IEC 62137-4:2014

IEC 62137-4 ®
Edition 1.0 2014-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Electronics assembly technology –
Part 4: Endurance test methods for solder joint of area array type package
surface mount devices
Technique d'assemblage des composants électroniques –
Partie 4: Méthodes d'essais d'endurance des joints brasés des composants
pour montage en surface à boîtiers de type matriciel
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IEC 62137-4 ®
Edition 1.0 2014-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Electronics assembly technology –

Part 4: Endurance test methods for solder joint of area array type package

surface mount devices
Technique d'assemblage des composants électroniques –

Partie 4: Méthodes d'essais d'endurance des joints brasés des composants

pour montage en surface à boîtiers de type matriciel

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX X
ICS 31.190 ISBN 978-2-8322-1873-0

– 2 – IEC 62137-4:2014 © IEC 2014
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms definitions and abbreviations . 9
3.1 Terms and definitions . 9
3.2 Abbreviations . 9
4 General . 9
5 Test apparatus and materials . 10
5.1 Specimen . 10
5.2 Reflow soldering equipment . 10
5.3 Temperature cycling chamber . 10
5.4 Electrical resistance recorder . 10
5.5 Test substrate . 10
5.6 Solder paste . 11
6 Specimen preparation . 11
7 Temperature cycling test . 13
7.1 Pre-conditioning . 13
7.2 Initial measurement . 13
7.3 Test procedure . 13
7.4 End of test criteria. 15
7.5 Recovery . 15
7.6 Final measurement . 15
8 Temperature cycling life . 15
9 Items to be specified in the relevant product specification . 15
Annex A (informative) Acceleration of the temperature cycling test for solder joints . 17
A.1 General . 17
A.2 Acceleration of the temperature cycling test for an Sn-Pb solder joint . 17
A.3 Temperature cycling life prediction method for an Sn-Ag-Cu solder joint . 18
A.4 Factor that affects the temperature cycling life of the solder joint . 22
Annex B (informative) Electrical continuity test for solder joints of the package . 23
B.1 General . 23
B.2 Package and daisy chain circuit . 23
B.3 Mounting condition and materials . 23
B.4 Test method . 23
B.5 Temperature cycling test using the continuous electric resistance monitoring
system . 23
Annex C (informative) Reflow solderability test method for package and test substrate
land . 25
C.1 General . 25
C.2 Test equipment . 25
C.2.1 Test substrate. 25
C.2.2 Pre-conditioning oven . 25
C.2.3 Solder paste . 25
C.2.4 Metal mask for screen printing . 25
C.2.5 Screen printing equipment . 25

C.2.6 Package mounting equipment . 25
C.2.7 Reflow soldering equipment . 25
C.2.8 X-ray inspection equipment . 26
C.3 Standard mounting process . 26
C.3.1 Initial measurement . 26
C.3.2 Pre-conditioning . 26
C.3.3 Package mounting on test substrate . 26
C.3.4 Recovery . 27
C.3.5 Final measurement . 27
C.4 Examples of faulty soldering of area array type packages . 27
C.4.1 Repelled solder by contamination on the ball surface of the BGA
package . 27
C.4.2 Defective solder ball wetting caused by a crack in the package . 27
C.5 Items to be given in the product specification . 28
Annex D (informative) Test substrate design guideline . 29
D.1 General . 29
D.2 Design standard . 29
D.2.1 General . 29
D.2.2 Classification of substrate specifications . 29
D.2.3 Material of the test substrate . 31
D.2.4 Configuration of layers of the test substrate . 31
D.2.5 Land shape of test substrate . 31
D.2.6 Land dimensions of the test substrate . 31
D.3 Items to be given in the product specification . 32
Annex E (informative) Heat resistance to reflow soldering for test substrate . 33
E.1 General . 33
E.2 Test apparatus . 33
E.2.1 Pre-conditioning oven . 33
E.2.2 Reflow soldering equipment . 33
E.3 Test procedure . 33
E.3.1 General . 33
E.3.2 Pre-conditioning . 33
E.3.3 Initial measurement . 33
E.3.4 Moistening process (1) . 34
E.3.5 Reflow heating (1) . 34
E.3.6 Moistening process (2) . 34
E.3.7 Reflow heating process (2) . 34
E.3.8 Final measurement . 34
E.4 Items to be given in the product specification . 34
Annex F (informative) Pull strength measurement method for the test substrate land . 35
F.1 General . 35
F.2 Test apparatus and materials . 35
F.2.1 Pull strength measuring equipment . 35
F.2.2 Reflow soldering equipment . 35
F.2.3 Test substrate. 35
F.2.4 Solder ball . 35
F.2.5 Solder paste . 35
F.2.6 Flux . 35
F.3 Measurement procedure . 36

– 4 – IEC 62137-4:2014 © IEC 2014
F.3.1 Pre-conditioning . 36
F.3.2 Solder paste printing . 36
F.3.3 Solder ball placement . 36
F.3.4 Reflow heating process . 36
F.3.5 Pull strength measurement . 36
F.3.6 Final measurement . 37
F.4 Items to be given in the product specification . 37
Annex G (informative) Standard mounting process for the packages . 38
G.1 General . 38
G.2 Test apparatus and materials . 38
G.2.1 Test substrate. 38
G.2.2 Solder paste . 38
G.2.3 Metal mask for screen printing . 38
G.2.4 Screen printing equipment . 38
G.2.5 Package mounting equipment . 38
G.2.6 Reflow soldering equipment . 38
G.3 Standard mounting process . 39
G.3.1 Initial measurement . 39
G.3.2 Solder paste printing . 39
G.3.3 Package mounting . 39
G.3.4 Reflow heating process . 39
G.3.5 Recovery . 40
G.3.6 Final measurement . 40
G.4 Items to be given in the product specification . 40
Annex H (informative) Mechanical stresses to the packages . 41
H.1 General . 41
H.2 Mechanical stresses . 41
Bibliography . 42

Figure 1 – Region for evaluation of the endurance test . 10
Figure 2 – Typical reflow soldering profile for Sn63Pb37 solder alloy . 12
Figure 3 – Typical reflow soldering profile for Sn96,5Ag3Cu,5 solder alloy . 13
Figure 4 – Test conditions of temperature cycling test. 14
Figure A.1 – FBGA package device and FEA model for calculation of acceleration
factors AF . 20
Figure A.2 – Example of acceleration factors AF with an FBGA package device using
Sn96,5Ag3Cu,5 solder alloy . 21
Figure A.3 – Fatigue characteristics of Sn96,5Ag3Cu,5 an alloy micro solder joint
(N = 20 % load drop from initial load) . 22
f
Figure B.1 – Example of a test circuit for the electrical continuity test of a solder joint . 23
Figure B.2 – Measurement example of continuously monitored resistance in the

temperature cycling test . 24
Figure C.1 – Temperature measurement of specimen using thermocouples . 26
Figure C.2 – Repelled solder caused by contamination on the solder ball surface . 27
Figure C.3 – Defective soldering as a result of a solder ball drop . 28
Figure D.1 – Standard land shapes of the test substrate . 31
Figure F.1 – Measuring methods for pull strength . 36

Figure G.1 – Example of printed conditions of solder paste . 39
Figure G.2 – Temperature measurement of the specimen using thermocouples . 40

Table 1 – Test conditions of temperature cycling test . 14
Table A.1 – Example of test results of the acceleration factor (Sn63Pb37 solder alloy) . 18
Table A.2 – Example test results of the acceleration factor (Sn96,5Ag3Cu,5 solder
alloy) . 20
Table A.3 – Material constant and inelastic strain range calculated by FEA for FBGA
package devices as shown in Figure A.1 (Sn96,5Ag3Cu,5 solder alloy) . 21
Table D.1 – Types classification of the test substrate . 30
Table D.2 – Standard layers' configuration of test substrates . 31
Table G.1 – Stencil design standard for packages . 38
Table H.1 – Mechanical stresses to mounted area array type packages . 41

– 6 – IEC 62137-4:2014 © IEC 2014
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ELECTRONICS ASSEMBLY TECHNOLOGY –

Part 4: Endurance test methods for solder joint
of area array type package surface mount devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62137-4 has been prepared by IEC technical committee 91:
Electronics assembly technology.
IEC 62137-4 (first edition) cancels and replaces IEC 62137:2004. This edition constitutes a
technical revision.
IEC 62137-4 includes the following significant technical changes with respect to
IEC 62137:2004:
• test conditions for use of lead-free solder are included;
• test conditions for lead-free solders are added;
• accelerations of the temperature cycling test for solder joints are added.

The text of this standard is based on the following documents:
FDIS Report on voting
91/1188/FDIS 91/1205/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62137 series, published under the general title Electronics
assembly technology can be found in the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 8 – IEC 62137-4:2014 © IEC 2014
ELECTRONICS ASSEMBLY TECHNOLOGY –

Part 4: Endurance test methods for solder joint
of area array type package surface mount devices

1 Scope
This part of IEC 62137 specifies the test method for the solder joints of area array type
packages mounted on the printed wiring board to evaluate solder joint durability against
thermo-mechanical stress.
This part of IEC 62137 applies to the surface mounting semiconductor devices with area array
type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages
(SON and QFN) that are intended to be used in industrial and consumer electrical or
electronic equipment.
An acceleration factor for the degradation of the solder joints of the packages by the
temperature cycling test due to the thermal stress when mounted, is described Annex A.
Annex H provides some explanations concerning various types of mechanical stress when
mounted.
The test method specified in this standard is not intended to evaluate semiconductor devices
themselves.
NOTE 1 Mounting conditions, printed wiring boards, soldering materials, and so on, significantly affect the result
of the test specified in this standard. Therefore, the test specified in this standard is not regarded as the one to be
used to guarantee the mounting reliability of the packages.
NOTE 2 The test method is not necessary, if there is no stress (mechanical or other) to solder joints in field use
and handling after mounting.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60191-6-2, Mechanical standardization of semiconductor devices – Part 6-2: General
rules for the preparation of outline drawings of surface mounted semiconductor device
packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal
packages
IEC 60191-6-5, Mechanical standardization of semiconductor devices – Part 6-5: General
rules for the preparation of outline drawings of surface mounted semiconductor device
packages – Design guide for fine-pitch ball grid array (FBGA)
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions

IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
IEC 61249-2-7, Materials for printed boards and other interconnecting structures – Part 2-7:
Reinforced base materials clad and unclad – Epoxide woven E-glass laminated sheet of
defined flammability (vertical burning test), copper-clad
IEC 61249-2-8, Materials for printed boards and other interconnecting structures – Part 2-8:
Reinforced base materials clad and unclad – Modified brominated epoxide woven fibreglass
reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
IEC 62137-3:2011, Electronics assembly technology – Part 3: Selection guidance of
environmental and endurance test methods for solder joints
3 Terms definitions and abbreviations
3.1 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60191-6-2,
IEC 60191-6-5 and IEC 60194, as well as the following, apply.
3.1.1
temperature cycling life
period of time to reach a lost performance state as agreed between the trading partners
during the temperature cycling test
3.1.2
momentary interruption detector
instrument capable to detect an electrical discontinuity in the daisy chain circuits
Note 1 to entry: See Annex B for the electrical continuity test of solder joint.
3.2 Abbreviations
FBGA Fine-pitch ball grid array
BGA Ball grid array
FLGA Fine-pitch land grid array
LGA Land grid array
SON Small outline non-leaded package
QFN Quad flat-pack non-leaded package
SMD Surface mounting device
OSP Organic solderability preservative
FR-4 Flame retardant type 4
FEA Finite element method analysis
CGA Column grid array
4 General
The regions of the solder joints to be evaluated are shown in Figure 1. The test method in this
standard is applicable to evaluate the durability of the solder joints against thermal stress to
the package mounted on substrate but not to test the mechanical strength of the package
itself.
– 10 – IEC 62137-4:2014 © IEC 2014
Therefore, the conditions for accelerated stress conditioning by a temperature cycling test
may exceed the maximum allowable temperature range for the package.
The test method specified in this standard is mainly applicable to the solder joint between
substrates of printed wiring board and the package as an evaluation target. However, the test
results depend on conditions such as the mounting method and the condition, materials and
the printed wiring board, etc. See Annex C to Annex G.
SMD (array type)
Substrate
Device
Device
Solder
Substrate
Device termination
Plating layers
Evaluation
Solder
area
Inter-metallic
Substrate
compound layers
Substrate Substrate land
IEC
Figure 1 – Region for evaluation of the endurance test
5 Test apparatus and materials
5.1 Specimen
Specimen is the package mounted on the test substrate (refer to Clause 6 for preparation).
5.2 Reflow soldering equipment
The reflow soldering equipment shall be able to realize the reflow soldering temperature
profile specified in Clause 6. Examples of temperature profile are shown in Figure 2 and
Figure 3.
NOTE A standard mounting process for the package is shown in Annex G.
5.3 Temperature cycling chamber
The temperature cycling chamber shall be able to realize the temperature cycling profile
specified in Figure 4. The general requirements for the temperature cycling chamber are
specified in IEC 60068-2-14.
5.4 Electrical resistance recorder
The electrical resistance recorder shall be able to detect electrical continuity interruption in
the daisy chain circuit. If there is no doubt of the measuring result, an electrical resistance
measuring instrument featured with a momentary interruption detector and/or a continuous
electrical resistance data logger should be used.
The interruption detector should be sufficiently sensitive to detect a 100 µs momentary
interruption. Furthermore, the electrical resistance measuring instrument should be able to
measure a resistance exceeding 1 000 Ω.
5.5 Test substrate
Unless otherwise specified in the product specification, the test substrate shall be as follows.
a) Test substrate material
Test substrate material shall be a single sided printed wiring board for general use, for
example, copper-clad epoxide woven fiberglass reinforced laminated sheets as specified
in IEC 61249-2-7 or IEC 61249-2-8. The thickness shall be (1,6 ± 0,2) mm including
copper foil. The copper foil thickness shall be (35 ± 10) µm.
NOTE 1 Heat resistance to reflow soldering for the test substrate is described in Annex E.
b) Test substrate dimensions
The test substrate dimensions depend on the mounted package size and shape. However,
the test substrate dimensions shall be fixed on the pull strength test equipment.
c) Land shape and land dimensions
Land shape and land dimensions should be as specified in IEC 61188-5-8 or as
recommended by the package manufacturer.
Moreover, the test substrate and the test package shall be designed in such a way that
their land pattern forms a daisy chain circuit after mounting for the electrical continuity
measurement.
NOTE 2 Annex D provides a test substrate design guide.
NOTE 3 Annex C provides a solderability test for the substrate land. And Annex F provides a strength test for
the substrate land.
d) Surface finish of land pattern
If specified in the product specification, a solderable region (land pattern of the test
substrate) shall be treated suitably against oxidization, for example, by means of an
organic solderability preservative (OSP) layer. The surface protection shall not interfere
with the solderability of the land pattern being soldered by using the reflow soldering
equipment specified in 5.2.
5.6 Solder paste
Solder paste is made of flux, finely divided particles of solder and additives to promote wetting
and to control viscosity, tackiness, slumping, drying rate, etc. Unless otherwise specified in
the product specification, one of the solder alloys listed below (as specified in IEC 61190-1-3)
shall be used. The product specification shall specify details of the solder paste.
The major composition of the solder alloys are as follows:
a) 63 % mass fraction of Sn (tin) and 37 % mass fraction on Pb (lead);
b) from 3,0 % to 4,0 % mass fraction of Ag (silver), from 0,5 % to 1,0 % mass fraction of Cu
(copper) and the remainder of Sn (tin).
Example: Sn-Ag-Cu ternary alloy such as Sn96,5Ag3Cu,5 alloy is used.
6 Specimen preparation
The package shall be mounted on the test substrate using the following reflow soldering
process. The package for the specimen shall be modified as for test dummy package to form
a daisy chain circuit with a land pattern of the test substrate after reflow soldering.
NOTE The solderability test to confirm the termination of the package and the test substrate land which affects
the solder joint strength is described in Annex C.
The specimen preparation process and the conditions are as follows.
a) Unless otherwise specified in the product specification, the solder paste specified in 5.6
shall be printed on the test substrate land specified in 5.5, using a stencil made of
stainless steel being 120 µm to 150 µm thick, and that have the same aperture
dimensions as the dimensions, shape and arrangement of the test substrate land.
b) The package shall be placed onto the printed solder paste.

– 12 – IEC 62137-4:2014 © IEC 2014
c) The reflow soldering equipment specified in 5.2 shall be used for soldering the package
terminals under the conditions shown in Figure 2 or Figure 3. The measuring point of the
temperature shall be on the land portion.
Figure 2 shows an example of a typical reflow soldering profile using Sn63Pb37 solder alloy,
as stated in IEC 61760-1:2006, Figure 13.
Figure 3 shows an example of a typical reflow soldering profile using Sn96,5Ag3Cu,5 solder
alloy, as stated in IEC 61760-1:2006, Figure 14.
SnPb Reflow
250 240 °C
230 °C
215 °C
180 °C
160 °C
ca. 60 s > 180 °C
150 °C
130 °C
Pre-heating
Ramp down rate < 6 K/s
Typical
Ramp up rate < 3 K/s
0 20 40 60 80 100 120 140 160 180 200 220 240
Time  s
Continous line: typical process (terminal temperature)
Dotted line: process limits. Bottom process limit (terminal temperature). Upper process limit (top surface
temperature)
IEC
Figure 2 – Typical reflow soldering profile for Sn63Pb37 solder alloy
Temperature  °C
SnAgCu Reflow
250 °C
245 °C
235 °C
220 °C
180 °C
Pre-heating
ca 45 s … 90 s > 220 °C
150 °C
Typical
Ramp down rate < 6 K/s
Ramp up rate < 3 K/s
0 30 60 90 120 150 180 210 240 270 300 330 360

Time  s
Continous line: typical process (terminal temperature)
Dotted line: process limits. Bottom process limit (terminal temperature). Upper process limit (top surface
temperature)
IEC
Figure 3 – Typical reflow soldering profile for Sn96,5Ag3Cu,5 solder alloy
7 Temperature cycling test
7.1 Pre-conditioning
If the specimen needs to be cleaned, the product specification should specify the cleaning
method.
7.2 Initial measurement
The specimen shall be subjected to visual examination. There shall be no defect, which may
impair the validity of the test.
Electrical resistance as electrical continuity of the specimen (daisy chain circuit) shall be
confirmed using the momentary interruption detector specified in 5.4.
7.3 Test procedure
The temperature cycling test is according to test Na (rapid change of temperature within the
prescribed time of transfer) specified in IEC 60068-2-14 with the following details.
Place the specimen in the temperature cycling chamber where the best airflow is obtained
and where there is sufficient airflow around the specimen.
The test condition shall be selected from Figure 4 and Table 1, and the test shall be
performed to the specified cycles in the product specification.
The electrical resistance of the daisy chain circuit shall be monitored continuously during the
test using the momentary interruption detector specified in 5.4.
Temperature  °C
– 14 – IEC 62137-4:2014 © IEC 2014
Maximum storage
temperature
(T )
max
Normal ambient
temperature
(T )
n
Minimum storage
temperature
Hold Hold
(T )
min
time
time
t t
1 2
One cycle period
t
cyc
IEC
Key
t Hold time at T
T Maximum storage temperature
1 min
max
t Hold time at T
T Normal ambient temperature
2 max
n
t One temperature cycle
T Minimum storage temperature
cyc
min
Figure 4 – Test conditions of temperature cycling test
Table 1 – Test conditions of temperature cycling test
Step Test condition A Test condition B Test condition C Test condition D
Minimum storage
T ± 5
−40 ± 5 −25 ± 5 −30 ± 5
op, min
temperature: T °C
min
Maximum storage
T ± 5
125 ± 5 125 ± 5 80 ± 5
op, max
temperature: T °C
max
t = t ≥ 7 min for Sn63Pb37 solder alloy
1 2
Hold time: t , t
1 2
t ≤ 30 min, t ≥ 15 min for Sn96,5Ag3Cu,5 solder alloy
1 2
For Sn96,5Ag3Cu,5 solder alloy, the dwell time in the temperature cycling chamber shall be set to 30 min at
maximum storage temperature, including the hold time t ; 15 min for stress relaxation and 15 min for stable
temperature. Refer to IEC 62137-3:2011, Annex A. At minimum storage temperature, it may not be necessary
that the stress r
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