IEC TS 62239-1:2015

IEC TS 62239-1 ®
Edition 2.0 2015-04
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Management plan –
Part 1: Preparation and maintenance of an electronic components management
plan
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IEC TS 62239-1 ®
Edition 2.0 2015-04
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Management plan –

Part 1: Preparation and maintenance of an electronic components management

plan
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-2608-7

– 2 – IEC TS 62239-1:2015 © IEC 2015

CONTENTS
FOREWORD . 4

INTRODUCTION . 6

1 Scope . 7

2 Normative references . 7

3 Terms, definitions and abbreviations . 7

3.1 Terms and definitions . 8

3.2 Abbreviations . 12
4 Technical requirements . 13
4.1 General . 13
4.2 Component selection . 14
4.2.1 General. 14
4.2.2 Application conditions for use . 14
4.2.3 Availability and durability . 14
4.2.4 Additional performance . 14
4.2.5 Component identification . 14
4.3 Component application . 15
4.3.1 General. 15
4.3.2 Electromagnetic compatibility (EMC) . 15
4.3.3 Derating and stress analysis . 15
4.3.4 Thermal analysis . 16
4.3.5 Mechanical analysis . 17
4.3.6 Testing, testability, and maintainability . 17
4.3.7 Avionics radiation environment . 18
4.3.8 Management of lead-free termination finish and soldering . 18
4.3.9 Counterfeited, fraudulent and recycled component avoidance . 18
4.3.10 Moisture and corrosion . 19
4.3.11 Additional customer related application requirements . 19
4.4 Component qualification . 19
4.4.1 General. 19
4.4.2 Minimum component qualification requirements . 20
4.4.3 Original component manufacturer quality management . 20
4.4.4 Original component manufacturer process management approval . 20

4.4.5 Demonstration of component qualification . 20
4.4.6 Qualification of components from a supplier that is not qualified . 22
4.4.7 Distributor process management approval . 22
4.4.8 Subcontractor assembly facility quality and process management
approval . 23
4.5 Continuous component quality assurance . 23
4.5.1 General quality assurance requirements . 23
4.5.2 On-going component quality assurance . 23
4.5.3 Plan owner in-house continuous monitoring . 24
4.5.4 Component design and manufacturing process change monitoring . 24
4.6 Component dependability . 25
4.6.1 General. 25
4.6.2 Component availability and associated risk assessment . 25
4.6.3 Component obsolescence . 25

4.6.4 Proactive measures . 26

4.6.5 Component obsolescence awareness . 26

4.6.6 Reporting . 26

4.6.7 Semiconductor reliability and wear out . 26

4.6.8 Reliability assessment . 26

4.7 Component compatibility with the equipment manufacturing process . 27

4.8 Component data . 27

4.8.1 General. 27

4.8.2 Minimum component data requirements . 28

4.9 Configuration control . 28

4.9.1 General. 28
4.9.2 Alternative components. 29
4.9.3 Alternative sources . 29
4.9.4 Equipment change documentation . 29
4.9.5 Customer notifications and approvals . 29
4.9.6 Focal organization . 30
5 Plan administration requirements . 30
5.1 Plan organization . 30
5.2 Plan terms and definitions . 30
5.3 Plan focal point . 30
5.3.1 Primary interface . 30
5.3.2 Plan focal point responsibilities . 30
5.4 Plan references. 30
5.5 Plan applicability . 30
5.6 Plan implementation . 31
5.6.1 ECMP compliance . 31
5.6.2 Plan objectives . 31
5.6.3 Plan owner subcontracted activities . 31
5.7 Plan acceptance . 31
5.8 Plan maintenance . 31
Annex A (informative) Requirement matrix for IEC TS 62239-1 . 32
Annex B (informative) Typical qualification requirements and typical component
minimum qualification requirements . 53
Annex C (informative) Semiconductor reliability and wear out . 57
Annex D (informative) Guidelines for environmental protection techniques and for

comparison of components specifications . 58
Bibliography . 73

Figure 1 – Suspect components perimeter . 19

Table A.1 – Requirements matrix . 32
Table B.1 – Typical qualification requirements and typical component minimum
qualification requirements . 54
Table D.1 – Environmental protection techniques to be considered during the avionics
design process . 58
Table D.2 – Guidelines for the comparison of internationally available component
specifications – Microcircuits . 63

– 4 – IEC TS 62239-1:2015 © IEC 2015

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
PROCESS MANAGEMENT FOR AVIONICS –

MANAGEMENT PLAN –
Part 1: Preparation and maintenance of an

electronic components management plan

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC TS 62239-1, which is a technical specification, has been prepared by IEC Technical
Committee 107: Process management for avionics.

This second edition cancels and replaces the first edition published in 2012. This edition

constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
a) the number of “shall” requirements has been rationalized;

b) the terms “supplier”, “equipment manufacturer”, and “OEM” have been replaced by “plan

owner”;
c) the term “device” has been replaced by “component”;

d) a requirement matrix has been included in Annex A, Table A.1;
e) various specifications and standards have been updated;
f) a new subclause (4.3.5.2) on mechanical stresses generated by temperature variation has
been added;
g) a new subclause (4.3.10) on moisture and corrosion has been added.
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/245/DTS 107/258/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC TS 62239 series under the general title Process management
for avionics – Management plan, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 6 – IEC TS 62239-1:2015 © IEC 2015

INTRODUCTION
This technical specification provides the structure for avionics equipment manufacturers,

subcontractors, maintenance facilities, and other aerospace component users to develop their

own Electronic Component Management Plans (ECMPs), hereinafter also referred to as ‘plan’.

This technical specification states objectives to be accomplished. The plan is not prescriptive

and those who prepare plans in compliance with this technical specification will document

processes that are the most effective and efficient for them in accomplishing the objectives of

this technical specification. In order to allow flexibility in implementing and updating the

documented processes, plan owners are encouraged to refer to their own internal process

documents instead of including detailed process documentation within their plans.

NOTE The equipment manufacturer, often called in the industry the original equipment manufacturer (OEM) is in
general considered as the plan owner.
This component management technical specification is intended for aerospace users of
electronic components. This technical specification is not intended for use by the
manufacturers of electronic components. Components selected and managed according to the
requirements of a plan compliant with this technical specification may be approved by the
concerned parties for the proposed application, and for other applications with equal or less
severe requirements.
Organizations that prepare such plans may prepare a single plan, and use it for all relevant
products supplied by the organization, or may prepare a separate plan for each relevant
product or customer.
PROCESS MANAGEMENT FOR AVIONICS –

MANAGEMENT PLAN –
Part 1: Preparation and maintenance of an

electronic components management plan

1 Scope
This part of IEC 62239, which is a technical specification, defines the requirements for
developing an Electronic Components Management Plan (ECMP) to assure customers that all
of the electronic components in the equipment of the plan owner are selected and applied in
controlled processes compatible with the end application and that the technical requirements
detailed in Clause 4 are accomplished.
In general, the plan owner of a complete Electronic Components Management Plan is the
avionics original equipment manufacturer (OEM).
This document provides an aid in the aerospace certification process.
Although developed for the avionics industry, this process may be applied by other industrial
sectors.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 62396-1:2012, Process management for avionics – Atmospheric radiation effects – Part
1: Accommodation of atmospheric radiation effects via single event effects within avionics
electronic equipment
IEC TS 62647-1, Process management for avionics – Aerospace and defence electronic
systems containing lead-free solder – Part 1: Preparation for a lead-free control plan

IPC/JEDEC J-STD-20, Moisture/Reflow Sensitivity Classifications for Nonhermetic Solid State
Surface Mount Devices
3 Terms, definitions and abbreviations
For the purposes of this document, the following terms, definitions and abbreviations apply.
NOTE In their plan, plan owners can use alternative definitions consistent with convention in their company.
___________
A new edition is under development. It will be published soon.

– 8 – IEC TS 62239-1:2015 © IEC 2015

3.1 Terms and definitions
3.1.1
environment
applicable environmental conditions (as described per the equipment specification) that the

equipment is able to withstand without loss or degradation in equipment performance
throughout its manufacturing cycle and maintenance life (the length of which is defined by the

plan owner in conjunction with customers)

3.1.2
purchased
bought outside the plan owner organization, from an independent supplier

Note 1 to entry: This indicates that the plan owner does not manufacture this in-house.
3.1.3
capable
capacity of a component to be used successfully in the intended application
3.1.4
certified
assessed to and compliant with an applicable certification body
3.1.5
characterization
process of testing a sample of components to determine the key electrical parameter values
that can be expected of all produced components of the type tested
3.1.6
component application
domain of use where the component meets the design requirements
3.1.7
component manufacturer
organization responsible for the component specification and its production
3.1.8
component obsolescence
absence of availability of a component which is not procurable due to the manufacturer(s)
ceasing production
Note 1 to entry: Component obsolescence management is considered as an element of component dependability.

3.1.9
component qualification
process used to demonstrate that the component is capable of meeting its specification for all
the required conditions and environments
3.1.10
component quality assurance
activities and processes to provide adequate confidence that each individual component
meets the performance and environmental requirements
3.1.11
component selection
process of choosing a specific component for a specific application

3.1.12
component standardization
process of developing and agreeing by consensus on uniform engineering criteria for products

and methods for achieving compatibility, interoperability, interchangeability, or commonality of

material
Note 1 to entry: Standardization is used to reduce proliferation of components into inventory.

3.1.13
counterfeit, verb
action of simulating, reproducing or modifying a material good or its packaging without

authorization
Note 1 to entry: It is the practice of producing products which are imitations or are fake goods or services. This
activity infringes the intellectual property rights of the original manufacturer and is an illegal act. Counterfeiting
generally relates to wilful trade mark infringement.
[SOURCE: IEC TS 62668-1:2014, 3.1.4]
3.1.14
counterfeited component
material good imitating or copying an authentic material good which may be covered by the
protection of one or more registered or confidential intellectual property rights
Note 1 to entry: A counterfeited component is one whose identity or pedigree has been altered or misrepresented
by its supplier.
Identity = original manufacturer, part number, date code, lot number, testing, inspection, documentation or warranty
etc.
Pedigree = origin, ownership history, storage, handling, physical condition, previous use etc.
[SOURCE: IEC TS 62668-1:2014, 3.1.5]
3.1.15
fraudulent component
electronic component produced or distributed either in violation of regional or local law or
regulation, or with the intent to deceive the customer
Note 1 to entry: This includes, but is not limited to the following which are examples of components which are
fraudulently sold as new ones to a customer:
(1) a stolen component;
(2) a component scrapped by the original component manufacturer (OCM) or by any user;
(3) a recycled component, that becomes a fraudulent recycled component when it is a disassembled component
resold as new component (see Figure 1), where typically there is evidence of prior use and rework ( e.g.
solder, re-plating or lead re-attachment activity) on the package terminations;

(4) a counterfeit component, copy, imitation, full or partial substitute of brands;
(5) fraudulent designs, models, patents, software or copyright sold as being new and authentic. For example: a
component whose production and distribution are not controlled by the original manufacturer;
(6) unlicensed copies of a design;
(7) a disguised component (remarking of original manufacturer name, reference date/code or other identifiers
etc.), which may be a counterfeit component; see Figure 1;
(8) component without internal silicon die or with substituted silicon die which is not the original manufacturer’s
silicon die.
[SOURCE: IEC TS 62668-1:2014, 3.1.10]
3.1.16
dependability
capability of a product enabling it to achieve the specified functional performance at the
appropriate time and for the planned duration, without damage to itself or its environment

– 10 – IEC TS 62239-1:2015 © IEC 2015

Note 1 to entry: Dependability is generally characterised by the following four parameters: reliability,

maintainability, availability, safety.

3.1.17
franchised distributor or agent

individual or corporate organization that is legally independent from the franchiser (in this

case the electronic component manufacturer or OCM) and who agrees under contract to

distribute products using the franchiser’s name and sales network

Note 1 to entry: Distribution activities are carried out in accordance with standards set and controlled by the

franchiser. Shipments against orders placed can be dispatched either direct from the OCM or the franchised
distributor or agent. In other words, the franchised distributor enters into contractual agreements with one or more

electronic component manufacturers to distribute and sell said components. Distribution agreements may be

stipulated according to the following criteria: geographical area, type of clientele (avionics for example), maximum
manufacturing lot size. Components sourced through this route are protected by the OCM’s warranty and supplied
with full traceability.
[SOURCE: IEC TS 62668-1:2014, 3.1.9]
3.1.18
Electronic Components Management Plan
ECMP
plan owner's document that defines the processes and practices for applying components to
an equipment or range of equipment and which generally addresses all relevant aspects of
controlling components during system design, development, production, and post-production
support
3.1.19
electronic components
electronic parts
piece parts
electrical or electronic devices that are not subject to disassembly without destruction or
impairment of design use
Note 1 to entry: Resistors, capacitors, diodes, integrated circuits, hybrids, application specific integrated circuits,
wound components and relays are examples of electronic component.
3.1.20
electronic equipment
functioning electronic device produced by the plan owner, which incorporates electronic
components
Note 1 to entry: End items, sub-assemblies, line-replaceable units and shop-replaceable units are examples of
electronic equipment.
3.1.21
flight equipment
equipment used for the active flying of the aircraft (UAV, etc.) and associated with active
flying of the aircraft such as flight recorders, etc.
Note 1 to entry: This excludes equipment fitted to the aircraft not actively involved with the flying of the aircraft,
such as in-flight entertainment, galley equipment, etc.
3.1.22
NAND
Negative-AND
logic gate which produces, in digital electronics, an output that is false (0) only if all its inputs
are true (1) and an output true (1) if one or both inputs are false (0)

3.1.23
NOR
Negative-OR
logic gate which produces, in digital electronics, an output that is true (1) if both the inputs are

false (0) and an output false (0) if one or both inputs are true (1)

3.1.24
obsolete component
component which is no longer manufactured, and may or may not still be available

3.1.25
package type
generic package family describing the physical outline and lead style
Note 1 to entry: Plastic quad flat-package, ball grid array, chip scale package, SOIC package, SOT23, etc., are
examples of package type.
3.1.26
plan owner
original design authority responsible for all aspects of the design, functionality and reliability
of the delivered equipment in the intended application and responsible for writing and
maintaining their specific ECMP
3.1.27
recycled component
electrical component removed from its original product or assembly and available for reuse
Note 1 to entry: The component has authentic logos, trademarks and markings. However, it typically has no
output to measure the useful life remaining for its reuse. A recycled component can fail earlier than a new one
when re-assembled into another product or assembly. A recycled component may also be physically or ESD
damaged during the removal process.
[SOURCE: IEC TS 62668-1:2014, 3.1.17]
3.1.28
risk
measure of the potential inability to achieve overall program objectives within defined cost,
schedule, and technical constraints
3.1.29
risk management
act or practice of dealing with risk that includes planning for risk, assessing (identifying and
analysing) risk areas, developing risk handling options, monitoring risks to determine how

risks have changed, and documenting the overall risk management program
3.1.30
single event effect
SEE
response of a component caused by the impact of a single particle (for example galactic
cosmic rays, solar energetic particles, energetic neutrons and protons)
Note 1 to entry: The range of responses can include both non-destructive (for example upset) and destructive (for
example latch-up or gate rupture) phenomena.
[SOURCE: IEC 62396-1:2012, 3.48]
3.1.31
subcontractor assembly facilities
location where the subcontractor conducts assembly processes and uses approved test
equipment to the plan owners drawings and bills of material and test specifications without
owning the intellectual property rights to the equipment

– 12 – IEC TS 62239-1:2015 © IEC 2015

3.1.32
subcontractor
person or entity to whom the holder of obligations under a contract has delegated part or all of

such obligations
3.1.33
substitute component
component used as a replacement in equipment after the equipment design has been

approved
Note 1 to entry: In some contexts, the term “alternate component” is used to describe a substitute component that
is equal to or better than the original component.

3.1.34
suspect component
electronic component which has lost supply chain traceability back to the original
manufacturer and which may have been misrepresented by the supplier or manufacturer and
may meet the definition of fraudulent or counterfeit component
Note 1 to entry: Suspect components may include but are not limited to:
(1) counterfeit components;
(2) recycled components coming from uncontrolled recycling operations carried outside of the OEM. Franchised
network and OEM business where typically it has been fraudulently sold to the OEM as being in a new
unused condition.
[SOURCE: IEC TS 62668-1:2014, 3.1.21]
3.1.35
validation
method of qualifying components at the plan owner, when no in-service data from prior use is
available and there is no manufacturer’s qualification data to analyse
3.2 Abbreviations
AQEC Aerospace qualified electronic component (see IEC TS 62564-1)
BGA Ball grid array (related to an electronic component package)
COTS Commercial off the shelf
DDR Double data rate
DMSMS Diminishing manufacturing sources and materials shortages
DPMO Defects per million opportunities
DRAM Dynamic random access memory

DLA Defence Logistics Agency
DSCC  Defence Supply Centre Columbus (now known as the DLA)
ECMP Electronic Components Management Plan
EM Electro-migration
EMC Electromagnetic compatibility
ESS Environmental stress screening
FPGA Field-programmable gate array
H3TRB High humidity, high temperature reverse bias
HAST Highly accelerate stress testing
HCI Hot carrier injection
HTOL High temperature operating life
HTRB High temperature reverse bias

IATF International Automotive Task Force

IECQ International electrotechnical system quality

ILD Inter-level dielectric
IMD Intra-metal dielectric
JEDEC Joint Electron Device Engineering Council

LCC Leadless chip carrier (related to an electronic component package)

MRAM Magnetic random access memory

OEM Original equipment manufacturer

OCM Original component manufacturer
PCB Printed circuit board
PCN Product/process change notice (in this abbreviation “Product” stands for
“electronic component”)
RH Relative humidity
SDRAM Synchronous dynamic random access memory
SEE Single event effects
SMT Surface-mount technology
SRAM Static random access memory
STACK STACK International, a non-profit consortium
TDDB Time dependent dielectric breakdown
THB Temperature humidity bias
UAV Unmanned avionic vehicle
4 Technical requirements
4.1 General
The plan shall document the processes used by the plan owner to accomplish the following
requirements which apply to all electronic components, including off-the-shelf components,
which are defined by the component manufacturer's data sheet, and custom components,
which are defined by the plan owner:
a) component selection;
b) component application;
c) component qualification;
d) component quality assurance;
e) component dependability;
f) component compatibility with the equipment manufacturing process;
g) component data;
h) configuration control.
Table A.1 provides a requirements matrix that may be used to document the accomplishments
of the technical requirements for this part of IEC TS 62239-1.
Table D.1 provides guidelines for environmental protection techniques to be considered
during the avionics design process.

– 14 – IEC TS 62239-1:2015 © IEC 2015

4.2 Component selection
4.2.1 General
All components shall be selected according to documented processes and satisfy the
requirements of 4.2 regardless of additional criteria such as standardisation, order

of preference, etc.
Because of the highly individual nature of most plan owners’ administrative processes, no

detail is included here. Component selection can include the use of a preferred COTS

component list, provided the requirements of 4.2 are met when the components are placed

onto the standard list. Components should then be selected from the standard list for use in

specific applications. The selection process may include levels of preference. This may refer
to another process document describing how components are selected. A preference list can
be included in a contract document.
It is recommended that component selection utilize the following criteria:
– minimal number of component types;
– selection of components from those readily available and produced in large volume;
– selection of components from those in a preferred stage of their lifecycle.
4.2.2 Application conditions for use
The conditions for use of the component shall be adequately identified from the component
specification based on the component manufacturer’s data sheet and any additional
requirements to ensure suitability in the end application.
4.2.3 Availability and durability
From the selection level, availability and durability shall be considered as major component
selection criteria.
4.2.4 Additional performance
Components shall be selected within temperature ranges in excess of or matching the
temperature range required in the application, see 4.3.4.
Components which meet the requirements of IEC TS 62686-1 need to be applied in avionics
applications with caution as they may not necessarily meet the full requirements of 4.3
(component application) and 4.6 (component dependability). In some applications an AQEC
component in conformity with IEC TS 62564-1 or a custom component with special design
characteristics or special screening may be required instead. Users need to demonstrate why

IEC TS 62686-1 components can be successfully used in avionics applications. Such
demonstrations may include (1) the analysis of component field history of similar equipment in
similar avionics applications, (2) unit qualification testing of similar equipment, (3) component
qualification testing, (4) other analysis etc.
The use of AQEC components to IEC TS 62564-1 (see 4.4.5.3.2.3) may be considered where
there are no off-the-shelf components available which will operate within the temperature
limits required.
If additional performance is required (for example upscreening, uprating, additional
parameters defined), then the component shall be considered as a specific one and be
uniquely identified. (See thermal analysis, 4.3.4.)
4.2.5 Component identification
Each selected component shall be comprehensively identified within the selection process.

NOTE Associated component data and information are addressed in 4.8.2.

4.3 Component application
4.3.1 General
4.3.1.1 Application processes
Listed here are some categories of component application processes that may be

documented in a plan. Not all of the categories listed below are relevant to every component

application; therefore, the requirements listed below are applicable only if relevant to the
given application. The plan shall:

1) Document the processes that are expected to be applicable to the majority of the plan
owner’s products, with the understanding that some of the documented processes may not
be used for specific programs or specific functionality of products.
2) Verify if the equipment containing the component is capable of continuing to meet its
performance requirements and specifications throughout the manufacturing, full service
storage, and operating lifetime.
Table D.1 provides more information on environmental protection techniques which may be
relevant.
4.3.1.2 Design reviews
In order to determine the design suitability of equipment, there shall be a formal design review
where the application technical design aspects given below in 4.3.2 to 4.3.11 are documented
for each component.
The following application processes are not specific to an individual component, but are
typically encountered when the component is placed into a circuit assembly.
4.3.2 Electromagnetic compatibility (EMC)
EMC is demonstrated by analysis, testing and simulation to customer requirements. The
component performance shall be capable of EMC compliance at equipment level.
Certain components, for example high power switching components, may produce more
electromagnetic signal than other types and additionally certain components can be more
susceptible to electromagnetic interference than others. EMC aspects at electronic
component level have been addressed in the IEC 61967 series and IEC 62132 series. Testing
is typically carried out at electronic equipment level.

4.3.3 Derating and stress analysis
4.3.3.1 Verification of derating criteria
The documented processes shall verify that the component is used within the operating limits
specified by the original component manufacturer according to a documented set of derating
criteria, based wherever possible on the component manufacturer’s derating criteria and
methods and thereafter using the plan owner’s appropriate derating criteria and methods.
4.3.3.2 Failure to meet der
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