WG 2 - TC 119/WG 2

IEC 62899-202-10:2023 defines terminology and measurement methods for the resistance change of conductive ink layer(s) as a function of thermoplastic elongation. The method measures resistance changes in-situ or post-elongation.
This document is applicable to thermoformable substrates with conductive ink layers. The thermoformable substrates can have printed graphic ink as well and cover insulation layers.

IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.

IEC 62899-202:2023 is available as IEC 62899-202:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62899-202:2023 defines the terms and specifies the standard test methods for characterization and evaluation of conductive inks. This document also provides measurement methods for evaluating the properties of conductive layers made both from an additive process using conductive inks and from a subtractive process used in printed electronics. This edition includes the following significant technical changes with respect to the previous edition:
a) definitions of conductive material, conductive ink and conductive layer have been revised;
b) a summary of test methods is added;
c) mechanical tests for conductive layer are added.

IEC 62899-202-4:2021(E) defines the terminology and measurement methods for the properties of stretchable printed layers, such as conductive ink, for forming stretchable conductors by printing, stretchable conductive films obtained from conductive ink, and stretchable printed wiring consisted by conductive ink with insulator.
Stretchable printed layers (conductive and insulating) handled by this document apply to the stretchable electric wiring printed on stretchable substrates, for example fabric integrated wearable devices, skin patchable devices, and so on.

IEC 62899-201-2:2021(E) defines measurement methods for the properties of stretchable substrates, in order to use evaluating stretchable functional layers (conductive, semiconducting, and insulating) formed by printing technologies. If the same types of materials as the substrates are used for the cover lay film, they are also subjected to the measurement defined in this document.
Stretchable substrates handled by this document apply to substrates subjected to repeated bending with wiring elements demanding a high level of performance, such as fabric integrated wearable devices or skin patchable devices.
This document does not define the required characteristics of the stretchable substrate. It provides test methods to characterize (pre-qualify) the substrates that are intended to be used for printing conductors and insulators for the purposes of manufacturing stretchable layers or structures.

IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.

IEC 62899-202-6:2020(E) provides a method of in-situ measurement for the resistance change of a conductive layer formed by printing methods on a flexible substrate under specified temperature and humidity conditions.

IEC 62899-204:2019 (E) defines the terms and specifies the standard methods for characterisation and evaluation. This document is applicable to insulator inks and printed insulating layers that are made from insulator inks used for printed electronics. The insulator inks include dielectric inks.

IEC 62899-202-3:2019(E) defines terms and specifies a standard method for the measurement of the sheet resistance of printed conductive films using a contactless eddy-current method.

IEC 62899-203:2018(E) defines terms and specifies standard methods for characterisation and evaluation. This document is applicable to semiconductor inks and semiconductive layers that are made from semiconductor inks.

IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.

IEC TR 62899-250:2016(E), which is a Technical Report (TR), explores a new technological field to establish standardization activities in TC 119 (Printed electronics) in particular, and to contribute to the development and market expansion of wearable smart device (WSD) technology.

IEC 62899-201:2016(E) defines the terms and specifies the evaluation method for substrates used in the printing process to form electronic components/devices. This international standard is also applied to the substrates which make surface treatment in order to improve their performance.

IEC 62899-202:2016(E) defines the terms and specifies the standard methods for characterisation and evaluation. This International Standard is applicable to conductive inks and conductive layer that are made from conductive inks.