IEC 60749-5:2017
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60749-5:2017 provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.
This second edition cancels and replaces the first edition published in 2003. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) correction of an error in an equation;
b) inclusion of notes for guidance;
c) clarification of the applicability of test conditions.
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 5: Essai continu de durée de vie sous température et humidité avec polarisation
L’IEC 60749-5:2017 décrit un essai continu de durée de vie utilisant la température et l’humidité avec polarisation pour évaluer la fiabilité des dispositifs à semiconducteurs sous boîtier non hermétique dans les environnements humides. Cette méthode d’essai est considérée comme destructive.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) correction d’une erreur dans une équation;
b) ajout de notes à des fins de recommandation;
c) clarification de l’applicabilité des conditions d’essai.
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IEC 60749-5 ®
Edition 2.0 2017-04
INTERNATIONAL
STANDARD
Semiconductor devices – Mechanical and climatic test methods –
Part 5: Steady-state temperature humidity bias life test
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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About the IEC
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International Standards for all electrical, electronic and related technologies.
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IEC 60749-5 ®
Edition 2.0 2017-04
INTERNATIONAL
STANDARD
Semiconductor devices – Mechanical and climatic test methods –
Part 5: Steady-state temperature humidity bias life test
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-4171-4
– 2 – IEC 60749-5:2017 © IEC 2017
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 General . 5
5 Equipment . 6
5.1 Equipment summary . 6
5.2 Temperature and relative humidity . 6
5.3 Devices under stress . 6
5.4 Minimizing release of contamination . 6
5.5 Ionic contamination . 6
5.6 Deionized water . 6
6 Test conditions . 6
6.1 Test conditions summary . 6
6.2 Temperature, relative humidity and duration . 6
6.3 Biasing guidelines . 7
6.4 Biasing choice and reporting . 7
7 Procedures . 8
7.1 Mounting . 8
7.2 Ramp-up . 8
7.3 Ramp-down . 8
7.4 Test clock . 8
7.5 Bias . 8
7.6 Read-out . 8
7.7 Handling . 9
8 Failure criteria . 9
9 Safety . 9
10 Summary . 9
Table 1 – Temperature, relative humidity and duration . 6
Table 2 – Criteria for choosing continuous or cyclical bias . 8
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 5: Steady-state temperature humidity bias life test
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-5 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2003. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) correction of an error in an equation;
b) inclusion of notes for guidance;
c) clarification of the applicability of test conditions.
– 4 – IEC 60749-5:2017 © IEC 2017
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2367/FDIS 47/2383/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, published under the general title Semiconductor
devices – Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 5: Steady-state temperature humidity bias life test
1 Scope
This part of IEC 60749 provides a steady-state temperature and humidity bias life test for the
purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid
environments.
This test method is considered destructive.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60749-4, Semiconductor devices – Mechanical and climatic test methods – Part 4: Damp
heat, steady-state, highly accelerated stress test (HAST)
3 Terms and definitions
No terms and definitions are listed in this document.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 General
This test employs conditions of temperature, humidity and bias which accelerate the
penetration of moisture through the external protective material (encapsulant or seal) or along
the interface between the external protective material and the metallic conductors which pass
through it.
Where both this steady-state, humidity bias test and the damp heat, highly accelerated stress
test (HAST) of IEC 60749-4 are performed, the results of this 85 °C/85 % RH steady-state test
will take priority over the results of the HAST test, which is an accelerated test designed to
activate the same failure mechanisms.
– 6 – IEC 60749-5:2017 © IEC 2017
5 Equipment
5.1 Equipment summary
The test requires a temperature-humidity test chamber capable of maintaining a specified
temperature and relative humidity continuously, while providing electrical connections to the
devices under test
...
IEC 60749-5 ®
Edition 2.0 2017-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 5: Steady-state temperature humidity bias life test
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques
et climatiques –
Partie 5: Essai continu de durée de vie sous température et humidité avec
polarisation
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary
(IEV) online.
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IEC publications issued since 2002. Some entries have been
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IEC 60749-5 ®
Edition 2.0 2017-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 5: Steady-state temperature humidity bias life test
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques
et climatiques –
Partie 5: Essai continu de durée de vie sous température et humidité avec
polarisation
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-7379-1
– 2 – IEC 60749-5:2017 © IEC 2017
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 General . 5
5 Equipment . 6
5.1 Equipment summary . 6
5.2 Temperature and relative humidity . 6
5.3 Devices under stress . 6
5.4 Minimizing release of contamination . 6
5.5 Ionic contamination . 6
5.6 Deionized water . 6
6 Test conditions . 6
6.1 Test conditions summary . 6
6.2 Temperature, relative humidity and duration . 6
6.3 Biasing guidelines . 7
6.4 Biasing choice and reporting . 7
7 Procedures . 8
7.1 Mounting . 8
7.2 Ramp-up . 8
7.3 Ramp-down . 8
7.4 Test clock . 8
7.5 Bias . 8
7.6 Read-out . 8
7.7 Handling . 9
8 Failure criteria . 9
9 Safety . 9
10 Summary . 9
Table 1 – Temperature, relative humidity and duration . 6
Table 2 – Criteria for choosing continuous or cyclical bias . 8
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 5: Steady-state temperature humidity bias life test
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-5 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2003. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) correction of an error in an equation;
b) inclusion of notes for guidance;
c) clarification of the applicability of test conditions.
– 4 – IEC 60749-5:2017 © IEC 2017
This bilingual version (2019-09) corresponds to the monolingual English version, published in
2017-04.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2367/FDIS 47/2383/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
The French version of this standard has not been voted upon.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, published under the general title Semiconductor
devices – Mechanical and climatic test methods, can be found on the IEC website
...
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