SIST EN IEC 61249-2-51:2023

SLOVENSKI STANDARD
01-september-2023
Materiali za plošče tiskanih vezij in druge povezovalne strukture - 2-51. del:
Ojačeni laminati z bakreno folijo in brez nje - Osnovni materiali za nosilne trakove
kartic integriranih vezij, neprevlečeni
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced
base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape,
unclad
Werkstoffe für Leiterplatten und andere Verbindungsstrukturen – Teil 2-51: Verstärkte
Basismaterialien, kaschiert und nicht kaschiert – Basismaterialien für Trägerbänder für
integrierte Schaltungen, nicht kaschiert
Matériaux pour circuits imprimés et autres structures d’interconnexion - Partie 2-51:
Matériaux de base renforcés, recouverts ou non - Matériaux de base pour bande support
de carte à circuit intégré, non recouverts
Ta slovenski standard je istoveten z: EN IEC 61249-2-51:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61249-2-51

NORME EUROPÉENNE
EUROPÄISCHE NORM June 2023
ICS 31.180
English Version
Materials for printed boards and other interconnecting structures
- Part 2-51: Reinforced base materials, clad and unclad - Base
materials for integrated circuit card carrier tape, unclad
(IEC 61249-2-51:2023)
Matériaux pour circuits imprimés et autres structures Werkstoffe für Leiterplatten und andere
d'interconnexion - Partie 2-51: Matériaux de base renforcés, Verbindungsstrukturen - Teil 2-51: Kaschierte und
plaqués et non plaqués - Matériaux de base pour bande unkaschierte verstärkte Basismaterialien - Basismaterial als
support de carte à circuit intégré, non plaqués Chipträger, nicht kaschiert
(IEC 61249-2-51:2023) (IEC 61249-2-51:2023)
This European Standard was approved by CENELEC on 2023-06-15. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61249-2-51:2023 E

European foreword
The text of document 91/1847/FDIS, future edition 1 of IEC 61249-2-51, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61249-2-51:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-03-15
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-06-15
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61249-2-51:2023 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
ISO 9000 NOTE Approved as EN ISO 9000
ISO 14001 NOTE Approved as EN ISO 14001
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 61189-2 2006 Test methods for electrical materials, EN 61189-2 2006
printed boards and other interconnection
structures and assemblies - Part 2: Test
methods for materials for interconnection
structures
IEC/PAS 61249-6-3 - Specification for finished fabric woven from - -
"E" glass for printed boards
ISO 2813 - Paints and varnishes - Determination of EN ISO 2813 -
gloss value at 20°, 60° and 85°
ISO 8296 - Plastics - Film and sheeting - - -
Determination of wetting tension
ISO 11014 2009 Safety data sheet for chemical products - - -
Content and order of sections
ISO 21920-2 - Geometrical product specifications (GPS) - EN ISO 21920-2 -
Surface texture: Profile - Part 2: Terms,
definitions and surface texture parameters
ASTM D 882 - Standard Test Method for Tensile - -
Properties of Thin Plastic Sheeting

IEC 61249-2-51 ®
Edition 1.0 2023-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Materials for printed boards and other interconnecting structures –

Part 2-51: Reinforced base materials, clad and unclad – Base materials for

integrated circuit card carrier tape, unclad

Matériaux pour circuits imprimés et autres structures d’interconnexion –

Partie 2-51: Matériaux de base renforcés, plaqués et non plaqués – Matériaux de

base pour bande support de carte à circuit intégré, non plaqués

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-6969-5

– 2 – IEC 61249-2-51:2023 © IEC 2023
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Construction and materials . 7
4.1 Construction . 7
4.2 Epoxide woven E-glass underlayer . 7
4.3 Adhesive . 7
4.4 Release film . 7
5 Electrical properties . 7
6 Non-electrical properties . 8
6.1 Appearance of the IC carrier tape base materials . 8
6.1.1 Delamination . 8
6.1.2 Colloidal particles and metallic particles in underlayer . 8
6.1.3 Colloidal particles in adhesive layer . 8
6.1.4 Scratches of adhesive . 8
6.1.5 Bubbles in underlayer . 8
6.1.6 Breakages and exposures of reinforcement fibre in underlayer . 8
6.2 Dimensional of IC carrier tape base materials . 8
6.2.1 Length and width . 8
6.2.2 Thickness of underlayer . 8
6.2.3 Thickness of adhesive layer . 8
6.3 Splices . 8
6.4 Glass transition temperature . 9
6.5 Surface properties of the underlayer side . 9
6.6 Tensile strength and elongation at break . 9
6.7 Water absorption . 9
6.8 Peel strength . 10
6.9 Resin flow . 10
7 Quality assurance . 10
7.1 Quality system . 10
7.2 Responsibility for inspection . 10
7.3 Positions of specimens on the sample . 10
7.4 Qualification inspection . 11
7.4.1 General . 11
7.4.2 Samples . 11
7.4.3 Frequency . 11
7.4.4 Criterion rule . 11
7.5 Quality conformance inspection . 12
7.5.1 General . 12
7.5.2 Inspection lot . 12
7.5.3 Group A inspection . 12
7.5.4 Group B inspection . 12
7.5.5 Group C inspection . 12
7.5.6 Criterion rule . 12
7.5.7 Rejected lots . 12

IEC 61249-2-51:2023 © IEC 2023 – 3 –
7.6 Certificate of conformance . 12
7.7 Safety data sheet . 12
8 Packaging, marking and storage . 13
8.1 Packaging, marking . 13
8.2 Storage, storage condition and shelf life . 13
Annex A (normative) Requirements for the preparation of samples of some
performance items . 14
A.1 Ordering information . 14
Annex B (informative) Engineering information . 15
B.1 General . 15
B.2 Chemical properties . 15
B.3 Electrical properties . 15
B.4 Mechanical properties . 15
B.5 Physical properties . 15
B.6 Thermal properties . 15
Bibliography . 16

Figure 1 – Construction of IC carrier tape base materials . 7

Table 1 – Electrical properties . 7
Table 2 – Glass transition temperature of underlayer . 9
Table 3 – roughness, glossiness(60°) and surface energy. 9
Table 4 – Tensile strength and elongation at break . 9
Table 5 – Water absorption . 9
Table 6 – Peel strength . 10
Table 7 – Resin flow . 10
Table 8 – Qualification and conformance inspection . 11
Table A.1 – Requirements for the preparation of samples of some performance items . 14

– 4 – IEC 61249-2-51:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MATERIALS FOR PRINTED BOARDS AND
OTHER INTERCONNECTING STRUCTURES –

Part 2-51: Reinforced base materials clad and unclad – Base
materials for integrated circuit card carrier tape, unclad

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
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Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
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misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
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services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61249-2-51 has been prepared by IEC technical committee 91, Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1847/FDIS 91/1865/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

IEC 61249-2-51:2023 © IEC 2023 – 5 –
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
...