IEC TS 62686-2:2019

IEC TS 62686-2 ®
Edition 1.0 2019-01
TECHNICAL
SPECIFICATION
Process management for avionics – Electronic components for aerospace,
defence and high performance (ADHP) applications –
Part 2: General requirements for passive components
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IEC TS 62686-2 ®
Edition 1.0 2019-01
TECHNICAL
SPECIFICATION
Process management for avionics – Electronic components for aerospace,

defence and high performance (ADHP) applications –

Part 2: General requirements for passive components

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-6247-4

– 2 – IEC TS 62686-2:2019 © IEC 2019
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviated terms . 8
3.1 Terms and definitions . 8
3.2 Abbreviated terms . 11
4 Technical requirements . 12
4.1 General . 12
4.1.1 Overview . 12
4.1.2 Equivalent methods . 13
4.2 Procedures . 13
4.2.1 General . 13
4.2.2 Product discontinuance . 14
4.2.3 ESD protection during manufacture . 14
4.2.4 Traceability . 14
4.3 Shipment controls . 14
4.3.1 General . 14
4.3.2 Unit pack container . 14
4.3.3 Intermediate packing . 14
4.3.4 Date codes . 15
4.3.5 Moisture sensitivity level (MSL) . 15
4.3.6 Lead-free marking . 15
4.3.7 Labels . 15
4.3.8 Electrostatic discharge (ESD) . 16
4.4 Product or process change notification (PCN) . 16
4.4.1 General . 16
4.4.2 Notification . 17
4.4.3 Notification details . 17
4.5 Electrical . 17
4.5.1 General . 17
4.5.2 Electrical test . 17
4.6 Mechanical . 17
4.6.1 General . 17
4.6.2 Device marking . 18
4.6.3 Lead-free components . 18
4.6.4 Moisture sensitivity . 18
4.6.5 Termination finishes . 18
4.6.6 Termination finish notification of change . 19
4.7 Audit capability . 19
4.7.1 General . 19
4.7.2 Internal quality audits . 19
4.7.3 Subcontract manufacturing . 19
4.8 Quality assurance . 19
4.8.1 General . 19
4.8.2 Quality system . 20
4.8.3 Sampling plans . 20

4.8.4 Failure analysis support . 20
4.8.5 Outgoing quality . 20
4.9 Qualification . 20
4.9.1 General . 20
4.9.2 Methodology . 21
4.9.3 Test samples . 24
4.9.4 Qualification categories . 24
4.9.5 Maintenance of qualification standard . 24
4.9.6 In-process test results . 25
4.9.7 Test references . 25
4.9.8 Qualification report . 25
4.9.9 Archiving . 25
4.9.10 Qualification of device changes . 25
4.9.11 Similarity assessment . 25
4.10 Product monitoring in the production line . 26
4.10.1 General . 26
4.10.2 Monitoring programme . 26
4.10.3 Problem notification . 26
4.10.4 Data reporting. 26
4.11 Environmental health and safety (EHS) . 26
4.11.1 General . 26
4.11.2 General EHS compliance . 27
4.11.3 Device handling . 27
4.11.4 Device materials and substances . 27
Annex A (informative) Test code (TC) information for guidance . 28
A.1 General . 28
A.2 TC1 – Electrical test. 28
A.3 TC2 – External visual . 28
A.4 TC3 – Package dimensions . 29
A.5 TC4 – High temperature exposure (storage) . 30
A.6 TC5 – Temperature cycling . 30
A.7 TC6 – Moisture resistance . 30
A.8 TC7 – Biased humidity . 30
A.9 TC8 – High temperature operating life. 30
A.10 TC9 – Terminal strength (leaded) . 31
A.11 TC10-Resistance to solvents . 31
A.12 TC11 – Mechanical shock . 31
A.13 TC12 – Vibration . 31
A.14 TC13 – Resistance to heat . 31
A.15 TC14 – Thermal shock . 32
A.16 TC15 – Board flex (SMD) . 32
A.17 TC16 – Beam load . 32
A.18 TC17 – Solderability . 32
A.19 TC18 – Electrostatic discharge . 32
A.20 TC19 – Flammability . 32
A.21 TC20 – Terminal strength (SMD) . 32
A.22 TC21 – Surge voltage . 32
A.23 TC22 – Hermeticity . 33
A.24 TC23 – Tin whisker . 33

– 4 – IEC TS 62686-2:2019 © IEC 2019
Annex B (informative) Typical IECQ-CECC approved components . 34
Annex C (informative) Typical USA military specified passive components. 36
Annex D (informative) Typical automotive components . 37
Annex E (informative) Typical IEC specified passive components . 39
E.1 Typical IEC passive component specifications . 39
E.2 IEC passive component environmental test methods . 39
Annex F (informative) Verification requirements matrix for IEC TS 62686-2 . 46
Bibliography . 55

Table 1 – Label requirements. 16
Table 2 – Internal quality audit areas . 19
Table 3 – Technology/family qualification and device qualification . 22
Table 4 – Qualification tests for device types . 23
Table D.1 – AEC-Q200 temperature grades . 37
Table E.1 – IEC passive specifications' environmental test methods compared to
those specified in Table 3 . 40
Table F.1 – Verification requirements matrix for IEC TS 62686-2 . 46

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS – ELECTRONIC
COMPONENTS FOR AEROSPACE, DEFENCE AND
HIGH PERFORMANCE (ADHP) APPLICATIONS –

Part 2: General requirements for passive components

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC TS 62686-2 which is a technical specification, has been prepared by IEC technical
committee 107: Process management for avionics.

– 6 – IEC TS 62686-2:2019 © IEC 2019
This first edition cancels and replaces the first edition of IEC PAS 62686-2 published in 2016.
This edition constitutes a technical revision.
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/302/DTS 107/343/RVDTS
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62686 series, published under the general title Process
management for avionics – Electronic components for aerospace, defence and high
performance (ADHP) applications, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

INTRODUCTION
This part IEC 62686 includes all the requirements of the obsolete STACK Specification
S/0003 issue 2 related to passive components and contains revisions for alternative
qualification test methods and additional test information for the aerosapace, defence and
high performance (ADHP) industries. This document is typically used in conjunction with
IEC TS 62239-1.
NOTE With the addition of alternative methods, it is possible for manufacturers to be audited by IECQ under the
new IECQ automotive scheme or IECQ approved component scheme.

– 8 – IEC TS 62686-2:2019 © IEC 2019
PROCESS MANAGEMENT FOR AVIONICS – ELECTRONIC
COMPONENTS FOR AEROSPACE, DEFENCE AND
HIGH PERFORMANCE (ADHP) APPLICATIONS –

Part 2: General requirements for passive components

1 Scope
This part of IEC 62686 defines the minimum requirements for general purpose "off-the-shelf"
COTS (commercial off-the-shelf) passive components for aerospace, defence and high
performance (ADHP) applications.
This document applies to all passive components that can be operated in ADHP applications
within the manufacturers’ publicly available data sheet limits in conjunction with
IEC TS 62239-1. This document can be used by other high performance and high reliability
industries, at their discretion.
ADHP application requirements are not necessarily fulfilled by this document alone. ADHP
original equipment manufacturers (OEMs) could consider redesigning their products or
conducting further testing to verify suitability in ADHP applications using their procedures for
satisfying their electronic component management plan (ECMP) (see IEC TS 62239-1).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
JESD48, Product discontinuance
J-STD-609B, Marking, symbols, and labels of leaded and lead-free terminal finished materials
used in electronic assembly
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp.
3.1.1
calendar days, pl.
continuous days, including weekends and holidays

3.1.2
container
outer shipping container consisting of one or more inner containers
3.1.3
data sheet
document prepared by the manufacturer that describes the electrical, mechanical, and
environmental characteristics of the component
3.1.4
deviation
user agreement to allow the delivery of a shipping lot which does not fully meet the
requirements of this document
Note 1 to entry: This is considered equivalent to concession for the purposes of this document.
3.1.5
device specification
document written by a user and agreed by the supplier
3.1.6
form
shape, size, dimensions, and other physically measurable parameters that uniquely
characterize a product
[SOURCE: IEC TS 62239-2:2017, 3.1.23]
3.1.7
fit
ability to physically interface or connect with
3.1.8
function
action or actions that a product is designed to perform
[SOURCE: IEC TS 62239-2:2017, 3.1.25]
3.1.9
incoming lot
one or more shipments of a device, grouped together for the purpose of incoming inspection
3.1.10
inner container
box or bag containing devices, either in magazines or bulk packaged
3.1.11
magazine
shipping container that feeds into automatic placement machines
EXAMPLE: Sticks, tubes, matrix trays, tape/reel, etc.
3.1.12
component
device
electrical or electronic device that is not subject to disassembly without destruction or
impairment of design use and is a small circuit having a high equivalent circuit element
density
– 10 – IEC TS 62686-2:2019 © IEC 2019
Note 1 to entry: It is considered as a single part composed of interconnected elements on or within a single
substrate to perform an electronic circuit function.
Note 2 to entry: This excludes printed wiring boards/printed circuit boards, circuit card assemblies and modules
composed exclusively of discrete electronic components.
3.1.13
manufacturing lot
definite quantity of devices tracked at each manufacturing operation
Note 1 to entry: A manufacturing lot is associated with a travel log and constitutes a group homogeneously
processed through all manufacturing operations under uniform manufacturing conditions.
3.1.14
moisture sensitivity level
MSL
rating indicating a component’s susceptibility to damage due to absorbed moisture when
subjected to reflow soldering
3.1.15
original component manufacturer
OCM
company specifying and manufacturing the electronic component
[SOURCE: IEC TS 62668-1:2016, 3.1.13]
3.1.16
OEM
original equipment manufacturer
manufacturer which defines the electronic subassembly that includes the electronic
components or defines the components used in an assembly and/or test specification
[SOURCE: IEC TS 62668-1:2016, 3.1.14]
3.1.17
passive component
component that does not require electrical power to operate (for example not capable of
power gain)
Note 1 to entry: For the purposes of this document, the term ’passive’ is restricted to capacitors and resistors.
3.1.18
room temperature
temperature identified at 25 °C ± 5 °C in a room
3.1.19
shipping lot
single lot of one or more containers received by a user
3.1.20
supplier
company which provides to another an electronic component which is identified by the logo or
name marked on the device
Note 1 to entry: A supplier can be the OCM, a franchised distributor or agent, a non-franchised distributor,
broker, reseller, OEM, CEM and EMS etc.
[SOURCE: IEC TS 62686-1:2015, 3.1.19]

3.1.21
termination
element of a component that connects it electrically and mechanically to the next level of
assembly
3.2 Abbreviated terms
AC alternating current
ADHP aerospace, defence and high performance
AEC Automotive Electronics Council
AOQ average out-going quality
AQEC aerospace qualified electronic component
AQL acceptable quality level
CB certification body
CECC CENELEC electronic components committee
CFC chlorofluorocarbon
COTS commercial off-the-shelf
DC direct current
DFMEA design failure modes and effect analysis
DLA Defense Logistics Agency (see http://www.dscc.dla.mil/)
DPM defects per million
DVP&R design verification plan and report
ECMP electronic component management plan
EHS environmental health and safety
EMAS Eco-Management and Audit Scheme (established by the European Union)
ESD electrostatic discharge
FFF form, fit and function
FIT failures in time
GR&R gage repeatability and reproducibility analysis
h hour
HAST highly accelerated stress test
HBM human body model
HTOL high temperature operating life
IATF International Automotive Task Force
IECQ International Electrotechnical Commission Quality Assessment System for
Electronic Components
I/O input and output
IR infra-red
LTB last time buy
LTPD lot tolerance percent defective
min minute
MSA measurements system analysis
MSL moisture sensitivity level
OCM original component manufacturer
OEM original equipment manufacturer
PC preconditioning
– 12 – IEC TS 62686-2:2019 © IEC 2019
PCB printed circuit board
PCN product or process change notification
PFMEA process failure modes and effects analysis
Pkg package
PPAP part production approval process
QA quality assurance
QPL qualified parts list
REACh registration, evaluation, authorization and restriction of substances
RoHS restriction of hazardous substances
SMD surface mount device
SPC statistical process control
T ambient temperature
amb
TC test code
T minimum operating temperature
opmin
T maximum operating temperature
opmax
UCT upper category temperature
4 Technical requirements
4.1 General
4.1.1 Overview
The supplier, preferably the franchised distributor or original component manufacturer (OCM),
as defined in 3.1.20 and 3.1.15, shall have an appropriate quality management system and
shall provide the following minimum technical requirements. Other proposed equivalent test
methods, rationale and supporting data shall be reviewed and shall achieve the same end
objectives as specified herein (see 4.4.4). The supplier or OCM shall provide a high-level
statement summarising how compliance to the specification is achieved including the use of
equivalent test methods (see 4.1.2), when they are used.
NOTE 1 ISO 9001 or AS/EN/JISQ 9100 can assist with compliance to this clause.
NOTE 2 In case the COTS passive components cannot be procured directly from the OCM (for example if too
small a quantity), the franchised distribution network is usually privileged with regard to potential risks (for example
lack of traceability and counterfeiting).
Informative annexes are provided at the end of this document and their contents are subject
to change. Users of this document are encouraged to review the latest data available
whenever referencing the content of these annexes:
• Informative Annex A: Test code (TC) information;
• Informative Annex B: Typical IECQ-CECC approved passive components;
• Informative Annex C: Typical USA military specified passive components;
• Informative Annex D: Typical automotive component;
• Informative Annex E: Typical IEC specified passive components;
• Informative Annex F: Verification requirements matrix for IEC TS 62686-2.

4.1.2 Equivalent methods
4.1.2.1 General
Use of such equivalent tests shall not be considered to be deviations or waivers to the
requirements of this document and are based on:
• IECQ-CECC approved components, see 4.1.2.2;
• automotive components see 4.1.2.3;
• IEC passive components see 4.1.2.4.
4.1.2.2 IECQ-CECC approved components
IECQ approved components to CECC specifications meet the requirements of this
specification, see the guidance in Annex C.
NOTE 1 The IECQ assesses and approves manufacturers to CECC specifications, which are listed on the IECQ
on-line certificate system for ‘Approved Component’ under the ‘Component’ section.
NOTE 2 USA military specified components are considered equivalent to the IECQ-CECC approved components
where the DLA assesses and approves manufacturers which are listed on qualified parts lists (QPLs), see annex A
for more guidance.
4.1.2.3 Automotive components
Automotive components which are typically manufactured on IATF 16949 certified
manufacturing lines and qualified to AEC-Q200, for temperature grades 0, 1, 2, and 3, with
the outgoing quality requirements typically included in a production part approval process
(PPAP) process and with the obsolescence and product change notification as specified
herein may meet the requirements of this specification, see Annex D for guidance.
NOTE 1 The IECQ automotive qualification programme can be expanded to cover this category of automotive
component.
NOTE 2 The VDA 6 series assessment, particularly VDA 6.3, Process audit, can be used for the PPAP element of
the IECQ assessment process.
4.1.2.4 IEC passive component specifications
Passive components specified by IEC meet most of the qualification requirements of this
specification, see the guidance in Annex E. However, the qualification test method durations
and sample sizes may be different and the other requirements of Clause 4 may not always be
met. An assessment and closure of any gaps in requirements will be required before claiming
compliance to this specification.
NOTE 1 These components are controlled by zero defect test schedules and are 100 % tested as finished
components.
NOTE 2 Currently there is no IECQ assessment scheme for these components.
4.2 Procedures
4.2.1 General
The OCM shall have the following procedures:
• product discontinuance (4.2.2);
• ESD protection during manufacture (4.2.3);
• specification control (4.2.4);
• traceability including anti-counterfeit measures (4.2.5).

– 14 – IEC TS 62686-2:2019 © IEC 2019
4.2.2 Product discontinuance
Notification shall be made for example in accordance with JESD48 or equivalent, with the
exception of timing as described in a) and b) below:
a) the OCM or supplier shall provide to the user a notice of last order dates:
• a minimum of 12 months before these dates for single-source devices, and
• a minimum of 6 months before these dates for multi-sourced devices;
b) the OCM or supplier may give less than the specified notice period provided a mutually
acceptable extension (up to the specification limit) is negotiated with any user needing a
different period.
4.2.3 ESD protection during manufacture
Many passive components are considered to be sensitive to static and shall be protected
through the OCM’s manufacturing operation. The OCM and supplier shall ensure that devices
are not exposed to static damage and are not degraded or damaged due to static discharge.
IEC 61340-3-1, IEC 61340-5-1, IEC TR 61340-5-2, JESD625 or AEC-Q200-002 are examples
of suitable documents for ESD precautions. OCMs and suppliers holding current certification
for compliance with IEC 61340-5-1 are deemed to have satisfied this requirement.
4.2.4 Traceability
Traceability shall be managed as follows:
a) the OCM and supplier shall have traceability for any device in a shipping lot through a
route code, lot code or other marking on the device or magazine or inner container to
identify the manufacturing route, for example manufacturing location, assembly location,
test location, date code and lot code;
b) the information needed to interpret the code shall be available for example according to
IEC 60062;
c) the procedure shall be available for inspection during audit.
The OCMs and suppliers shall use anti-counterfeit measures to protect their intellectual
property, such as use of registered trademarks, logos, patents, etc. The OCM and supplier
shall also assist the user in determining if the product is genuine when requested and in
identifying the franchised distributors.
4.3 Shipment controls
4.3.1 General
The OCM‘s name, logo and trademark shall be marked on the shipping container where it is
practical to do so.
4.3.2 Unit pack container
The packing for shipment needs to preserve the integrity of goods inside:
a) unit pack container configurations should be in accordance with existing industry
practices;
b) components should be oriented in the same direction, in all unit pack containers.
NOTE Industry standards such as EIA-481, EIA-468, EIA-296, EIA-948, EIA-960 can be used to provide guidance
for 4.3.2.
4.3.3 Intermediate packing
An intermediate container packing process should be designed to eliminate the presence of
partial quantities.
4.3.4 Date codes
4.3.4.1 Mixing
As a preferred methodology, there should be no more than one date code per unit pack
container. If this is not possible, then there should be no more than two date codes in one unit
pack container. If two date codes are used, the unit pack container should be clearly labelled
as having mixed date codes and labels need to indicate the quantity for each date code.
If possible, there should be no more than three date codes per sealed intermediate by date
code. The label on the intermediate container should list all date codes and quantities by date
code.
4.3.4.2 Remarking
If the date of assembly and test are both marked, the test date can be remarked if the device
is re-tested at a later date. If only one date is marked to represent the manufacturing date and
initial electrical test it shall not be changed unless it is necessary to correct poor quality
marking or incorrect information and provided that the time delta between the original mark
and the remark in less than 6 weeks.
4.3.4.3 Age on delivery
Date code age on delivery shall be as follows where shipped directly from the OCM or
supplier:
a) the date codes of devices shall not be older than 48 months upon users’ receipt date;
b) the exception is for aluminium electrolytic capacitors which shall not be older than
24 months.
4.3.5 Moisture sensitivity level (MSL)
The labelling and inner container, used for example for shipping, shall be in accordance with
IEC 61760-4 or J-STD-033 or equivalent standard.
4.3.6 Lead-free marking
The shipping container and date code marking shall be in accordance with J-STD-609B or
equivalent.
4.3.7 Labels
In general, labels shall include the requirements mentioned in Table 1 and exhibit:
a) human readable content: the content shown for each label shall be available in human
readable form on the outside of the relevant package;
b) machine readable content: bar codes for those items specified shall be included in 3 of
9 codes (bar code 39) according to IEC 62090 or ANSI/EIA-556 or equivalent compatible
standard;
c) warning notice: any necessary warning notices or symbols to ensure the safety of the
contents shall be included as appropriate.

– 16 – IEC TS 62686-2:2019 © IEC 2019
Table 1 – Label requirements
Dry pack label: Bar
code
• Date of sealing and sealed life or expiration date.
• Time and storage condition limits after opening.
• Bake conditions if usage conditions after opening are violated.

• Moisture sensitivity classification according to IEC 61760-4 or J-STD-020.
Outer container label: this label is typically implemented as a shipping note or packing list attached
to the outer container:
• Delivery address.
• Purchase order number. *
*
• User part number.
a
*
• OCM’s device type number .
a
• OCM’s name .
b
• Export Control Certification number and controlling authority . *
a
• Quantities enclosed of each device type .
Inner container label:
• OCM’s device type number. *
b
• User part number . *
b
*
• Purchase order number .
• Quantity of devices. *
• Date code. *
*
• Lot number.
b
• Assembly location .
b
• Test location .
a
For security reasons, can be omitted by agreement of the user.
b
Preferred but not mandatory.
4.3.8 Electrostatic discharge (ESD)
The symbols and labelling used for marking shall be in accordance with IEC 61340-5-3 or
ANSI/EIA-471 or equivalent standard.
For their ESD protection, all devices shall be supplied in suitable protective packaging with
electrostatic properties meeting the requirements of IEC 61340-5-3 or ANSI/EIA-541.
All packaging should be static safe (non-generative as a minimum) to safeguard sensitive
products occupying the same manufacturing areas.
4.4 Product or process change notification (PCN)
4.4.1 General
The OCM shall provide the following:
• notification (4.4.2);
• notification details (4.4.3).

4.4.2 Notification
In the event of the OCM proposing or making a change to a device, then:
a) the OCM and/or supplier shall give at least 90 calendar days' written notice prior to
shipping the changed product. The user will respond to confirm the date on which the
changed product shipments can begin (this could be less than 90 calendar days), advise
that the changed product is not acceptable, or request further information;
b) where an event beyond the control of the OCM occurs, where the 90 calendar days’ notice
cannot be given, the OCM or supplier shall reach a mutually agreed lesser notice period
with any user affected by the change
NOTE AEC-Q200 process change notification satisfies this requirement.
4.4.3 Notification details
The PCN shall include the following items:
a) title of change;
b) OCM’s type number(s) affected;
c) OCM’s notification identification number;
d) estimated last order and shipment dates for unchanged devices to be supplied on request;
e) estimated earliest shipment date of changed devices;
f) manufacturing location and product line affected;
g) thorough description of the proposed change;
h) means of distinguishing changed devices from unchanged devices. This may be a date
code, lot code, date code range or distinguishing marking or feature that is visible to the
user at point of receipt of shipment;
i) sufficient engineering and/or qualification test data, including details of any qualification
test vehicle used and its applicability to the product change. These shall be available on
request to demonstrate that the change will not adversely affect device form, fit, function,
quality or reliability, and that the changed product will continue to meet the specified
requirements;
j) user part number of the affected device (preferred item but not mandatory).
4.5 Electrical
4.5.1 General
Operating conditions shall be as defined in the device specification or data sheet, as
explained in 4.5.2.
4.5.2 Electrical test
All shipped packaged devices shall have passed a production electrical test progra
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