IEC 60191-4:2013/AMD1:2018

IEC 60191-4 ®
Edition 3.0 2018-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
A MENDMENT 1
AM ENDEMENT 1
Mechanical standardization of semiconductor devices –
Part 4: Coding system and classification into forms of package outlines for
semiconductor device packages
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 4: Système de codification et classification en formes des structures des
boîtiers pour dispositifs à semiconducteurs

IEC 60191-4:2013-10/AMD1:2018-03(en-fr)

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing 21 000 terms and definitions in
Technical Specifications, Technical Reports and other English and French, with equivalent terms in 16 additional
documents. Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical
iPad. Vocabulary (IEV) online.

IEC publications search - webstore.iec.ch/advsearchform IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a 67 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and

CISPR.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.

Catalogue IEC - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
Application autonome pour consulter tous les renseignements
Le premier dictionnaire en ligne de termes électroniques et
bibliographiques sur les Normes internationales,
électriques. Il contient 21 000 termes et définitions en anglais
Spécifications techniques, Rapports techniques et autres
et en français, ainsi que les termes équivalents dans 16
documents de l'IEC. Disponible pour PC, Mac OS, tablettes
langues additionnelles. Egalement appelé Vocabulaire
Android et iPad.
Electrotechnique International (IEV) en ligne.

Recherche de publications IEC -
Glossaire IEC - std.iec.ch/glossary
webstore.iec.ch/advsearchform
67 000 entrées terminologiques électrotechniques, en anglais
La recherche avancée permet de trouver des publications IEC et en français, extraites des articles Termes et Définitions des
en utilisant différents critères (numéro de référence, texte, publications IEC parues depuis 2002. Plus certaines entrées
comité d’études,…). Elle donne aussi des informations sur les antérieures extraites des publications des CE 37, 77, 86 et
projets et les publications remplacées ou retirées. CISPR de l'IEC.

IEC Just Published - webstore.iec.ch/justpublished Service Clients - webstore.iec.ch/csc
Restez informé sur les nouvelles publications IEC. Just Si vous désirez nous donner des commentaires sur cette
Published détaille les nouvelles publications parues. publication ou si vous avez des questions contactez-nous:
Disponible en ligne et aussi une fois par mois par email. sales@iec.ch.

IEC 60191-4 ®
Edition 3.0 2018-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
A MENDMENT 1
AM ENDEMENT 1
Mechanical standardization of semiconductor devices –

Part 4: Coding system and classification into forms of package outlines for

semiconductor device packages
Normalisation mécanique des dispositifs à semiconducteurs –

Partie 4: Système de codification et classification en formes des structures des

boîtiers pour dispositifs à semiconducteurs

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-5495-0

– 2 – IEC 60191-4:2013/AMD1:2018
© IEC 2018
FOREWORD
This amendment has been prepared by subcommittee 47D: Semiconductor devices packaging,
of IEC technical committee 47: Semiconductor devices.
The text of this amendment is based on the following documents:
CDV Report on voting
47D/897/CDV 47D/904/RVC
Full information on the voting for the approval of this amendment can be found in the report
on voting indicated in the above table.
The committee has decided that the contents of this amendment and the base publication will
remain unchanged until the stability date indicated on the IEC website under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
_____________
Add, after Annexes A and B, the following new Annex C:
Annex C
(informative)
Terminology of semiconductor package outlines
To prevent misuse, misunderstanding and confusion of terminology of semiconductor package
outline, correct terms and descriptions are required to be indicated in the international
standards.
Correct terms and descriptions of semiconductor package outline including package code
variations are listed in Table C.1.

© IEC 2018
Table C.1 – Package name and parts name
Classification Term Description
Package name Ball Grid Array Package A package with the balls or bumps
placed in a row of 3 x 3 or more, or in
(BGA)
grid, on the upper or lower side of its
body
Package name Low Profile Ball Grid Array Package BGA with the seated height of over
1,2 mm and up to 1,7 mm
(LBGA)
Package name Thin Ball Grid Array Package BGA with the seated height of over
1,0 mm and up to 1,2 mm
(TBGA)
Package name Very Thin Ball Grid Array Package BGA with the seated height of over
0,8 mm and up to 1,0 mm
(VBGA)
Package name Very-very Thin Ball Grid Array Package BGA with the seated height of over
0,65 mm and up to 0,8 mm
(WBGA)
Package name Ultra-thin Ball Grid Array Package BGA with the seated height of over
0,5 mm and up to 0,65 mm
(UBGA)
Package name Extra Thin Ball Grid Array Package BGA with the seated height of up to
0,5 mm
(XBGA)
Package name Heat Sink Ball Grid Array Package BGA with a heat sink
(HBGA)
Package name Heat Sink Low Profile Ball Grid Array Package LBGA with a heat sink
(HLBGA)
Package name Heat Sink Thin Ball Grid Array Package TBGA with a heat sink
(HTBGA)
Package name Heat Sink Very Thin Ball Grid Array Package VBGA with a heat sink
(HVBGA)
Package name Heat Sink Very-very Thin Ball Grid Array WBGA with a heat sink
Package
(HWBGA)
Package name Heat Sink Ultra-thin Ball Grid Array Package UBGA with a heat sink
(HUBGA)
Package name Heat Sink Extra Thin Ball Grid Array Package XBGA with a heat sink
(HXBGA)
Package name Fine Pitch Ball Grid Array Package BGA with the terminal pitch of up to
0,8 mm
(FBGA)
Package name Low Profile Fine Pitch Ball Grid Array Package FBGA with the seated height of over
1,2 mm and up to 1,7 mm
(LFBGA)
Package name Thin Fine Pitch Ball Grid Array Package FBGA with the seated height of over
1,0 mm and up to 1,2 mm
(TFBGA)
Package name Very Thin Fine Pitch Ball Grid Array Package FBGA with the seated height of over
0,8 mm and up to 1,0 mm
(VFBGA)
Package name Very-very Thin Fine Pitch Ball Grid Array FBGA with the seated height of over
Package 0,65 mm and up to 0,8 mm
(WFBGA)
– 4 – IEC 60191-4:2013/AMD1:2018
© IEC 2018
Classification Term Description
Package name Ultra-thin Fine Pitch Ball Grid Array Package FBGA with the seated height of over
0,5 mm and up to 0,65 mm
(UFBGA)
Package name Extra Thin Fine Pitch Ball Grid Array Package FBGA with the seated height of up to
0,5 mm
(XFBGA)
Package name Terminal for stack Fine Pitch Ball Grid Array FBGA with the terminals for layer stack
Package
(PFBGA)
Package name Terminal for stack Low Profile Fine Pitch Ball LFBGA with the terminals for layer stack
Grid Array Package
(PLFBGA)
Package name Terminal for stack Thin Fine Pitch Ball Grid TFBGA with the terminals for layer stack
Array Package
(PTFBGA)
Package name Terminal for stack Very Thin Fine Pitch Ball Grid VFBGA with the terminals for layer stack
Array Package
(PVFBGA)
Package name Terminal for stack Very-very Thin Fine Pitch WFBGA with the terminals for layer stack
Ball Grid Array Package
(PWFBGA)
Package name Terminal for stack Ultra-thin Fine Pitch Ball Grid UFBGA with the terminals for layer stack
Array Package
(PUFBGA)
Package name Terminal for stack Extra Thin Fine Pitch Ball XFBGA with the terminals for layer stack
Grid Array Package
(PXFBGA)
Package name Interstitial Ball Grid Array Package Interstitial BGA
(IBGA)
Package name Plastic Ball Grid Array Package Plastic BGA
(P-BGA)
Package name Ceramic Ball Grid Array Package Ceramic BGA
(C-BGA)
Package name Silicon Fine Pitch Ball Grid Array Package Silicon FBGA
(S-FBGA)
Package name Dual Inline Package A package with the leads extended from
the two sides of its body and used for
(DIP)
through-hole mounting
Package name Shrink Dual Inline Package Shrink DIP
(SDIP)
Package name Heat Sink Dual Inline Package DIP with a heat sink
(HDIP)
Package name Heat Sink Shrink Dual Inline Package SDIP with a heat sink
(HSDIP)
Package name Piggyback Dual Inline Package Piggyback DIP
(PDIP)
Package name Plastic Dual Inline Package Plastic DIP
(P-DIP)
© IEC 2018
Classification Term Description
Package name Ceramic Dual Inline Package Ceramic DIP
(C-DIP)
Package name Glass-Sealed Ceramic Dual Inline Package Glass-sealed ceramic DIP
(G-DIP)
Package name Glass-Sealed Ceramic Window Dual Inline Glass-sealed ceramic DIP with a window
Package
(G-DDIP)
Package name Dual Tape Carrier Package A package with the leads extended from
the two sides of its body and consisting
(DTP)
of the tapes
Package name Dual Tape Carrier Package Type 1 DTP Type-1
(DTP(1))
Package name Dual Tape Carrier Package Type 2 DTP Type-2
(DTP(2))
Package name Land Grid Array Package A package without pins and with the
lands placed in a row of 3 x 3 or more, or
(LGA)
in grid, on the upper or lower side of its
body
Package name Low Profile Land Grid Array Package LGA with the seated height of over
1,2 mm and up to 1,7 mm
(LLGA)
Package name Thin Land Grid Array Package LGA with the seated height of over
1,0 mm and up to 1,2 mm
(TLGA)
Package name Very Thin Land Grid Array Package LGA with the seated height of over
0,8 mm and up to 1,0 mm
(VLGA)
Package name Very-very Thin Land Grid Array Package LGA with the seated height of over
0,65 mm and up to 0,8 mm
(WLGA)
Package name Ultra-thin Land Grid Array Package LGA with the seated height of over
0,5 mm and up to 0,65 mm
(ULGA)
Package name Extra Thin Land Grid Array Package LGA with the seated height of up to
0,5 mm
(XLGA)
Package name Heat Sink Land Grid Array Package LGA with a heat sink
(HLGA)
Package name Heat Sink Low Profile Land Grid Array Package LLGA with a heat sink
(HLLGA)
Package name Heat Sink Thin Land Grid Array Package TLGA with a heat sink
(HTLGA)
Package name Heat Sink Very Thin Land Grid Array Package VLGA with a heat sink
(HVLGA)
Package name Heat Sink Very-very Thin Land Grid Array WLGA with a heat sink
Package
(HWLGA)
Package name Heat Sink Ultra-thin Land Grid Array Package ULGA with a heat sink
(HULGA)
Package name Heat Sink Extra Thin Land Grid Array Package XLGA with a heat sink
(HXLGA)
– 6 – IEC 60191-4:2013/AMD1:2018
© IEC 2018
Classification Term Description
Package name Fine Pitch Land Grid Array Package LGA with the terminal pitch of up to
0,8 mm
(FLGA)
Package name Low Profile Fine Pitch Land Grid Array Package FLGA with the seated height of over
1,2 mm and up to 1,7 mm
(LFLGA)
Package name Thin Fine Pitch Land Grid Array Package FLGA with the seated height of over
1,0 mm and up to 1,2 mm
(TFLGA)
Package name Very Thin Fine Pitch Land Grid Array Package FLGA with the seated height of over
0,8 mm and up to 1,0 mm
(VFLGA)
Package name Very-very Thin Fine Pitch Land Grid Array FLGA with the seated height of over
Package 0,65 mm and up to 0,8 mm
(WFLGA)
Package name Ultra-thin Fine Pitch Land Grid Array Package FLGA with the seated height of over
0,5 mm and up to 0,65 mm
(UFLGA)
Package name Extra Thin Fine Pitch Land Grid Array Package FLGA with the seated height of up to
0,5 mm
(XFLGA)
Package name Interstitial Land Grid Array Package Interstitial LGA
(ILGA)
Package name Plastic Land Grid Array Package Plastic LGA
(P-LGA)
Package name Ceramic Land Grid Array Package Ceramic LGA
(C-LGA)
Package name Silicon Fine Pitch Land Grid Array Package Silicon FLGA
(S-FLGA)
Package name Pin Grid Array Package A package with the pins placed in a row
of 3 x 3 or more, or in grid, on the upper
(PGA)
or lower side of its body
Package name Shrink Pin Grid Array Package Shrink PGA
(SPGA)
Package name Interstitial Pin Grid Array Package Interstitial PGA
(IPGA)
Package name Heat Sink Pin Grid Array Package PGA with a heat sink
(HPGA)
Package name Ceramic Pin Grid Array Package Ceramic PGA
(C-PGA)
Package name Glass-Sealed Ceramic Pin Grid Array Package Glass-sealed ceramic PGA
(G-PGA)
Package name Plastic Pin Grid Array Package Plastic PGA
(P-PGA)
Package name Quad Flat F-Leaded Package A package with non-formed leads
extended from the four sides of its body
(QFF)
Package name Plastic Quad Flat F-Leaded Package Plastic QFF
(P-QFF)
© IEC 2018
Classification Term Description
Package name Glass-Sealed Ceramic Quad Flat F-Leaded Glass-sealed ceramic QFF
Package
(G-QFF)
Package name Quad Flat I-Leaded Package A package with leads formed like the
letter “I” and extended from the four
(QFI)
sides of its body
Package name Plastic Quad Flat I-Leaded Package Plastic QFI
(P-QFI)
Package name Quad Flat J-Leaded Package A package with leads formed like the
letter “J” and extended from the four
(QFJ)
sides of its body
Package name Plastic Quad Flat J-Leaded Package Plastic QFJ
(P-QFJ)
Package name Ceramic Quad Flat J-Leaded Package Ceramic QFJ
(C-QFJ)
Package name Glass-Sealed Ceramic Quad Flat J-Leaded Glass-sealed ceramic QFJ
Package
(G-QFJ)
Package name Glass-Sealed Ceramic Window Quad Flat J- Glass-sealed ceramic QFJ with a window
Leaded Package
(G-DQFJ)
Package name Quad Flat No Lead Package A package with only one row of terminals
on each side of the four sides and on the
(QFN)
bottom
Package name Low Profile Quad Flat No Lead Package QFN with the seated height of over
1,2 mm and up to 1,7 mm
(LQFN)
Package name Thin Quad Flat No Lead Package QFN with the seated height of over
1,0 mm and up to 1,2 mm
(TQFN)
Package name Very Thin Quad Flat No Lead Package QFN with the seated height of over
0,8 mm and up to 1,0 mm
(VQFN)
Package name Very-very Thin Quad Flat No Lead Package QFN with the seated height of over
0,65 mm and up to 0,8 mm
(WQFN)
Package name Ultra-thin Quad Flat No Lead Package QFN with the seated height of over
0,5 mm and up to 0,65 mm
(UQFN)
Package name Extra Thin Quad Flat No Lead Package QFN with the seated height up to 0,5 mm
(XQFN)
Package name Heat Sink Quad Flat No Lead Package QFN with a heat sink
(HQFN)
Package name Heat Sink Low Profile Quad Flat No Lead LQFN with a heat sink
Package
(HLQFN)
Package name Heat Sink Thin Quad Flat No Lead Package TQFN with a heat sink
(HTQFN)
Package name Heat Sink Very Thin Quad Flat No Lead VQFN with a heat sink
Package
(HVQFN)
– 8 – IEC 60191-4:2013/AMD1:2018
© IEC 2018
Classification Term Description
Package name Heat Sink Very-very Thin Quad Flat No Lead WQFN with a heat sink
Package
(HWQFN)
Package name Heat Sink Ultra-thin Quad Flat No Lead UQFN with a heat sink
Package
(HUQFN)
Package name Heat Sink Extra Thin Quad Flat No Lead XQFN with a heat sink
Package
(HXQFN)
Package name Interstitial Quad Flat No Lead Package QFN with the terminals arranged in a
zigzag alignment (the zigzag alignment is
(IQFN)
considered as one row)
Package name Plastic Quad Flat No Lead Package Plastic QFN
(P-QFN)
Package name Ceramic Quad Flat No Lead Package Ceramic QFN
(C-QFN)
Package name Silicon Quad Flat No Lead Package Silicon QFN
(S-QFN)
Package name Quad Flat Package A package with leads formed in gull-wing
shape and extended from the four sides
(QFP)
of its body
Package name Low Profile Quad Flat Package QFP with the seated height of over
1,2 mm and up to 1,7 mm
(LQFP)
Package name Thin Quad Flat Package QFP with the seated height of over
1,0 mm and up to 1,2 mm
(TQFP)
Package name Very Thin Quad Flat Package QFP with the seated height of over
0,8 mm and up to 1,0 mm
(VQFP)
Package name Very-very Thin Quad Flat Package QFP with the seated height of over
0,65 mm and up to 0,8 mm
(WQFP)
Package name Heat Sink Quad Flat Package QFP with a heat sink
(HQFP)
Package name Heat Sink Low Profile Quad Flat Package LQFP with a heat sink
( HLQFP)
Package name Heat Sink Thin Quad Flat Package TQFP with a heat sink
(HTQFP)
Package name Fine-pitch Quad Flat Package QFP with the terminal pitch of up to
0,5 mm
(FQFP)
Package name Plastic Quad Flat Package Plastic QFP
(P-QFP)
Package name Ceramic Quad Flat Package Ceramic QFP
(C-QFP)
Package name Glass-Sealed Ceramic Quad Flat Package Glass-sealed ceramic QFP
(G-QFP)
Package name Quad Tape Carrier Package A package with the leads extended from
the four sides of its body and consisting
(QTP)
of the tapes
© IEC 2018
Classification Term Description
Package name Single Inline Package A package with the a row of leads
extended from one side of its body
(SIP)
Package name Heat Sink Single Inline Package SIP with a heat sink
(HSIP)
Package name Plastic Single Inline Package Plastic SIP
(P-SIP)
Package name Small Outline F-Leaded Package A package with non-formed leads
extended from the two sides of its body
(SOF)
Package name Small Outline I-Leaded Package A package with leads formed like the
letter “I” and extended from the two sides
(SOI)
of its body
Package name Small Outline J-Leaded Package A package with leads formed like the
letter “J” and extended from the two
(SOJ)
sides of its body
Package name Plastic Small Outline J-Leaded Package Plastic SOJ
(P-SOJ)
Package name Ceramic Small Outline J-Leaded Package Ceramic SOJ
(C-SOJ)
Package name Glass-Sealed Ceramic Small Outline J-Leaded Glass-sealed ceramic SOJ
Package
(G-SOJ)
Package name Glass-Sealed Ceramic Window Small Outline J- Glass-sealed ceramic SOJ with a window
Leaded Package
(G-DSOJ)
Package name Small Outline No Lead Package A package with only one row of terminals
on each side of the two sides and on the
(SON)
bottom
Package name Low Profile Small Outline No Lead Package SON with the seated height of over
1,2 mm and up to 1,7 mm
(LSON)
Package name Thin Small Outline No Lead Package SON with the seated height of over
1,0 mm and up to 1,2 mm
(TSON)
Package name Very Thin Small Outline No Lead Package SON with the seated height of over
0,8 mm and up to 1,0 mm
(VSON)
Package name Very-very Thin Small Outline No Lead Package SON with the seated height of over
0,65 mm and up to 0,8 mm
(WSON)
Package name Ultra-thin Small Outline No Lead Package SON with the seated height of over
0,5 mm and up to 0,65 mm
(USON)
Package name Extra Thin Small Outline No Lead Package SON with the seated height of up to
0,5 mm
(XSON)
Package name Heat Sink Small Outline No Lead Package SON with a heat sink
(HSON)
Package name Heat Sink Low Profile Small Outline No Lead LSON with a heat sink
Package
(HLSON)
– 10 – IEC 60191-4:2013/AMD1:2018
© IEC 2018
Classification Term Description
Package name Heat Sink Thin Small Outline No Lead Package TSON with a heat sink
(HTSON)
Package name Heat Sink Very Thin Small Outline No Lead VSON with a heat sink
Package
(HVSON)
Package name Heat Sink Very-very Thin Small Outline No Lead WSON with a heat sink
Package
(HWSON)
Package name Heat Sink Ultra-thin Small Outline No Lead USON with a heat sink
Package
(HUSON)
Package name Heat Sink Extra Thin Small Outline No Lead XSON with a heat sink
Package
(HXSON)
Package name Plastic Small Outline No Lead Package Plastic SON
(P-SON)
Package name Ceramic Small Outline No Lead Package Ceramic SON
(C-SON)
Package name Small Outline Package A package with leads formed in gull-wing
shape and extended from the two sides
(SOP)
of its body
Package name Low Profile Small Outline Package SOP with the seated height of over
1,2 mm and up to 1,7 mm
(LSOP)
Package name Thin Small Outline Package Type 1 Type-1 SOP with the seated height of
over 1,0 mm and up to 1,2 mm
(TSOP(1))
Package name Thin Small Outline Package Type 2 Type-2 SOP with the seated height of
over 1,0 mm and up to 1,2 mm
(TSOP(2))
Package name Shrink Small Outline Package Shrink SOP
(SSOP)
Package name Low Profile Shrink Small Outline Package SSOP with the seated height of over
1,2 mm and up to 1,7 mm
(LSSOP)
Package name Thin Shrink Small Outline Package SSOP with the seated height of over
1,0 mm and up to 1,2 mm
(TSSOP)
Package name Heat Sink Small Outline Package SOP with a heat sink
HSOP
Package name Heat Sink Low Profile Small Outline Package LSOP with a heat sink
(HLSOP)
Package name Heat Sink Thin Shrink Small Outline Package TSSOP with a heat sink
(HTSSOP)
Package name Plastic Small Outline Package Plastic SOP
(P-SOP)
Package name Ceramic Small Outline Package Ceramic SOP
(C-SOP)
Package name Glass-Sealed Ceramic Small Outline Package Glass-sealed ceramic SOP
(G-SOP)
© IEC 2018
Classification Term Description
Package name Surface Vertical Package A package with the leads extended from
one side of its body and formed like the
(SVP)
letter “L”
Package name Plastic Surface Vertical Package Plastic SVP
(P-SVP)
Package name Zigzag Inline Package A package with the leads extended from
one side of its body and folded in zigzag
(ZIP)
positions inside of its body
Package name Heat Sink Zigzag Inline Package ZIP with a heat sink
(HZIP)
Package name Shrink Zigzag Inline Package Shrink ZIP
(SZIP)
Package name Plastic Zigzag Inline Package Plastic ZIP
(P-ZIP)
Undefined package Ceramic Leaded Chip Carrier
[Unrecommended term] A name for the
name outline of a ceramic package with the
(CLCC)
terminals buried in its body. This name
was used in the 1980’s in the U.S. The
Leadless Chip Carrier
official JEITA name is C-QFN.
(LCC)
Undefined package Plastic Leaded Chip Carrier [Unrecommended term] A name for a
name plastic package with the leads formed
(PLCC)
like the letter “J”. This name was used in
the 1980’s in the U.S. The official JEITA
name is P-QFJ.
Undefined package Ceramic Dual Inline Package [Unrecommended term] A colloquial term
name for a glass-sealed ceramic package with
(CERDIP)
the DIP outline. The official JEITA name
is G-DIP.
Undefined package Tape Carrier Package A name for a package which is made of
name flexible film and manufactured by TAB
(TCP)
connection. A collective term for the
packages named as DTP and QTP by
JEITA, for the liquid crystal display driver
IC packages and other appropriate
packages.
Undefined package Hybrid IC A ceramic or glass epoxy IC on which
name multiple semiconductor devices,
packages, and passive devices are
loaded, and which makes up a small
system circuit. As the terminals for
external connection can be mounted by
soldering like a package, this is called
IC. (Related term: module)
Undefined package Chip Size Package [Unrecommended term] A package with
name almost the same outline dimensions with
(CSP)
a semiconductor chip. As this term
describes the characteristics of the
package and does not refer to the shape,
the use of this term is not recommended.
This term is used for the name of
packages represented by FBGA.
Undefined package Multi Chip Module An electronic circuit module on which
name more than one IC is mounted.
(MCM)
Variations such as –C, －Si, and –
L ,according to the board material, were
proposed.
Undefined package Multi Chip Package A package on which multiple IC chips of
name the same type or of different types are
(MCP)
loaded.
– 12 – IEC 60191-4:2013/AMD1:2018
© IEC 2018
Classification Term Description
Undefined package Module Although this term is commonly used in
name English, it is usually interpreted as a
product consisting of a group made up by
semiconductor device, passive device,
connector, inductor, filter, etc. as a part
of its system, in the field of
semiconductor package.
A module is part of the function to make
up the system.
Undefined package System in Package A product which embeds multiple chips to
name realize one function in the electronic
(SiP)
circuit system in one package. While the
MCP seals multiple chips into one
package, SiP has a unique package that
can provide certain system function. This
is a collective term covering PoP and
PiP.
Undefined package Package on Package A composite package made by
name connecting multiple packages at the
(PoP, POP)
terminals and integrating them. Unlike
PiP, PoP can be identified as a staked
package of multiple packages from its
external shape.
Undefined package Package in Package A package of which multiple packages
name are sealed inside. Unlike PoP, it is
(PiP, PIP)
usually impossible to identify this
package as PiP from its external shape.
Undefined package Flip Chip Ball Grid Array Package A colloquial name for the BGA where
name semiconductor chips are connected face
(FC-BGA)
down to its board via the connecting
bump. As the classification of the official
names does not allow the classification
according to the method for internal
connection, this term shall not be used
as the outline name.
Undefined package TAB-Ball Grid Array Package BGA with TAB
name
(T-BGA)
Undefined package Ceramic-Column Grid Array Package
name
(C-CGA)
Undefined package Wafer Level Chip Size Package [Unrecommended term] A package which
name has the same dimensions as the chip and
(WL-CSP)
which is manufactured by performing
rewiring, sealing, and mounting of
external terminals at the state of a wafer
and by cutting into pieces in the final
process. As the classification of the
official names does not allow the
classification according to the
manufacturing method, this term shall not
be used as the outline name.
Undefined package TO-XXX (XXX is numeric character) [Unrecommended term] Number
name registered in the Outline Dimensions
Table for Transistors set by the JEDEC
standards. Individual semiconductor is
numbered as SC-YYY in JEITA  (YYY is
numeric character). (Ex. TO-220 is SC-
46 in JEITA)
Undefined package DO-XXX (XXX is numeric character) [Unrecommended term] Number
name registered in the Outline Dimensions
Table for Diodes set by the JEDEC
standards. Individual semiconductor is
numbered as SC-YYY in JEITA (YYY is
numeric character). (Ex. DO-35 is SC-40
in JEITA)
© IEC 2018
Classification Term Description
Undefined package MO-XXX (XXX is numeric character) [Unrecommended term] Number
name registered in the Outline Dimensions
Table for Electronics Parts set by the
JEDEC standards.
Package parts Terminal A collective term for electrodes for
name external connection such as lead, pin,
land, bump and ball.
Package parts Package body A component of a package, excluding a
name terminal.
Package parts Visual index This index is established for setting the
name device location, position and direction.
The index uses reference shapes with
which the location of the first terminal
can be visually identified. (Mark,
chamfer, notch, tab, dent, etc.)
Package parts Mechanical index This index is established for setting the
name device location, position and direction to
identify them mechanically, optically,
electrically, and pneumatically. (Tab,
notch, flat, groove, key, etc.)
Package parts Gate burr Resin remaining at the resin supply inlet
name on the resin molded package, without
being completely removed. (This refers
to the condition.)
Package parts Terminal finish Plating or other method for a terminal to
name keep good junction with a seating surface
during the mounting of devices.
Package parts Cavity Dents that are made on the package
name body to load the chips.
Package parts Flange A part used for mounting to a board that
name is attached to the package body of a
through hole mount package mainly for
individual semiconductor. Or, a part
projecting from a package in terms of the
structure.
Package parts Stand A part used for mounting to a board that
name is attached to the package body of a
surface mount package mainly for
individual semiconductor.
Package parts Gull wing lead A lead form of IC package that has the
name shape of gull wing. It is also called “L-
lead”.
Package parts J lead A lead that is shaped like the letter “J”
name and molded inside of the IC package.
Package parts I lead A shape of the semiconductor package
name terminal whose leads are shaped like the
(Butt lead)
letter “I”. The synonym of “I-lead”.
Package parts Bump An electrode terminal of a raised shape.
name
Package parts Chip, die, pellet A part made by cutting a semiconductor
name board (wafer) that formed an electronic
circuit into pieces
Package parts Die pad An area to load chips. It is also called
name “Island”, “Tab”, and “Die stage”.
Package parts Bonding pad An electrode which is installed on a chip.
name
Package parts Heat sink A heat content member for temporarily
name accumulating the heat generated from
the chip.
Package parts Heat spreader (radiator plate) A heat transmitting member for diffusing
name the heat generated from the chip.

– 14 – IEC 60191-4:2013/AMD1:2018
© IEC 2018
Classification Term Description
Package parts Heat releasing fin A member for releasing the heat to the
name air.
Package parts Header A metal plate on the upper part of the
name individual semiconductor for releasing
the heat of for mounting.
Package parts Interstitial A row of terminals that cannot be put on
name a regular terminal pitch. Zigzag
alignment and stagger mean the same.
Package parts Index Place where a location pin is indicated.
name
Package parts Interposer A part that is located between the chip
name and the mounting board to realign and
electrically connect the terminals.
Package parts TAB Tape Automated Bonding
name
Package parts BTC Bottom Termination Components
name
Package parts C4 FC C4 (controlled collapse chip connection)
name Flip Chip
Term for package Package outline drawing A package outline drawing which
drawings specifies the dimensions necessary for
the mechanical interchangeability to
mount a device.
Term for package Seating plane A plane which contacts with a package
drawings body or the terminal, when mounting a
device.
Term for package Base plane A plane going through the lowest point of
drawings the package body which is parallel to the
seating plane.
Term for package Reference plane A plane which is displaced parallel to the
drawings seating plane by certain distance.
Term for package Index area An area where all indexes are located.
drawings
Term for package Terminal row A straight row of terminals.
drawings
Term for package Mold burr Resin remaining on the package body,
drawings after generated during the molding of the
resin molded package and caked
between the lead frame and the package
body.
Term for package Pattern of terminal position area A range for placing the terminals with
drawings consideration to the terminal location
tolerance, when mounting a surface
mount package.
Term for package Nominal dimensions The dimensions that are important in the
drawings packaging design and are the most
appropriate and typical ones to express
the variation of the package.
Term for package Standoff Clearance between the seating plane and
drawings the base plane.
Term for package Coplanarity (Uniformity of the lowest plane of The maximum value for the distance
drawings the terminals) between the lowest point of all terminals
and the seating plane.
Term for package Datum A theoretically exact geometrical
drawings reference established for controlling the
tolerance zone when specifying a
geometrical tolerance for a related
feature.
© IEC 2018
Classification Term Description
Term for package Maximum material requirement An allowable limit size where the actual
drawings size of a feature is at its maximum no
matter where it is placed on the feature.

___________
– 16 – IEC 60191-4:2013/AMD1:2018
© IEC 2018
AVANT-PROPOS
Le présent amendement a été établi par le sous-comité 47D: Boîtiers des dispositifs semi-
conducteurs, du Comité d’études 47 de l’IEC: Dispositifs à semiconducteurs.
Le texte de cet amendement est issu des documents suivants:
CDV Rapport de vote
47D/897/CDV 47D/904/RVC
Le rapport de vote indiqué dans le tableau ci-dessus donne toute information sur le vote ayant
abouti à l'approbation de cet amendement.
Le comité a décidé que le contenu de cet amendement et de la publication de base ne sera
pas modifié avant la date de stabilité indiquée sur le site web de l'IEC sous
"http://webstore.iec.ch" dans les données relatives à la publication recherchée. A cette date,
la publication sera
• reconduite,
• supprimée,
• remplacée par une édition révisée, ou
• amendée.
_____________
Ajouter, après les Annexes A et B, la nouvelle Annexe C suivante:
Annexe C
(informative)
Terminologie des structures des boîtiers pour dispositifs à semiconducteurs
Il est exigé que les termes et descriptions corrects soient indiqués dans les Normes
internationales, afin d’éviter une quelconque utilisation inappropriée, incompréhension ou
confusion dans la terminologie des structures des boîtiers pour dispositifs à semiconducteurs.
Les termes et descriptions corrects applicables aux structures des boîtiers pour dispositifs à
semiconducteurs, comprenant les codes de variante de boîtier, sont énumérés dans le
Tableau C.1.
© IEC 2018
Tableau C.1 – Noms de boîtier et noms de partie de boîtier
Classification Terme Description
Nom de boîtier Ball Grid Array Package Boîtier matriciel à billes, dont les billes ou
les bosses sont disposées en au moins
(BGA)
3 rangées x 3 colonnes, ou en grille, sur
la partie supérieure ou inférieure de son
corps
Nom de boîtier Low Profile Ball Grid Array Package BGA avec une hauteur d’appui supérieure
à 1,2 mm et pouvant atteindre 1,7 mm
(LBGA)
Nom de boîtier Thin Ball Grid Array Package BGA avec une hauteur d’appui supérieure
à 1,0 mm et pouvant atteindre 1,2 mm
(TBGA)
Nom de boîtier Very Thin Ball Grid Array Package BGA avec une hauteur d’appui supérieure
à 0,8 mm et pouvant atteindre 1,0 mm
(VBGA)
Nom de boîtier Very-very Thin Ball Grid Array Package BGA avec une hauteur d’appui supérieure
à 0,65 mm et pouvant atteindre 0,8 mm
(WBGA)
Nom de boîtier Ultra-thin Ball Grid Array Package BGA avec une hauteur d’appui supérieure
à 0,5 mm et pouvant atteindre 0,65 mm
(UBGA)
Nom de boîtier Extra Thin Ball Grid Array Package BGA avec une hauteur d’appui pouvant
atteindre 0,5 mm
(XBGA)
Nom de boîtier Heat Sink Ball Grid Array Package BGA doté d’un dissipateur thermique
(HBGA)
Nom de boîtier Heat Sink Low Profile Ball Grid Array Package LBGA doté d’un dissipateur thermique
(HLBGA)
Nom de boîtier Heat Sink Thin Ball Grid Array Package TBGA doté d’un dissipateur thermique
(HTBGA)
Nom de boîtier Heat Sink Very Thin Ball Grid Array Package VBGA doté d’un dissipateur thermique
(HVBGA)
Nom de boîtier Heat Sink Very-very Thin Ball Grid Array WBGA doté d’un dissipateur thermique
Package
(HWBGA)
Nom de boîtier Heat Sink Ultra-thin Ball Grid Array Package UBGA doté d’un dissipateur thermique
(HUBGA)
Nom de boîtier Heat Sink Extra Thin Ball Grid Array Package XBGA doté d’un dissipateur thermique
(HXBGA)
Nom de boîtier Fine Pitch Ball Grid Array Package BGA avec un pas des broches pouvant
atteindre 0,8 mm
(FBGA)
Nom de boîtier Low Profile Fine Pitch Ball Grid Array Package FBGA avec une hauteur d’appui
supérieure à 1,2 mm et pouvant atteindre
(LFBGA)
1,7 mm
Nom de boîtier Thin Fine Pitch Ball Grid Array Package FBGA avec une hauteur d’appui
supérieure à 1,0 mm et pouvant atteindre
(TFBGA)
1,2 mm
Nom de boîtier Very Thin Fine Pitch Ball Grid Array Package FBGA avec une hauteur d’appui
supérieure à 0,8 mm et pouvant atteindre
(VFBGA)
1,0 mm
Nom de boîtier Very-very Thin Fine Pitch Ball Grid Array FBGA avec une hauteur d’appui
Package supérieure à 0,65 mm et pouvant atteindre
0,8 mm
(WFBGA)
– 18 – IEC 60191-4:2013/AMD1:2018
© IEC 2018
Classification Terme Description
Nom de boîtier Ultra-thin Fine Pitch Ball Grid Array Package FBGA avec une hauteur d’appui
supérieure à 0,5 mm et pouvant atteindre
(UFBGA)
0,65 mm
Nom de boîtier Extra Thin Fine Pitch Ball Grid Array Package FBGA avec une hauteur d’appui pouvant
atteindre 0,5 mm
(XFBGA)
Nom de boîtier Terminal for stack Fine Pitch Ball Grid Array FBGA avec les broches pour l’empilage
Package de couches
(PFBGA)
Nom de boîtier Terminal for stack Low Profile Fine Pitch Ball LFBGA avec les broches pour l’empilage
Grid Array Package de couches
(PLFBGA)
Nom de boîtier Terminal for stack Thin Fine Pitch Ball Grid TFBGA avec les broches pour l’empilage
Array Package de couches
(PTFBGA)
Nom de boîtier Terminal for stack Very Thin Fine Pitch Ball VFBGA avec les broches pour l’empilage
Grid Array Package de couches
(PVFBGA)
Nom de boîtier Terminal for stack Very-very Thin Fine Pitch WFBGA avec les broches pour l’empilage
Ball Grid Array Package de couches
(PWFBGA)
Nom de boîtier Terminal for stack Ultra-thin Fine Pitch Ball UFBGA avec les broches pour l’empilage
Grid Array Package de couches
(PUFBGA)
Nom de boîtier Terminal for stack Extra Thin Fine Pitch Ball XFBGA avec les broches pour l’empilage
Grid Array Package de couches
(PXFBGA)
Nom de boîtier Interstitial Ball Grid Array Package BGA à pas interstitiel
(IBGA)
Nom de boîtier Plastic Ball Grid Array Package BGA en plastique
(P-BGA)
Nom de boîtier Ceramic Ball Grid Array Package BGA en céramique
(C-BGA)
Nom de boîtier Silicon Fine Pitch Ball Grid Array Package FBGA en silicium
(S-FBGA)
Nom de boîtier Dual Inline Package Boîtier doté de connexions sur les deux
côtés de son corps, utilisé pour les
(DIP)
montages traversants
Nom de boîtier Shrink Dual Inline Package DIP de format compact
(SDIP)
Nom de boîtier Heat Sink Dual Inline Package DIP doté d’un dissipateur thermique
(HDIP)
Nom de boîtier Heat Sink Shrink Dual Inline Package SDIP doté d’un dissipateur thermique
(HSDIP)
Nom de boîtier Piggyback Dual Inline Package DIP avec Piggyback
(PDIP)
Nom de boîtier Plastic Dual Inline Package DIP en plastique
(P-DIP)
© IEC 2018
Classification Terme Description
Nom de boîtier Ceramic Dual Inline Package DIP en céramique
(C-DIP)
Nom de boîtier Glass-Sealed Ceramic Dual Inline Package DIP en céramique, scellement verre
(G-DIP)
Nom de boîtier Glass-Sealed Ceramic Window Dual Inline DIP en céramique à scellement verre doté
Package d’une fenêtre
(G-DDIP)
Nom de boîtier Dual Tape Carrier Package Boîtier doté de connexions sur deux côtés
de son corps, formant les bandes
(DTP)
Nom de boîtier Dual Tape Carrier Package Type 1 DTP de type 1
(DTP(1))
Nom de boîtier Dual Tape Carrier Package Type 2 DTP de type 2
(DTP(2))
Nom de boîtier Land Grid Array Package Boîtier matriciel à pastilles, sans broches,
dont les pastilles sont disposées en au
(LGA)
moins 3 rangées x 3 colonnes, ou en
grille, sur la partie supérieure ou
inférieure de son corps
Nom de boîtier Low Profile Land Grid Array Package LGA avec une hauteur d’appui supérieure
à 1,2 mm et pouvant atteindre 1,7 mm
(LLGA)
Nom de boîtier Thin Land Grid Array Package LGA avec une hauteur d’appui supérieure
à 1,0 mm et pouvant atteindre 1,2 mm
(TLGA)
Nom de boîtier Very Thin Land Grid Array Package LGA avec une hauteur d’appui supérieure
à 0,8 mm et pouvant atteindre 1,0 mm
(VLGA)
Nom de boîtier Very-very Thin Land Grid Array Package LGA avec une hauteur d’appui supérieure
à 0,65 mm et pouvant atteindre 0,8 mm
(WLGA)
Nom de boîtier Ultra-thin Land Grid Array Package LGA avec une hauteur d’appui supérieure
à 0,5 mm et pouvant a
...