IEC TS 62239-1:2015

IEC TS 62239-1 ®
Edition 2.0 2015-04
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Management plan –
Part 1: Preparation and maintenance of an electronic components management
plan
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IEC TS 62239-1 ®
Edition 2.0 2015-04
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Management plan –

Part 1: Preparation and maintenance of an electronic components management

plan
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-2608-7

– 2 – IEC TS 62239-1:2015 © IEC 2015

CONTENTS
FOREWORD . 4

INTRODUCTION . 6

1 Scope . 7

2 Normative references . 7

3 Terms, definitions and abbreviations . 7

3.1 Terms and definitions . 8

3.2 Abbreviations . 12
4 Technical requirements . 13
4.1 General . 13
4.2 Component selection . 14
4.2.1 General. 14
4.2.2 Application conditions for use . 14
4.2.3 Availability and durability . 14
4.2.4 Additional performance . 14
4.2.5 Component identification . 14
4.3 Component application . 15
4.3.1 General. 15
4.3.2 Electromagnetic compatibility (EMC) . 15
4.3.3 Derating and stress analysis . 15
4.3.4 Thermal analysis . 16
4.3.5 Mechanical analysis . 17
4.3.6 Testing, testability, and maintainability . 17
4.3.7 Avionics radiation environment . 18
4.3.8 Management of lead-free termination finish and soldering . 18
4.3.9 Counterfeited, fraudulent and recycled component avoidance . 18
4.3.10 Moisture and corrosion . 19
4.3.11 Additional customer related application requirements . 19
4.4 Component qualification . 19
4.4.1 General. 19
4.4.2 Minimum component qualification requirements . 20
4.4.3 Original component manufacturer quality management . 20
4.4.4 Original component manufacturer process management approval . 20

4.4.5 Demonstration of component qualification . 20
4.4.6 Qualification of components from a supplier that is not qualified . 22
4.4.7 Distributor process management approval . 22
4.4.8 Subcontractor assembly facility quality and process management
approval . 23
4.5 Continuous component quality assurance . 23
4.5.1 General quality assurance requirements . 23
4.5.2 On-going component quality assurance . 23
4.5.3 Plan owner in-house continuous monitoring . 24
4.5.4 Component design and manufacturing process change monitoring . 24
4.6 Component dependability . 25
4.6.1 General. 25
4.6.2 Component availability and associated risk assessment . 25
4.6.3 Component obsolescence . 25

4.6.4 Proactive measures . 26

4.6.5 Component obsolescence awareness . 26

4.6.6 Reporting . 26

4.6.7 Semiconductor reliability and wear out . 26

4.6.8 Reliability assessment . 26

4.7 Component compatibility with the equipment manufacturing process . 27

4.8 Component data . 27

4.8.1 General. 27

4.8.2 Minimum component data requirements . 28

4.9 Configuration control . 28

4.9.1 General. 28
4.9.2 Alternative components. 29
4.9.3 Alternative sources . 29
4.9.4 Equipment change documentation . 29
4.9.5 Customer notifications and approvals . 29
4.9.6 Focal organization . 30
5 Plan administration requirements . 30
5.1 Plan organization . 30
5.2 Plan terms and definitions . 30
5.3 Plan focal point . 30
5.3.1 Primary interface . 30
5.3.2 Plan focal point responsibilities . 30
5.4 Plan references. 30
5.5 Plan applicability . 30
5.6 Plan implementation . 31
5.6.1 ECMP compliance . 31
5.6.2 Plan objectives . 31
5.6.3 Plan owner subcontracted activities . 31
5.7 Plan acceptance . 31
5.8 Plan maintenance . 31
Annex A (informative) Requirement matrix for IEC TS 62239-1 . 32
Annex B (informative) Typical qualification requirements and typical component
minimum qualification requirements . 53
Annex C (informative) Semiconductor reliability and wear out . 57
Annex D (informative) Guidelines for environmental protection techniques and for

comparison of components specifications . 58
Bibliography . 73

Figure 1 – Suspect components perimeter . 19

Table A.1 – Requirements matrix . 32
Table B.1 – Typical qualification requirements and typical component minimum
qualification requirements . 54
Table D.1 – Environmental protection techniques to be considered during the avionics
design process . 58
Table D.2 – Guidelines for the comparison of internationally available component
specifications – Microcircuits . 63

– 4 – IEC TS 62239-1:2015 © IEC 2015

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
PROCESS MANAGEMENT FOR AVIONICS –

MANAGEMENT PLAN –
Part 1: Preparation and maintenance of an

electronic components management plan

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the
...