IEC 60191-6-13:2016

IEC 60191-6-13 ®
Edition 2.0 2016-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid
Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-13: Guide de conception pour les supports sans couvercle pour les
boîtiers matriciels à billes et à pas fins (FBGA) et les boîtiers matriciels à zone
de contact plate et à pas fins (FLGA)
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IEC 60191-6-13 ®
Edition 2.0 2016-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –

Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid

Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Normalisation mécanique des dispositifs à semiconducteurs –

Partie 6-13: Guide de conception pour les supports sans couvercle pour les

boîtiers matriciels à billes et à pas fins (FBGA) et les boîtiers matriciels à zone

de contact plate et à pas fins (FLGA)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-3662-8

– 2 – IEC 60191-6-13:2016 © IEC 2016
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references. 6
3 Terms and definitions . 6
4 Socket code . 6
4.1 Construction of socket code . 6
4.2 Symbols . 7
4.2.1 Semiconductor sockets symbol . 7
4.2.2 Socket type symbol . 7
4.2.3 Socket nominal dimension symbol . 7
4.2.4 Number of terminal arrays . 7
4.2.5 Terminal pitch . 7
5 Terminal number . 7
6 Socket nominal dimension . 8
7 Socket length and width . 8
8 Reference symbols and schematics . 8
8.1 Outline drawings . 8
8.2 Reference symbols and schematics of recommended socket mounting
pattern on printed circuit board . 11
8.3 Overall dimensions . 12
8.4 Recommended dimensions of socket mounting pattern on printed circuit
board . 17
9 Individual outline drawing standard registration . 18

Figure 1 – Outline drawings of the socket . 9
Figure 2 – Outline drawings for the definition of terminal diameter . 10
Figure 3 – Applicable package outline . 10
Figure 4 – Socket mounting pattern . 11

Table 1 – Overview for the different socket groups . 8
Table 2 – Overall dimensions (1 of 2) . 12
Table 3 – Socket dimensions for Group 1, 2 and 3 (square socket) (1 of 2) . 14
Table 4 – Socket dimension for Group 4 (square or rectangular socket) . 16
Table 5 – Socket mounting dimensions. 17
Table 6 – Registration table . 18

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-13: Design guideline of open-top-type sockets for
Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6-13 has been prepared by subcommittee 47D:
Semiconductor devices packaging, of IEC technical committee 47: Semiconductor devices.
This second edition cancels and replaces the first edition published in 2007. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm,
respectively. Accordingly, six socket sizes have been added to the socket group
numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group
number 4.
– 4 – IEC 60191-6-13:2016 © IEC 2016
The text of this standard is based on the following documents:
FDIS Report on voting
47D/878/FDIS 47D/885/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 60191 series, under the general title Mechanical
standardization of semiconductor devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
INTRODUCTION
This part of IEC 60191 aims to standardize the outer dimensions of the sockets for FBGA and
FLGA, where leading-edge developments are aggressively innovated, to establish their
compatibility with the needs of the surface-mount industry that is globally expanding due to
enhanced functions and performances of electrical devices.
For defining each dimension, the target was to indicate the standard design value which has
the concept of the design centre as much as possible, aiming to enhance the function as a
standardization index.
– 6 – IEC 60191-6-13:2016 © IEC 2016
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-13: Design guideline of open-top-type sockets for
Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

1 Scope
This part of IEC 60191 specifies a design guideline of open-top-type semiconductor sockets
for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this
part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test
and burn-in sockets applied to FBGA and FLGA.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60191-2, Mechanical standardization of semiconductor devices – Part 2: Dimensions
IEC 60191-6, Mechanical standardization of semiconductor devices – Part 6: General rules for
the preparation of outline drawings of surface mounted semiconductor device packages
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60191-6 apply.
4 Socket code
4.1 Construction of socket code
A socket code is constructed as follows.
EXAMPLE
Symbol of Symbol of Symbol of Number of Terminal
socket socket nominal terminal pitch
type dimension arrays
[ ][ ][ ] [ ][ ]
4.2.1 4.2.2 4.2.3 4.2.4 4.2.5
SFB TX  2120AB  1616  080
4.2 Symbols
4.2.1 Semiconductor sockets symbol
The symbol for socket shall be expressed in three characters. The first character, “S”, refers
to socket and the rest to the package code. FBGA shall be expressed as “FB”, FLGA shall be
expressed as “FL”.
4.2.2 Socket type symbol
The symbol for socket type shall be expressed in two characters. The first character “T” refers
to open-top type and the rest remains option “X”. Clamshell type socket is referred to as “C”.
4.2.3 Socket nominal dimension symbol
The symbol for nominal dimension shall be expressed in six characters, which consist of four
numeric characters and two alphabetical characters. The first four numeric characters comply
with nominal dimension E × D, which refers to the applicable maximum width and length of
FBGA/FLGA package.
The last two alphabetical characters refer to socket base matrix size either an even or an odd.
It refers to an odd contact row by “A” and an even contact row by “B” in the following order:
socket width direction and then socket length direction.
Namely, it refers to “AA” in case row number is an odd number both for width and length
direction, “BB” in case row number is an even number both for width and length direction, “AB”
in case row number is an odd number for width direction and an even number for length
direction, and “BA” in case row number is an even number for width direction and an odd
number for length direction.
4.2.4 Number of terminal arrays
The symbol for the number of terminal arrays shall be expressed by four numeric characters
applying applicable package matrix size in the E direction and the D direction.
4.2.5 Terminal pitch
The symbol for terminal pitch of applicable package shall be expressed in three numeric
characters. The decimal sign is omitted.
5 Terminal number
The terminal number is provided in the following manner when the socket is viewed with the
angle from topside. The horizontal row nearest to the index corner when the index is placed
on the left topside is referred to as A.
As the row moves down, the number changes in the order of B, C, ……. AA, AB.
The terminal number one (1) is defined for the vertical row nearest to the index corner. As the
row moves rightward, the number is increased to two (2), three (3), etc. The terminal number
is combined with these letters and numbers and expressed as A1 or B1. Six (6) alphabetical
letters, “I”, “O”, “Q”, “S”, “X” and “Z”, shall not be used as symbols for a horizontal row.

– 8 – IEC 60191-6-13:2016 © IEC 2016
6 Socket nominal dimension
The applicable package length and width which extend from 1,50 mm to 43,0 mm by 0,50 mm
increments are divided into ten package groups. The socket nominal dimension is defined by
the largest value of the package length or width in each socket group.
In consideration of a specific need for minimum socket outline size, the socket nominal
dimension with 1,0 mm increments can be specified as an exception. The package length and
width of 5,00 mm or less are unified in one socket nominal dimension.
7 Socket length and width
Socket length and width are categorized into four groups, from group one (1) to group four (4),
to cover the difference of its terminal counts and mechanism (see Table 1).
In socket group one (1), two (2) and three (3), only the square socket outline is allowed.
Socket length and width are determined by the nominal dimension value plus 36,0 mm,
24,0 mm and 12,0 mm, respectively.
In socket group four (4), square and rectangular socket outlines are allowed. Socket length
and width are determined by the nominal dimension value plus 8,0 mm independently in each
side.
Socket group one (1) is intended for a high terminal counts package or a FLGA socket which
is composed of a complicated socket structure. Socket groups two (2) and three (3) are for
the socket currently available. Socket group four (4) is for the socket which is required to have
the smallest possible outline, such as for Memory IC.
Table 1 – Overview of the different socket groups
Value added to the socket nominal dimension
Socket group number Allowed socket outline
to determine the socket length and width
Group 1 Square 36,0 mm
Group 2 Square 24,0 mm
Group 3 Square 12,0 mm
Group 4 Square or rectangular 8,0 mm

8 Reference symbols and schematics
8.1 Outline drawings
Outline drawings of the socket and the terminal diameter are shown in Figure 1 and Figure 2,
respectively. The applicable package outline is presented in Figure 3. The overall dimensions
are given in Table 2 and socket dimensions in Table 3 and Table 4.

IEC
a
Indicates the mounting plane. The mounting plane is defined by the plane where the socket contacts its
mounting surface.
b
Stipulates the true geometric position of the terminals.
c
Indicates positional tolerance of the index mark. Index mark should be completely within the shaded area.
Figure 1 – Outline drawings of the socket

– 10 – IEC 60191-6-13:2016 © IEC 2016

IEC
a
Terminal diameter is defined as the maximum diameter of a circle circumscribed about a horizontal
cross-section of the terminal from the mounting plane.
Figure 2 – Outline drawings for the definition of terminal diameter
A
B
C
1 2 3
E
IEC
Figure 3 – Applicable package outline
D
8.2 Reference symbols and schematics of recommended socket mounting pattern on
printed circuit board
The drawing of the recommended socket mounting pattern on a printed circuit board is shown
in Figure 4 for reference in designing printed circuit board. See Table 5 for recommended
dimensions.
S
pw2
øB
S
p1
pw1
øB
p2
e
A
B
C
1  2  3
S
w
øB
p
W
p
IEC
NOTE The subscript "p" indicates projected dimension. For example, L is recognized automatically as the
p
projected dimension “L” to the base plane.
Figure 4 – Socket mounting pattern
S
pL2
S
pL1
e
S
L
L
p
– 12 – IEC 60191-6-13:2016 © IEC 2016
8.3 Overall dimensions
Overall socket dimensions are shown in Table 2. Every reference symbol is indicated in
Figure 1 and Figure 2.
Table 2 – Overall dimensions (1 of 2)
Recommended
Reference Stipulations
Name value Supplement
symbol mm
mm
Socket nominal E × D This value is based on the nominal dimensions – Table 3,
dimension of FBGA and FLGA compatible with the Table 4
socket.
Socket length L Socket length: L nominal defined. – Table 3,
L = W (group 4 is exception). Table 4
Socket width W Socket width: W nominal defined – Table 3,
W = L (group 4 is exception). Table 4
Socket height A A max = 22,0 –
End stroke A A max = 16,0 14,0
1 1
height
13,5
Seating plane A A max = 14,0 9,7
2 2
height
8,2
Terminal pitch e e = 0,80  e = 0,65  e = 0,50  e = 0,40 –
Terminal length A A = 0,7 to 6,3 –
3 3
Terminal Øb Maximum dimension of the terminal cross- –
diameter section
e Øb max
0,80 0,28
0,65 0,21
0,50 0,20
0,40 0,19
Number of n n = 0, 2, 3, 4 (one to be selected) –
1 1
alignment pins
(inside)
Number of n n = 0, 2, 3, 4 (one to be selected) –
2 2
alignment pins
(outside)
Alignment pin F F = 1,0 –
min
length
Distance S Group 1, 2, 3: Socket nominal dimension plus – Table 3,
L1
between 5,0 Table 4
alignment pins
Group 4: No pins exist
in L-direction
(inside)
Distance S Group 1, 2, 3: Socket nominal dimension plus – Table 3,
W1
between 5,0 Table 4
alignment pins
Group 4: No pins exist
in W-direction
(inside)
Table 2 (2 of 2)
Recommended
Reference Stipulations
Name value Supplement
symbol mm
mm
Distance S Group 1: Socket nominal dimension plus 30,0 – Table 3,
L2
between Table 4
Group 2: Socket nominal dimension plus 18,0
alignment pins
in L-direction
Group 3: Socket nominal dimension plus 9,0
(outside)
Group 4: Socket nominal dimension plus 5,0
Distance S Group 1: Socket nominal dimension plus 30,0 – Table 3,
W2
between Table 4
Group 2: Socket nominal dimension plus 18,0
alignment pins
in W-direction
Group 3: Socket nominal dimension plus 9,0
(outside)
Group 4: Socket nominal dimension plus 5,0
Alignment pin ØB ØB max = 1,5 –
1 1
diameter
(inside)
Alignment pin ØB Group 1 and 2: ØB max = 2,0 – Table 3,
2 2
diameter Table 4
Group 3 and 4: ØB max =1,5
(outside) 2
Centre terminal S When M is an odd number, S = 0 –

L L L
position in
When M is an even number, S = e/2

L-direction L L
Centre terminal S When M is an odd number, S = 0 –

W W W
position in
When M is an even number, S = e/2

W W
W-direction
Number of N Number of terminals and matrix sizes shall be –
terminals equal to those of the applicable package
specified in IEC 60191-2.
Matrix size in M
L
Matrix layout with partially thinning-out
L-direction
terminal is accepted.
Matrix size in M
W
W-direction
Package setting Direction of shifting for package insertion. –
direction This is to provide the direction of package
shifting in order to ensure uniformity when
fitting a package to a socket that has a larger
terminal matrix than the package, when that
package has an odd number of rows less than
the socket. The direction of shifting shall be
upper left.
– 14 – IEC 60191-6-13:2016 © IEC 2016
Table 3 – Socket dimensions for Group 1, 2 and 3 (square socket) (1 of 2)
Socket length and width
Longer side of package Socket nominal dimension
mm
length or width E × D
Group 1 Group 2 Group 3
mm mm
L = W L = W L = W
1,50
2,00
2,50
3,00
3,50
4,00
4,50
5,00
9 × 9 45,0 33,0 21,0
5,50
6,00
6,50
7,00
7,50
8,00
8,50
9,00
9,50
10,00
10,50
11,00
13 × 13 49,0 37,0 25,0
11,50
12,00
12,50
13,00
13,50
14,00
14,50
15,00
53,0 41,0 29,0
17 × 17
15,50
16,00
16,50
17,00
17,50
18,00
18,50
19,00
57,0 45,0 33,0
21 × 21
19,50
20,00
20,50
21,00
Table 3 (2 of 2)
Socket length and width
Longer side of package Socket nominal dimension
mm
length or width E × D
Group 1 Group 1 Group 1
mm mm
L = W L = W L = W
21,50
22,00
22,50
23,00
25 × 25 61,0 49,0 37,0
23,50
24,00
24,50
25,00
25,50
26,00
26,50
27,00
29 × 29 65,0 53,0 41,0
27,50
28,00
28,50
29,00
29,50
30,00
30,50
31,00
69,0 57,0 45,0
33 × 33
31,50
32,00
32,50
33,00
33,50
34,00
34,50
35,00
37 × 37 73,0 61,0 49,0
35,50
36,00
36,50
37,00
37,50
38,00
38,50
39,00
41 × 41 77,0 65,0 53,0
39,50
40,00
40,50
41,00
41,50
42,00
43 × 43 81,0 69,0 57,0
42,50
43,00
– 16 – IEC 60191-6-13:2016 © IEC 2016
Table 4 – Socket dimension for Group 4 (square or rectangular socket)
Package Socket Socket length Package Socket Socket length
length or nominal and width length or nominal and width
width dimension width dimension
mm mm
E × D E × D
Group 4 Group 4
mm mm mm mm
L = W L = W
1,50 22,50
31,0
23 × 23
2,00 23,00
2,50 23,50
24 × 24 32,0
3,00 24,00
13,0
5 × 5
3,50 24,50
25 × 25 33,0
4,00 25,00
4,50 25,50
34,0
26 × 26
5,00 26,00
5,50 26,50
6 × 6 14,0 27 × 27 35,0
6,00 27,00
6,50 27,50
15,0 36,0
7 × 7 28 × 28
7,00 28,00
7,50 28,50
8 × 8 16,0 29 × 29 37,0
8,00 29,00
8,50 29,50
9 × 9 17,0 30 × 30 38,0
9,00 30,00
9,50 30,50
39,0
10 × 10 18,0 31 × 31
10,00 31,00
10,50 31,50
11 × 11 19,0 32 × 32 40,0
11,00 32,00
11,50 32,50
20,0 41,0
12 × 12 33 × 33
12,00 33,00
12,50 33,50
13 × 13 21,0 34 × 34 42,0
13,00 34,00
13,50 34,50
14 × 14 22,0 35 × 35 43,0
14,00 35,00
14,50 35,50
44,0
15 × 15 23,0 36 × 36
15,00 36,00
15,50 36,50
16 × 16 24,0 37 × 37 45,0
16,00 37,00
16,50 37,50
25,0 46,0
17 × 17 38 × 38
17,00 38,00
17,50 38,50
18 × 18 26,0 39 × 39 47,0
18,00 39,00
18,50 39,50
19 × 19 27,0 40 × 40 48,0
19,00 40,00
19,50 40,50
28,0 49,0
20 × 20 41 × 41
20,00 41,00
20,50 41,50
21 × 21 29,0 42 × 42 50,0
21,00 42,00
21,50 42,50
30,0 51,0
22 × 22 43 × 43
22,00 43,00
8.4 Recommended dimensions of socket mounting pattern on printed circuit board
Dimensions of socket mounting pattern on printed circuit board are shown in Table 5. Every
reference symbol is indicated in Figure 1 and Figure 4.
Table 5 – Socket mounting dimensions
Recommended
Stipulations
Reference Supple-
value
Name
symbol ment
mm
mm
Socket mounting L Socket mounting length: L max –
p p
length
L = L + 0,8
p
Socket mounting W Socket mounting width: W max –
p p
width
W = W + 0,8
p
Terminal length A A = 0,7 to 6,3 –
3 3
Through hole Øb Through hole diameter: Øb min
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