IEC TS 62239-1:2012

IEC/TS 62239-1 ®
Edition 1.0 2012-07
TECHNICAL
SPECIFICATION
Process management for avionics – Management plan –
Part 1: Preparation and maintenance of an electronic components management
plan
IEC/TS 62239-1:2012(E)
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IEC/TS 62239-1 ®
Edition 1.0 2012-07
TECHNICAL
SPECIFICATION
Process management for avionics – Management plan –

Part 1: Preparation and maintenance of an electronic components management

plan
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
XA
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-83220-224-1

– 2 – TS 62239-1 © IEC:2012(E)
CONTENTS
FOREWORD . 4
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviations . 10
3.1 Terms and definitions . 10
3.2 Abbreviations . 14
4 Technical requirements . 14
4.1 General . 14
4.2 Component selection . 15
4.3 Component application . 16
4.3.1 General . 16
4.3.2 Electromagnetic compatibility (EMC) . 16
4.3.3 Derating and stress analysis . 17
4.3.4 Thermal analysis . 17
4.3.5 Mechanical analysis . 18
4.3.6 Testing, testability, and maintainability . 18
4.3.7 Avionics radiation environment . 18
4.3.8 Management of lead-free termination finish and soldering . 18
4.3.9 Counterfeit, fraudulent and recycled component avoidance . 19
4.4 Component qualification . 19
4.4.1 General . 19
4.4.2 General component qualification requirements . 19
4.4.3 Component manufacturer quality management . 19
4.4.4 Component manufacturer process management approval . 19
4.4.5 Demonstration of component qualification . 20
4.4.6 Qualification of components from a supplier that is not qualified . 21
4.4.7 Distributor process management approval . 21
4.4.8 Subcontractor assembly facility quality and process management
approval . 22
4.5 Continuous component quality assurance . 22
4.5.1 General quality assurance requirements . 22
4.5.2 On-going component quality assurance . 22
4.5.3 Plan owner in-house continuous monitoring . 23
4.5.4 Component design and manufacturing process change monitoring . 23
4.6 Component availability and associated risk assessment . 23
4.6.1 General . 23
4.6.2 Component obsolescence . 24
4.6.3 Pro-active measures . 24
4.6.4 Component obsolescence awareness . 25
4.6.5 Reporting. 25
4.6.6 Component dependability . 25
4.6.7 Semiconductor reliability and wear out. 25
4.6.8 Reliability assessment . 25
4.7 Component compatibility with the equipment manufacturing process . 26

TS 62239-1 © IEC:2012(E) – 3 –
4.8 Component data . 26
4.9 Configuration control . 27
4.9.1 General . 27
4.9.2 Alternative sources . 27
4.9.3 Equipment change documentation . 27
4.9.4 Customer notifications and approvals . 28
4.9.5 Focal organisation . 28
5 Plan administration requirements. 28
5.1 Using components outside the manufacturer’s specified temperature range . 28
5.2 Plan organization . 28
5.3 Plan terms and definitions . 29
5.4 Plan focal point . 29
5.5 Plan references . 29
5.6 Plan applicability . 29
5.7 Plan implementation . 29
5.8 Plan acceptance . 29
5.9 Plan maintenance . 29
Annex A (informative) Typical qualification requirements, typical component minimum
qualification requirements . 30
Annex B (informative) Semiconductor reliability and wear out . 34
Annex C (informative) Guidelines for environmental protection techniques, and for
comparison of components specifications . 35
Bibliography . 50

Table A.1 – Typical qualification requirements, typical component minimum
qualification requirements . 31
Table C.1 – Environmental protection techniques to be considered during the avionics
design process . 35
Table C.2 – Guidelines for the comparison of internationally available component
specifications – Microcircuits. . 40

– 4 – TS 62239-1 © IEC:2012(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
MANAGEMENT PLAN –
Part 1: Preparation and maintenance of an
electronic components management plan

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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The main task of IEC technical committees is to prepare International Standards. In
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• the required support cannot be obtained for the publication of an International Standard,
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• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC/TS 62239-1, which is a technical specification, has been prepared by IEC Technical
Committee 107: Process management for avionics.

TS 62239-1 © IEC:2012(E) – 5 –
This edition cancels and replaces IEC/TS 62239 published in 2008. This edition constitutes a
technical revision.
This edition includes the following significant technical changes with respect to
IEC/TS 62239:2008:
a) Scope – Added DO-254 for clarification
b) Normative references – Added additional references
c) Terms, definitions and abbreviations – Clarified some definitions
d) 4 Technical requirements – Added clarification related to managing ECMP at
subcontractor
e) 4.2 Component selection – Clarified temperature range requirements
f) 4.3.3 De-rating and stress analysis – Added information relative to part wear out
g) 4.3.8 Management of lead free termination finish and soldering – Added requirement
h) 4.3.9 Counterfeit, fraudulent and recycled component avoidance – Added requirement
i) 4.4.5 Demonstration of component qualification – Clarified documentation required
j) 4.4.5.3.4 Equipment manufacturer validation – Added additional requirements
k) 4.4.7 Distributor process management approval – Added additional requirements
l) 4.5.2. On-going component quality assurance – Changed title to clarify purpose and
changed STACK 0001 reference to IEC/PAS 62686-1
m) 4.6.5 Reporting – Added requirement to periodically report status of obsolescence
program to customer
n) 4.6.7 Semiconductor reliability and wear out – Added requirement to address
semiconductor wear out
o) Annex A: Typical Qualification Requirements – Added requirement for minimum part
qualification
p) Annex B Semiconductor reliability and wear out – Added annex B to provide information
about wear out
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/161/DTS 107/179/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC/TS 62239 series under the general title Process management
for avionics – Management plan, can be found on the IEC website.

– 6 – TS 62239-1 © IEC:2012(E)
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• transformed into an International Standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

TS 62239-1 © IEC:2012(E) – 7 –
INTRODUCTION
This Technical Specification provides the structure for aerospace equipment manufacturers,
subcontractors, maintenance facilities, and other aerospace component users to develop their
own Electronic Component Management Plans (ECMPs), hereinafter also referred to as ‘plan’.
This Technical Specification states objectives to be accomplished; it does not require specific
tasks to be performed, specific data to be collected or reports to be issued. Those who
prepare plans in compliance with this Technical Specification will document processes that
are the most effective and efficient for them in accomplishing the objectives of this Technical
Specification. In order to allow flexibility in implementing and updating the documented
processes, plan authors are encouraged to refer to their own internal process documents
instead of including detailed process documentation within their plans.
Subcontractors or test houses will be assessed by the plan owner on the relevant parts of 4.1
to 4.9 as agreed with the plan owner
This component management Technical Specification is intended for aerospace users of
electronic components. This Technical Specification is not intended for use by the
manufacturers of electronic components. Components selected and managed according to the
requirements of a plan compliant to this Technical Specification may be approved by the
concerned parties for the proposed application, and for other applications with equal or less
severe requirements.
Organizations that prepare such plans may prepare a single plan, and use it for all relevant
products supplied by the organization, or may prepare a separate plan for each relevant
product or customer.
– 8 – TS 62239-1 © IEC:2012(E)
PROCESS MANAGEMENT FOR AVIONICS –
MANAGEMENT PLAN –
Part 1: Preparation and maintenance of an
electronic components management plan

1 Scope
This part of the IEC/TS 62239 series defines the requirements for developing an Electronic
Components Management Plan (ECMP) to assure customers and regulatory agencies that all
of the electronic components in the equipment of the plan owner are selected and applied in
controlled processes compatible with the end application and that the technical requirements
detailed in Clause 4 are accomplished. In general, the owners of a complete electronic
components management plan are avionics equipment manufacturers. This part of the
IEC/TS 62239 series provides the minimum requirements for system development assurance
levels according to levels A, B and C of the DO-254 A, B and C for flight equipment.
Although developed for the avionics industry, this process may be applied by other industrial
sectors.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC/TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
IEC/TR 62240, Process management for avionics – Use of semiconductor devices outside
manufacturers' specified temperature range
IEC 62396-1, Process management for avionics – Atmospheric radiation effects – Part 1:
Accommodation of atmospheric radiation effects via single event effects within avionics
electronic equipment
IEC/TS 62396-2, Process management for avionics – Atmospheric radiation effects – Part 2:
Guidelines for single event effects testing for avionics systems
IEC/TS 62396-3, Process management for avionics – Atmospheric radiation effects – Part 3:
Optimising system design to accommodate the single event effects (SEE) of atmospheric
radiation
IEC/TS 62396-4, Process management for avionics – Atmospheric radiation effects – Part 4:
Guidelines for designing with high voltage aircraft electronics and potential single event
effects
IEC/TS 62396-5, Process management for avionics – Atmospheric radiation effects – Part 5:
Guidelines for assessing thermal neutron fluxes and effects in avionics systems

TS 62239-1 © IEC:2012(E) – 9 –
IEC 62402, Obsolescence management – Application guide
IEC/TS 62564-1, Process management for avionics Aerospace qualified electronic
components (AQEC) – Part 1: Integrated circuits and discrete semiconductors
IEC/PAS 62647-1, Process management for avionics – Aerospace and defence electronic
systems containing lead-free solder – Part 1: Lead-free management
IEC/TS 62647-1 , Process management for avionics – Aerospace and defence electronic
systems containing lead-free solder – Part 1: Preparation for a lead-free control plan
IEC/PAS 62647-2, Process management for avionics – Aerospace and defence electronic
systems containing lead-free solder – Part 2: Mitigation of the deleterious effects of tin
IEC/TS 62647-2 , Process management for avionics – Aerospace and defence electronic
systems containing lead-free solder – Part 2: Mitigation of the deleterious effects of tin
IEC/TS 62668-1, Process management for avionics – Counterfeit prevention – Part 1:
Avoiding the use of counterfeit, fraudulent and recycled electronic components
IEC/PAS 62686-1, Process management for avionics – Aerospace qualified electronic
components (AQEC) – Part 1: General requirements for high reliability integrated circuits and
discrete semiconductors
IEC/TS 62686-1 , Process management for avionics – Aerospace qualified electronic
components (AQEC) – Part 1: General requirements for high reliability integrated circuits and
discrete semiconductors
ISO 9000:2005, Quality management systems – Fundamentals and vocabulary
JEP 149:2004, JEDEC Standard, Application Thermal Derating Methodologies
JESD 47, JEDEC Standard, Stress – Test-driven qualification of integrated circuits
JESD 94.01, JEDEC Standard, Application Specific Qualification Using Knowledge Based
Test Methodology
MIL-HDBK-263, Revision B, Electrostatic Discharge Control Handbook
AEC–Q100, Failure Mechanism based Stress Test Qualification for Integrated Circuits
AEC–Q101, Stress Test Qualification for Automotive Grade Discrete Semiconductors
AEC–Q200, Stress Test Qualification for Passive components
SAE AS5553, Counterfeit Electronic Parts, Avoidance, Detection, Mitigation, and Disposition
ANSI/GEIA-STD-0002-1, Aerospace Qualified Electronic Component (AQEC) Volume 1 –
Integrated Circuits and Semiconductors
___________
To be published. This will supersede the PAS document.
To be published. This will supersede the PAS document.
To be published. This will supersede the PAS document.

– 10 – TS 62239-1 © IEC:2012(E)
ANSI/GEIA-STD-0005-1, Performance Standard for Aerospace and Military Electronic
Systems Containing Lead-Free Solder
ANSI/GEIA-STD-0005-2, Standard for Mitigating the Effects of Tin Whiskers in Aerospace and
High Performance Electronic Systems
GIFAS/5052/2008, Guide for managing electronic component sourcing through non franchised
distributors. Preventing fraud and counterfeiting
AS/EN/JISQ 9100 Quality Management Systems-Requirements for Aviation Space and
Defense Organizations
IPC/JEDEC J-STD-20, Moisture/Reflow Sensitivity Classifications
3 Terms, definitions and abbreviations
For the purposes of this document, the following terms, definitions and abbreviations apply.
In their plan, plan owners may use alternative definitions consistent with convention in their
company.
3.1 Terms and definitions
3.1.1
environment
applicable environmental conditions (as described per the equipment specification) that the
equipment is able to withstand without loss or degradation in equipment performance
throughout its manufacturing cycle and maintenance life (the length of which is defined by the
equipment manufacturer in conjunction with customers)
3.1.2
purchased
bought outside the plan owner organization, from an independent supplier
Note 1 to entry: This indicates that the plan owner does not manufacture this in-house
3.1.3
capable
capacity of a component to be used successfully in the intended application
3.1.4
certified
assessed and compliant to an applicable 3rd party
3.1.5
characterization
process of testing a sample of components to determine the key electrical parameter values
that can be expected of all produced components of the type tested
3.1.6
component application
domain of use where the component meets the design requirements
3.1.7
component manufacturer
organization responsible for the component specification and its production

TS 62239-1 © IEC:2012(E) – 11 –
3.1.8
component obsolescence
absence of availability of a component which is not procurable due to the manufacturer(s)
ceasing production
Note 1 to entry: Component obsolescence management is considered as an element of component dependability
3.1.9
component qualification
process used to demonstrate that the component is capable of meeting its specification for all
the required conditions and environments
3.1.10
component quality assurance
activities and processes to provide adequate confidence that each individual component
meets the performance and environmental requirements
3.1.11
component selection
process of choosing a specific component for a specific application
3.1.12
component standardization
process of developing and agreeing by consensus on uniform engineering criteria for products
and methods for achieving compatibility, interoperability, interchangeability, or commonality of
material
Note 1 to entry: Standardization is used to reduce proliferation of parts into inventory.
3.1.13
counterfeit
practice of producing products which are imitations or are fake goods or services and,
therefore, infringes the intellectual property rights of the original manufacturer.
Note 1 to entry: Counterfeiting is illegal and generally relates to wilful trade mark infringement
3.1.14
fraudulent
produced or distributed in violation of the law
EXAMPLE Fraudulent parts include but are not limited to:
a) parts which do not contain the proper internal construction (die, manufacturer, wire bonding etc.),
b) parts which have been used refurbished or reclaimed but represented as new product,
c) parts which have different package style or surface plating/finish than the ordered parts,
d) parts which have not successfully completed the original component manufacturer's full production and test
flow but are represented as the completed product,
e) parts sold as upscreened parts which have not successfully completed upscreening,
f) parts sold with modified labelling or markings intended to misrepresent the part’s form, fit, function or grade,
g) parts which have been refinished, upscreened or uprated and have been identified as such, and are submitted
as compliant parts, are not considered fraudulent (SAE AS5553, IEC/TS 62668-1:2012, definition),
h) pieces rejected at manufacturing level which meet the definition of a counterfeit part.
Note 1 to entry: This includes stolen electronic components, components scrapped by the original component
manufacturer or by any user, disassembled components salvaged and resold as new components, counterfeit
components, copies, imitations, full or partial substitutes of brands, designs, models, patents, software or copyright
for example: components whose production and distribution are not controlled by the original manufacturer,
unlicensed copies of a design, disguised components (remarking of the original manufacturer name, reference
date/code or other identifiers etc.) components without chips or chips other than of the original manufacturers'
chips.
– 12 – TS 62239-1 © IEC:2012(E)
3.1.15
dependability
capability of a product enabling it to achieve the specified functional performance at the
appropriate time and for the planned duration, without damage to itself or its environment
Note 1 to entry: Dependability is generally characterised by the following four parameters: reliability,
maintainability, availability, safety.
3.1.16
franchised distributor
individual or organization that is legally independent from the franchiser (in this case the
electronic component manufacturer or OCM) and who agrees under contract to distribute
products under the franchiser’s name and sales network
3.1.17
Electronic Components Management Plan
ECMP
equipment manufacturer's document that defines the processes and practices for applying
components to an equipment or range of equipment and which generally addresses all
relevant aspects of controlling components during system design, development, production,
and post-production support
3.1.18
electronic components
electronic parts
piece parts
electrical or electronic devices that are not subject to disassembly without destruction or
impairment of design use.
EXAMPLE Resistors, capacitors, diodes, integrated circuits, hybrids, application specific integrated circuits,
wound components and relays.
3.1.19
electronic equipment
functioning electronic device produced by the plan owner, which incorporates electronic
components
EXAMPLE End items, sub-assemblies, line-replaceable units and shop-replaceable units.
3.1.20
flight equipment
equipment used for the active flying of the aircraft (UAV etc.) and associated with active flying
of the aircraft such as flight recorders, etc.
Note 1 to entry: This excludes equipment fitted to the aircraft not actively involved with the flying of the aircraft,
such as in-flight entertainment, galley equipment, etc.
3.1.21
may
indicates a course of action which is permissible within the limits of this Technical
Specification
3.1.22
obsolete component
component which is no longer manufactured, and may or may not still be available
3.1.23
package type
generic package family describing the physical outline and lead style
EXAMPLE Plastic quad flat-package, ball grid array, chip scale package, SOIC package, SOT23, etc.

TS 62239-1 © IEC:2012(E) – 13 –
3.1.24
plan owner
original design authority responsible for all aspects of the design, functionality and reliability
of the delivered equipment in the intended application and is responsible for writing and
maintaining their specific ECMP
3.1.25
risk
measure of the potential inability to achieve overall program objectives within defined cost,
schedule, and technical constraints
3.1.26
risk management
act or practice of dealing with risk that includes planning for risk, assessing (identifying and
analysing) risk areas, developing risk handling options, monitoring risks to determine how
risks have changed, and documenting the overall risk management program
3.1.27
shall
indicates a requirement
3.1.28
should
indicates that, among several possibilities, one is recommended as particularly suitable,
without mentioning or excluding others; or that a certain course of action is preferred but not
necessarily required; or that (in the negative form) a certain course of action is discouraged
but not prohibited
3.1.29
single event effect
response of a component caused by the impact of galactic cosmic rays, solar enhanced
particles and/or energetic neutrons and protons
Note 1 to entry: The range of responses can include both non-destructive (for example upset) and destructive (for
example latch-up or gate rupture) phenomena.
3.1.30
subcontractor assembly facilities
location where subcontractor conducts assembly processes and uses approved test
equipment to the plan owners drawings and bills of material and test specifications without
owning the intellectual property rights to the equipment
3.1.31
subcontractor
person or entity to whom the holder of obligations under a contract has delegated part or all of
such obligations
3.1.32
substitute component
component used as a replacement in equipment after the equipment design has been
approved
Note 1 to entry: In some contexts, the term “alternate component” is used to describe a substitute component that
is equal to or better than the original component.
3.1.33
validation
method of qualifying components at the equipment manufacturer, when no in service data
from prior use is available and there is no manufacturer’s qualification data to analyse

– 14 – TS 62239-1 © IEC:2012(E)
3.2 Abbreviations
AQEC Aerospace Qualified Electronic Component (see IEC 62564-1)
COTS Commercial Off The Shelf
DSCC Defence Supply Centre Columbus
ECMP Electronic Components Management Plan
EMC Electromagnetic Compatibility
ESS Environmental Stress Screening
IECQ International Electrotechnical System Quality
NSI National Supervising Inspectorate
OEM Original Equipment Manufacturer
OCM Original Component Manufacturer
PCN Part Change Notice
UAV Unmanned Avionic Vehicle
4 Technical requirements
4.1 General
The plan shall document the processes used by the plan owner to accomplish the following
requirements. These requirements shall apply to all electronic components, including off-the-
shelf components, which are defined by the component manufacturer's data sheet, and
custom components, which are defined by the original equipment manufacturer:
a) component selection;
b) component application;
c) component qualification;
d) component quality assurance;
e) component dependability;
f) component compatibility with the equipment manufacturing process;
g) component data;
h) configuration control.
The plan shall state clearly, concisely, and unambiguously:
• what the plan owner does to accomplish each of the requirements;
• how compliance to the plan is demonstrated; and
• the evidence that is available to show that the requirements have been accomplished.
The plan shall document the processes used to address each of the requirements listed
above and described in 4.1 to 4.9 depending on program or product line requirements and the
plan owner may, with appropriate justification, amend the above list of requirements by adding
or deleting requirements. If this is done, then the plan shall be assessed according to the
amended list of requirements stated in the plan.
The only type of amendment permitted is to add or delete entire requirements (those
designated and described in 4.1 to 4.9). Modification of any of the requirements listed above
and described in this clause is not permitted.
All the requirements given in this clause apply to equipment as stated in 5.6. The above
requirements may be satisfied by either the Original Equipment Manufacturer (OEM plan
owner) or may be subcontracted. In either case, the OEM shall satisfy and demonstrate
compliance to all requirements.

TS 62239-1 © IEC:2012(E) – 15 –
If part or all of the equipment design/manufacturing is designed or manufactured by a
subcontractor, the plan owner shall document how the subcontractor is managed, maintaining
compliance with the applicable clauses of IEC/TS 62239-1.
Table C.1 provides guidelines for environmental protection techniques to be considered
during the avionics design process.
Ground support test equipment, flight demonstrator assemblies, and prototypes are typically
exempt from these requirements, unless the plan owner states otherwise in their plan (see
5.6).
The plan shall satisfy the requirements of this clause with objective evidence, regardless of
the source from which the plan owner obtains components.
NOTE
– An ECMP plan can be certified by an international third party organization like IECQ (or other).
– Subcontractors' ECMP plan can be audited by the OEM and/or his customer. Information regarding skills of the
auditor and his training can be found, for example, in applicable sections of IECQ documents: IECQ 03-4,
IECQ OD 702 and IECQ OD 703.
– The supplier can get objective evidence that the subcontractors products satisfies the requirements of
IEC/TS 62239-1, according to tests or analyses conducted by either the supplier or the subcontractor, and
approved by the customer.
4.2 Component selection
All components shall be selected according to documented processes and shall satisfy the
requirements of this subclause regardless of additional criteria such as standardisation, order
of preference, etc. The termination finish of all components shall be identified and the risk of
any lead-free finishes assessed (see 4.3.8).
Because of the highly individual nature of most plan owners’ administrative processes, no
detail is included here. Component selection can include the use of a preferred COTS
component list, provided the requirements of this subclause are met when the components
are placed onto the standard list. Components should then be selected from the standard list
for use in specific applications. The selection process may include levels of preference. This
may refer to another process document describing how parts are selected. A preference list
can be included in a contract document.
It is recommended that component selection utilizes the following criteria:
– number of component types be minimised;
– components be selected from those readily available and produced in large volume;
– components be selected from those in a preferred stage of their lifecycle.
The conditions for use of the component shall be adequately identified, from the component
specification based on the component manufacturer’s data sheet and any additional
requirements to ensure suitability in the end application.
Availability and level of obsolescence risk should be considered as major component
selection criteria.
Components shall be selected within temperature ranges in excess or matching the
temperature range required in the application, see 4.3.4.
Components which meet the requirements of IEC/PAS 62686-1 or IEC/TS 62686-1 that will
supersede IEC/PAS 62686-1 need to be applied in avionics applications with caution as they
may not necessarily meet the full requirements of 4.3 (component application) and 4.6
(component availability and associated risk assessment). In some applications an AQEC
component in conformity with IEC/TS 62564-1 or custom component with special design

– 16 – TS 62239-1 © IEC:2012(E)
characteristics or special screening may be required instead. Users need to demonstrate why
IEC/PAS 62686-1 or IEC/TS 62686-1 that will supersede IEC/PAS 62686-1 components can
be successfully used in avionics applications. Such demonstrations may include (1) the
analysis of component field history of similar equipment in similar avionics applications, (2)
unit qualification testing of similar equipment, (3) component qualification testing, (4) other
analysis etc.
The use of AQEC components to IEC/TS 62564-1 or GEIA-STD-0002-1 (see 4.4.5.3.1) may
be considered where there are no off-the-shelf components available which will operate within
the temperature limits required.
If additional performance is required (for example upscreening, uprating, additional
parameters defined), then the component shall be considered as a specific one and shall be
uniquely identified. (See thermal analysis, 4.3.4.)
Each selected component shall be comprehensively identified within the selection process.
• For off-the-shelf components, as a minimum, the component manufacturer's data sheet,
technical and application notes, packaging, reliability and availability data, productibility
data (including storage, soldering conditions, etc.), lead-free status and lead-free
termination finish shall be identified.
• For components specified by the equipment manufacturer, the specific documentation
(including specification, manufacturer data and process, reliability, specific tests and
screening, and associated in-house continuous monitoring) shall be identified.
4.3 Component application
4.3.1 General
Listed here are some categories of component application processes that may be
documented in a plan. Not all of the categories listed below are relevant to every component
application; therefore, the requirements listed below are applicable only if relevant to the
given application. The plan shall document the processes that are expected to be applicable
to the majority of the plan owner’s products, with the understanding that some of the
documented processes may not be used for specific programs or specific functionality of
products.
In each case, the documented processes shall verify if the equipment containing the
component shall continue to meet its performance requirements and specifications throughout
the manufacturing, full service storage, and operating lifetime. In order to determine design
suitability of equipment, there shall be a formal design review. At the design review,
consideration for each component shall be given to all design aspects including those given in
4.3.7 to 4.3.9.
The following application processes are not specific to an individual component, but are
typically encountered when the component is placed into a circuit assembly.
A documented report shall be prepared against each of the following design aspects:
4.3.2 Electromagnetic compatibility (EMC)
EMC is demonstrated by analysis, testing and simulation to customer requirements. The
component performance shall be capable of EMC compliance at equipment level.
Certain components, for example high power switching components, may produce more
electromagneti
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