IEC 62899-202-8:2024

IEC 62899-202-8 ®
Edition 1.0 2024-03
INTERNATIONAL
STANDARD
Printed electronics –
Part 202-8: Materials – Conductive ink – Measurement of difference in resistance
of printing direction of conductive film fabricated with wire-shaped materials

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IEC 62899-202-8 ®
Edition 1.0 2024-03
INTERNATIONAL
STANDARD
Printed electronics –
Part 202-8: Materials – Conductive ink – Measurement of difference in

resistance of printing direction of conductive film fabricated with wire-shaped

materials
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 87.080 ISBN 978-2-8322-8432-2

– 2 – IEC 62899-202-8:2024 © IEC 2024
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test sample, apparatus and measuring device . 7
4.1 Measurement environmental conditions . 7
4.2 Test apparatus . 7
4.3 Measuring device . 8
4.4 Sample preparation for measuring resistance difference with printing
direction . 8
5 Test procedure . 9
6 Report . 9
6.1 Reporting the resistance . 9
6.2 Report of the results . 10
Annex A (informative) Measurement of difference of printing direction of printed
conductive film . 11
A.1 Sample preparation . 11
A.2 Settings for the test sample . 11
Bibliography . 13

Figure 1 – Schematic diagram of printed conductive film with screws for a four-wire
measurement . 8
Figure 2 – Samples with printing direction of conductive film fabricated with wire-
shaped materials . 9
Figure A.1 – Sample preparation. 11
Figure A.2 – Holder with setting a test sample . 12

Table 1 – Resistance range of the test piece and the applied current . 8
Table A.1 – Test results . 12

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED ELECTRONICS –
Part 202-8: Materials – Conductive ink – Measurement of difference
in resistance of printing direction of conductive film
fabricated with wire-shaped materials

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
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9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
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shall not be held responsible for identifying any or all such patent rights.
IEC 62899 has been prepared by IEC technical committee 119: Printed electronics. It is an
International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
119/476/FDIS 119/483/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
– 4 – IEC 62899-202-8:2024 © IEC 2024
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 62899 series, published under the general title Printed electronics,
can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

INTRODUCTION
The printing process for fabricating flexible devices is a very promising technology due to its
high conductivity and efficiency. Specifically, a printed metal-based conductive layer on a
flexible substrate can be employed as electrode or be interconnected for flexible devices. It can
be commercialized as a type of composite material where the conductive layer is formed on the
substrate as a conductor.
For metal-based transparent conductive (TC) films, silver or copper nanowires or metal mesh
on a flexible substrate are a key component for many recently developed electronic products,
ranging from smartphones to keypads of appliances such as refrigerators and washing
machines. While indium tin oxide (ITO) is the conventional material for TC films, metal-based
TC films fabricated using printed electronics technologies are being increasingly used as an
alternative. TC film-fabricated nanowires have superior intrinsic properties owing to their wire
shape. Their electrical performance can differ based on the printing direction and ink properties.
The alignment of a wire depends on the printing equipment, ink composition, printing process,
etc. [1] to [3] .
In this document, a method to evaluate the difference in electrical properties based on the
printing direction is proposed. In particular, the proposed method monitors changes in the
resistance of a printed metal-based TC film on a flexible substrate.

___________
Numbers in square brackets refer to the Bibliography.

– 6 – IEC 62899-202-8:2024 © IEC 2024
PRINTED ELECTRONICS –
Part 202-8: Materials – Conductive ink – Measurement of difference
in resistance of printing direction of conductive film
fabricated with wire-shaped materials

1 Scope
This part of IEC 62899 provides a method for measuring the resistance difference of the printing
direction of a printed conductive layer with wire-shaped or wire-type conducting materials. The
method described in this document offers a measurement method and conditions for solution
processed conductive films, fabricated by coating and printing process.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated reference
...