IEC 60191-2:1966/AMD21:2020
(Amendment)Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
General Information
- Status
- Published
- Publication Date
- 12-Feb-2020
- Technical Committee
- SC 47D - Semiconductor devices packaging
- Drafting Committee
- WG 1 - TC 47/SC 47D/WG 1
- Current Stage
- PPUB - Publication issued
- Start Date
- 13-Feb-2020
- Completion Date
- 18-Feb-2020
Overview
IEC 60191-2:1966/AMD21:2020 is Amendment 21 (2020) to IEC 60191-2 - the International Electrotechnical Commission standard for the mechanical standardization of semiconductor devices - Part 2: Dimensions. This amendment updates the device outline drawings content by inserting new sheets and revisions to the title/preface pages. It was prepared by IEC TC 47 subcommittee 47D (Semiconductor devices packaging).
Key topics and requirements
- Insertion of new pages and drawings: Amendment 21 provides instructions to replace the existing title page and preface page and to add new sheets to Chapter I (Device Outline Drawings).
- New package drawings added:
- 60191 IEC I-190B
- IEC code: 190B
- Package name: large power package with 3 load terminals
- Device type: Power transistors
- Material: P
- Position: U
- Package: MP
- Form: A
- Count: 3
- 60191 IEC I-191B
- IEC code: 191B
- Package name: large power package with 5 load terminals
- Device type: Power transistors
- Material: P
- Position: U
- Package: MP
- Form: A
- Count: 5
- 60191 IEC I-190B
- Document control and provenance: The amendment references voting reports and confirms editorial and procedural instructions for integrating the new sheets into the existing IEC 60191-2 publication.
- Use of normative references: The amendment highlights that correct application depends on referenced normative documents and that users must ensure they hold the latest editions, corrigenda or amendments.
- Intellectual property and liability: Notes about copyright, possible patent rights, and IEC disclaimers are reiterated.
Applications
- Semiconductor packaging engineers: Use the updated outline drawings when designing and specifying mechanical packages for power transistors.
- PCB and mechanical designers: Apply the standardized package outlines to ensure correct footprint, thermal mounting and mechanical compatibility.
- Manufacturers and component suppliers: Adopt the standardized mechanical dimensions to support interchangeability and consistent production.
- Quality, procurement and compliance teams: Reference the amendment for procurement specifications, conformity assessment and supplier communication.
Related standards
- IEC 60191-2 (base publication) - Part 2: Dimensions (this amendment is to that base document).
- Prepared by IEC TC 47 / Subcommittee 47D - relevant for packaging and mechanical interfaces of semiconductor devices.
This amendment is primarily administrative and editorial in nature but important for maintaining up-to-date mechanical outline information (including the new large power package drawings 190B and 191B) used across design, manufacturing and procurement workflows.
Frequently Asked Questions
IEC 60191-2:1966/AMD21:2020 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions". This standard covers: Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD21:2020 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.
You can purchase IEC 60191-2:1966/AMD21:2020 directly from iTeh Standards. The document is available in PDF format and is delivered instantly after payment. Add the standard to your cart and complete the secure checkout process. iTeh Standards is an authorized distributor of IEC standards.
Standards Content (Sample)
IEC 60191-2 ®
Edition 1.0 2020-02
INTERNATIONAL
STANDARD
AMENDMENT 21
The sheets contained in this amendment are to be inserted in IEC 60191-2
Mechanical standardization of semiconductor devices –
Part 2: Dimensions
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
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IEC 60191-2 ®
Edition 1.0 2020-02
INTERNATIONAL
STANDARD
AMENDMENT 21
The sheets contained in this amendment are to be inserted in IEC 60191-2
Mechanical standardization of semiconductor devices –
Part 2: Dimensions
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-7865-9
INSTRUCTIONS FOR THE INSERTION
OF NEW PAGES IN IEC 60191-2
Replace the existing title page with the new title page.
Remove the existing page 60191 IEC I containing the preface and insert in its place the new page
60191 IEC I containing the preface to Amendment 21 (2020).
Chapter I:
Add the following new sheets:
60191 IEC I-190B-a
60191 IEC I-191B-a
60191 IEC I-190B/191B-b
IEC 60191-2 ®
Edition 1.0 1966
INTERNATIONAL
STANDARD
Mechanical standardization of semiconductor devices –
Part 2: Dimensions
Includes Supplements and Amendments / Inclut les Compléments et Amendements:
A (1967), B (1969), C (1970), D (1971), E (1974), F (1976), G (1978), H (1978),
J (1980), K (1981), L (1982), M (1983), N (1987), P (1988), Q (1990), R (1995),
S (1995), T(1995), U(1997), V(1998), W(1999), X(1999), Y(2000), Z(2000), 1 (2001),
2(2001), 3(2001), 4(2001), 5(2002), 6(2002), 7(2002), 8(2003), 9(2003), 10(2004),
11(2004), 12(2006), 13(2006), 14(2006), 15(2006), 16(2007), 17(2008), 18(2011),
19(2012), 20(2018), 21(2020)
IEC 60191-2:1966
INTERNATIONAL ELECTROTECHNICAL COMMISSION
PUBLICATION 191-2
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –
Part 2: Dimensions
CONTENTS
FOREWORD
PREFACE
PHILOSOPHY OF MECHANICAL STAN-
DARDIZATION .Chapter 00
RECOMMENDED VALUES FOR CERTAIN
DIMENSIONS OF DRAWINGS OF SEMI-
CONDUCTOR DEVICES . Chapter 0
DEVICE OUTLINE DRAWINGS . Chapter I
TYPES OF SEMICONDUCTOR DEVICES
GENERALLY MOUNTED IN THE
PACKAGES OF CHAPTER I
BASE DRAWINGS . Chapter II
CASE OUTLINE DRAWINGS .Chapter III
GAUGE DRAWINGS . Chapter IV
TABLES SHOWING ASSOCIATIONS BE-
TWEEN CASE OUTLINES AND BASES . Chapter V
OBSOLETE DRAWINGS
ADDITIONS TO THE LISTS OF
NATIONAL CODES APPEARING ON
THE STANDARD SHEETS OF
IEC PUBLICATION 191-2
DELETIONS TO THE LISTS OF
NATIONAL CODES APPEARING ON
THE STANDARD SHEETS OF
IEC PUBLICATION 191-2
IEC Publication 191-2
Date: 1987
INTERNATIONAL ELECTROTECHNICAL COMMISSION
_________
Amendment 21 (2020) to IEC 60191-2 (1966)
MECHANICAL STANDARDIZATION OF
SEMICONDUCTOR DEVICES –
Part 2: Dimensions
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition
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this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also
participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in
accordance with conditions determined by agreement between the two organizations.
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consensus of opinion on the relevant subjects since each technical committee has representation from all interested
IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in th
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