IEC 62668-1:2019
(Main)Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components
Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components
IEC 62668-1:2019 defines requirements for avoiding the use of counterfeit, recycled and fraudulent components used in the aerospace, defence and high performance (ADHP) industries. It also defines requirements for ADHP industries to maintain their intellectual property (IP) for all of their products and services. The risks associated with purchasing components outside of franchised distributor networks are considered in IEC 62668-2. Although developed for the avionics industry, this document can be applied by other high performance and high reliability industries at their discretion.
This first edition cancels and replaces the third edition of IEC TS 62668-1 published in 2016. This edition includes the following significant technical changes with respect to the previous edition:
a) added a reference to AS/EN/JISQ 9100 and AS/EN/JISQ 9110 which contain anti-counterfeit requirements
b) added reference to USA DFAR rule 252.246.7008 and to UK Defence Standard 05-135;
c) added reference to more GAO, OECD and ICC reports
d) updated weblinks and other references;
e) added new Annex E with figures describing how anti-counterfeit documents can be used in supply chains;
f) added a reference to the new IECQ OD 3702 traceability audit;
g) added new definition for re-manufactured components with a warning that these are not recommended.
Gestion des processus pour l'avionique - Prévention de la contrefaçon - Partie 1: Prévention de l'utilisation de composants électroniques contrefaits, frauduleux et recyclés
l'IEC 62668-1:2019 définit les exigences permettant d'éviter l'utilisation de composants contrefaits, recyclés et frauduleux dans le secteur de l'aérospatial, de la défense et des hautes performances (ADHP). Elle définit également les exigences permettant de maintenir la propriété intellectuelle de tous les produits et services utilisés dans ce même secteur. Les risques associés à l'achat de composants en dehors des réseaux de distributeurs franchisés sont pris en compte dans l'IEC 62668-2. Bien que développé pour l'industrie avionique, le présent document peut être appliqué par d'autres secteurs à hautes performances et à haute fiabilité s’ils le souhaitent.
Cette première édition annule et remplace la troisième édition de l'IEC TS 62668-1 parue en 2016. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) ajout d'une référence à l'AS/EN/JISQ 9100 et l'AS/EN/JISQ 9110, qui contiennent les exigences de prévention de la contrefaçon
b) ajout d'une référence à la règle 252.246.7008 de la DFAR (Etats-Unis) et à la Defence Standard 05-135 (Royaume-Uni);
c) ajout d'une référence à plusieurs rapports du GAO, de l'OCDE et de la CCI;
d) mise à jour de liens Internet et d'autres références;
e) ajout de la nouvelle Annexe E contenant des figures représentant la manière dont les documents de prévention de la contrefaçon peuvent être utilisés dans les chaînes d'approvisionnement;
f) ajout d'une référence au nouvel audit de traçabilité OD 3702 de l'IECQ;
g) ajout d'une nouvelle définition pour les composants refabriqués avec un avertissement précisant que ces composants ne sont pas recommandés.
General Information
Relations
Overview - IEC 62668-1:2019 (Process management for avionics - Counterfeit prevention)
IEC 62668-1:2019 defines organizational and technical requirements to avoid the use of counterfeit, fraudulent and recycled electronic components in the avionics, aerospace, defence and high-performance (ADHP) industries. The standard also requires measures to protect and maintain intellectual property (IP) for products and services. Although developed for avionics, the standard is applicable to other high-reliability industries that need robust counterfeit-prevention and supply‑chain controls.
This consolidated edition includes amendments up to 2024 and replaces the earlier IEC TS 62668-1 (2016). Significant technical updates include new references to AS/EN/JISQ 9100/9110, DFARS 252.246-7008, UK Defence Standard 05-135, IECQ OD 3702 traceability audits, additional reports and weblinks, Annex E supply‑chain figures, and a new definition/warning on re-manufactured components.
Key topics and technical requirements
- Avoidance of counterfeit, fraudulent and recycled components - policies, procurement controls and acceptance criteria.
- Traceability - establishing and maintaining traceability of parts through the supply chain; causes of lost traceability and mitigation.
- Intellectual property control - definition, protection and lifecycle management of IP for avionics products and services.
- Supplier and distributor controls - franchised vs non-franchised distributor guidance, minimum accreditations, and approval processes.
- Procurement and inventory practices - buy-from-approved-sources, certificates of conformance, planning to avoid obsolescence, and approved aftermarket paths.
- Reporting and governance - procedures for suspected counterfeit/fraud reporting (FAA, EASA, national bodies) and record keeping.
- Awareness and training - anti-counterfeit training for procurement, quality and engineering staff.
- Supporting tools and schemes - references to AS/EN/JISQ 9100/9110, SAE AS5553 / AS6174 (anti-counterfeit practice), IECQ OD 3702 traceability audit, and other industry programs.
Practical applications - who uses this standard
- Avionics OEMs and Tier‑1 suppliers for procurement policies, product design protection and supplier approval.
- Quality, procurement and supply‑chain managers to implement anti‑counterfeit controls and traceability audits.
- Maintenance, repair & overhaul (MRO) organizations to validate parts authenticity and reporting processes.
- Distributors and brokers seeking accreditation and guidance on acceptable practices.
- Regulators and auditors evaluating compliance with aerospace anti‑counterfeit requirements. Because it addresses high-reliability component risk, IEC 62668-1 is also useful to defence, space, medical and industrial sectors.
Related standards and references
- AS/EN/JISQ 9100 and AS/EN/JISQ 9110 (quality & anti-counterfeit requirements)
- SAE AS5553, SAE AS6174 (anti-counterfeit implementation and material reporting)
- IECQ OD 3702 (traceability audit)
- DFARS 252.246‑7008, UK Defence Standard 05‑135 and various GAO/OECD/ICC reports
Keywords: IEC 62668-1:2019, counterfeit prevention, avionics, electronic components, supply chain traceability, aerospace, defence, intellectual property.
Standards Content (Sample)
IEC 62668-1 ®
Edition 1.1 2024-09
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
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Process management for avionics – Counterfeit prevention –
Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic
components
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IEC 62668-1 ®
Edition 1.1 2024-09
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
colour
inside
Process management for avionics – Counterfeit prevention –
Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic
components
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50, 31.020, 49.060 ISBN 978-2-8322-9708-7
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© IEC 2024
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviated terms . 8
3.1 Terms and definitions . 8
3.2 Abbreviated terms . 13
4 Technical requirements . 15
4.1 General . 15
4.2 Minimum avionics OEM requirements . 16
4.3 Intellectual property . 19
4.3.1 General . 19
4.3.2 Definition of intellectual property. 20
4.4 Counterfeit consideration . 20
4.4.1 General . 20
4.4.2 Legal definition of counterfeit . 21
4.4.3 Fraudulent components . 21
4.4.4 How to establish traceability . 21
4.4.5 Reasons for the loss of component traceability . 22
4.5 The counterfeit problem . 23
4.5.1 General . 23
4.5.2 General worldwide activities combating counterfeit issues . 23
4.5.3 Cultural differences . 24
4.5.4 Counterfeiting activities and avionics equipment . 24
4.5.5 Electronic components direct action groups . 27
4.6 Recycled components . 27
4.6.1 General . 27
4.6.2 Why the avionics industry does not use recycled components . 27
4.6.3 How recycled components become suspect and potentially fraudulent . 28
4.7 Original component manufacturer (OCM) anti-counterfeit guidelines . 28
4.7.1 General . 28
4.7.2 Chinese Reliable Electronic Component Supplier (RECS) audit scheme . 28
4.7.3 Original component manufacturer (OCM) ISO 9001 and AS/EN/JISQ
9100 Third Party Certification . 28
4.7.4 Original component manufacturer's (OCM) trademarks . 28
4.7.5 Original component manufacturer's (OCM) IP control. 29
4.7.6 Original component manufacturer's (OCM) physical part marking and
packaging marking . 29
4.7.7 The Semiconductor Industries Association Anti Counterfeit Task Force
(ACTF) . 29
4.7.8 USA Trusted Foundry Program . 30
4.7.9 USA Trusted IC Supplier Accreditation Program . 30
4.7.10 Physical unclonable function (PUF) . 30
4.7.11 Original component manufacturer (OCM) best practice . 31
4.8 Distributor minimum accreditations . 31
4.9 Distributor AS/EN/JISQ 9120 Third Party Certification . 31
4.10 Franchised distributor network . 31
4.10.1 General . 31
© IEC 2024
4.10.2 SAE AS6496 . 33
4.10.3 Control stock through tracking schemes . 33
4.10.4 Control of scrap . 33
4.10.5 RECS . 33
4.11 Non-franchised distributor anti-counterfeit guidelines . 33
4.11.1 General . 33
4.11.2 CCAP-101 certified program for independent distributor . 34
4.11.3 SAE AS6081 . 34
4.11.4 OEM managed non-franchised distributors . 34
4.11.5 Brokers . 34
4.12 Avionics OEM anti-counterfeit guidelines when procuring components . 35
4.12.1 Anti-counterfeiting general approach . 35
4.12.2 Buy from approved sources . 35
4.12.3 Traceable components . 35
4.12.4 Certificate of conformance and packing slip . 36
4.12.5 Plan and buy sufficient quantities . 36
4.12.6 Use of non- franchised distributors . 37
4.12.7 Brokers . 37
4.12.8 Contact the original manufacturer . 37
4.12.9 Obsolete components and franchised aftermarket sources . 37
4.12.10 IEC 62239-1 approved alternatives . 38
4.12.11 Product redesign . 38
4.12.12 Non traceable components . 38
4.12.13 OEM anti-counterfeit plans including SAE AS5553 and SAE AS6174 . 38
4.13 OEM anti-counterfeit guidelines for their products . 45
4.13.1 IP control . 45
4.13.2 Tamper-proofing the OEM design . 46
4.13.3 Tamper-proof labels. 46
4.13.4 Use of ASICs and FPGAs with IP protection features . 46
4.13.5 Control the final OEM product marking . 46
4.13.6 Control OEM scrap . 47
4.13.7 OEM trademarks and logos. 47
4.13.8 Control delivery of OEM products and spares and their useful life . 47
4.13.9 MRO activities . 47
4.14 Counterfeit, fraud and component recycling reporting . 48
4.14.1 General . 48
4.14.2 USA FAA suspected unapproved parts (SUP) program . 48
4.14.3 EASA . 49
4.14.4 UK counterfeit reporting . 49
4.14.5 EU counterfeit reporting . 49
4.14.6 UKEA anti-counterfeiting forum . 49
4.15 Anti-counterfeit awareness training . 49
4.16 Information to support the management of the supply chain . 49
Annex A (informative) Useful contacts . 50
A.1 World Intellectual Property Organization (WIPO) . 50
A.1.1 General . 50
A.1.2 What is WIPO? . 50
A.1.3 WIPO Intellectual Property Services . 51
A.1.4 WIPO global network on Intellectual Property (IP) Academies. 52
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A.2 Anti-Counterfeiting Trade Agreement (ACTA) . 52
A.2.1 ACTA . 52
A.2.2 Global Anti-Counterfeiting Network (GACG) . 53
A.3 World Semiconductor Council (WSC) and GAMS . 53
A.4 SEMI . 54
A.5 Electronics Authorized Directory . 55
A.6 UK . 55
A.6.1 The UK intellectual property office . 55
A.6.2 Alliance for IP . 56
A.6.3 UK Chartered Trading Standards Institute. 56
A.6.4 UK HM Revenue and Customs . 56
A.6.5 Anti-Counterfeiting Forum . 56
A.6.6 Electronic Component Supplier Network (ESCN) . 57
A.6.7 UK Ministry of Defence . 57
A.7 Europe . 57
A.7.1 Europa Summaries of EU Legislation . 57
A.7.2 Europol, the European Law Enforcement Agency. 57
A.7.3 European Patent Office . 57
A.7.4 EUIPO . 57
A.7.5 European Aviation Safety Agency (EASA) . 58
A.7.6 IECQ audit schemes . 59
A.7.7 BEAMA . 59
A.8 USA . 59
A.8.1 United States Patent and Trademark Office . 59
A.8.2 The International Trade Administration, US Department of Commerce . 60
A.8.3 International Intellectual Property Alliance . 60
A.8.4 The Federal Aviation Administration (FAA) . 60
A.8.5 Trusted Access Program Office (TAPO) . 61
A.8.6 Independent Distributors of Electronics Association (IDEA) . 61
A.8.7 ECIA formerly National Electronic Distributors Association (NEDA) . 62
A.8.8 Components Technology Institute Inc. (CTI) . 63
A.8.9 Defense Logistics Agency (DLA) . 63
A.8.10 DFARS . 63
A.8.11 IAQG . 64
A.8.12 USA Homeland Security . 64
A.9 China . 64
A.9.1 CNIPA . 64
A.9.2 Chinese Patent and Trademark Office . 64
A.9.3 China Electronics Associations: . 64
A.9.4 China Quality Certification Centre (CQC) . 64
A.9.5 Civil Aviation Administration of China (CAAC) . 64
A.9.6 China lawinfo.Co Ltd., for Law info China . 64
A.10 Japan – Japanese Patent Office (JPO) . 65
A.11 Physical unclonable function . 65
A.12 PUF and tags initiative and solutions . 66
A.12.1 The Hardware Intrinsic Security (HIS) initiative . 66
A.12.2 Examples of tag providers . 66
A.13 Examples of tamper-proof design companies . 67
A.14 Examples of FPGA die serialization . 67
© IEC 2024
A.15 Examples of NVRAM manufacturers . 67
A.16 SAE G-19 . 67
A.17 iNEMI. 72
A.18 OECD . 72
A.19 ICC . 72
A.20 Applied DNA Sciences . 72
A.21 "Safety Directors" Forum . 72
A.22 "Stop fake bearings" video . 72
A.23 Industrial company’s online anti-counterfeit awareness training . 73
A.24 Subscription based anti-counterfeit awareness training . 73
A.25 USA Government anti-counterfeit publications and awareness training . 73
A.26 IECQ WG6 . 73
A.27 Anti-counterfeiting videos . 73
Annex B (informative) Examples of aftermarket sources . 74
B.1 Examples of franchised aftermarket sources . 74
B.2 Examples of sources of franchised die which can be packaged . 74
B.3 Examples of third party custom packaging houses which provide aftermarket
solutions . 74
B.4 Examples of emulated aftermarket providers . 74
Annex C (informative) Typical example of a RECS certificate . 76
Annex D (informative) Flowchart of IEC 62668-1 requirements . 77
Annex E (Informative) Typical use of anti-counterfeit standards in supply chains . 80
Bibliography . 88
Figure 1 – Suspect components perimeter . 21
Figure 2 – Typical IEC 62668-1 and SAE AS5553 traceability requirements approach . 22
Figure D.1 – Flowchart of IEC 62668-1 requirements and their relationship to external
standards . 79
Figure E.1 – Available anti-counterfeit standards for supply chains . 80
Figure E.2 – Overview of typical relationships for anti-counterfeit standards in an
avionics supply chain . 84
Figure E.3 – Overview of typical anti-counterfeit standards in an avionics OEM supply
chain. 85
Figure E.4 – IECQ OD 3702 traceability audit . 86
Figure E.5 – Typical IECQ OD 3702 coverage in any supply chain . 87
Table 1 – Anti-counterfeit awareness training guidelines . 18
Table 2 – IEC 62668-1 requirements satisfied or not if OEM has an approved .
Table 3 – IEC 62668-1 requirements satisfied or not if OEM has an approved SAE
AS5553B AS5553D plan . 42
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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
COUNTERFEIT PREVENTION –
Part 1: Avoiding the use of counterfeit, fraudulent and
recycled electronic components
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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This consolidated version of the official IEC Standard and its amendment has been
prepared for user convenience.
IEC 62668-1 edition 1.1 contains the first edition (2019-09) [documents 107/335/CDV and
107/346A/RVC] and its amendment 1 (2024-09) [documents 107/416/FDIS and
107/421/RVD].
In this Redline version, a vertical line in the margin shows where the technical content
is modified by amendment 1. Additions are in green text, deletions are in strikethrough
red text. A separate Final version with all changes accepted is available in this
publication.
© IEC 2024
International Standard IEC 62668-1 has been prepared by IEC technical committee 107:
Process management for avionics.
This first edition cancels and replaces the third edition of IEC TS 62668-1 published in 2016.
This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) added a reference to AS/EN/JISQ 9100 and AS/EN/JISQ 9110 which contain anti-
counterfeit requirements which may be used to satisfy the requirements of 4.2;
b) added reference to USA DFAR rule 252.246.7008 and to UK Defence Standard 05-135;
c) added reference to more GAO, OECD and ICC reports in 4.5.1;
d) updated weblinks and other references;
e) added new Annex E with figures describing how anti-counterfeit documents can be used
in supply chains;
f) added a reference to the new IECQ OD 3702 traceability audit;
g) added new definition for re-manufactured components with a warning that these are not
recommended.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62668 series, published under the general title Process
management for avionics – Counterfeit prevention, can be found on the IEC website.
The committee has decided that the contents of this document and its amendment will remain
unchanged until the stability date indicated on the IEC website under webstore.iec.ch in the
data related to the specific document. At this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
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PROCESS MANAGEMENT FOR AVIONICS –
COUNTERFEIT PREVENTION –
Part 1: Avoiding the use of counterfeit, fraudulent and
recycled electronic components
1 Scope
This part of IEC 62668 defines requirements for avoiding the use of counterfeit, recycled and
fraudulent components used in the aerospace, defence and high performance (ADHP)
industries. It also defines requirements for ADHP industries to maintain their intellectual
property (IP) for all of their products and services. The risks associated with purchasing
components outside of franchised distributor networks are considered in IEC 62668-2.
Although developed for the avionics industry, this document can be applied by other high
performance and high reliability industries at their discretion.
NOTE IEC 62668 (all parts) does not address the restriction on the re-use of a component in maintenance, repair
and overhaul (MRO) operations and only addresses MRO activities when they are under the OEM’s responsibility.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 62239-1, Process management for avionics – Management plan – Part 1: Preparation and
maintenance of an electronic components management plan
IEC 62668-2, Process management for avionics – Counterfeit prevention – Part 2: Managing
electronic components from non-franchised sources
ISO 9001, Quality management systems – Requirements
AS/EN/JISQ 9100, Quality Management Systems – Requirements for Aviation, Space and
Defense Organizations
AS/EN/JISQ 9110, Quality Maintenance Systems – Aerospace – Requirements for
Maintenance Organizations
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
© IEC 2024
3.1.1
aftermarket source
reseller which may or may not be under contract with the original component manufacturer
(OCM), or is sometimes a component “re-manufacturer”, under contract with the OCM
Note 1 to entry: The reseller accumulates inventories of encapsulated or non-encapsulated (wafer) components
whose end of life date has been published by the OCM. These components are then resold at a profit to fill a need
within the market for components that have become obsolete.
3.1.2
broker
individual or corporate organization that serves as an intermediary between buyer and seller
Note 1 to entry: In the electronic component sector a broker specifically seeks to supply obsolete or hard to find
components in order to turn a profit. To do so it may accumulate an inventory of components considered to be of
strategic value or may rely on inventories accumulated by others. The broker operates within a worldwide
component exchange network.
3.1.3
COTS product
commercial off-the-shelf product
one or more components, assembled and developed for multiple commercial consumers,
whose design and/or configuration is controlled by the manufacturer’s specification or industry
standard
Note 1 to entry: COTS products can include electronic components, subassemblies or assemblies, or top level
assemblies. Electronic COTS subassemblies or assemblies include circuit card assemblies, power supplies, hard
drives, and memory modules. Top-level COTS assemblies include a fully integrated rack of equipment such as raid
arrays, file servers to individual switches, routers, personal computers, or similar equipment.
Note 2 to entry: This note applies to the French language only.
3.1.4
counterfeit, verb
action of simulating, reproducing or modifying a material good or its packaging without
authorization
Note 1 to entry: It is the practice of producing products which are imitations or are fake goods or services. This
activity infringes the intellectual property rights of the original manufacturer and is an illegal act. Counterfeiting
generally relates to wilful trademark infringement.
3.1.5
counterfeited component
material good imitating or copying an authentic material good which may be covered by the
protection of one or more registered or confidential intellectual property rights
Note 1 to entry: A counterfeited component is one whose identity or pedigree has been altered or misrepresented
by its supplier.
Identity = original manufacturer, part number, date code, lot number, testing, inspection, documentation or
warranty, etc.
Pedigree = origin, ownership history, storage, handling, physical condition, previous use, etc.
Note 2 to entry: When a material good has no registered or confidential intellectual property rights, then the
material good has no intellectual property protection. Examples include situations where the original component
manufacturer (OCM) has ceased to trade and has not sold or passed on the intellectual property rights to another
entity.
3.1.6
customer device specification
device specification written by a user and agreed by the supplier
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3.1.7
customer
user
original equipment manufacturer (OEM) which purchases electronic components, including
integrated circuits and/or semiconductor devices compliant with this document, and uses them
to design, produce, and maintain systems
3.1.8
data sheet
document prepared by the manufacturer that describes the electrical, mechanical, and
environmental characteristics of the component
3.1.9
franchised distributor or agent
individual or corporate organization that is legally independent from the franchiser (in this
case the electronic component manufacturer or OCM) and agrees under contract to distribute
products using the franchiser’s name and sales network
Note 1 to entry: Distribution activities are carried out in accordance with standards set and controlled by the
franchiser. Shipments against orders placed can be despatched either directly from the OCM or the franchised
distributor or agent. In other words, the franchised distributor enters into contractual agreements with one or more
electronic component manufacturers to distribute and sell the said components. Distribution agreements may be
stipulated according to the following criteria: geographical area, type of clientele (avionics for example), maximum
manufacturing lot size. Components sourced through this route are protected by the OCM’s warranty and supplied
with full traceability.
3.1.10
fraudulent component
electronic component produced or distributed either in violation of regional or local law or
regulation, or with the intent to deceive the customer
Note 1 to entry: This includes but is not limited to the following which are examples of components which are
fraudulently sold as new ones to a customer:
1) a stolen component;
2) a component scrapped by the original component manufacturer (OCM) or by any user;
3) a recycled component, that becomes a fraudulent recycled component when it is a disassembled (for example
disassembled from a PCB assembly) component resold as a new component (see Figure 1), where typically
there is evidence of prior use and rework (e.g. solder, re-plating or lead re-attachment activity) on the
component package terminations;
4) a counterfeit component, a copy, an imitation, a full or partial substitute of brands;
5) fraudulent designs, models, patents, software or copyright sold as being new and authentic. For example: a
component whose production and distribution are not controlled by the original manufacturer;
6) unlicensed copies of a design;
7) a disguised component (remarking of the original manufacturer’s name, reference date/code or other
identifiers etc.), which may be a counterfeit component (see Figure 1);
8) a component without an internal silicon die or with a substituted silicon die which is not the original
manufacturer’s silicon die.
3.1.11
intellectual property
creations of the mind such as inventions, literary and artistic works, and symbols, names,
images, and designs used in commerce
Note 1 to entry: This is property created through intellectual or creative activity.
Note 2 to entry: It includes patents, trademarks, copyright and designs. It can be owned, rented out, licensed,
sold or given away.
© IEC 2024
3.1.12
microcircuit
component
device
electrical or electronic device that is not subject to disassembly without destruction or
impairment of design use and is a small circuit having a high equivalent circuit element
density which is considered as a single part composed of interconnected elements on or
within a single substrate to perform an electronic circuit function
Note 1 to entry: This excludes printed wiring boards/printed circuit boards, circuit card assemblies and modules
composed exclusively of discrete electronic components.
3.1.13
MRO
maintenance, repair and overhaul
operations, such as tests, measurements, replacements, adjustments, and repairs, intended
to retain or restore a functional unit in or to a specified state in which the unit can perform its
required functions
Note 1 to entry: This activity includes inspection, rebuilding, alteration and the supply of spare parts, accessories,
raw materials, adhesives, sealants, coatings and consumables.
Note 2 to entry: This note applies to the French language only.
3.1.14
non-franchised distributor
company which does not fall under a franchised distributor or OCM
Note 1 to entry: These distributors may purchase components from component manufacturers, franchised
distributors, or through other supply channels (open markets). These distributors cannot always provide the
guarantees and support provided by the franchised distributor network; components sourced through this source
are usually protected by the source’s warranty only.
Note 2 to entry: Some non-franchised distributors are able to purchase traceable components from the OCM or
their franchised distributors and to provide traceability paperwork and/or are able to return stock for investigation to
the OCM. Such non-franchised distributors can satisfy the USA DFARS 252.246.7008 requirements (see A.8.10).
3.1.15
OCM
original component manufacturer
company specifying and manufacturing the electronic component
Note 1 to entry: This note applies to the French language only.
3.1.16
OEM
original equipment manufacturer
manufacturer which defines the electronic subassembly that includes the electronic
components or defines the components used in an assembly and/or test specification
Note 1 to entry: This note applies to the French language only.
3.1.17
piracy
willful copyright infringement
3.1.18
re-manufactured component
recycled element
electronic component that includes a recycled silicon die or technology element as
documented and disclosed by the electronic component re-manufacturer and that is fully
tested before being sold
REDLINE VERSION – 12 – IEC 62668-1:2019+AMD1:2024 CSV
© IEC 2024
Note 1 to entry: Examples include a silicon or other die extracted from another electronic component, either new
or used, which is externally marked and disclosed using the re-manufacturer’s name, logo and different part
number.
Note 2 to entry: Re-manufacturing an electronic component can necessitate the original engineering data and
schematics of the product. This does not mean that a re-manufactured product is identical to the new product.
Note 3 to entry: Electronic re-manufactured components often come with warranties.
3.1.19
reseller
general supplier which offers a selection of electronic components to order from a catalog
3.1.20
recycled component
electrical component removed from its original product or assembly and available for reuse
Note 1 to entry: The component has authentic logos, trademarks and markings. However, it typically has no
output to measure the useful life remaining for its reuse. A recycled component can fail earlier than a new one
when re-assembled into another product or assembly. A recycled component may also be physically damaged or
damaged through electro static discharge (ESD) during the removal process.
3.1.21
semiconductor
electronic component in which the characteristic distinguishing electronic conduction takes
place within a semiconductor
Note 1 to entry: This includes semiconductor diodes which are semiconductor devices having two terminals and
exhibiting a nonlinear voltage-current characteristic and transistors which are active semiconductor devices
capable of providing power amplification and having three or more terminals.
3.1.22
subcontractor
manufacturer of electronic subassemblies or supplier manufacturing items in compliance with
customer design data pack and drawings, and under the authority of the OEM
Note 1 to entry: This supplier can potentially procure all or part of the electronic components required to produce
a subassembly and is often referred to as the contract electronic manufacturer (CEM) or electronics manufacturing
services (EMS).
3.1.23
supplier
company which provides to another an electronic component which is identified by the logo or
nam
...
IEC 62668-1 ®
Edition 1.0 2019-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Process management for avionics – Counterfeit prevention –
Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic
components
Gestion des processus pour l'avionique – Prévention de la contrefaçon –
Partie 1: Prévention de l'utilisation de composants électroniques contrefaits,
frauduleux et recyclés
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IEC 62668-1 ®
Edition 1.0 2019-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Process management for avionics – Counterfeit prevention –
Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic
components
Gestion des processus pour l'avionique – Prévention de la contrefaçon –
Partie 1: Prévention de l'utilisation de composants électroniques contrefaits,
frauduleux et recyclés
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-7249-7
– 2 – IEC 62668-1:2019 © IEC 2019
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviated terms . 8
3.1 Terms and definitions . 8
3.2 Abbreviated terms . 13
4 Technical requirements . 15
4.1 General . 15
4.2 Minimum avionics OEM requirements . 16
4.3 Intellectual property . 19
4.3.1 General . 19
4.3.2 Definition of intellectual property. 20
4.4 Counterfeit consideration . 20
4.4.1 General . 20
4.4.2 Legal definition of counterfeit . 21
4.4.3 Fraudulent components . 21
4.4.4 How to establish traceability . 21
4.4.5 Reasons for the loss of component traceability . 22
4.5 The counterfeit problem . 22
4.5.1 General . 22
4.5.2 General worldwide activities combating counterfeit issues . 23
4.5.3 Cultural differences . 23
4.5.4 Counterfeiting activities and avionics equipment . 23
4.5.5 Electronic components direct action groups . 26
4.6 Recycled components . 26
4.6.1 General . 26
4.6.2 Why the avionics industry does not use recycled components . 27
4.6.3 How recycled components become suspect and potentially fraudulent . 27
4.7 Original component manufacturer (OCM) anti-counterfeit guidelines . 27
4.7.1 General . 27
4.7.2 Chinese Reliable Electronic Component Supplier (RECS) audit scheme . 28
4.7.3 Original component manufacturer (OCM) ISO 9001 and AS/EN/JISQ
9100 Third Party Certification . 28
4.7.4 Original component manufacturer's (OCM) trademarks . 28
4.7.5 Original component manufacturer's (OCM) IP control. 28
4.7.6 Original component manufacturer's (OCM) physical part marking and
packaging marking . 28
4.7.7 The Semiconductor Industries Association Anti Counterfeit Task Force
(ACTF) . 29
4.7.8 USA Trusted Foundry Program . 29
4.7.9 USA Trusted IC Supplier Accreditation Program . 30
4.7.10 Physical unclonable function (PUF) . 30
4.7.11 Original component manufacturer (OCM) best practice . 30
4.8 Distributor minimum accreditations . 30
4.9 Distributor AS/EN/JISQ 9120 Third Party Certification . 31
4.10 Franchised distributor network . 31
4.10.1 General . 31
4.10.2 SAE AS6496 . 32
4.10.3 Control stock through tracking schemes . 32
4.10.4 Control of scrap . 33
4.10.5 RECS . 33
4.11 Non-franchised distributor anti-counterfeit guidelines . 33
4.11.1 General . 33
4.11.2 CCAP-101 certified program for independent distributor . 33
4.11.3 SAE AS6081 . 33
4.11.4 OEM managed non-franchised distributors . 34
4.11.5 Brokers . 34
4.12 Avionics OEM anti-counterfeit guidelines when procuring components . 34
4.12.1 Anti-counterfeiting general approach . 34
4.12.2 Buy from approved sources . 34
4.12.3 Traceable components . 34
4.12.4 Certificate of conformance and packing slip . 35
4.12.5 Plan and buy sufficient quantities . 36
4.12.6 Use of non- franchised distributors . 36
4.12.7 Brokers . 36
4.12.8 Contact the original manufacturer . 37
4.12.9 Obsolete components and franchised aftermarket sources . 37
4.12.10 IEC 62239-1 approved alternatives . 37
4.12.11 Product redesign . 37
4.12.12 Non traceable components . 38
4.12.13 OEM anti-counterfeit plans including SAE AS5553 and SAE AS6174 . 38
4.13 OEM anti-counterfeit guidelines for their products . 43
4.13.1 IP control . 43
4.13.2 Tamper-proofing the OEM design . 43
4.13.3 Tamper-proof labels. 43
4.13.4 Use of ASICs and FPGAs with IP protection features . 43
4.13.5 Control the final OEM product marking . 44
4.13.6 Control OEM scrap . 44
4.13.7 OEM trademarks and logos. 44
4.13.8 Control delivery of OEM products and spares and their useful life . 44
4.13.9 MRO activities . 45
4.14 Counterfeit, fraud and component recycling reporting . 46
4.14.1 General . 46
4.14.2 USA FAA suspected unapproved parts (SUP) program . 46
4.14.3 EASA . 46
4.14.4 UK counterfeit reporting . 46
4.14.5 EU counterfeit reporting . 46
4.14.6 UKEA anti-counterfeiting forum . 46
4.15 Anti-counterfeit awareness training . 46
4.16 Information to support the management of the supply chain . 47
Annex A (informative) Useful contacts . 48
A.1 World Intellectual Property Organization (WIPO) . 48
A.1.1 General . 48
A.1.2 What is WIPO? . 48
A.1.3 WIPO Intellectual Property Services . 49
A.1.4 WIPO global network on Intellectual Property (IP) Academies. 50
– 4 – IEC 62668-1:2019 © IEC 2019
A.2 Anti-Counterfeiting Trade Agreement (ACTA) . 50
A.2.1 ACTA . 50
A.2.2 Global Anti-Counterfeiting Network (GACG) . 51
A.3 World Semiconductor Council (WSC) and GAMS . 51
A.4 SEMI . 52
A.5 Electronics Authorized Directory . 53
A.6 UK . 53
A.6.1 The UK intellectual property office . 53
A.6.2 Alliance for IP . 54
A.6.3 UK Chartered Trading Standards Institute. 54
A.6.4 UK HM Revenue and Customs . 54
A.6.5 Anti-Counterfeiting Forum . 54
A.6.6 Electronic Component Supplier Network (ESCN) . 55
A.6.7 UK Ministry of Defence . 55
A.7 Europe . 55
A.7.1 Europa Summaries of EU Legislation . 55
A.7.2 Europol, the European Law Enforcement Agency. 55
A.7.3 European Patent Office . 55
A.7.4 EUIPO . 55
A.7.5 European Aviation Safety Agency (EASA) . 56
A.7.6 IECQ audit schemes . 57
A.7.7 BEAMA . 57
A.8 USA . 57
A.8.1 United States Patent and Trademark Office . 57
A.8.2 The International Trade Administration, US Department of Commerce . 58
A.8.3 International Intellectual Property Alliance . 58
A.8.4 The Federal Aviation Administration (FAA) . 58
A.8.5 Trusted Access Program Office (TAPO) . 59
A.8.6 Independent Distributors of Electronics Association (IDEA) . 59
A.8.7 ECIA formerly National Electronic Distributors Association (NEDA) . 60
A.8.8 Components Technology Institute Inc. (CTI) . 61
A.8.9 Defense Logistics Agency (DLA) . 61
A.8.10 DFARS . 61
A.8.11 IAQG . 62
A.8.12 USA Homeland Security . 62
A.9 China . 62
A.9.1 CNIPA. . 62
A.9.2 Chinese Patent and Trademark Office . 62
A.9.3 China Electronics Associations: . 62
A.9.4 China Quality Certification Centre (CQC) . 62
A.9.5 Civil Aviation Administration of China (CAAC) . 62
A.9.6 China lawinfo.Co Ltd., for Law info China . 62
A.10 Japan – Japanese Patent Office (JPO) . 63
A.11 Physical unclonable function . 63
A.12 PUF and tags initiative and solutions . 64
A.12.1 The Hardware Intrinsic Security (HIS) initiative . 64
A.12.2 Examples of tag providers . 64
A.13 Examples of tamper-proof design companies . 65
A.14 Examples of FPGA die serialization . 65
A.15 Examples of NVRAM manufacturers . 65
A.16 SAE G-19 . 65
A.17 iNEMI. 69
A.18 OECD . 69
A.19 ICC . 69
A.20 Applied DNA Sciences . 70
A.21 Safety Directors’ Forum . 70
A.22 ‘Stop fake bearings’ video . 70
A.23 Industrial company’s online anti-counterfeit awareness training . 70
A.24 Subscription based anti-counterfeit awareness training . 70
A.25 USA Government anti-counterfeit publications and awareness training . 70
A.26 IECQ WG6 . 71
A.27 Anti-counterfeiting videos . 71
Annex B (informative) Examples of aftermarket sources . 72
B.1 Examples of franchised aftermarket sources . 72
B.2 Examples of sources of franchised die which can be packaged . 72
B.3 Examples of third party custom packaging houses which provide aftermarket
solutions . 72
B.4 Examples of emulated aftermarket providers . 72
Annex C (informative) Typical example of a RECS certificate . 74
Annex D (informative) Flowchart of IEC 62668-1 requirements . 75
Annex E (Informative) Typical use of anti-counterfeit standards in supply chains . 77
Bibliography . 83
Figure 1 – Suspect components perimeter . 21
Figure D.1 – Flowchart of IEC 62668-1 requirements and their relationship to external
standards . 76
Figure E.1 – Available anti-counterfeit standards for supply chains . 77
Figure E.2 – Overview of typical relationships for anti-counterfeit standards in an
avionics supply chain . 79
Figure E.3 – Overview of typical anti-counterfeit standards in an avionics OEM supply
chain. 80
Figure E.4 – IECQ OD 3702 traceability audit . 81
Figure E.5 – Typical IECQ OD 3702 coverage in any supply chain . 82
Table 1 – Anti-counterfeit awareness training guidelines . 18
Table.2 – IEC 62668-1 requirements satisfied or not if OEM has an approved SAE
AS5553A plan . 39
Table.3 – IEC 62668-1 requirements satisfied or not if OEM has an approved SAE
AS5553B plan . 41
– 6 – IEC 62668-1:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
COUNTERFEIT PREVENTION –
Part 1: Avoiding the use of counterfeit, fraudulent
and recycled electronic components
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62668-1 has been prepared by IEC technical committee 107:
Process management for avionics.
This first edition cancels and replaces the third edition of IEC TS 62668-1 published in 2016.
This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) added a reference to AS/EN/JISQ 9100 and AS/EN/JISQ 9110 which contain anti-
counterfeit requirements which may be used to satisfy the requirements of 4.2;
b) added reference to USA DFAR rule 252.246.7008 and to UK Defence Standard 05-135;
c) added reference to more GAO, OECD and ICC reports in 4.5.1;
d) updated weblinks and other references;
e) added new Annex E with figures describing how anti-counterfeit documents can be used
in supply chains;
f) added a reference to the new IECQ OD 3702 traceability audit;
g) added new definition for re-manufactured components with a warning that these are not
recommended.
The text of this International Standard is based on the following documents:
CDV Report on voting
107/335/CDV 107/346A/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62668 series, published under the general title Process
management for avionics – Counterfeit prevention, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 8 – IEC 62668-1:2019 © IEC 2019
PROCESS MANAGEMENT FOR AVIONICS –
COUNTERFEIT PREVENTION –
Part 1: Avoiding the use of counterfeit, fraudulent
and recycled electronic components
1 Scope
This part of IEC 62668 defines requirements for avoiding the use of counterfeit, recycled and
fraudulent components used in the aerospace, defence and high performance (ADHP)
industries. It also defines requirements for ADHP industries to maintain their intellectual
property (IP) for all of their products and services. The risks associated with purchasing
components outside of franchised distributor networks are considered in IEC 62668-2.
Although developed for the avionics industry, this document can be applied by other high
performance and high reliability industries at their discretion.
NOTE IEC 62668 (all parts) does not address the restriction on the re-use of a component in maintenance, repair
and overhaul (MRO) operations and only addresses MRO activities when they are under the OEM’s responsibility.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 62239-1, Process management for avionics – Management plan – Part 1: Preparation and
maintenance of an electronic components management plan
IEC 62668-2, Process management for avionics – Counterfeit prevention – Part 2: Managing
electronic components from non-franchised sources
ISO 9001, Quality management systems – Requirements
AS/EN/JISQ 9100, Quality Management Systems – Requirements for Aviation, Space and
Defense Organizations
AS/EN/JISQ 9110, Quality Maintenance Systems – Aerospace – Requirements for
Maintenance Organizations
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1.1
aftermarket source
reseller which may or may not be under contract with the original component manufacturer
(OCM), or is sometimes a component “re-manufacturer”, under contract with the OCM
Note 1 to entry: The reseller accumulates inventories of encapsulated or non-encapsulated (wafer) components
whose end of life date has been published by the OCM. These components are then resold at a profit to fill a need
within the market for components that have become obsolete.
3.1.2
broker
individual or corporate organization that serves as an intermediary between buyer and seller
Note 1 to entry: In the electronic component sector a broker specifically seeks to supply obsolete or hard to find
components in order to turn a profit. To do so it may accumulate an inventory of components considered to be of
strategic value or may rely on inventories accumulated by others. The broker operates within a worldwide
component exchange network.
3.1.3
COTS product
commercial off-the-shelf product
one or more components, assembled and developed for multiple commercial consumers,
whose design and/or configuration is controlled by the manufacturer’s specification or industry
standard
Note 1 to entry: COTS products can include electronic components, subassemblies or assemblies, or top level
assemblies. Electronic COTS subassemblies or assemblies include circuit card assemblies, power supplies, hard
drives, and memory modules. Top-level COTS assemblies include a fully integrated rack of equipment such as raid
arrays, file servers to individual switches, routers, personal computers, or similar equipment.
Note 2 to entry: This note applies to the French language only.
3.1.4
counterfeit, verb
action of simulating, reproducing or modifying a material good or its packaging without
authorization
Note 1 to entry: It is the practice of producing products which are imitations or are fake goods or services. This
activity infringes the intellectual property rights of the original manufacturer and is an illegal act. Counterfeiting
generally relates to wilful trademark infringement.
3.1.5
counterfeited component
material good imitating or copying an authentic material good which may be covered by the
protection of one or more registered or confidential intellectual property rights
Note 1 to entry: A counterfeited component is one whose identity or pedigree has been altered or misrepresented
by its supplier.
Identity = original manufacturer, part number, date code, lot number, testing, inspection, documentation or
warranty, etc.
Pedigree = origin, ownership history, storage, handling, physical condition, previous use, etc.
Note 2 to entry: When a material good has no registered or confidential intellectual property rights, then the
material good has no intellectual property protection. Examples include situations where the original component
manufacturer (OCM) has ceased to trade and has not sold or passed on the intellectual property rights to another
entity.
3.1.6
customer device specification
device specification written by a user and agreed by the supplier
– 10 – IEC 62668-1:2019 © IEC 2019
3.1.7
customer
user
original equipment manufacturer (OEM) which purchases electronic components, including
integrated circuits and/or semiconductor devices compliant with this document, and uses them
to design, produce, and maintain systems
3.1.8
data sheet
document prepared by the manufacturer that describes the electrical, mechanical, and
environmental characteristics of the component
3.1.9
franchised distributor or agent
individual or corporate organization that is legally independent from the franchiser (in this
case the electronic component manufacturer or OCM) and agrees under contract to distribute
products using the franchiser’s name and sales network
Note 1 to entry: Distribution activities are carried out in accordance with standards set and controlled by the
franchiser. Shipments against orders placed can be despatched either directly from the OCM or the franchised
distributor or agent. In other words, the franchised distributor enters into contractual agreements with one or more
electronic component manufacturers to distribute and sell the said components. Distribution agreements may be
stipulated according to the following criteria: geographical area, type of clientele (avionics for example), maximum
manufacturing lot size. Components sourced through this route are protected by the OCM’s warranty and supplied
with full traceability.
3.1.10
fraudulent component
electronic component produced or distributed either in violation of regional or local law or
regulation, or with the intent to deceive the customer
Note 1 to entry: This includes but is not limited to the following which are examples of components which are
fraudulently sold as new ones to a customer:
1) a stolen component;
2) a component scrapped by the original component manufacturer (OCM) or by any user;
3) a recycled component, that becomes a fraudulent recycled component when it is a disassembled (for example
disassembled from a PCB assembly) component resold as a new component (see Figure 1), where typically
there is evidence of prior use and rework (e.g. solder, re-plating or lead re-attachment activity) on the
component package terminations;
4) a counterfeit component, a copy, an imitation, a full or partial substitute of brands;
5) fraudulent designs, models, patents, software or copyright sold as being new and authentic. For example: a
component whose production and distribution are not controlled by the original manufacturer;
6) unlicensed copies of a design;
7) a disguised component (remarking of the original manufacturer’s name, reference date/code or other
identifiers etc.), which may be a counterfeit component (see Figure 1);
8) a component without an internal silicon die or with a substituted silicon die which is not the original
manufacturer’s silicon die.
3.1.11
intellectual property
creations of the mind such as inventions, literary and artistic works, and symbols, names,
images, and designs used in commerce
Note 1 to entry: This is property created through intellectual or creative activity.
Note 2 to entry: It includes patents, trademarks, copyright and designs. It can be owned, rented out, licensed,
sold or given away.
3.1.12
microcircuit
component
device
electrical or electronic device that is not subject to disassembly without destruction or
impairment of design use and is a small circuit having a high equivalent circuit element
density which is considered as a single part composed of interconnected elements on or
within a single substrate to perform an electronic circuit function
Note 1 to entry: This excludes printed wiring boards/printed circuit boards, circuit card assemblies and modules
composed exclusively of discrete electronic components.
3.1.13
MRO
maintenance, repair and overhaul
operations, such as tests, measurements, replacements, adjustments, and repairs, intended
to retain or restore a functional unit in or to a specified state in which the unit can perform its
required functions
Note 1 to entry: This activity includes inspection, rebuilding, alteration and the supply of spare parts, accessories,
raw materials, adhesives, sealants, coatings and consumables.
Note 2 to entry: This note applies to the French language only.
3.1.14
non-franchised distributor
company which does not fall under a franchised distributor or OCM
Note 1 to entry: These distributors may purchase components from component manufacturers, franchised
distributors, or through other supply channels (open markets). These distributors cannot always provide the
guarantees and support provided by the franchised distributor network; components sourced through this source
are usually protected by the source’s warranty only.
Note 2 to entry: Some non-franchised distributors are able to purchase traceable components from the OCM or
their franchised distributors and to provide traceability paperwork and/or are able to return stock for investigation to
the OCM. Such non-franchised distributors can satisfy the USA DFARS 252.246.7008 requirements (see A.8.10).
3.1.15
OCM
original component manufacturer
company specifying and manufacturing the electronic component
Note 1 to entry: This note applies to the French language only.
3.1.16
OEM
original equipment manufacturer
manufacturer which defines the electronic subassembly that includes the electronic
components or defines the components used in an assembly and/or test specification
Note 1 to entry: This note applies to the French language only.
3.1.17
piracy
willful copyright infringement
3.1.18
re-manufactured component
recycled element
electronic component that includes a recycled silicon die or technology element as
documented and disclosed by the electronic component re-manufacturer and that is fully
tested before being sold
– 12 – IEC 62668-1:2019 © IEC 2019
Note 1 to entry: Examples include a silicon or other die extracted from another electronic component, either new
or used, which is extern
...
Frequently Asked Questions
IEC 62668-1:2019 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components". This standard covers: IEC 62668-1:2019 defines requirements for avoiding the use of counterfeit, recycled and fraudulent components used in the aerospace, defence and high performance (ADHP) industries. It also defines requirements for ADHP industries to maintain their intellectual property (IP) for all of their products and services. The risks associated with purchasing components outside of franchised distributor networks are considered in IEC 62668-2. Although developed for the avionics industry, this document can be applied by other high performance and high reliability industries at their discretion. This first edition cancels and replaces the third edition of IEC TS 62668-1 published in 2016. This edition includes the following significant technical changes with respect to the previous edition: a) added a reference to AS/EN/JISQ 9100 and AS/EN/JISQ 9110 which contain anti-counterfeit requirements b) added reference to USA DFAR rule 252.246.7008 and to UK Defence Standard 05-135; c) added reference to more GAO, OECD and ICC reports d) updated weblinks and other references; e) added new Annex E with figures describing how anti-counterfeit documents can be used in supply chains; f) added a reference to the new IECQ OD 3702 traceability audit; g) added new definition for re-manufactured components with a warning that these are not recommended.
IEC 62668-1:2019 defines requirements for avoiding the use of counterfeit, recycled and fraudulent components used in the aerospace, defence and high performance (ADHP) industries. It also defines requirements for ADHP industries to maintain their intellectual property (IP) for all of their products and services. The risks associated with purchasing components outside of franchised distributor networks are considered in IEC 62668-2. Although developed for the avionics industry, this document can be applied by other high performance and high reliability industries at their discretion. This first edition cancels and replaces the third edition of IEC TS 62668-1 published in 2016. This edition includes the following significant technical changes with respect to the previous edition: a) added a reference to AS/EN/JISQ 9100 and AS/EN/JISQ 9110 which contain anti-counterfeit requirements b) added reference to USA DFAR rule 252.246.7008 and to UK Defence Standard 05-135; c) added reference to more GAO, OECD and ICC reports d) updated weblinks and other references; e) added new Annex E with figures describing how anti-counterfeit documents can be used in supply chains; f) added a reference to the new IECQ OD 3702 traceability audit; g) added new definition for re-manufactured components with a warning that these are not recommended.
IEC 62668-1:2019 is classified under the following ICS (International Classification for Standards) categories: 03.100.50 - Production. Production management; 31.020 - Electronic components in general; 49.060 - Aerospace electric equipment and systems. The ICS classification helps identify the subject area and facilitates finding related standards.
IEC 62668-1:2019 has the following relationships with other standards: It is inter standard links to IEC TS 62668-1:2016, IEC 62668-1:2019/AMD1:2024, IEC TS 62668-1:2012. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
You can purchase IEC 62668-1:2019 directly from iTeh Standards. The document is available in PDF format and is delivered instantly after payment. Add the standard to your cart and complete the secure checkout process. iTeh Standards is an authorized distributor of IEC standards.
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