IEC TS 62647-4:2018

IEC TS 62647-4 ®
Edition 1.0 2018-04
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 4: Ball grid array (BGA) re-balling

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IEC TS 62647-4 ®
Edition 1.0 2018-04
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace and defence electronic systems

containing lead-free solder –
Part 4: Ball grid array (BGA) re-balling

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-5530-8

– 2 – IEC TS 62647-4:2018 © IEC 2018
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 8
3 Terms and definitions . 9
4 Process approach . 12
4.1 Typical process . 12
4.2 Awareness . 14
5 General requirements . 14
5.1 Process control at the customer level . 14
5.1.1 Customer’s responsibilities . 14
5.1.2 Electronic components classes . 14
5.2 Process control at re-balling provider level . 15
5.2.1 Re-balling provider’s responsibilities . 15
5.2.2 Electronic component classes . 15
5.2.3 Counterfeit prevention and traceability management . 15
5.2.4 Quality . 16
5.2.5 Records . 16
5.2.6 Facility requirements . 16
5.2.7 Electrostatic discharge (ESD) . 16
5.2.8 Physical handling of BGA components . 16
5.2.9 Moisture/reflow sensitivity . 16
5.2.10 Configuration management . 17
5.2.11 Personnel proficiency . 17
5.2.12 Order of precedence . 17
5.3 Customer and re-balling provider relationship . 17
6 Technical requirements . 17
6.1 Receipt of BGA components and separate balls . 17
6.1.1 General . 17
6.1.2 Incoming inspection of BGA components . 17
6.1.3 Incoming inspection of separate solder balls . 19
6.2 Specific analysis based on component balls alloy . 19
6.3 BGA component de-balling. 20
6.3.1 General . 20
6.3.2 Temperature excursions . 20
6.3.3 Flux . 20
6.3.4 Preheat. 20
6.3.5 Solder balls removal (de-balling) . 20
6.3.6 Cool down . 21
6.3.7 Cleaning (post de-balling) . 21
6.3.8 Complete removal and cleanliness verification . 21
6.4 BGA component re-balling . 21
6.4.1 General . 21
6.4.2 Capability . 21
6.4.3 Solder paste . 22
6.4.4 Flux . 22

6.4.5 Ball placement (alignment and co-planarity) . 22
6.4.6 Preheating . 22
6.4.7 Reflow temperature profile . 22
6.4.8 Cooling down . 22
6.4.9 Cleaning (post re-balling) . 23
6.5 Post-process inspection of re-balled BGA components . 23
6.5.1 General . 23
6.5.2 Production lot tests . 23
6.5.3 Process monitoring and control . 23
6.5.4 Case of failures . 24
6.5.5 Records . 24
6.6 Rework . 24
6.6.1 General . 24
6.6.2 Rework if authorized by the customer . 24
6.7 New BGA component part number qualification . 24
6.7.1 General . 24
6.7.2 New BGA component part number qualification by similarity . 25
6.7.3 New BGA component part number qualification . 25
6.7.4 Records . 26
6.7.5 Customer’s approval . 26
6.7.6 Cases of BGA component re-qualification . 26
6.8 Physical marking . 27
6.9 Packaging and shipping . 27
6.10 Re-balled BGA components segregation . 27
Annex A (informative) Template for tailoring the requirements of IEC TS 62647-4. 28
Annex B (informative) Requirement matrix for IEC TS 62647-4 . 29
Annex C (normative) Test methods . 37
Annex D (informative) Template for test methods tailoring in the frame of a BGA
component production lot test plan or a new BGA component part number qualification
test plan . 39
Bibliography . 40

Figure 1 – Typical flowchart of de-balling/re-balling operations . 13

Table 1 – Electronic component class . 14
Table 2 – Typical control and inspection test methods . 19
Table 3 – Typical production lot test methods . 23
Table 4 – Typical test methods for process monitoring and control . 24
Table 5 – Typical test methods used for inspection of re-balled BGA components
within the framework of new BGA component part number qualification . 25
Table 6 – Typical optional additional tests for new BGA component part number
qualification . 26
Table A.1 – Template for tailoring of requirements . 28
Table B.1 – Requirement matrix . 29
Table C.1 – Test methods . 37
Table D.1 – Template for requirements tailoring . 39

– 4 – IEC TS 62647-4:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC
SYSTEMS CONTAINING LEAD-FREE SOLDER –

Part 4: Ball grid array (BGA) re-balling

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC TS 62647-4, which is a Technical Specification, has been prepared by IEC technical
committee 107: Process management for avionics.

The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/314/DTS 107/331/RVDTS
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62647 series, published under the general title Process
management for avionics – Aerospace and defence electronic systems containing lead-free
solder, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

– 6 – IEC TS 62647-4:2018 © IEC 2018
INTRODUCTION
As the result of RoHS directives, soldering assembly processes have migrated predominantly
from tin-lead to Pb-free, and a majority of BGA components manufacturers have converted
from tin-lead solder balls to Pb-free solder balls. This has introduced well documented
reliability concerns. In the case of a leaded soldering process, a solution can be to replace the
Pb-free solder balls on the BGA components with tin-lead solder balls. This will prevent
mixing solder alloys.
This document was prepared to standardize the requirements and guidelines for replacing the
solder balls on applicable BGA components. The requirements within this document are
derived from existing industry standards and a collaboration of service providers and
customers, typically avionics original equipment manufacturers (OEMs).
This document is intended to be used by de-balling/re-balling providers and customers to
incorporate these requirements into their operations to provide a consistent and well-
controlled process, or to create a de-balling/re-balling plan that augments their existing
processes.
There are two major reasons to de-ball/re-ball BGA components: alloy compatibility and
replacement of damaged balls.
The customer should understand the potential risks of the BGA de-balling/re-balling process
for a specific package.
To avoid reliability problems, the BGA de-balling/re-balling process should be qualified and
carefully controlled to prevent the possibility of BGA failure after re-balling. Generally,
automated processes contribute positively to this objective and are encouraged in the
electronic industry.
This document does not guarantee a particular yield or reliability of BGA components going
through the de-balling/re-balling process. BGA component construction and materials used
should be evaluated for compatibility with the solder re-balling process to ensure that BGA
component reliability and integrity are maintained.
Because of the dynamic nature of the transition to lead-free (Pb-free) electronics, this and
other similar documents are based on the best information and expertise available; its update
will be considered as future knowledge and data are obtained.

PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC
SYSTEMS CONTAINING LEAD-FREE SOLDER –

Part 4: Ball grid array (BGA) re-balling

1 Scope
This part of IEC 62647, which is a Technical Specification, defines the requirements for
replacing solder balls on ball grid array (BGA) component packages in the context of an
electronic components management plan (ECMP) for aerospace, defence and high reliability
products.
NOTE 1 IEC TS 62239-1 and EIA-STD-4899 describe the electronic components management program (ECMP).
It does not apply to column grid array (CGA) components or chip scale components.
This re-balling document addresses two types of configurations. For other configuration types,
see Annex A for tailoring.
• Configuration 1: A BGA package that will be de-balled and then re-balled with tin-lead
balls compatible with a tin-lead soldering assembly process.
• Configuration 2: A BGA package that will be de-balled and then re-balled with Pb-free
balls compatible with a Pb-free soldering assembly process.
The intent of this document is to provide re-balling companies (hereinafter referred to as the
re-balling provider) with the administrative and technical requirements to be incorporated
within existing processes or for establishing, implementing and maintaining a new set of
processes or the creation of a stand-alone re-balling process.
This document is intended to be used by de-balling/re-balling providers and customers,
typically avionics original equipment manufacturers (OEM); it defines the requirements for re-
balling providers who are providing services to the aerospace, defence, high performance and
high reliability electronics industry.
Requirements for new BGA component part number qualification are also included. This
document identifies the need for the creation of new part numbers for re-balled BGA
components, covers process and testing requirements for the de-balling/re-balling process
and encourages the automated processes due to the ability to control the process.
Companies engaged in re-balling are supposed to have the necessary knowledge, experience
and tools, and to customize if needed their own methods for defining a de-balling/re-balling
process that meets the requirements in this document.
Each customer determines the applicability of this document and the need for full replacement
of the existing solder balls. Some applications can have unique requirements that exceed the
scope of this document and are therefore specified separately.
This document is not intended to address all procedures and processes associated with a de-
balling/re-balling facility; it is assumed there are management, quality, manufacturing, safety,
calibration and training processes/procedures in place as well as all the necessary tools and
equipment to accomplish the work.
NOTE 2 For the purposes of this document, if the term “BGA” is used alone, it is stated as “BGA component".

– 8 – IEC TS 62647-4:2018 © IEC 2018
NOTE 3 The replacement, for example, of damaged tin-lead balls by new tin-lead balls or damaged Pb-free balls
by new Pb-free balls is not specifically addressed in this document but some parts of the document and the table
for tailoring the requirements (see Annex A) can be used for supporting the operations.
Although developed for the avionics industry, this process can be applied by other industrial
sectors at their discretion.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
IEC 62090, Product package labels for electronic components using bar code and two-
dimensional symbologies
IEC 62668 (all parts), Process management for avionics – Counterfeit prevention
AEC-Q100-010, Solder ball shear test
ANSI/ESD S20.20, Protection of Electrical and Electronic Parts, Assemblies and Equipment
(Excluding Electrically Initiated Explosive Devices)
ECA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly
Processes
IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies
IPC J-STD-001xS , Space Applications Electronic Hardware Addendum to IPC J-STD-001x
Requirements for Soldered Electrical and Electronic Assemblies
IPC J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and
Wires
IPC J-STD-004, Requirements for Soldering Fluxes
IPC J-STD-005, Requirements for Soldering Pastes
IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Non-hermetic Solid
State Surface Mount Devices
IPC/JEDEC J-STD-033, Handling, Packing Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices
IPC/JEDEC J-STD-035, Acoustic Microscopy for Non-Hermetic. Encapsulated. Electronic.
Components
___________
In « IPC J-STD-001xS » the « x » refers to the issue of the IPC J-STD-001 document ; for exemple « IPC J-
STD-001FS » refers to « IPC JST-001F » (issue F).

IPC-TM-650 number 2.3.25, Test Methods Manual – Detection and Measurement of Ionizable
Surface Contaminants by Resistivity of Solvent Extract (ROSE)
JEDEC J-STD-046, Customer Notification of Product/Process Changes by Electronic Product
Suppliers
JEDEC JESD625, Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS)
Devices
JEDEC JESD22-A101, Steady State Temperature Humidity Bias Life Test
JEDEC JESD22-B101, External visual
JEDEC JESD22-B107, Mark Permanency
JEDEC JESD22-B117, Solder Ball Shear
JEDEC JESD213, Standard Test Method Utilizing X-ray Fluorescence (XRF) for Analyzing
Component Finishes and Solder Alloys to Determine Tin (Sn) – Lead (Pb) Content
MIL-STD-883, Test Method Standard: Microcircuits
SAE AS5553, Counterfeit Electronic Parts; Avoidance, Detection, Mitigation, and Disposition
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
AM
acoustic microscopy
microscopy that employs very high or ultra-high frequency ultrasound
Note 1 to entry: Acoustic microscopy is a technical field where the acoustic microscope operates non-
destructively and penetrates most solid materials to make visible images of internal features, including defects
such as cracks, delaminations and voids; the acoustic microscope is generally called “scanning acoustic
microscope (SAM)”.
3.2
approved supplier
organization selling or supplying materiel, parts, products or provision of a service, which has
been determined capable by a procuring organization to deliver throughout the lifetime of a
contract
3.3
BGA
ball grid array
surface mount package wherein the balls for terminations are formed in a grid on the bottom
of a package
Note 1 to entry: There are different varieties of BGA packages and solder ball technologies such as CBGA,
PBGA, TBGA packages.
– 10 – IEC TS 62647-4:2018 © IEC 2018
3.4
CBGA
ceramic ball grid array
BGA package with a ceramic body
3.5
declaration of conformance
document certified by a competent authority that the supplied good or service meets the
required specifications
Note 1 to entry: Declaration of conformance can also be called certificate of conformance; the competent
authority can be the original manufacturer of the supplied good or service.
3.6
CTE
coefficient of thermal expansion
degree of expansion of a material divided by the change in temperature
Note 1 to entry: PCB/PWB CTE (x-y) is measured in the direction in the plane of the piece part mounting surface
and is used to quantify the stresses in the solder joint arising from the differences in CTE between the piece parts
and the PCB/PWB during thermal cycling. CTE (z axis) is measured in the “thickness” direction and is typically
used to quantify plated through hole stress
Note 2 to entry: The term “piece part” can be used in lieu of “component”.
[SOURCE: IEC TS 62647-22:2013, 3.1.8, modified – Note 2 has been added.]
3.7
customer
one who pays for the service or the services provided by another
3.8
de-balling
process operation that consists in removing the solder balls from a BGA
3.9
HIC
humidity indicator card
card on which a moisture-sensitive chemical is applied such that it will make a significant,
perceptible change in color (hue), typically from blue (dry) to pink (wet) when the indicated
relative humidity is exceeded
3.10
Pb-free
lead-free
less than 0,1 % by weight of lead (Pb) in accordance with reduction of hazardous substances
(RoHS) guidelines
[SOURCE: IEC TS 62647-1:2012, 3.8, modified – "lead-free" has been added as a second
term.]
3.11
MSL
moisture sensitivity level
alphanumeric rating indicating a plastic electronic device’s susceptibility to damage due to
absorbed moisture when subjected to reflow soldering as determined by IPC/JEDEC J-STD-
3.12
OCM
original component manufacturer
company specifying and manufacturing the electronic component
[SOURCE: IEC TS 62668-1:2016, 3.1.13]
3.13
part number
unambiguous identifier
Note 1 to entry: A part number unambiguously identifies for example an electronic component, a design, or an
equipment.
3.14
PCB
printed circuit board
PWB
printed wiring board
substrate using conductive pathways, tracks or signal traces etched from copper sheets
laminated, and allowing to connect electrically a set of electronic components to realize a
circuit card
[SOURCE: IEC TS 62647-21:2013, 3.1.10]
3.15
PBGA
plastic ball grid array
BGA with a plastic body
3.16
qualification by similarity
act of qualifying a product part number based on already available testing results which have
been used to deliver the qualification to another product part number whose technical
characteristics are considered similar or practically similar
Note 1 to entry: Qualification by similarity may apply to a component part number when the component has
package and die sizes, construction and materials which are considered to be insignificantly different from an
already ”qualified” component part number.
3.17
re-balling
process operation that consists in putting back a solder ball in replacement of the previous
one on a ball grid array (BGA) package
3.18
re-balling provider
company offering de-balling and re-balling service
3.19
RoHS
European directive dealing with the restriction of the use of certain hazardous substances
Note 1 to entry: The RoHS directive is a European Union directive on the restriction of the use of certain
hazardous substances in electrical and electronic equipment.

– 12 – IEC TS 62647-4:2018 © IEC 2018
3.20
solder ball technology
technology employing solder balls or bumps at the component package level to make
mechanical and electrical connections between the component package and the PCB/PWB
EXAMPLE 1 Ball grid arrays (BGAs), flip chips and chip scale interconnections.
3.21
tin-lead
solder bearing the elements tin and lead, and corresponding to 63 % by weight of tin and
37 % by weight of lead unless otherwise specified
[SOURCE: IEC TS 62647-3:2014, 3.1.6]
3.22
TBGA
taped ball grid array
BGA on a tape substrate
Note 1 to entry: The tape is generally a polyimide film.
3.23
qualification
process for confirming and approving that a product or service meets the needs or
requirements of its user
Note 1 to entry: For the purposes of this document, the qualification process applies to manufacturing and
production operations and processes. It is generally based on objective evidence (for example tests results,
process parameters) demonstrating that the product requirements and the quality demands are met.
3.24
XRF
X-ray fluorescence
method for material composition analysis
[SOURCE: IEC TS 62647-2:2012, 3.1.28]
4 Process approach
4.1 Typical process
Figure 1 provides a typical flowchart for BGA de-balling/re-balling processes and operations
in accordance with the configurations 1 and 2 mentioned in Clause 1.
The process step 12a of Figure 1 addresses a new BGA component part number qualification
which is performed using the de-balling/re-balling process before launching production lots of
this new BGA component part number in a “production lot” mode; the process steps 4 to 11 of
Figure 1 apply and the customer’s approval of the qualification is based on results provided
by the re-balling provider (see 6.7).
The process step 12b addresses the inspection and control of re-balled BGA components in a
“production lot” mode.
1 – Start
No
2 – Is re-balling
3 – Approved re-balling provider
provider on approved
suppliers list
Yes
4 – Identify received base
component (BGA)
5 – Base component (BGA)
incoming inspection
No
Passed
16 – Stop
Yes
Alternative
6 – Base component (BGA)
ball composition
Configuration 2
Sn-Pb balls
Configuration 1
Pb-free balls
12a – New BGA
component part number
qualification
7 – Check if
10 – De-balling
base part can survive
the Pb-free reflow
temperature
Yes
No
Or Or
12b – Inspection,
11 – Re-balling for
8 – De-balling
marking and control
Sn-Pb balls
17 – Stop
or other
alternative Stop
14 – Packing
9 – Re-balling
13 – Marking 15 – End
and shipping
18 – Stop
for Pb-free balls
IEC
Figure 1 – Typical flowchart of de-balling/re-balling operations
Table B.1 provides a requirements matrix that may be used to document the accomplishments
of the requirements for IEC TS 62647-4.
The requirements of this document may be tailored to address the customer’s unique/specific
program needs. If tailoring is performed, the re-balling provider shall obtain the documented
customer’s approval. The customer is cautioned that tailoring the test plan by reducing the
sample sizes, eliminating the tests, or relaxing the acceptance criteria can result in
compromised reliability of the processed components. Annex A provides a tailoring template
that may be used.
– 14 – IEC TS 62647-4:2018 © IEC 2018
4.2 Awareness
As a reminder, BGA de-balling/re-balling process and operations can degrade the
performance and reliability of the electronic components as determined in the original
component manufacturer's (OCM) datasheet and/or technical data and lead to the loss of any
regular or extended warranty which is normally provided by the original component
manufacturer (OCM) regarding the electronic component use and storage. Consulting with the
OCM is recommended to determine if there are potential limitations concerning additional
reflow and re-processing of the BGA terminations.
5 General requirements
5.1 Process control at the customer level
5.1.1 Customer’s responsibilities
The re-balling provider shall be on the approved suppliers' list with an approved de-balling/re-
balling process.
If the re-balling provider is not on the approved suppliers' list the re-balling provider can assist
in gaining approval by demonstrating how its de-balling/re-balling process complies with the
requirements contained herein by mapping its demonstration data to the compliance
verification matrix contained in Annex B which can depend on the class assigned to the BGA
components (see 5.2.2) and any tailoring.
NOTE 1 Some customers might require for approval additional information that can include:
• process capability definition and description (including process flow chart);
• process monitoring definition and description;
• acceptance criteria definition for re-balled BGA component (for example co-planarity, ball size and shape, ball
shear strength and cleaning contamination level).
NOTE 2 Subclause 5.1 addresses the process steps 2 and 3 identified in Figure 1.
5.1.2 Electronic components classes
Electronic components are divided into four classes which define the levels of requirements.
Descriptions are provided in Table 1.
Table 1 – Electronic component class
Class Class description Class definition
a
1 General electronic products Products suitable for applications where the major requirement is
function of the complete assembly.
a
2 Dedicated service electronic Products where continued performance and extended life are
products required, and for which uninterrupted service is desired but not
critical. Typically the end-use environment would not cause
failures.
a
3 High performance/harsh Products where continued high performance or performance-on-
environment electronic products demand is critical, equipment downtime cannot be tolerated, end-
use environment can be uncommonly harsh, and the equipment
must function when required, such as life support or other critical
systems.
b
Space High performance/extremely Products where performance is required for surviving the vibration
severe environment electronic and thermal cyclic environments getting to and operating in space.
products
a
See IPC J-STD-001.
b
See IPC J-STD-001xS (Space Applications Electronic Hardware Addendum)

5.2 Process control at re-balling provider level
5.2.1 Re-balling provider’s responsibilities
The re-balling provider is responsible for the development and implementation of
requirements and procedures necessary to prevent damage and to control conditions for
passing the production tests (see 6.5) and to satisfy customer requirements (see 5.3).
If the re-balling provider plans to subcontract activities, it shall:
• inform the customer, consider subcontractor(s) which is(are) in its own approved suppliers
list, or in the customer-approved suppliers list if any, and request customer’s approval
with regard to the intended subcontracted activities;
• if approved by the customer, cascade all the requirements with regard to the potential
subcontractor(s) and subcontracted activities, and verify the implementation of
requirements.
5.2.2 Electronic component classes
Prior to processing, the re-balling provider shall obtain the component class from the
customer (see 5.1.2).
5.2.3 Counterfeit prevention and traceability management
5.2.3.1 Electronic component counterfeit prevention
If the re-balling provider is engaged in the procurement of BGA components
• the re-balling provider shall only purchase BGA components:
– direct from the original component manufacturers; or
– from franchised or authorized distributors with full traceability through the supply chain
to the original component manufacturer;
• if this is not possible, the re-balling provider shall:
– advise the customer;
– ask the customer where it purchases the BGA components in accordance with its anti-
counterfeit management plan or any other decision with regard to BGA components
procurement source;
• the re-balling provider shall, in any case, have a counterfeit electronic components
management plan/process which satisfies the requirements of IEC 62668 (all parts) and/or
SAE AS5553 or equivalent.
5.2.3.2 Materials, chemicals, components, and process tools and equipment
traceability
5.2.3.2.1 Materials and chemicals
All process materials and chemicals (balls, solder alloys, cleaning fluids, de-ionized water,
fluxes, etc.) shall be traceable to their original manufacturers.
5.2.3.2.2 BGA components
Changing solder ball metallurgy composition is considered a major change according to
JEDEC J-STD-046. New part numbers shall be created. Process lot traceability shall be
maintained and documented on all relevant paperwork and the smallest unit container. The
re-balling provider shall label the containers and shipping documentation of processed piece
parts in accordance with marking standard IEC 62090 or equivalent.

– 16 – IEC TS 62647-4:2018 © IEC 2018
5.2.3.2.3 Process tools and equipment
All tools and equipment used in the de-balling/re-balling process shall be identified and
traceable.
5.2.4 Quality
5.2.4.1 Quality standards
The re-balling provider shall have a documented quality system registered to an
internationally recognized quality management system. In addition, the de-balling and re-
balling process shall satisfy the applicable requirements of IPC J-STD-001.
NOTE 1 An internationally recognized quality management system can be the relevant parts of AS/EN/JISQ 9100
or equivalent.
NOTE 2 Usually the documented quality system includes technical operation procedures, non-conformance and
corrective actions aspects and configuration management, for example of materials, chemicals, tools and
equipment or processes.
5.2.4.2 Declaration of conformity
The re-balling provider shall have a process to provide at products deliveries a declaration of
conformity stating that the specified requirements (see 5.2.12) are met.
NOTE ISO/IEC 17050-1 can be a relevant document to assist the declaration of conformity process.
5.2.5 Records
Quality records, technical records (for example component qualification test results, control
results, process monitoring), lot travellers, change notices and all other documentation
generated during the de-balling/re-balling process shall be retained for a minimum period of
ten years unless otherwise required by the customer, and made available to the customer
upon request within five business days.
5.2.6 Facility requirements
In addition to having the tools and equipment necessary and maintained (for example
calibration) for de-balling and re-balling, the re-balling provider’s f
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