IEC 61191-1:2018
(Main)Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61191-1:2018 is also available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
- the term "assembly drawing" has been changed to "assembly documentation" throughout;
- references to IEC standards have been corrected;
- Clause 9 was completely rewritten;
- Annex B was removed because there are already procedures for circuit board assemblies.
Ensembles de cartes imprimées - Partie 1: Spécification générique - Exigences relatives aux ensembles électriques et électroniques brasés utilisant les techniques de montage en surface et associées
IEC 61191-1:2018 est disponible sous forme de IEC 61191-1:2018 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L’IEC 61191-1:2018 établit les exigences relatives aux matériaux, méthodes et critères de vérification utilisés dans le cadre de la production d’interconnexions et d’ensembles brasés de qualité faisant appel à la technique de montage en surface ainsi qu’à des techniques d’assemblage associées. La présente partie de l’IEC 61191 comprend également des recommandations concernant la qualité des processus de fabrication. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- les exigences ont été mises à jour pour être conformes aux critères d’acceptation de l’IPC‑A-610F;
- le terme "dessin d’assemblage" a été remplacé partout par "document d’assemblage";
- les références aux normes IEC ont été corrigées;
- l’Article 9 a été entièrement réécrit;
- l’Annexe B a été retirée car des procédures d’assemblages de cartes à circuits existent déjà.
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IEC 61191-1 ®
Edition 3.0 2018-09
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Printed board assemblies –
Part 1: Generic specification – Requirements for soldered electrical and
electronic assemblies using surface mount and related assembly technologies
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.
IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
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The advanced search enables to find IEC publications by a 67 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and
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IEC 61191-1 ®
Edition 3.0 2018-09
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Printed board assemblies –
Part 1: Generic specification – Requirements for soldered electrical and
electronic assemblies using surface mount and related assembly technologies
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.190; 31.240 ISBN 978-2-8322-6051-7
– 2 – IEC 61191-1:2018 RLV © IEC 2018
CONTENTS
FOREWORD . 7
1 Scope . 9
2 Normative references. 9
3 Terms and definitions . 10
4 General requirements . 11
4.1 Order of precedence . 11
4.1.1 General remark . 11
4.1.2 Conflict . 11
4.1.3 Conformance documentation . 12
4.2 Interpretation of requirements . 12
4.3 Classification . 12
4.4 Defects and process indicators . 13
4.5 Process control requirements . 13
4.6 Requirements flowdown . 13
4.7 Physical designs . 13
Design requirements .
4.7.1 New designs . 13
4.7.2 Existing designs . 13
4.8 Visual aids . 14
4.9 Proficiency of personnel . 14
4.9.1 Design proficiency . 14
4.9.2 Manufacturing proficiency. 14
4.10 Electrostatic discharge (ESD) . 14
4.11 Facilities . 14
4.11.1 General . 14
4.11.2 Environmental controls . 14
4.11.3 Temperature and humidity . 15
4.11.4 Lighting . 15
4.11.5 Field conditions . 15
4.11.6 Clean rooms . 15
4.12 Assembly tools and equipment . 15
4.12.1 General . 15
4.12.2 Process control . 15
5 Requirements of materials . 15
5.1 Overview. 15
5.2 Solder . 16
5.3 Flux . 16
5.4 Solder paste . 16
5.5 Preform solder . 16
5.6 Adhesives . 16
5.7 Cleaning agents . 16
5.7.1 General . 16
5.7.2 Cleaning agents selection . 17
5.8 Polymeric coatings . 17
General .
5.8.1 Solder resists and localized maskants . 17
5.8.2 Conformal coating and encapsulants . 17
5.8.3 Spacers (permanent and temporary) . 17
5.9 Chemical strippers . 17
5.10 Cleaning Agents . 17
5.11 Heat shrinkable soldering devices . 17
6 Components and printed board requirements . 18
6.1 General . 18
6.2 Solderability . 18
6.2.1 Parts solderability . 18
6.2.2 Reconditioning . 18
6.2.3 Solderability testing of ceramic boards . 18
6.3 Solderability maintenance . 18
6.3.1 General . 18
6.3.2 Preconditioning . 18
6.3.3 Gold embrittlement of solder joints . 19
6.3.4 Tinning of non-solderable parts . 19
6.4 Solder purity maintenance . 19
6.5 Lead preparation . 20
6.5.1 General . 20
6.5.2 Lead forming . 20
6.5.3 Lead-forming limits . 21
7 Assembly process requirements . 21
7.1 Overview. 21
7.2 Cleanliness . 21
7.3 Part markings and reference designations . 21
7.4 Solder connection contours . 21
7.5 Moisture traps . 21
7.6 Thermal dissipation . 21
8 Assembly soldering requirements . 22
8.1 General . 22
8.1.1 Soldering process . 22
8.1.2 Machine maintenance . 22
8.1.3 Handling of parts . 22
8.1.4 Preheating . 22
8.1.5 Carriers . 22
8.1.6 Hold down of surface mount leads . 22
8.1.7 Heat application . 22
8.1.8 Cooling . 23
8.2 Reflow soldering . 23
8.2.1 Requirements . 23
8.2.2 Process development for reflow soldering . 23
8.2.3 Flux application . 23
8.2.4 Solder application . 23
8.3 Manual/hand soldering . 24
8.3.1 Non-reflow manual soldering . 26
8.3.2 Reflow manual soldering .
...
IEC 61191-1 ®
Edition 3.0 2018-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed board assemblies –
Part 1: Generic specification – Requirements for soldered electrical and
electronic assemblies using surface mount and related assembly technologies
Ensembles de cartes imprimées –
Partie 1: Spécification générique – Exigences relatives aux ensembles
électriques et électroniques brasés utilisant les techniques de montage en
surface et associées
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.
Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.
IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing 21 000 terms and definitions in
Technical Specifications, Technical Reports and other English and French, with equivalent terms in 16 additional
documents. Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical
iPad. Vocabulary (IEV) online.
IEC publications search - webstore.iec.ch/advsearchform IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a 67 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and
CISPR.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
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IEC 61191-1 ®
Edition 3.0 2018-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed board assemblies –
Part 1: Generic specification – Requirements for soldered electrical and
electronic assemblies using surface mount and related assembly technologies
Ensembles de cartes imprimées –
Partie 1: Spécification générique – Exigences relatives aux ensembles
électriques et électroniques brasés utilisant les techniques de montage en
surface et associées
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.190; 31.240 ISBN 978-2-8322-5953-5
– 2 – IEC 61191-1:2018 © IEC 2018
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references. 8
3 Terms and definitions . 9
4 General requirements . 10
4.1 Order of precedence . 10
4.1.1 General remark . 10
4.1.2 Conflict . 10
4.1.3 Conformance documentation . 10
4.2 Interpretation of requirements . 11
4.3 Classification . 11
4.4 Defects and process indicators . 11
4.5 Process control requirements . 12
4.6 Requirements flowdown . 12
4.7 Physical designs . 12
4.7.1 New designs . 12
4.7.2 Existing designs . 12
4.8 Visual aids . 12
4.9 Proficiency of personnel . 13
4.9.1 Design proficiency . 13
4.9.2 Manufacturing proficiency. 13
4.10 Electrostatic discharge (ESD) . 13
4.11 Facilities . 13
4.11.1 General . 13
4.11.2 Environmental controls . 13
4.11.3 Temperature and humidity . 13
4.11.4 Lighting . 14
4.11.5 Field conditions . 14
4.11.6 Clean rooms . 14
4.12 Assembly tools and equipment . 14
4.12.1 General . 14
4.12.2 Process control . 14
5 Requirements of materials . 14
5.1 Overview. 14
5.2 Solder . 14
5.3 Flux . 14
5.4 Solder paste . 15
5.5 Preform solder . 15
5.6 Adhesives . 15
5.7 Cleaning agents . 15
5.7.1 General . 15
5.7.2 Cleaning agents selection . 15
5.8 Polymeric coatings . 16
5.8.1 Solder resists and localized maskants . 16
5.8.2 Conformal coating and encapsulants . 16
5.8.3 Spacers (permanent and temporary) . 16
5.9 Chemical strippers . 16
5.10 Cleaning Agents . 16
5.11 Heat shrinkable soldering devices . 16
6 Components and printed board requirements . 16
6.1 General . 16
6.2 Solderability . 17
6.2.1 Parts solderability . 17
6.2.2 Reconditioning . 17
6.2.3 Solderability testing of ceramic boards . 17
6.3 Solderability maintenance . 17
6.3.1 General . 17
6.3.2 Preconditioning . 17
6.3.3 Gold embrittlement of solder joints . 17
6.3.4 Tinning of non-solderable parts . 18
6.4 Solder purity maintenance . 18
6.5 Lead preparation . 19
6.5.1 General . 19
6.5.2 Lead forming . 19
6.5.3 Lead-forming limits .
...
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