IEC 60191-4:2013

IEC 60191-4 ®
Edition 3.0 2013-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colourcolour
insinsiidede
Mechanical standardization of semiconductor devices –
Part 4: Coding system and classification into forms of package outlines for
semiconductor device packages
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 4: Système de codification et classification en formes des structures des
boîtiers pour dispositifs à semiconducteurs
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IEC 60191-4 ®
Edition 3.0 2013-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Mechanical standardization of semiconductor devices –

Part 4: Coding system and classification into forms of package outlines for

semiconductor device packages
Normalisation mécanique des dispositifs à semiconducteurs –

Partie 4: Système de codification et classification en formes des structures des

boîtiers pour dispositifs à semiconducteurs

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX T
ICS 31.080 ISBN 978-2-8322-1155-7

– 2 – 60191-4  IEC:2013
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Coding system of package outlines for semiconductor devices . 5
3 Classification into forms of package outlines for semiconductor devices . 5
4 Coding system for semiconductor-device packages . 6
4.1 General . 6
4.2 New descriptive codes . 6
4.3 Descriptive designators . 6
4.3.1 General remarks . 6
4.3.2 Minimum descriptive designator . 6
4.3.3 Terminal-position prefix. 8
4.3.4 Package-body-material prefix . 8
4.3.5 Package-specific feature prefix . 9
4.3.6 Lead-form and terminal-count suffixes . 9
4.3.7 Detailed information field . 11
5 Coding system of package-outline styles . 12
Annex A (informative) Examples of descriptive coding system application . 15
Annex B (informative) Derivation and application of the descriptive coding system –
Common package names . 22

Figure 1 – Descriptive coding for semiconductor device packages . 7
Figure 2 – Relationship of codes to profile . 10
Figure A.1 – Typical package styles and descriptive coding system (1 of 4) . 17
Figure A.2 – Examples of lead forms (or terminal shapes) . 21
Figure B.1 – Descriptive coding system for common name of semiconductor-device
package . 22

Table 1 – Package-outline-style codes. 8
Table 2 – Terminal-position prefixes . 9
Table 3 – Prefixes for predominant package-body material . 10
Table 4 – Prefixes for package-specific features . 10
Table 5 – Suffixes for lead form (or terminal shape) . 12
Table A.1 – Descriptive coding system application . 16
Table B.1 – Basic package code and names . 23
Table B.2 – Common package name and descriptive code examples . 24

60191-4  IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 4: Coding system and classification into forms of package
outlines for semiconductor device packages

FOREWORD
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International Standard IEC 60191-4 has been prepared by subcommittee 47D: Semiconductor
devices packaging, of IEC technical committee 47: Semiconductor devices.
This third edition cancels and replaces the second edition published in 1999,
Amendment 1:2001 and Amendment 2:2002.This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.

– 4 – 60191-4  IEC:2013
The text of this standard is based on the following documents:
FDIS Report on voting
47D/837/FDIS 47D/848/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 60191 series, published under the general title Mechanical
standardization of semiconductor devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicat
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