishing a contact with the mounting surface, for example punched or sawn
surfaces consisting of unplated leadframe resulting from component singulation for moulded
semiconductor packages.
The generic requirements for dimensional drawings of SMDs from the viewpoint of land -pattern
design as specified in IEC 61188–6–4 shall be adopted for surface mounting devices.
IEC CDV 61760-1 ED4 © IEC 2025

Where necessary (e.g. in the case of large components with an overall length of more than
25 mm), the detail specification shall contain data on thermal expansion, at least along the X
and Y axes. In the case of mechanical fixation of large components (e.g. by screwing), mismatch
of the coefficients of thermal expansion between component and mounting substrate can result
in warping of the component and the mounting substrate.
For components singulated by punching or sawing, for which parts of the terminals may not wet
during a soldering operation owing to the absence of a surface finish preserving a solderable
surface on the leadframe, such surfaces shall be indicated in the dr awing.
For bottom-termination components (BTCs) as QFNs (quad-flat no lead packages), DFNs (dual-
flat no lead packages), etc., for which a wettable-flank pin modification has been applied to
assure the formation of an outer fillet in reflow soldering, the minimum height of the plated flank
of the leadframe shall be indicated in the drawing.
NOTE 1 For components intended for high-performance applications, such as automotive and aerospace industries,
the height of the wettable portion typically is larger than 100 µm to enable a robust automated solder -joint inspection.
NOTE 2 The presence of an outer fillet, as enabled by a wettable-flank pin modifciation, generally increases the
reliability of the solder joints under environmental loads such as thermal cycling.
4.4.2 Termination design
The relevant specification shall provide information on termination design (i.e. the termination
base material, layer structure and finish).
4.4.3 Pick-up area requirements
The design of the component shall consider that it shall be possible to grip the component by
suction and transport it to its exact placement position on the substrate. It shall be possible to
create a vacuum strong enough to fix the component in its position under the pipette. During
the total transport process, which may include optical inspection, the component shall remain
exactly in its position under the pipette, until the component is placed.
The centre of the suction area should match the centre of gravity and the geometrical centre.
The opening of the pipette (Y), the dimension (L) of the component or its pick up area (X) and
the tolerances on the position of the component inside the compartment of packaging with
length dimension (A ) and width dimension (
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