IEC 60191-1:2018
(Main)Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
IEC 60191-1:2018 gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.
This edition includes the following significant technical changes with respect to the previous edition:
a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8;
b) a definition of the term "stand-off" has been added;
c) the methods for locating the datum have been extended to be suitable for SMD-packages;
d) the visual identification of terminal position one for automatic handling has been clarified;
e) the rules for the drawing of terminals have been clarified;
f) Table A.1 has been completed with symbols specifically for SMD-packages;
g) Annex B "Standardization philosophy" has been deleted;
h) a normative Annex with special rules for SMD-packages has been added;
i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.
Normalisation mécanique des dispositifs à semiconducteurs - Partie 1: Règles générales pour la préparation des dessins d’encombrement des dispositifs discrets
L’IEC 60191-1:2018 donne des lignes directrices pour la préparation des dessins d’encombrement des dispositifs discrets, comprenant les dispositifs discrets à semiconducteurs pour montage en surface dont le nombre de connexions est inférieur à 8.
Il convient également de se référer à l’IEC 60191-6 pour la préparation des dessins d’encombrement des dispositifs discrets pour montage en surface dont le nombre de connexions est supérieur ou égal à 8.
L’objectif principal de ces dessins consiste à indiquer l’espace à octroyer aux dispositifs dans un équipement, ainsi que d’autres caractéristiques dimensionnelles exigées pour assurer une interchangeabilité mécanique.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
le domaine d’application a été étendu pour couvrir les dispositifs à semiconducteurs pour montage en surface dont le nombre de connexions est inférieur à 8;
une définition du terme "élévation" a été ajoutée;
les méthodes de positionnement de la référence spécifiée ont été étendues pour englober les boîtiers des composants pour montage en surface (CMS);
l’identification visuelle de la position de broche no 1, dans le cadre des procédures de manipulation automatique, a été clarifiée;
les règles de représentation des broches ont été clarifiées;
le Tableau A.1 a été complété avec des symboles spécifiquement destinés aux boîtiers CMS;
l’Annexe B "Concept de normalisation" a été supprimée;
une annexe normative avec des règles spécifiques aux boîtiers CMS a été ajoutée;
les exemples de dessins de dispositifs à semiconducteurs ont été alignés sur l’état de l’art des boîtiers, en englobant les boîtiers CMS.
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IEC 60191-1 ®
Edition 3.0 2018-01
INTERNATIONAL
STANDARD
Mechanical standardization of semiconductor devices –
Part 1: General rules for the preparation of outline drawings of discrete devices
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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IEC 60191-1 ®
Edition 3.0 2018-01
INTERNATIONAL
STANDARD
Mechanical standardization of semiconductor devices –
Part 1: General rules for the preparation of outline drawings of discrete devices
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-5266-6
– 2 – IEC 60191-1:2018 IEC 2018
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 General rules for all drawings . 8
4.1 Drawing layout . 8
4.2 Dimensions and tolerances . 9
4.3 Methods for locating the datum . 10
4.4 Numbering of terminals . 11
4.4.1 General . 11
4.4.2 Single-ended devices with terminals in a linear array . 11
4.4.3 Single-ended devices with terminals in a circular array . 11
4.4.4 Double-ended devices . 11
4.4.5 Devices with terminals disposed in a square or rectangular periphery . 11
4.4.6 Particular case of lozenge – shaped bases . 11
4.4.7 Other devices . 12
5 Additional rules . 12
5.1 Rules for device and case outline drawings . 12
5.2 Rules to specify the dimensions and positions of terminals . 13
5.2.1 General rules . 13
5.2.2 Rules to specify the dimensions and the positions of the terminals on a
base drawing . 13
5.3 Rules for gauge drawings . 13
6 Inter-conversion of inch and millimetre dimensions and rules for rounding off . 14
7 Rules for coding . 14
Annex A (informative) Reference letter symbols . 15
Annex B (informative) Rules to specify the dimensions and positions of terminals on a
base drawing . 18
B.1 Example of dimensioning for a circular base outline with no tab and having
four terminals located symmetrically on a pitch circle . 18
B.1.1 Interpretation of the principle of dimensioning . 18
B.1.2 Checking . 19
B.2 Example of dimensioning for a circular base outline with a tab and having
four terminals located symmetrically on a pitch circle . 19
B.2.1 Interpretation of the principle of dimensioning . 19
B.2.2 Checking . 20
Annex C (normative) General philosophy of flat base devices . 24
Annex D (normative) Special rules for SMD-packages . 26
D.1 General reference . 26
D.2 Lead terminals . 26
D.3 Measuring methods . 26
Annex E (informative) Examples of semiconductor device drawings . 27
Annex F (informative) Former rules for rounding off . 33
F.1 Toleranced dimensions . 33
F.1.1 Maximum and minimum values of toleranced dimensions . 33
F.1.2 Nominal value of toleranced dimensions . 33
F.2 Untoleranced dimensions (maximum only or minimum only) . 33
F.3 Untoleranced nominal dimensions given for general information . 33
F.4 Untoleranced nominal dimensions given to specify true geometrical positions . 34
Annex G (informative) Former rules for coding . 35
G.1 General . 35
G.2 Device outlines . 35
G.3 Bases . 35
G.4 Case outlines . 35
G.5 Type variants and provisional drawings . 35
Bibliography . 36
Figure 1 – Numbering of terminals for the particular case of lozenge – shaped bases . 12
Figure 2 – System to indicate the dimensions of the terminals . 13
Figure B.1 – Circular base outline with no tab . 21
Figure B.2 – Tolerances of terminals. 21
Figure B.3 – Gauge for a circular base outline with no tab . 22
Figure B.4 – Circular base outline with tab . 22
Figure B.5 – Gauge for a circular base outline with tab . 23
Figure C.1 − Example of flat base outline . 25
Figure E.1 – Long form package . 27
Figure E.2 – Post/stud mount package . 27
Figure E.3 – Cylindric package . 28
Figure E.4 – Cylindric in-line package . 29
Figure E.5 – Flange-mounted in-line package . 29
Figure E.6 – Press package . 30
Figure E.7 – SMD-package with flat leads . 30
Figure E.8 – SMD-Package with gull-wing leads . 31
Figure E.9 – SMD-package with no leads . 32
Table A.1 – Dimensions of reference letter symbols . 15
– 4 – IEC 60191-1:2018 IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –
Part 1: General rules for the preparation of outline drawings
of discrete devices
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IEC 60191-1 ®
Edition 3.0 2018-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 1: General rules for the preparation of outline drawings of discrete devices
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 1: Règles générales pour la préparation des dessins d’encombrement
des dispositifs discrets
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
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International Standards for all electrical, electronic and related technologies.
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IEC 60191-1 ®
Edition 3.0 2018-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 1: General rules for the preparation of outline drawings of discrete devices
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 1: Règles générales pour la préparation des dessins d’encombrement
des dispositifs discrets
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-1092-4
– 2 – IEC 60191-1:2018 IEC 2018
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 General rules for all drawings . 8
4.1 Drawing layout . 8
4.2 Dimensions and tolerances . 9
4.3 Methods for locating the datum . 10
4.4 Numbering of terminals . 11
4.4.1 General . 11
4.4.2 Single-ended devices with terminals in a linear array . 11
4.4.3 Single-ended devices with terminals in a circular array . 11
4.4.4 Double-ended devices . 11
4.4.5 Devices with terminals disposed in a square or rectangular periphery . 11
4.4.6 Particular case of lozenge – shaped bases . 11
4.4.7 Other devices . 12
5 Additional rules . 12
5.1 Rules for device and case outline drawings . 12
5.2 Rules to specify the dimensions and positions of terminals . 13
5.2.1 General rules . 13
5.2.2 Rules to specify the dimensions and the positions of the terminals on a
base drawing . 13
5.3 Rules for gauge drawings . 13
6 Inter-conversion of inch and millimetre dimensions and rules for rounding off . 14
7 Rules for coding . 14
Annex A (informative) Reference letter symbols . 15
Annex B (informative) Rules to specify the dimensions and positions of terminals on a
base drawing . 18
B.1 Example of dimensioning for a circular base outline with no tab and having
four terminals located symmetrically on a pitch circle . 18
B.1.1 Interpretation of the principle of dimensioning . 18
B.1.2 Checking . 19
B.2 Example of dimensioning for a circular base outline with a tab and having
four terminals located symmetrically on a pitch circle . 19
B.2.1 Interpretation of the principle of dimensioning . 19
B.2.2 Checking . 20
Annex C (normative) General philosophy of flat base devices . 24
Annex D (normative) Special rules for SMD-packages . 26
D.1 General reference . 26
D.2 Lead terminals . 26
D.3 Measuring methods . 26
Annex E (informative) Examples of semiconductor device drawings . 27
Annex F (informative) Former rules for rounding off . 33
F.1 Toleranced dimensions . 33
F.1.1 Maximum and minimum values of toleranced dimensions . 33
F.1.2 Nominal value of toleranced dimensions . 33
F.2 Untoleranced dimensions (maximum only or minimum only) . 33
F.3 Untoleranced nominal dimensions given for general information . 33
F.4 Untoleranced nominal dimensions given to specify true geometrical positions . 34
Annex G (informative) Former rules for coding . 35
G.1 General . 35
G.2 Device outlines . 35
G.3 Bases . 35
G.4 Case outlines . 35
G.5 Type variants and provisional drawings . 35
Bibliography . 36
Figure 1 – Numbering of terminals for the particular case of lozenge – shaped bases . 12
Figure 2 – System to indicate the dimensions of the terminals . 13
Figure B.1 – Circular base outline with no tab . 21
Figure B.2 – Tolerances of terminals. 21
Figure B.3 – Gauge for a circular base outline with no tab . 22
Figure B.4 – Circular base outline with tab . 22
Figure B.5 – Gauge for a circular base outline with tab . 23
Figure C.1 − Example of flat base outline . 25
Figure E.1 – Long form package . 27
Figure E.2 – Post/stud mount package . 27
Figure E.3 – Cylindric package . 28
Figure E.4 – Cylindric in-line package . 29
Figure E.5 – Flange-mounted in-line package . 29
Figure E.6 – Press package . 30
Figure E.7 – SMD-package with flat leads . 30
Figure E.8 – SMD-Package with gull-wing leads . 31
Figure E.9 – SMD-package with no leads . 32
Table A.1 – Dimensions of reference letter symbols .
...
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