SIST EN IEC 61189-2-809:2025

SLOVENSKI STANDARD
01-marec-2025
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-809. del: Preskus X/Y CTE s termomehansko analizo (TMA)
za tanke podložne materiale
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick
Base Materials by TMA
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen – Teil 2-809: Prüfung des X/Y-Wärmeausdehnungskoeffizienten (CTE)
für dicke Grundwerkstoffe mittels TMA
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles - Partie 2-809: Essai du coefficient de dilatation
thermique (CTE) X/Y pour matériaux de base épais à l'aide d'un analyseur
thermomécanique (TMA)
Ta slovenski standard je istoveten z: EN IEC 61189-2-809:2025
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61189-2-809

NORME EUROPÉENNE
EUROPÄISCHE NORM January 2025
ICS 31.180
English Version
Test methods for electrical materials, circuit boards and other
interconnection structures and assemblies - Part 2-809: X/Y
coefficient of thermal expansion (CTE) test for thick base
materials by TMA
(IEC 61189-2-809:2024)
Méthodes d'essai pour les matériaux électriques, les Prüfverfahren für Elektromaterialien, Leiterplatten und
circuits imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-809: Essai du coefficient de dilatation 809: Prüfung des X/Y-Wärmeausdehnungskoeffizienten
thermique (CTE) X/Y pour matériaux de base épais à l'aide (CTE) für dicke Grundwerkstoffe mittels TMA
d'un analyseur thermomécanique (TMA) (IEC 61189-2-809:2024)
(IEC 61189-2-809:2024)
This European Standard was approved by CENELEC on 2025-01-13. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
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Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2025 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-809:2025 E

European foreword
The text of document 91/1983/FDIS, future edition 1 of IEC 61189-2-809, prepared by TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-809:2025.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2026-01-31
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2028-01-31
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-809:2024 was approved by CENELEC as a
European Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-1 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 1: Common
usage in printed board and electronic
assembly technologies
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 61189-2-809 ®
Edition 1.0 2024-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, circuit boards and other interconnection

structures and assemblies –
Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base

materials by TMA
Méthodes d'essai pour les matériaux électriques, les circuits imprimées et

autres structures d'interconnexion et ensembles –

Partie 2-809: Essai du coefficient de dilatation thermique (CTE) X/Y pour

matériaux de base épais à l'aide d'un analyseur thermomécanique (TMA)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180  ISBN 978-2-8327-0054-9

– 2 – IEC 61189-2-809:2024-© IEC 2024
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test specimens . 5
5 Test apparatus . 6
6 Test procedure . 6
7 Calculations . 7
8 Report . 8
Bibliography . 9

Figure 1 – Diagram of sample direction . 6
Figure 2 – Specimen size versus temperature . 8

IEC 61189-2-809:2024-© IEC 2024 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, CIRCUIT BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-809: X/Y coefficient of thermal expansion (CTE) test
for thick base materials by TMA

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
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9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
respect thereof. As of the date of publication of this document, IEC had not received notice of (a) patent(s), which
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the latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC
shall not be held responsible for identifying any or all such patent rights.
IEC 61189-2-809 has been prepared by IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1983/FDIS 91/1994/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
– 4 – IEC 61189-2-809:2024-© IEC 2024
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, circuit boards and other interconnection structures and assemblies, can be
found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users sh
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