IEC TS 62647-4:2018

IEC TS 62647-4 ®
Edition 1.0 2018-04
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 4: Ball grid array (BGA) re-balling

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IEC TS 62647-4 ®
Edition 1.0 2018-04
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace and defence electronic systems

containing lead-free solder –
Part 4: Ball grid array (BGA) re-balling

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-5530-8

– 2 – IEC TS 62647-4:2018 © IEC 2018
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 8
3 Terms and definitions . 9
4 Process approach . 12
4.1 Typical process . 12
4.2 Awareness . 14
5 General requirements . 14
5.1 Process control at the customer level . 14
5.1.1 Customer’s responsibilities . 14
5.1.2 Electronic components classes . 14
5.2 Process control at re-balling provider level . 15
5.2.1 Re-balling provider’s responsibilities . 15
5.2.2 Electronic component classes . 15
5.2.3 Counterfeit prevention and traceability management . 15
5.2.4 Quality . 16
5.2.5 Records . 16
5.2.6 Facility requirements . 16
5.2.7 Electrostatic discharge (ESD) . 16
5.2.8 Physical handling of BGA components . 16
5.2.9 Moisture/reflow sensitivity . 16
5.2.10 Configuration management . 17
5.2.11 Personnel proficiency . 17
5.2.12 Order of precedence . 17
5.3 Customer and re-balling provider relationship . 17
6 Technical requirements . 17
6.1 Receipt of BGA components and separate balls . 17
6.1.1 General . 17
6.1.2 Incoming inspection of BGA components . 17
6.1.3 Incoming inspection of separate solder balls . 19
6.2 Specific analysis based on component balls alloy . 19
6.3 BGA component de-balling. 20
6.3.1 General . 20
6.3.2 Temperature excursions . 20
6.3.3 Flux . 20
6.3.4 Preheat. 20
6.3.5 Solder balls removal (de-balling) . 20
6.3.6 Cool down . 21
6.3.7 Cleaning (post de-balling) . 21
6.3.8 Complete removal and cleanliness verification . 21
6.4 BGA component re-balling . 21
6.4.1 General . 21
6.4.2 Capability . 21
6.4.3 Solder paste . 22
6.4.4 Flux . 22

6.4.5 Ball placement (alignment and co-planarity) . 22
6.4.6 Preheating . 22
6.4.7 Reflow temperature profile . 22
6.4.8 Cooling down . 22
6.4.9 Cleaning (post re-balling) . 23
6.5 Post-process inspection of re-balled BGA components . 23
6.5.1 General . 23
6.5.2 Production lot tests . 23
6.5.3 Process monitoring and control . 23
6.5.4 Case of failures . 24
6.5.5 Records . 24
6.6 Rework . 24
6.6.1 General . 24
6.6.2 Rework if authorized by the customer . 24
6.7 New BGA component part number qualification . 24
6.7.1 General . 24
6.7.2 New BGA component part number qualification by similarity . 25
6.7.3 New BGA component part number qualification . 25
6.7.4 Records . 26
6.7.5 Customer’s approval . 26
6.7.6 Cases of BGA component re-qualification . 26
6.8 Physical marking . 27
6.9 Packaging and shipping . 27
6.10 Re-balled BGA components segregation . 27
Annex A (informative) Template for tailoring the requirements of IEC TS 62647-4. 28
Annex B (informative) Requirement matrix for IEC TS 62647-4 . 29
Annex C (normative) Test methods . 37
Annex D (informative) Template for test methods tailoring in the frame of a BGA
component production lot test plan or a new BGA component part number qualification
test plan . 39
Bibliography . 40

Figure 1 – Typical flowchart of de-balling/re-balling operations . 13

Table 1 – Electronic component class . 14
Table 2 – Typical control and inspection test methods . 19
Table 3 – Typical production lot test methods . 23
Table 4 – Typical test methods for process monitoring and control . 24
Table 5 – Typical test methods used for inspection of re-balled BGA components
within the framework of new BGA component part number qualification . 25
Table 6 – Typical optional additional tests for new BGA component part number
qualification . 26
Table A.1 – Template for tailoring of requirements . 28
Table B.1 – Requirement matrix . 29
Table C.1 – Test methods . 37
Table D.1 – Template for requirements tailoring . 39

– 4 – IEC TS 62647-4:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC
SYSTEMS CONTAINING LEAD-FREE SOLDER –

Part 4: Ball grid array (BGA) re-balling

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on al
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