IEC 62137:2004/COR1:2005
(Corrigendum)Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
General Information
- Status
- Replaced
- Publication Date
- 26-Jan-2005
- Technical Committee
- TC 91 - Electronics assembly technology
- Current Stage
- DELPUB - Deleted Publication
- Start Date
- 09-Oct-2014
- Completion Date
- 14-Feb-2026
Relations
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
Frequently Asked Questions
IEC 62137:2004/COR1:2005 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN". This standard covers: Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
IEC 62137:2004/COR1:2005 is classified under the following ICS (International Classification for Standards) categories: 31.190 - Electronic component assemblies. The ICS classification helps identify the subject area and facilitates finding related standards.
IEC 62137:2004/COR1:2005 has the following relationships with other standards: It is inter standard links to IEC 62137-4:2014, IEC 62137:2004. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
IEC 62137:2004/COR1:2005 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
IEC 62137
(First edition – 2004)
ENVIRONMENTAL AND ENDURANCE TESTING – TEST METHODS FOR SURFACE-MOUNT BOARDS OF
AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
CORRIGENDUM 1
Page 5
2 Normative references
Delete:
IEC 61190-1-1, Attachment materials for electronic assemblies – Part 1-1: Requirements
for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-2, Attachment materials for electronic assemblies – Part 1-2: Requirements
for solder pastes for high-quality interconnections in electronics assembly
IEC 61190-1-3, Attachment materials for electronic assemblies – Part 1-3: Requirements
for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic
soldering applications
Page 16
A.2.4.4 Post-treatment (flux removal)
First sentence
Instead of:
“(propanol)”
read:
“(isopropanol)”.
Page 17
A.3.4.1 Soldering process, a) Pre-treatment
...
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