IEC TS 62668-1:2012

IEC/TS 62668-1


®


Edition 1.0 2012-05



TECHNICAL



SPECIFICATION




colour
inside


Process management for avionics – Counterfeit prevention –
Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic
components


IEC/TS 62668-1:2012(E)

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IEC/TS 62668-1



®



Edition 1.0 2012-05







TECHNICAL





SPECIFICATION











colour

inside










Process management for avionics – Counterfeit prevention –

Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic

components



























INTERNATIONAL

ELECTROTECHNICAL

COMMISSION

PRICE CODE
XA


ICS 03.100.50; 31.020; 49.060 ISBN 978-2-88912-064-2



  Warning! Make sure that you obtained this publication from an authorized distributor.


® Registered trademark of the International Electrotechnical Commission

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– 2 – TS 62668-1  IEC:2012(E)



CONTENTS


FOREWORD . 4

1 Scope . 6

2 Normative references . 6

3 Terms, definitions and abbreviations . 7

3.1 Terms and definitions . 7

3.2 Abbreviations . 10

4 Technical requirements . 12
4.1 General . 12
4.2 Minimum avionics OEM requirements . 13
4.3 Intellectual property . 14
4.3.1 General . 14
4.3.2 Definition of intellectual property . 15
4.4 Counterfeit definition . 15
4.4.1 General . 15
4.4.2 Legal definition of counterfeit . 16
4.4.3 Definition of fraudulent components . 16
4.4.4 Traceable components . 16
4.4.5 Untraceable components . 16
4.5 Why is counterfeit a problem? . 16
4.5.1 General . 16
4.5.2 General worldwide activities combating counterfeit issues . 17
4.5.3 Cultural differences . 17
4.5.4 Counterfeiting activities and avionics equipment . 18
4.5.5 Reliability impact and danger to general public . 19
4.6 Recycled components . 19
4.6.1 General . 19
4.6.2 Why does the avionics industry not use recycled components? . 19
4.6.3 When do recycled components become counterfeit? . 19
4.7 Original Component Manufacturer (OCM) anti-counterfeit guidelines . 20
4.7.1 General . 20
4.7.2 Chinese Reliable Electronic Component Supplier (RECS) audit
scheme . 20

4.7.3 Original Component manufacturer (OCM) ISO 9001 and AS/EN/JISQ
9100 Third Party Certification . 20
4.7.4 Original component manufacturer (OCM) trademarks . 20
4.7.5 Original Component manufacturer (OCM) IP control . 20
4.7.6 Original Component manufacturer (OCM) physical part marking and
packaging marking . 21
4.7.7 The Semiconductor Industries Association Anti Counterfeit Task
Force (ACTF) . 21
4.7.8 USA Trusted Foundry Program . 21
4.7.9 USA Trusted IC Supplier Accreditation Program . 22
4.7.10 Physical unclonable function (PUF) . 22
4.7.11 Original Component Manufacturer (OCM) best practice . 22
4.8 Distributor minimum accreditations . 23
4.9 Distributor AS/EN/JISQ 9120 Third Party Certification . 23

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TS 62668-1  IEC:2012(E) – 3 –


4.10 Franchised distributor network . 23

4.10.1 General . 23

4.10.2 Control stock through tracking schemes . 24

4.10.3 Control scrap . 24

4.10.4 RECS . 24

4.10.5 SAE AS6081 . 24

4.11 Non- franchised distributor anti-counterfeit guidelines . 24

4.11.1 General . 24

4.11.2 OEM managed non-franchised distributors . 25

4.11.3 Brokers . 25

4.12 Avionics OEM anti-counterfeit guidelines when procuring components . 25
4.12.1 General . 25
4.12.2 Buy from approved sources . 25
4.12.3 Traceable components . 26
4.12.4 Certificates of conformance . 26
4.12.5 Plan and buy sufficient quantities . 26
4.12.6 Use of non- franchised distributors . 27
4.12.7 Brokers . 27
4.12.8 Contact the original manufacturer . 27
4.12.9 Obsolete components and Franchised Aftermarket sources . 27
4.12.10 IEC TS 62239 approved alternatives . 27
4.12.11 Product redesign . 28
4.12.12 Non traceable components . 28
4.12.13 OEM anti-counterfeit plans including SAE AS5553 and SAE AS6174 . 28
4.13 OEM anti-counterfeit guidelines for their products . 28
4.13.1 IP control . 28
4.13.2 Tamper-proofing the OEM Design . 29
4.13.3 Tamper Proof Labels . 29
4.13.4 Use of ASICS and FPGAs with IP protection features . 29
4.13.5 Control the final OEM product marking . 29
4.13.6 Control OEM scrap . 30
4.13.7 OEM Trademarks and logos . 30
4.13.8 Control delivery of OEM products and spares and their useful life . 30
4.13.9 Repairs to OEM products . 30
4.14 Counterfeit, fraud and component recycling reporting . 31

4.14.1 General . 31
4.14.2 USA FAA suspected unapproved parts (SUP) program . 31
4.14.3 UK counterfeit reporting . 31
4.14.4 EU counterfeit reporting . 31
4.14.5 UKEA anti-counterfeiting forum. 31
Annex A (informative) Useful contacts . 32
Annex B (informative) Examples of aftermarket sources . 55
Annex C (informative) Typical example of a RECS certificate . 56
Annex D (informative) Flowchart of IEC/TS 62668-1 requirements . 57
Bibliography . 59

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– 4 – TS 62668-1  IEC:2012(E)


INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________



PROCESS MANAGEMENT FOR AVIONICS –

COUNTERFEIT PREVENTION –



Part 1: Avoiding the use of counterfeit, fraudulent

and recycled electronic components





FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
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specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC/TS 62668-1, which is a technical specification, has been prepared by IEC technical
committee 107: Process management for avionics.

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TS 62668-1  IEC:2012(E) – 5 –


The text of this technical specification is based on the following documents:


Enquiry draft Report on voting


107/165/DTS 107/177/RVC



Full information on the voting for the approval of this technical specification can be found in

the report on voting indicated in the above table.


This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.


A list of all the parts in the IEC 62668 series, published under the general title Process
management for avionics – Counterfeit prevention, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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– 6 – TS 62668-1  IEC:2012(E)


PROCESS MANAGEMENT FOR AVIONICS –

COUNTERFEIT PREVENTION –



Part 1: Avoiding the use of counterfeit, fraudulent

and recycled electronic components








1 Scope

This Technical Specification defines requirements for avoiding the use of counterfeit, recycled
and fraudulent components used in the aerospace, defence and high performance (ADHP)
industries. It also defines requirements for ADHP industries to maintain their intellectual
property (IP) for all of their products and services. The risks associated with purchasing
1
components outside of franchised distributor networks will be considered in IEC/TS 62668-2
which is to be published in the near future. Although developed for the avionics industry, this
specification may be applied by other high performance and high reliability industries at their
discretion.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC/TS 62239, Process management for avionics – Preparation of an electronic components
2
management plan
IEC/PAS 62435, Electronic components – Long-duration storage of electronic components –
Guidance for implementation
ISO 9001, Quality management systems – Requirements
AS/EN/JISQ 9100, Quality Management Systems – Requirements for Aviation, Space and
Defense Organizations
AS/EN/JISQ 9110, Quality Maintenance Systems – Aerospace- Requirements for
Maintenance Organizations
AS/EN/JISQ 9120, Quality Management Systems – Requirements for Aviation, Space and
Defense Distributors
GEIA-STD-0016, Standard for Preparing a DMSMS Management Plan
IDEA-STD-1010B, Acceptability of electronic components distributed in the open market
___________
1
 Under consideration.
2
 This Technical Specification will be superseded by IEC/TS 62239-1, Process management for avionics –
Management plan – Part 1: Preparation and maintenance of an electronic components management plan, which
is currently under study.

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TS 62668-1  IEC:2012(E) – 7 –


3
SAE AS5553 , Counterfeit Electronic Parts; Avoidance, Detection, Mitigation and Disposition


SEMI T20, Specification for authentication of semiconductors and related products


SEMI T20.1, Specification for object labelling to authenticate semiconductors and related

Products in an open market


SEMI T20.2, Guide for qualifications of authentication service bodies for detecting and

preventing counterfeiting of semiconductors and related products


3 Terms, definitions and abbreviations
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1.1
after-market source
reseller who may or may not be under contract with the original component manufacturer
(OCM), or is sometimes a component “re-manufacturer”, under contract with the OCM
Note 1 to entry: The reseller accumulates inventories of encapsulated or non-encapsulated (wafer) components
whose end of life date has been published by the OCM. These components are then resold at a profit to fill a need
within the market for components that have become obsolete.
3.1.2
counterfeit
action to simulate, reproduce or modify a material good or its packaging without authorization
Note 1 to entry: It is the practice of producing products which are imitations or are fake goods or services. This
activity infringes the Intellectual Property rights of the original manufacturer and is an illegal act. Counterfeiting
generally relates to wilful trade mark infringement.
3.1.3
counterfeited component
material good imitating or copying an authentic material good which may be covered by the
protection of one or more registered or confidential intellectual property rights
Note 1 to entry: It is one whose identity or pedigree has been altered or misrepresented by its supplier
Identity = Original manufacturer, part number, date code, lot number, testing, inspection, documentation or
warranty etc.

Pedigree = Origin, ownership history, storage, handling, physical condition, previous use etc.
3.1.4
COTS
commercial off-the-shelf products
one or more pieces, mechanical or electrical, developed for multiple commercial consumers,
whose design and/or configuration is controlled by the supplier’s specification or industry
standard
Note 1 to entry: They can include electronic components, subassemblies, or top level assemblies. COTS
subassemblies include circuit card assemblies, power supplies, hard drives, and memory modules. Top-level COTS
assemblies includes a fully integrated rack of equipment such as raid arrays, file servers to individual switches,
routers, personal computers, or similar equipment.
___________
3
 This standard will be superseded by SAE AS5553A, Counterfeit Electronic Parts; Avoidance, Detection,
Mitigation and Disposition, which is currently under study.

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– 8 – TS 62668-1  IEC:2012(E)


3.1.5

customer, user

original equipment manufacturer (OEM) who purchases electronic components, including

integrated circuits and/or semiconductor devices compliant to this technical specification, and

uses them to design, produce, and maintain systems


3.1.6

data sheet

document prepared by the manufacturer that describes the electrical, mechanical, and

environmental characteristics of the component


3.1.7
broker
individual or corporate organization that serves as an intermediary between buyer and seller.
Note 1 to entry: In the electronic component sector a broker specifically seeks to supply obsolete or hard to find
components in order to turn a profit. To do so it may accumulate an inventory of components considered to be of
strategic value or may rely on inventories accumulated by another. The broker operates within a worldwide
component exchange network.
3.1.8
customer device specification
device specification written by a user and agreed by the supplier
3.1.9
fraudulent component
electronic component produced or distributed in violation of the law
Note 1 to entry: This includes stolen component, component scrapped by the original component manufacturer
(OCM) or by any user, disassembled component salvaged and resold as new component, counterfeit component,
copy, imitation, full or partial substitute of brands, designs, models , patents, software or copyright, for example:
component whose production and distribution are not controlled by the original manufacturer, unlicensed copies of
a design, disguised component (remarking of original manufacturer name, reference date/code or other identifiers
etc.), component without internal silicon die or with substituted silicon die which are not the original manufacturer’s
silicon die.
3.1.10
franchised distributor or agent
individual or corporate organisation that is legally independent from the franchiser (in this
case the electronic component manufacturer or OCM) and who agrees under contract to
distribute products using the franchiser’s name and sales network
Note 1 to entry: Distribution activities are carried out in accordance with standards set and controlled by the
franchiser. Shipments against orders placed can be despatched either direct from the OCM or the franchised
distributor or agent. In other words, the franchised distributor enters into contractual agreements with one or more
electronic component manufacturers to distribute and sell said components. Distribution agreements may be

stipulated according to the following criteria: geographical area, type of clientele (avionics for example), maximum
manufacturing lot size. Components sourced through this route are protected by the OCM’s warranty and supplied
with full traceability
3.1.11
non-franchised distributor
non-franchised or independent electronic component distributors are companies who do not
fall under one of the above mentioned categories (i.e. franchised distributor)
Note 1 to entry: These distributors may purchase components from component manufacturers, franchised
distributors, or through other supply channels (open markets). These distributors cannot always provide the
guarantees and support provided by the franchised distributor network; components sourced through this source
are usually protected by the source’s warranty only. However, some of them are able to purchase traceable
components and/or to provide traceability paperwork and/or are able to return stock for investigation to the OCM.

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TS 62668-1  IEC:2012(E) – 9 –


3.1.12

purchasing agency

organization who groups the quantities of electronic components required by a series of

companies in order to constitute significant buying power and thereby obtain the best possible

supplier conditions for purchasing ( especially as regards pricing and purchasing conditions)

as well as for assistance with management, documentation , financing etc.


3.1.13

reseller

general supplier who offers a selection of electronic components to order from a catalog


3.1.14
microcircuit, component, device
electrical or electronic device that is not subject to disassembly without destruction or
impairment of design use and is a small circuit having a high equivalent circuit element
density which is considered as a single part composed of interconnected elements on or
within a single substrate to perform an electronic circuit function
Note 1 to entry: This excludes printed wiring boards / printed circuit boards, circuit card assemblies and modules
composed exclusively of discrete electronic components.
3.1.15
original equipment manufacturer (OEM)
manufacturer who defines the electronic sub assembly that includes the electronic
components or defines the components used in an assembly and/or test specification
3.1.16
original component manufacturer (OCM)
company specifying and manufacturing the electronic component
3.1.17
piracy
willful copyright infringement
3.1.18
sourcing channel
various sourcing system available to the electronic equipment manufacturer and its
subcontractors for example: purchase of electronic components directly from the original
manufacturer or its representative, purchase through a franchised or non-franchised
distributor, broker or other source
3.1.19
semiconductor
elec
...