Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

IEC 60191-1:2018 gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.
This edition includes the following significant technical changes with respect to the previous edition:
a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8;
b) a definition of the term "stand-off" has been added;
c) the methods for locating the datum have been extended to be suitable for SMD-packages;
d) the visual identification of terminal position one for automatic handling has been clarified;
e) the rules for the drawing of terminals have been clarified;
f) Table A.1 has been completed with symbols specifically for SMD-packages;
g) Annex B "Standardization philosophy" has been deleted;
h) a normative Annex with special rules for SMD-packages has been added;
i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.

Normalisation mécanique des dispositifs à semiconducteurs - Partie 1: Règles générales pour la préparation des dessins d’encombrement des dispositifs discrets

L’IEC 60191-1:2018 donne des lignes directrices pour la préparation des dessins d’encombrement des dispositifs discrets, comprenant les dispositifs discrets à semiconducteurs pour montage en surface dont le nombre de connexions est inférieur à 8.
Il convient également de se référer à l’IEC 60191-6 pour la préparation des dessins d’encombrement des dispositifs discrets pour montage en surface dont le nombre de connexions est supérieur ou égal à 8.
L’objectif principal de ces dessins consiste à indiquer l’espace à octroyer aux dispositifs dans un équipement, ainsi que d’autres caractéristiques dimensionnelles exigées pour assurer une interchangeabilité mécanique.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:  
le domaine d’application a été étendu pour couvrir les dispositifs à semiconducteurs pour montage en surface dont le nombre de connexions est inférieur à 8;
une définition du terme "élévation" a été ajoutée;
les méthodes de positionnement de la référence spécifiée ont été étendues pour englober les boîtiers des composants pour montage en surface (CMS);
l’identification visuelle de la position de broche no 1, dans le cadre des procédures de manipulation automatique, a été clarifiée;
les règles de représentation des broches ont été clarifiées;
le Tableau A.1 a été complété avec des symboles spécifiquement destinés aux boîtiers CMS;
l’Annexe B "Concept de normalisation" a été supprimée;
une annexe normative avec des règles spécifiques aux boîtiers CMS a été ajoutée;
les exemples de dessins de dispositifs à semiconducteurs ont été alignés sur l’état de l’art des boîtiers, en englobant les boîtiers CMS.

General Information

Status
Published
Publication Date
22-Jan-2018
Current Stage
PPUB - Publication issued
Start Date
16-Feb-2018
Completion Date
23-Jan-2018
Ref Project

Relations

Buy Standard

Standard
IEC 60191-1:2018 - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
English language
36 pages
sale 15% off
Preview
sale 15% off
Preview
Standard
IEC 60191-1:2018 - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
English and French language
76 pages
sale 15% off
Preview
sale 15% off
Preview

Standards Content (Sample)


IEC 60191-1 ®
Edition 3.0 2018-01
INTERNATIONAL
STANDARD
Mechanical standardization of semiconductor devices –
Part 1: General rules for the preparation of outline drawings of discrete devices
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing 21 000 terms and definitions in
Technical Specifications, Technical Reports and other English and French, with equivalent terms in 16 additional
documents. Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical
iPad. Vocabulary (IEV) online.

IEC publications search - webstore.iec.ch/advsearchform IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a 67 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and

CISPR.
IEC Just Published - webstore.iec.ch/justpublished

Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
IEC 60191-1 ®
Edition 3.0 2018-01
INTERNATIONAL
STANDARD
Mechanical standardization of semiconductor devices –

Part 1: General rules for the preparation of outline drawings of discrete devices

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-5266-6

– 2 – IEC 60191-1:2018  IEC 2018
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 General rules for all drawings . 8
4.1 Drawing layout . 8
4.2 Dimensions and tolerances . 9
4.3 Methods for locating the datum . 10
4.4 Numbering of terminals . 11
4.4.1 General . 11
4.4.2 Single-ended devices with terminals in a linear array . 11
4.4.3 Single-ended devices with terminals in a circular array . 11
4.4.4 Double-ended devices . 11
4.4.5 Devices with terminals disposed in a square or rectangular periphery . 11
4.4.6 Particular case of lozenge – shaped bases . 11
4.4.7 Other devices . 12
5 Additional rules . 12
5.1 Rules for device and case outline drawings . 12
5.2 Rules to specify the dimensions and positions of terminals . 13
5.2.1 General rules . 13
5.2.2 Rules to specify the dimensions and the positions of the terminals on a
base drawing . 13
5.3 Rules for gauge drawings . 13
6 Inter-conversion of inch and millimetre dimensions and rules for rounding off . 14
7 Rules for coding . 14
Annex A (informative) Reference letter symbols . 15
Annex B (informative) Rules to specify the dimensions and positions of terminals on a
base drawing . 18
B.1 Example of dimensioning for a circular base outline with no tab and having
four terminals located symmetrically on a pitch circle . 18
B.1.1 Interpretation of the principle of dimensioning . 18
B.1.2 Checking . 19
B.2 Example of dimensioning for a circular base outline with a tab and having
four terminals located symmetrically on a pitch circle . 19
B.2.1 Interpretation of the principle of dimensioning . 19
B.2.2 Checking . 20
Annex C (normative) General philosophy of flat base devices . 24
Annex D (normative) Special rules for SMD-packages . 26
D.1 General reference . 26
D.2 Lead terminals . 26
D.3 Measuring methods . 26
Annex E (informative) Examples of semiconductor device drawings . 27
Annex F (informative) Former rules for rounding off . 33
F.1 Toleranced dimensions . 33
F.1.1 Maximum and minimum values of toleranced dimensions . 33
F.1.2 Nominal value of toleranced dimensions . 33

F.2 Untoleranced dimensions (maximum only or minimum only) . 33
F.3 Untoleranced nominal dimensions given for general information . 33
F.4 Untoleranced nominal dimensions given to specify true geometrical positions . 34
Annex G (informative) Former rules for coding . 35
G.1 General . 35
G.2 Device outlines . 35
G.3 Bases . 35
G.4 Case outlines . 35
G.5 Type variants and provisional drawings . 35
Bibliography . 36

Figure 1 – Numbering of terminals for the particular case of lozenge – shaped bases . 12
Figure 2 – System to indicate the dimensions of the terminals . 13
Figure B.1 – Circular base outline with no tab . 21
Figure B.2 – Tolerances of terminals. 21
Figure B.3 – Gauge for a circular base outline with no tab . 22
Figure B.4 – Circular base outline with tab . 22
Figure B.5 – Gauge for a circular base outline with tab . 23
Figure C.1 − Example of flat base outline . 25
Figure E.1 – Long form package . 27
Figure E.2 – Post/stud mount package . 27
Figure E.3 – Cylindric package . 28
Figure E.4 – Cylindric in-line package . 29
Figure E.5 – Flange-mounted in-line package . 29
Figure E.6 – Press package . 30
Figure E.7 – SMD-package with flat leads . 30
Figure E.8 – SMD-Package with gull-wing leads . 31
Figure E.9 – SMD-package with no leads . 32

Table A.1 – Dimensions of reference letter symbols . 15

– 4 – IEC 60191-1:2018  IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 1: General rules for the preparation of outline drawings
of discrete devices
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certificatio
...


IEC 60191-1 ®
Edition 3.0 2018-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 1: General rules for the preparation of outline drawings of discrete devices

Normalisation mécanique des dispositifs à semiconducteurs –
Partie 1: Règles générales pour la préparation des dessins d’encombrement
des dispositifs discrets
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite ni
utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie et
les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Secretariat Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC Products & Services Portal - products.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always have
committee, …). It also gives information on projects, replaced access to up to date content tailored to your needs.
and withdrawn publications.
Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 300 terminological entries in English
details all new publications released. Available online and once
and French, with equivalent terms in 19 additional languages.
a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Customer Service Centre - webstore.iec.ch/csc
If you wish to give us your feedback on this publication or need
further assistance, please contact the Customer Service
Centre: sales@iec.ch.
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.

Recherche de publications IEC - Découvrez notre puissant moteur de recherche et consultez
webstore.iec.ch/advsearchform gratuitement tous les aperçus des publications. Avec un
La recherche avancée permet de trouver des publications IEC abonnement, vous aurez toujours accès à un contenu à jour
en utilisant différents critères (numéro de référence, texte, adapté à vos besoins.
comité d’études, …). Elle donne aussi des informations sur les
projets et les publications remplacées ou retirées. Electropedia - www.electropedia.org

Le premier dictionnaire d'électrotechnologie en ligne au monde,
IEC Just Published - webstore.iec.ch/justpublished
avec plus de 22 300 articles terminologiques en anglais et en
Restez informé sur les nouvelles publications IEC. Just
français, ainsi que les termes équivalents dans 19 langues
Published détaille les nouvelles publications parues.
additionnelles. Egalement appelé Vocabulaire
Disponible en ligne et une fois par mois par email.
Electrotechnique International (IEV) en ligne.

Service Clients - webstore.iec.ch/csc
Si vous désirez nous donner des commentaires sur cette
publication ou si vous avez des questions contactez-nous:
sales@iec.ch.
IEC Products & Services Portal - products.iec.ch

IEC 60191-1 ®
Edition 3.0 2018-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –

Part 1: General rules for the preparation of outline drawings of discrete devices

Normalisation mécanique des dispositifs à semiconducteurs –

Partie 1: Règles générales pour la préparation des dessins d’encombrement

des dispositifs discrets
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-1092-4

– 2 – IEC 60191-1:2018  IEC 2018
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 General rules for all drawings . 8
4.1 Drawing layout . 8
4.2 Dimensions and tolerances . 9
4.3 Methods for locating the datum . 10
4.4 Numbering of terminals . 11
4.4.1 General . 11
4.4.2 Single-ended devices with terminals in a linear array . 11
4.4.3 Single-ended devices with terminals in a circular array . 11
4.4.4 Double-ended devices . 11
4.4.5 Devices with terminals disposed in a square or rectangular periphery . 11
4.4.6 Particular case of lozenge – shaped bases . 11
4.4.7 Other devices . 12
5 Additional rules . 12
5.1 Rules for device and case outline drawings . 12
5.2 Rules to specify the dimensions and positions of terminals . 13
5.2.1 General rules . 13
5.2.2 Rules to specify the dimensions and the positions of the terminals on a
base drawing . 13
5.3 Rules for gauge drawings . 13
6 Inter-conversion of inch and millimetre dimensions and rules for rounding off . 14
7 Rules for coding . 14
Annex A (informative) Reference letter symbols . 15
Annex B (informative) Rules to specify the dimensions and positions of terminals on a
base drawing . 18
B.1 Example of dimensioning for a circular base outline with no tab and having
four terminals located symmetrically on a pitch circle . 18
B.1.1 Interpretation of the principle of dimensioning . 18
B.1.2 Checking . 19
B.2 Example of dimensioning for a circular base outline with a tab and having
four terminals located symmetrically on a pitch circle . 19
B.2.1 Interpretation of the principle of dimensioning . 19
B.2.2 Checking . 20
Annex C (normative) General philosophy of flat base devices . 24
Annex D (normative) Special rules for SMD-packages . 26
D.1 General reference . 26
D.2 Lead terminals . 26
D.3 Measuring methods . 26
Annex E (informative) Examples of semiconductor device drawings . 27
Annex F (informative) Former rules for rounding off . 33
F.1 Toleranced dimensions . 33
F.1.1 Maximum and minimum values of toleranced dimensions . 33
F.1.2 Nominal value of toleranced dimensions . 33

F.2 Untoleranced dimensions (maximum only or minimum only) . 33
F.3 Untoleranced nominal dimensions given for general information . 33
F.4 Untoleranced nominal dimensions given to specify true geometrical positions . 34
Annex G (informative) Former rules for coding . 35
G.1 General . 35
G.2 Device outlines . 35
G.3 Bases . 35
G.4 Case outlines . 35
G.5 Type variants and provisional drawings . 35
Bibliography . 36

Figure 1 – Numbering of terminals for the particular case of lozenge – shaped bases . 12
Figure 2 – System to indicate the dimensions of the terminals . 13
Figure B.1 – Circular base outline with no tab . 21
Figure B.2 – Tolerances of terminals. 21
Figure B.3 – Gauge for a circular base outline with no tab . 22
Figure B.4 – Circular base outline with tab . 22
Figure B.5 – Gauge for a circular base outline with tab . 23
Figure C.1 − Example of flat base outline . 25
Figure E.1 – Long form package . 27
Figure E.2 – Post/stud mount package . 27
Figure E.3 – Cylindric package . 28
Figure E.4 – Cylindric in-line package . 29
Figure E.5 – Flange-mounted in-line package . 29
Figure E.6 – Press package . 30
Figure E.7 – SMD-package with flat leads . 30
Figure E.8 – SMD-Package with gull-wing leads . 31
Figure E.9 – SMD-package with no leads . 32

Table A.1 – Dimensions of reference letter symbols .
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.