IEC 60191-4:2013/AMD1:2018

IEC 60191-4 ®
Edition 3.0 2018-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
A MENDMENT 1
AM ENDEMENT 1
Mechanical standardization of semiconductor devices –
Part 4: Coding system and classification into forms of package outlines for
semiconductor device packages
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 4: Système de codification et classification en formes des structures des
boîtiers pour dispositifs à semiconducteurs

IEC 60191-4:2013-10/AMD1:2018-03(en-fr)

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing 21 000 terms and definitions in
Technical Specifications, Technical Reports and other English and French, with equivalent terms in 16 additional
documents. Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical
iPad. Vocabulary (IEV) online.

IEC publications search - webstore.iec.ch/advsearchform IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a 67 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and

CISPR.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.

Catalogue IEC - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
Application autonome pour consulter tous les renseignements
Le premier dictionnaire en ligne de termes électroniques et
bibliographiques sur les Normes internationales,
électriques. Il contient 21 000 termes et définitions en anglais
Spécifications techniques, Rapports techniques et autres
et en français, ainsi que les termes équivalents dans 16
documents de l'IEC. Disponible pour PC, Mac OS, tablettes
langues additionnelles. Egalement appelé Vocabulaire
Android et iPad.
Electrotechnique International (IEV) en ligne.

Recherche de publications IEC -
Glossaire IEC - std.iec.ch/glossary
webstore.iec.ch/advsearchform
67 000 entrées terminologiques électrotechniques, en anglais
La recherche avancée permet de trouver des publications IEC et en français, extraites des articles Termes et Définitions des
en utilisant différents critères (numéro de référence, texte, publications IEC parues depuis 2002. Plus certaines entrées
comité d’études,…). Elle donne aussi des informations sur les antérieures extraites des publications des CE 37, 77, 86 et
projets et les publications remplacées ou retirées. CISPR de l'IEC.

IEC Just Published - webstore.iec.ch/justpublished Service Clients - webstore.iec.ch/csc
Restez informé sur les nouvelles publications IEC. Just Si vous désirez nous donner des commentaires sur cette
Published détaille les nouvelles publications parues. publication ou si vous avez des questions contactez-nous:
Disponible en ligne et aussi une fois par mois par email. sales@iec.ch.

IEC 60191-4 ®
Edition 3.0 2018-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
A MENDMENT 1
AM ENDEMENT 1
Mechanical standardization of semiconductor devices –

Part 4: Coding system and classification into forms of package outlines for

semiconductor device packages
Normalisation mécanique des dispositifs à semiconducteurs –

Partie 4: Système de codification et classification en formes des structures des

boîtiers pour dispositifs à semiconducteurs

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-5495-0

– 2 – IEC 60191-4:2013/AMD1:2018
© IEC 2018
FOREWORD
This amendment has been prepared by subcommittee 47D: Semiconductor devices packaging,
of IEC technical committee 47: Semiconductor devices.
The text of this amendment is based on the following documents:
CDV Report on voting
47D/897/CDV 47D/904/RVC
Full information on the voting for the approval of this amendment can be found in the report
on voting indicated in the above table.
The committee has decided that the contents of this amendment and the base publication will
remain unchanged until the stability date indicated on the IEC website under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
_____________
Add, after Annexes A and B, the following new Annex C:
Annex C
(informative)
Terminology of semiconductor package outlines
To prevent misuse, misunderstanding and confusion of terminology of semiconductor package
outline, correct terms and descriptions are required to be indicated in the international
standards.
Correct terms and descriptions of semiconductor package outline including package code
variations are listed in Table C.1.

© IEC 2018
Table C.1 – Package name and parts name
Classification Term Description
Package name Ball Grid Array Package A package with the balls or bumps
placed in a row of 3 x 3 or more, or in
(BGA)
grid, on the upper or lower side of its
body
Package name Low Profile Ball Grid Array Package BGA with the seated height of over
1,2 mm and up to 1,7 mm
(LBGA)
Package name Thin Ball Grid Array Package BGA with the seated height of over
1,0 mm and up to 1,2 mm
(TBGA)
Package name Very Thin Ball Grid Array Package BGA with the seated height of over
0,8 mm and up to 1,0 mm
(VBGA)
Package name Very-very Thin Ball Grid Array Package BGA with the seated height of over
0,65 mm and up to 0,8 mm
(WBGA)
Package name Ultra-thin Ball Grid Array Package BGA with the seated height of over
0,5 mm and up to 0,65 mm
(UBGA)
Package name Extra Thin Ball Grid Array Package BGA with the seated height of up to
0,5 mm
(XBGA)
Package name Heat Sink Ball Grid Array Package BGA with a heat sink
(HBGA)
Package name Heat Sink Low Profile Ball Grid Array Package LBGA with a heat sink
(HLBGA)
Package name Heat Sink Thin Ball Grid Array Package TBGA with a heat sink
(HTBGA)
Package name Heat Sink Very Thin Ball Grid Array Package VBGA with a heat sink
(HVBGA)
Package name Heat Sink Very-very Thin Ball Grid Array WBGA with a heat sink
Package
(HWBGA)
Package name Heat Sink Ultra-thin Ball Grid Array Package UBGA with a heat sink
(HUBGA)
Package name Heat Sink Extra Thin Ball Grid Array Package XBGA with a heat sink
(HXBGA)
Package name Fine Pitch Ball Grid Array Package BGA with the terminal pitch of up to
0,8 mm
(FBGA)
Package name Low Profile Fine Pitch Ball Grid Array Package FBGA with the seated height of over
1,2 mm and up to 1,7 mm
(LFBGA)
Package name Thin Fine Pitch Ball Grid Array Package FBGA with the seated height of over
1,0 mm and up to 1,2 mm
(TFBGA)
Package name Very Thin Fine Pitch Ball Grid Array Package FBGA with the seated height of over
0,8 mm and up to 1,0 mm
(VFBGA)
Package name Very-very Thin Fine Pitch Ball Grid Array FBGA with the seated height of over
Package 0,65 mm and up to 0,8 mm
(WFBGA)
– 4 – IEC 60191-4:2013/AMD1:2018
© IEC 2018
Classification Term Description
Package name Ultra-thin Fine Pitch Ball Grid Array Package FBGA with the seated height of over
0,5 mm and up to 0,65 mm
(UFBGA)
Package name Extra Thin Fine Pitch Ball Grid Array Package FBGA with the seated height of up to
0,5 mm
(XFBGA)
Package name Terminal for stack Fine Pitch Ball Grid Array FBGA with the terminals for layer stack
Package
(PFBGA)
Package name Terminal for stack Low Profile Fine Pitch Ball LFBGA with the terminals for layer stack
Grid Array Package
(PLFBGA)
Package name Terminal for stack Thin Fine Pitch Ball Grid TFBGA with the terminals for layer stack
Array Package
(PTFBGA)
Package name Terminal for stack Very Thin Fine Pitch Ball Grid VFBGA with the terminals for layer stack
Array Package
(PVFBGA)
Package name Terminal for stack Very-very Thin Fine Pitch WFBGA with the terminals for layer stack
Ball Grid Array Package
(PWFBGA)
Package name Terminal for stack Ultra-thin Fine Pitch Ball Grid UFBGA with the terminals for layer stack
Array Package
(PUFBGA)
Package name Terminal for stack Extra Thin Fine Pitch Ball XFBGA with the terminals for layer stack
Grid Array Package
(PXFBGA)
Package name Interstitial Ball Grid Array Package Interstitial BGA
(IBGA)
Package name Plastic Ball Grid Array Package Plastic BGA
(P-BGA)
Package name Ceramic Ball Grid Array Package Ceramic BGA
(C-BGA)
Package name Silicon Fine Pitch Ball Grid Array Package Silicon FBGA
(S-FBGA)
Package name Dual Inline Package A package with the leads extended from
the two sides of its body and used for
(DIP)
through-hole mounting
Package name Shrink Dual Inline Package Shrink DIP
(SDIP)
Package name Heat Sink Dual Inline Package DIP with a heat sink
(HDIP)
Package name Heat Sink Shrink Dual Inline Package SDIP with a heat sink
(HSDIP)
Package name Piggyback Dual Inline Package Piggyback DIP
(PDIP)
Package name Plastic Dual Inline Package Plastic DIP
(P-DIP)
© IEC 2018
Classification Term Description
Package name Ceramic Dual Inline Package Ceramic DIP
(C-DIP)
Package name Glass-Sealed Ceramic Dual Inline Package Glass-sealed ceramic DIP
(G-DIP)
Package name Glass-Sealed Ceramic Window Dual Inline Glass-sealed ceramic DIP with a window
Package
(G-DDIP)
Package name Dual Tape Carrier Package A package with the leads extended from
the two sides of its body and consisting
(DTP)
of the tapes
Package name Dual Tape Carrier Package Type 1 DTP Type-1
(DTP(1))
Package name Dual Tape Carrier Package Type 2 DTP Type-2
(DTP(2))
Package name Land Grid Array Package A package without pins and with the
lands placed in a row of 3 x 3 or more, or
(LGA)
in grid, on the upper or lower side of its
body
Package name Low Profile Land Grid Array Package LGA with the seated height of over
1,2 mm and up to 1,7 mm
(LLGA)
Package name Thin Land Grid Array Package LGA with the seated height of over
1,0 mm and up to 1,2 mm
(TLGA)
Package name Very Thin Land Grid Array Package LGA with the seated height of over
0,8 mm and up to 1,0 mm
(VLGA)
Package name Very-very Thin Land Grid Array Package LGA with the seated height of over
0,65 mm and up to 0,8 mm
(WLGA)
Package name Ultra-thin Land Grid Array Package LGA with the seated height of over
0,5 mm and up to 0,65 mm
(ULGA)
Package name Extra Thin Land Grid Array Package LGA with the seated height of up to
0,5 mm
(XLGA)
Package name Heat Sink Land Grid Array Package LGA with a heat sink
(HLGA)
Package name Heat Sink Low Profile Land Grid Array Package LLGA with a heat sink
(HLLGA)
Package name Heat Sink Thin Land Grid Array Package TLGA with a heat sink
(HTLGA)
Package name Heat Sink Very Thin Land Grid Array Package VLGA with a heat sink
(HVLGA)
Package name Heat Sink Very-very Thin Land Grid Array WLGA with a heat sink
Package
(HWLGA)
Package name Heat Sink Ultra-thin Land Grid Array Package ULGA with a heat sink
(HULGA)
Package name Heat Sink Extra Thin Land Grid Array Package XLGA with a heat sink
(HXLGA)
– 6 – IEC 60191-4:2013/AMD1:2018
© IEC 2018
Classifi
...