IEC 60191-6-21:2010

IEC 60191-6-21 ®
Edition 1.0 2010-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6-21: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages – Measuring methods for package
dimensions of small outline packages (SOP)

Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-21: Règles générales pour la préparation des dessins d'encombrement
des boîtiers pour dispositifs à semiconducteurs pour montage en surface –
Méthodes de mesure pour les dimensions des boîtiers de faible encombrement
(SOP)
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IEC 60191-6-21 ®
Edition 1.0 2010-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6-21: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages – Measuring methods for package
dimensions of small outline packages (SOP)

Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-21: Règles générales pour la préparation des dessins d'encombrement
des boîtiers pour dispositifs à semiconducteurs pour montage en surface –
Méthodes de mesure pour les dimensions des boîtiers de faible encombrement
(SOP)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
N
CODE PRIX
ICS 31.080.01 ISBN 978-2-88912-168-7
– 2 – 60191-6-21 © IEC:2010
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-21: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Measuring methods for package dimensions
of small outline packages (SOP)

FOREWORD
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6-21 has been prepared by subcommittee 47D: Mechanical
standardization of semiconductor devices, of IEC technical committee 47: Semiconductor
devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47D/772/FDIS 47D/776/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

60191-6-21 © IEC:2010 – 3 –
A list of all the parts in the IEC 60191 series, under the general title Mechanical
standardization of semiconductor devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 4 – 60191-6-21 © IEC:2010
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-21: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Measuring methods for package dimensions
of small outline packages (SOP)

1 Scope
This part of IEC 60191 specifies methods to measure package dimensions of small outline
packages (SOP), package outline form E in accordance to IEC 60191-4.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60191-4, Mechanical standardization of semiconductor devices – Part 4: Coding system
and classification into forms of package outlines for semiconductor device packages
IEC 60191-6, Mechanical standardization of semiconductor devices – Part 6: General rules for
the preparation of outline drawings of surface mounted semiconductor device packages
3 Terms and definitions
For the purposes of this document the terms and definitions given in IEC 60191-6 apply.
4 Measuring methods
4.1 Description of measuring method
The measuring methods described in this standard are for dimension values guaranteed to
users on the basis of the following items.
a) In general, measuring the dimensions shall be made with the semiconductor packages
mounted on printed circuit-board as the guarantee is made to the user.
b) In general, measurement may be made either by hand or automatically.
c) The dimensions that cannot be measured unless the package is destroyed may be
calculated from other dimensions or replaced by representative values. See 4.6.2.3.

60191-6-21 © IEC:2010 – 5 –
4.2 Reference characters and drawing
Thin small outline package TSOP (1)
An outline drawing is given in Figure 1.

HD
D
1 n
n-1
A B
Terminal 1
index area
n/2 n/2+1
IEC  2248/09
Figure 1a – Top view
E
Seating plane
S
y
S
e
bp
ZE
A-B
x M P S
IEC  2249/09
Figure 1b – Side view
G1D
P
θ
bp
b1
L1
Lp
L
IEC  2251/09
IEC  2250/09
Figure 1c – Lead section Figure 1d – Lead side view

l1
HDmin-2Lpmax
HDmax
IEC  2252/09
Figure 1e – Pattern of terminal position areas

Figure 1 – TSOP(1) outline drawings
c1
c
A3
e b3
A1
A2
A
– 6 – 60191-6-21 © IEC:2010
Shrink small outline package SSOP, TSOP(2)
An outline drawing is given in Figure 2.

A
n  n-1
n/2-1
n4 n3
n1 n2
1 n/2
Terminal 1 2
B
index area
IEC  2243/09
Figure 2a – Top view
D
Seating plane
S
e
y
S
ZD
bp
x M P S A-B
IEC  2244/09
Figure 2b – Side view
G1E
P
θ
bp
L1
b1
Lp
L
IEC  2246/09
IEC  2245/09
Figure 2c – Lead section Figure 2d – Lead side view

e
b3
IEC  2247/09
Figure 2e – Pattern of terminal position areas
Figure 2 – SSOP, TSOP(2) outline drawings
c1
l1 c
HEmin
-2Lpmax
HEmax E
A3
HE
A1
A2
A
60191-6-21 © IEC:2010 – 7 –
4.3 Mounting height A
4.3.1 Description
Let the height of a package from the seating plane to the top of the package be denoted as
the mounting height. See Figure 3.

S
A
S
A
IEC  2032/10
Figure 3 – Mounting height
4.3.2 Measuring method
The measuring method shall be as follows.
a) Put the package on the surface plate to establish the seating plane.
b) From the side or top, measure the distance to a highest point. Let the distance be denoted
as the mounting height A.
4.4 Stand-off A1
4.4.1 Description
Let a distance from the seating plane to the lowest point of a package be denoted as the
stand-off. See Figure 4.
– 8 – 60191-6-21 © IEC:2010
S
A1
S
A
IEC  2033/10
Figure 4 – Stand-off
4.4.2 Measuring method
The measuring method shall be as
...