Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

General Information

Status
Published
Publication Date
11-Apr-2018
Drafting Committee
WG 1 - TC 47/SC 47D/WG 1
Current Stage
PPUB - Publication issued
Start Date
16-Mar-2018
Completion Date
12-Apr-2018

Overview

IEC 60191-2:1966/AMD20:2018 is Amendment 20 (2018) to IEC 60191‑2 - the long‑standing IEC publication for mechanical standardization of semiconductor devices (Part 2: Dimensions). This amendment updates the device outline drawings and insertion instructions for the base publication, reflecting changes approved by IEC TC 47 / SC 47D (Semiconductor Packaging). The extract shows administrative and editorial changes, new drawing sheets to be inserted, and two new power‑package outline entries.

Key topics

  • Mechanical standardization of device outlines and dimensions
    • Instructions for inserting amendment sheets into the existing IEC 60191‑2 publication.
    • Updates to the list of device outline drawings (Chapter I) and associated index pages.
  • New package additions
    • Two new device outline drawings are added: IEC code 188F and IEC code 189F - both described as Power package with 3.2 mm pitch for power transistors. The amendment records package metadata (material P, position Z, package MP, form P) and listed counts (188F: count 165; 189F: count 89).
  • Document control and provenance
    • Amendment prepared by Subcommittee 47D; references to FDIS and voting reports are included.
    • Instructions indicate replacement of specific title and preface pages and insertion of new sheets.

Applications and who uses it

This amendment and the underlying IEC 60191‑2 standard are used by professionals who require consistent mechanical definitions for semiconductor packages:

  • Package designers and semiconductor manufacturers - for defining and documenting package outlines to ensure interchangeability.
  • PCB and mechanical engineers - for accurate footprint design and board layout using standardized package pitches (e.g., 3.2 mm).
  • Test, assembly and tooling engineers - to align gauges, jigs and handlers with standard outlines.
  • Purchasing and regulatory teams - to reference internationally accepted package codes in specifications and procurement.
  • Standards and compliance specialists - to maintain up‑to‑date national or corporate libraries of IEC package drawings.

Related standards

  • The amendment is part of the IEC 60191 series (mechanical standardization of semiconductor devices). Users should consult other parts of IEC 60191 and related IEC/TC 47 publications for complete mechanical, electrical and testing requirements and for the latest consolidated edition.

Keywords: IEC 60191-2, Amendment 20, mechanical standardization, semiconductor device dimensions, device outline drawings, power package 3.2 mm pitch, IEC TC47, package dimensions.

Standard

IEC 60191-2:1966/AMD20:2018 - Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

English language
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Frequently Asked Questions

IEC 60191-2:1966/AMD20:2018 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions". This standard covers: Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-2:1966/AMD20:2018 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.

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Standards Content (Sample)


IEC 60191-2 ®
Edition 1.0 2018-04
INTERNATIONAL
STANDARD
AMENDMENT 20
The sheets contained in this amendment are to be inserted in IEC 60191-2
Mechanical standardization of semiconductor devices –
Part 2: Dimensions
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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IEC 60191-2 ®
Edition 1.0 2018-04
INTERNATIONAL
STANDARD
AMENDMENT 20
The sheets contained in this amendment are to be inserted in IEC 60191-2

Mechanical standardization of semiconductor devices –

Part 2: Dimensions
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-5566-7

INSTRUCTIONS FOR THE INSERTION
OF NEW PAGES IN IEC 60191-2
Replace the existing title page with the new title page.

Remove the existing page 60191 IEC I containing the preface and insert in its place the new page
60191 IEC I containing the preface to Amendment 20 (2018).

Chapter I:
Add the following new sheets:
60191 IEC I-188F-a/b
60191 IEC I-189F-a/b
IEC 60191-2 ®
Edition 1.0 1966
INTERNATIONAL
STANDARD
Mechanical standardization of semiconductor devices –
Part 2: Dimensions
Includes Supplements and Amendments / Inclut les Compléments et Amendements:
A (1967), B (1969), C (1970), D (1971), E (1974), F (1976), G (1978), H (1978),
J (1980), K (1981), L (1982), M (1983), N (1987), P (1988), Q (1990), R (1995),
S (1995), T(1995), U(1997), V(1998), W(1999), X(1999), Y(2000), Z(2000), 1 (2001),
2(2001), 3(2001), 4(2001), 5(2002), 6(2002), 7(2002), 8(2003), 9(2003), 10(2004),
11(2004), 12(2006), 13(2006), 14(2006), 15(2006), 16(2007), 17(2008), 18(2011),
19(2012), 20(2018)
IEC 60191-2:1966
INTERNATIONAL ELECTROTECHNICAL COMMISSION

PUBLICATION 191-2
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 2: Dimensions
CONTENTS
FOREWORD
PREFACE
PHILOSOPHY OF MECHANICAL STAN-
DARDIZATION .Chapter 00

RECOMMENDED VALUES FOR CERTAIN
DIMENSIONS OF DRAWINGS OF SEMI-
CONDUCTOR DEVICES . Chapter 0

DEVICE OUTLINE DRAWINGS . Chapter I

TYPES OF SEMICONDUCTOR DEVICES
GENERALLY MOUNTED IN THE
PACKAGES OF CHAPTER I
BASE DRAWINGS . Chapter II

CASE OUTLINE DRAWINGS .Chapter III

GAUGE DRAWINGS . Chapter IV

TABLES SHOWING ASSOCIATIONS BE-
TWEEN CASE OUTLINES AND BASES . Chapter V

OBSOLETE DRAWINGS
ADDITIONS TO THE LISTS OF
NATIONAL CODES APPEARING ON
THE STANDARD SHEETS OF
IEC PUBLICATION 191-2
DELETIONS TO THE LISTS OF
NATIONAL CODES APPEARING ON
THE STANDARD SHEETS OF
IEC PUBLICATION 191-2
IEC Publication 191-2
Date: 1987
INTERNATIONAL ELECTROTECHNICAL COMMISSION
_________
Amendment 20 (2018) to IEC 60191-2 (1966)
MECHANICAL STANDARDIZATION OF
SEMICONDUCTOR DEVICES –
Part 2: Dimensions
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition
to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly
Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in
this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also
participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in
accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all interested
IE
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