IEC TS 62239:2008

IEC/TS 62239
Edition 2.0 2008-10
TECHNICAL
SPECIFICATION
Process management for avionics – Preparation of an electronic components
management plan
IEC/TS 62239:2008(E)
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IEC/TS 62239
Edition 2.0 2008-10
TECHNICAL
SPECIFICATION
Process management for avionics – Preparation of an electronic components
management plan
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
T
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-88910-651-6
– 2 – TS 62239 © IEC:2008(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6
1 Scope.7
2 Normative references .7
3 Terms, definitions and abbreviations .8
3.1 Terms and definitions .8
3.2 Abbreviations .11
4 Technical requirements .11
4.1 Component selection.12
4.2 Component application.12
4.2.1 Electromagnetic compatibility (EMC) .13
4.2.2 De-rating and stress analysis .13
4.2.3 Thermal analysis .13
4.2.4 Mechanical analysis .13
4.2.5 Testing, testability, and maintainability .14
4.2.6 Avionics radiation environment .14
4.3 Component qualification .14
4.3.1 General component qualification requirements .14
4.3.2 Component manufacturer quality management .14
4.3.3 Component manufacturer process management approval.14
4.3.4 Demonstration of component qualification .15
4.3.5 Qualification of components from a supplier that is not qualified .16
4.3.6 Distributor quality and process management approval .16
4.4 Continuous component quality assurance.16
4.4.1 General quality assurance requirements.16
4.4.2 On-going component quality assurance .17
4.4.3 Plan owner in-house continuous monitoring.17
4.4.4 Component design and manufacturing process change monitoring .17
4.5 Component dependability .18
4.5.1 Reliability assessment .18
4.5.2 Component availability and associated risk assessment .18
4.5.3 Component obsolescence.19
4.6 Component compatibility with the equipment manufacturing process .20
4.7 Component data.20
4.8 Configuration control .21
4.8.1 Alternative sources.21
4.8.2 Equipment change documentation .21
4.8.3 Customer notifications and approvals .22
4.8.4 Focal organisation .22
5 Plan administration requirements .22
5.1 Using components outside the manufacturer’s specified temperature range .22
5.2 Plan organization .22
5.3 Plan terms and definitions .23
5.4 Plan focal point .23
5.5 Plan references .23
5.6 Plan applicability .23

TS 62239 © IEC:2008(E) – 3 –
5.7 Plan implementation.23
5.8 Plan acceptance.23
Bibliography.24

– 4 – TS 62239 © IEC:2008(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –

Preparation of an electronic components management plan

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• The subject is still under technical development or where, for any other reason, there is
the future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC/TS 62239, which is a technical specification, has been prepared by IEC Technical
Committee 107: Process management for avionics.

TS 62239 © IEC:2008(E) – 5 –
This second edition cancels and replaces the first edition published in 2003. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
1) 4.2.2 – Derating and stress analysis, addition of JEP149.
2) 4.2.3 – Derating and stress analysis, thermal analysis allowed using provisions of
JEP149.
3) 4.3.4.2.1 – Component manufacturing technology qualification data, added JESD47,
JESD94, AEC-Q100, AEC-Q101, and AEC-Q200.
4) 4.3.4.2.1.1- Added avionics qualified electronic component program.
5) 4.5 – Component dependability, added integrated circuit wear out criteria from JESD47.
6) 4.8 – Configuration control, added counterfeit parts requirement.
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/60/DTS 107/78A/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this technical specification may be issued at a later date.

– 6 – TS 62239 © IEC:2008(E)
INTRODUCTION
This Technical Specification is intended to help aerospace equipment manufacturers,
subcontractors, maintenance facilities, and other aerospace component users develop their
own Electronic Component Management Plans (ECMPs), hereinafter also referred to as ‘plan’.
This Technical Specification states objectives to be accomplished; it does not require specific
tasks to be performed, specific data to be collected or reports to be issued. Those who
prepare plans in compliance with this Technical Specification are encouraged to document
processes that are the most effective and efficient for them in accomplishing the objectives of
this Technical Specification. In order to allow flexibility in implementing and updating the
documented processes, plan authors are encouraged to refer to their own internal process
documents instead of including detailed process documentation within their plans.
This component management Technical Specification is intended for aerospace users of
electronic components. This standard is not intended for use by the manufacturers of
electronic components. Components selected and managed according to the requirements of
a plan compliant to this Technical Specification may be approved by the concerned parties for
the proposed application, and for other applications with equal or less severe requirements.
Organizations that prepare such plans may prepare a single plan, and use it for all relevant
products supplied by the organization, or may prepare a separate plan for each relevant
product or customer.
NOTE Verification of compliance with IEC/TS 62239 will be done in accordance with IECQ documentation listed in
the bibliography.
TS 62239 © IEC:2008(E) – 7 –
PROCESS MANAGEMENT FOR AVIONICS –

Preparation of an electronic components management plan

1 Scope
This Technical Specification defines the requirements for developing an Electronic
Components Management Plan (ECMP) to assure customers and regulatory agencies that all
of the electronic components in the equipment of the plan owner are selected and applied in
controlled processes compatible with the end application and that the technical requirements
detailed in Clause 4 are accomplished. In general, the owners of a complete electronic
components management plan are avionics equipment manufacturers.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61340-5-1:2007, Electrostatics – Part 5-1: Protection of electronic devices from electro-
static phenomena – General requirements
IEC/TR 61340-5-2:2007, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
IEC/TR 62240, Process management for avionics – Use of semiconductor devices outside
manufacturers' specified temperature range
IEC/TS 62396 (all parts), Process management for avionics – Atmospheric radiation effects
IEC 62402:2007, Obsolescence management – Application guide
JEP149 (Nov 2004), JEDEC Publication, JEDEC Standard Application Thermal Derating
Methodologies
JESD47, JEDEC Standard, Stress – Test-Driven Qualification of integrated circuits
JESD94.01, JEDEC Standard, Application Specific Qualification Using Knowledge Based Test
Methodology
MIL-HDBK-263, Revision B Electrostatic Discharge Control Handbook
AEC–Q100, Failure Mechanism based Stress Test Qualification for Integrated Circuits
AEC–Q101, Stress Test Qualification for Automotive Grade discrete Semiconductors
AEC–Q200, Stress Test Qualification for Passive components

– 8 – TS 62239 © IEC:2008(E)
3 Terms, definitions and abbreviations
3.1 Terms and definitions
For the purposes of this document, the following definitions apply.
NOTE Plan owners may use alternative definitions consistent with convention within their company in their plan.
3.1.1
avionics equipment environment
applicable environmental conditions (as described per the equipment specification) that the
equipment shall be able to withstand without loss or degradation in equipment performance
throughout its manufacturing cycle and maintenance life (the length of which is defined by the
equipment manufacturer in conjunction with customers)
3.1.2
capable
term used to indicate that a component can be used successfully in the intended application
3.1.3
certified
indicates assessment and compliance to an applicable third party standard and maintenance
of a certificate and registration (i.e. JAN, IECQ)
3.1.4
characterization
process of testing a sample of components to determine the key electrical parameter values
that can be expected of all produced components of the type tested
3.1.5
component application
process that assures that the component meets the design requirements of the equipment in
which it is used
3.1.6
component manufacturer
organization responsible for the component specification and its production
3.1.7
component obsolescence management
range of management actions taken to avoid or resolve the effects of components not being
procurable due to the manufacturer(s) ceasing production. Component obsolescence manage-
ment should be considered an element of component dependability
3.1.8
component qualification
process used to demonstrate that the component is capable of meeting its specification for all
the required conditions and environments
3.1.9
component quality assurance
all activities and processes to provide adequate confidence that each individual component
meets the performance and environmental requirements
3.1.10
component selection
process of choosing a specific component for a specific application

TS 62239 © IEC:2008(E) – 9 –
3.1.11
component standardization
process of developing and agreeing on (by consensus of decision) uniform engineering
criteria for products and methods for achieving compatibility, interoperability,
interchangeability, or commonality of material
NOTE Standardization is used to reduce proliferation of parts into inventory.
3.1.12
dependability
capability of a product enabling it to achieve the specified functional performance at the
appropriate time and for the planned duration, without damage to itself or its environment
NOTE Dependability is generally characterised by the following four parameters: reliability, maintainability,
availability, safety.
3.1.13
distributor
organization contractually authorized by a manufacturer to store, split, repack and distribute
completely finished components which have been declared by the manufacturer as
conforming to their specifications. The distributor is responsible for providing any technical
information and traceability information supplied by the component manufacturer
3.1.14
Electronic Components Management Plan
ECMP
equipment manufacturer's document that defines the processes and practices for applying
components to an equipment or range of equipment. Generally, it addresses all relevant
aspects of controlling components during system design, development, production, and post-
production support
3.1.15
electronic components
electrical or electronic devices that are not subject to disassembly without destruction or
impairment of design use. They are sometimes called electronic parts, or piece parts
EXAMPLES Resistors, capacitors, diodes, integrated circuits, hybrids, application specific integrated circuits,
wound components and relays.
3.1.16
component source facility
this is a subcontractor to an OEM that procures and supplies the components in accordance
with the requirements of IEC/TS 62239
3.1.17
electronic equipment
item produced by the plan owner, which incorporates electronic components
EXAMPLES End items, sub-assemblies, line-replaceable units and shop-replaceable units.
3.1.18
may
Indicates a course of action which is permissible within the limits of this Technical
Specification
3.1.19
obsolete component
component which is no longer manufactured, and may or may not still be available

– 10 – TS 62239 © IEC:2008(E)
3.1.20
package type
generic package family describing the physical outline and lead style
EXAMPLES Plastic quad flat-package, ball grid array, chip scale package, SOIC package, SOT23, etc.
3.1.21
plan owner
original design authority responsible for all aspects of the design, functionality and reliability
of the delivered equipment in the intended application and is responsible for writing and
maintaining their specific ECMP
3.1.22
risk
measure of the potential inability to achieve overall program objectives within defined cost,
schedule, and technical constraints
3.1.23
risk management
is the act or practice of dealing with risk. It includes planning for risk, assessing (identifying
and analyzing) risk areas, developing risk handling options, monitoring risks to determine how
risks have changed, and documenting the overall risk management program
3.1.24
shall
indicates a requirement
3.1.25
should
offers a guideline or recommendation that might be used or helpful to assure compliance to
this Technical Specification or to an ECMP
3.1.26
single event effect
response of a component caused by the impact of galactic cosmic rays, solar enhanced
particles and/or energetic neutrons and protons. The range of responses can include both
non-destructive (for example upset) and destructive (for example latch-up or gate rupture)
phenomena
3.1.27
subcontractor
person or entity to whom the holder of obligations under a contract has delegated part or all of
such obligations
3.1.28
substitute component
component used as a replacement in equipment after the equipment design has been
approved
NOTE In some contexts, the term “alternate component” is used to describe a substitute component that is “equal
to or better than” the original component.
3.1.29
validation
method of qualifying components at the equipment manufacturer, when no in service data
from prior use is available and there is no manufacturer’s qualification data to analyse

TS 62239 © IEC:2008(E) – 11 –
3.1.30
will
expresses a declaration of intent when used in the context of being compliant to this
Technical Specification or to an ECMP
3.2 Abbreviations
DSCC – Defence Supply Centre Columbus
ECMP – Electronic Components Management Plan
EMC – Electromagnetic Compatibility
ESS – Environmental Stress Screening
NSI – National Supervising Inspectorate
OEM – Original Equipment Manufacturer
4 Technical requirements
The plan shall document the processes used by the plan owner to accomplish the following
requirements. These requirements shall apply to all electronic components, including off-
the-shelf components, which are defined by the component manufacturer data sheet, and
custom components, which are defined by the original equipment manufacturer.
1) component selection,
2) component application,
3) component qualification,
4) component quality assurance,
5) component dependability,
6) component compatibility with the equipment manufacturing process,
7) component data,
8) configuration control.
The plan shall state clearly, concisely, and unambiguously:
• what the plan owner does to accomplish each of the requirements;
• how compliance to the plan is demonstrated; and
• the evidence that is available to show that the requirements have been accomplished.
The plan shall document the processes used to address each of the requirements listed
above and described in 4.1 to 4.8 Depending on program or product line requirements, the
plan owner may, with appropriate justification, amend the above list of requirements by adding
or deleting requirements. If this is done, then the plan shall be assessed according to the
amended list of requirements stated in the plan.
The only type of amendment permitted is to add or delete entire requirements (those
designated and described in 4.1 to 4.8. Modification of any of the requirements listed above
and described in this Clause is not permitted.
All the requirements given in this Clause apply to deliverable flight equipment or
subassemblies for the avionics industry as stated in 5.6. The Original Equipment
Manufacturer (OEM plan owner) has the responsibility of satisfying the requirements given in
the list above. These requirements may be accomplished by either the OEM or may be
subcontracted. In either case, the OEM has the responsibility for ensuring all requirements
are met.
NOTE Ground support test equipment, flight demonstrator assemblies, and prototypes are typically exempt from
these requirements, unless the plan owner states otherwise in their plan, see 5.6.

– 12 – TS 62239 © IEC:2008(E)
The plan shall satisfy the requirements of this Clause, regardless of the source from which the
plan owner obtains components.
4.1 Component selection
All components shall be selected according to documented processes and shall satisfy the
requirements of this Subclause regardless of additional criteria such as standardisation, order
of preference, etc.
NOTE 1 Because of the highly individual nature of most plan owners’ administrative processes, no detail is
included here. It may include the use of a standard component list, provided the requirements of this Subclause are
met when the components are placed onto the standard list. Components should then be selected from the
standard list for use in specific applications. The selection process may include levels of preference. This may
refer to another process document describing how parts are selected. A preference list may be included in a
contract document.
NOTE 2 It is recommended that:
– the number of component types be minimised;
– components be selected from those readily available and produced in large volume;
– components be selected from those in a preferred stage of their lifecycle.
The conditions for use of the component shall be adequately identified, from the component
specification based on the component manufacturer’s data sheet and any additional
requirements to ensure suitability in the end application.
Availability and level of obsolescence risk should be considered as major component
selection criteria.
If additional performance is required (for example upscreening, uprating, additional
parameters defined), then the component shall be considered as a specific one and shall be
uniquely identified.
Each selected component shall be comprehensively identified within the selection process:
• For off-the-shelf components, as a minimum, the component manufacturer data sheet,
component manufacturer technical and application notes, packaging, reliability and
availability data, producibility data (including storage, soldering conditions, etc.) shall be
identified.
• For components specified by the equipment manufacturer, the specific documentation
(including specification, manufacturer data and process, reliability, specific tests and
screening, and associated in-house continuous monitoring) shall be identified.
4.2 Component application
Listed here are some categories of component application processes that may be
documented in a plan. Not all of the categories listed below are relevant to every component
application; therefore, the requirements listed below are applicable only if relevant to the
given application. The plan shall document the processes that are expected to be applicable
to the majority of the plan owner’s products, with the understanding that some of the
documented processes may not be used for specific programs or specific functionality of
products.
In each case, the documented processes shall verify if the equipment containing the
component shall continue to meet its performance requirements and specifications throughout
the manufacturing, full service storage, and operating lifetime. In order to determine design
suitability of equipment, there shall be a formal design review. At the design review,
consideration for each component shall be given to all design aspects including those given in
4.2.1 to 4.2.6. A documented report shall be prepared against each of the following design
aspects:
TS 62239 © IEC:2008(E) – 13 –
4.2.1 Electromagnetic compatibility (EMC)
EMC is demonstrated by analysis, testing and simulation to customer requirements. The
component performance shall be capable of EMC compliance at equipment level.
NOTE Certain components, for example high power switching components, may produce more electromagnetic
signal than other types and additionally certain components can be more susceptible to electromagnetic
interference than others. Component level EMC aspects have been addressed in IEC 61967-1.
4.2.2 De-rating and stress analysis
The documented processes shall verify that the component is used within the operating limits
specified by the component manufacturer per a documented set of derating criteria.
When the component manufacturer provides derating criteria and methods, they shall be used
where applicable. If the component manufacturer does not provide this information, or if it is
not applicable, then the plan owner shall develop and document appropriate derating criteria
and methods. All instances in which a component is not used within the limits defined above
shall be documented in the design records. In all such instances, either corrective action shall
be taken, or justification for not satisfying the criteria shall be documented.
JEP149 “Application Thermal Derating Methodologies” outlines derating methods that can be
used in avionics applications. Components handled in the manner described in JEP149 are
considered to be used within the specification limits provided by the manufacturer, if internal
parameters and technical data used for component thermal modelling (which ensures the
application) are documented with the component manufacturer data. JEP149 outlines two
important analyses related to thermal considerations of the application: reliability and
functional performance, both of which employ a process utilizing junction temperature
analysis. These analyses may require information from the component manufacturer not
provided in published data sheets. In these cases, the manufacturer shall be contacted to
determine the data needed to support appropriate application of the part with regard to these
issues.
4.2.3 Thermal analysis
The documented processes shall verify that the component is used within the temperature
limits specified by the component manufacturer, or by the plan owner.
If components are used outside the temperature ranges specified by the component manu-
facturer, then the supplier shall demonstrate how he controls this process. Recommendations
and guidelines on how to do this are contained in IEC/TR 62240 and may be used in addition
to the plan prepared according to this Technical Specification. Equivalent procedures from
other documents may also be acceptable.
NOTE 1 A common maximum temperature for semiconductor devices is the junction temperature. In some
instances, other limiting temperatures may be specified for semiconductor devices driven by physical properties of
materials used in packaging, bond pad and lead frame, etc., and other types of components. When the application
thermal analysis has successfully implemented the thermal and stress analysis process outlined in the note in
4.2.2, in conjunction with the component manufacturer, the component is considered to be used within the
manufacturer’s rating.
NOTE 2 In some instances, the manufacturer may not specify the maximum temperature. However, the maximum
temperature may be calculated from other information supplied by the component manufacturer.
NOTE 3 Verification processes may include analysis, modelling, thermal survey, simulation, or testing.
4.2.4 Mechanical analysis
The documented processes shall verify that the component is mechanically compatible with
the application. This includes mechanical fit, as well as the ability to withstand vibration,
mechanical shock, and mechanical stresses including those generated by mismatches of
coefficients of thermal expansion of the different materials.

– 14 – TS 62239 © IEC:2008(E)
NOTE Verification processes may include analysis, modelling, simulation, or testing.
4.2.5 Testing, testability, and maintainability
The documented processes shall assure testability and maintainability of the equipment by
the plan owner.
NOTE 1 The focus here is on testing and testability with regard to component verification, not on software or
system verification. Examples include board level or sub-assembly level testing, provision for test pins, and that
other equipment level tests will be available to verify component function at the appropriate level. Exhaustive
testing of complex components is not always realistic, but documented processes should assure some level of
evaluation of all components at appropriate points in the production flow.
NOTE 2 This requirement also includes design for maintainability, for example, placement for ease of component
replacement, mounting that minimises the risk of damage during maintenance and assures equipment quality
following maintenance or repair by equipment manufacturer.
4.2.6 Avionics radiation environment
The documented processes shall verify that the components will operate successfully in the
application with regard to the effects of atmospheric radiation on them. These include various
types of single event effects (SEE), such as single event upset (SEU), single event latch-up
(SEL), and single event burnout (SEB). If radiation effects are accommodated by the
equipment design, than the method of accommodation shall be documented in the equipment
design records. Guidance on the effects of atmospheric radiation may be found in the
IEC/TS 62396 series. The effects of atmospheric radiation and their accommodation shall be
assessed and documented in accordance with the SEE compliance considerations of the
IEC/TS 62396 series.
4.3 Component qualification
4.3.1 General component qualification requirements
It is desired and expected that the majority of components be obtained from qualified
component manufacturers; in which case the requirements of 4.3.2, 4.3.3, and 4.3.4 shall
apply. In cases where the component manufacturer is not qualified, the requirements of 4.3.5
shall apply.
4.3.2 Component manufacturer quality management
The plan owner shall verify that the component manufacturer has a documented quality
management system.
4.3.2.1 The component manufacturer shall have a quality system assessed to the relevant
parts of the ISO 9000 series or equivalent.
4.3.2.2 Where the component manufacturer is not assessed in accordance with 4.3.2.1
above or an approved existing scheme, then the plan owner shall demonstrate how the quality
management system of the component manufacturer shall be maintained. Where the plan
owner conducts or enables an audit on the component manufacturing facility, then the audit
shall be conducted in accordance with the relevant standards of the ISO 9000 series or
equivalent system. Suitably trained auditors shall conduct that audit.
4.3.3 Component manufacturer process management approval
The plan owner shall verify that the component manufacturer has a manufacturing process
capability utilising manufacturing technologies with demonstrable repeatability.
This may be satisfied by one of the following:

TS 62239 © IEC:2008(E) – 15 –
4.3.3.1 Manufacturing approval of the component technologies by a third party (for example
DSCC, IECQ, STACK S/0001) or within an international second party system.
4.3.3.2 Where the component manufacturer is not assessed as in 4.3.3.1 above, then the
plan owner shall demonstrate how the process management capability of the component
manufacturer is ensured. Where the plan owner conducts or enables an audit on the
component manufacturing facility, then the audit shall be conducted in accordance with one of
the above systems (as in 4.3.3.1 above) by suitably accredited auditors.
4.3.3.3 Manufacturers who do not have an appropriate internal quality management system
may be used when their products are fully qualified by the plan owner in accordance with
4.3.4.2.
4.3.4 Demonstration of component qualification
The plan owner shall document the component qualification process for each component.
The qualification plan and test procedures, sampling and criteria of acceptance (with the de-
fined margins) shall be described. The approach to quality and reliability required in the
application shall be outlined.
This can be demonstrated by any of the following, but the choice shall be justified:
4.3.4.1 Component qualification by an external party
Components qualified in accordance with a second or third party approval system as in
4.3.3.1.
4.3.4.2 Component qualification by the equipment manufacturer
Component qualification by the equipment manufacturer can be demonstrated by one or more
of the following:
4.3.4.2.1 Component manufacturer technology qualification data
Component manufacturers perform and record data from initial and regular ongoing
qualification testing on significant numbers of components. The plan owner shall review such
defined qualification testing with acceptance criteria and resulting data for suitability in the
end application. Component manufacturers produce components across a wide range of
market sectors, and qualification testing will reflect these. Stress levels in the component
qualification should equate to or exceed those of the end application or additional testing will
be necessary. This data is not guaranteed performance data and the avionics manufacturer
shall validate that each device type utilized is adequately qualified for the customer
performance requirements.
The component manufacturer may choose to qualify specific components in accordance with
JESD94, JESD47, AEC-Q100, AEC-Q101 and/or AEC-Q200. If the use of JESD94 is
determined to be applicable to any parts to be used on an avionics application, it shall be
specifically demonstrated the manufacturer’s qualification data was applicable to the avionics
application.
4.3.4.2.1.1 Avionics qualified electronic component program
The integrated circuit manufacturers are increasingly limiting their products to commercial or
industrial temperature range products. This trend is most pronounced in the functional areas
that are critical to avionics products, microprocessors, FPGA’s and memories. The Avionics
Qualified Electronic Part (AQEC) specification to GEIA-STD-0001-1 is being developed to
give access to internal manufacturer information which can be utilized to evaluate the

– 16 – TS 62239 © IEC:2008(E)
suitability of AQEC parts for specific applications. These are also typically sole source
products and the manufacturers will not supply any information relative to test programs.
The use of data obtained from a GEIA-STD-0002-1 Avionics Qualified Electronic Program
manufacturer is permitted and encouraged. This data is not guaranteed performance data and
it will be necessary for the avionics manufacturer to validate that each device type utilized
meets the customer performance requirements.
4.3.4.2.2 In-service experience
Satisfactory performance including reliability of the component in a similar or more harsh
environment shall be documented.
4.3.4.2.3 Similarity
Documentary evidence from test data or in-service experience of a previously qualified
associated component shall be given. The plan shall address the ground rules for assessment
by similarity to other component. For further details on similarity rules, refer to relevant
standards.
NOTE For example, EN 100114 or AEC Q100/101/200.
4.3.4.2.4 Equipment manufacturer validation
Validation may be employed particularly if components are from a manufacturer, component
technology or package type not previously used before.
The plan owner may need to perform component qualification at component level, with
completion at equipment level, for new technologies or package types not used before. New
components using existing technology and package styles used previously by the plan owner,
can be qualification tested within the equipment assembly qualification testing, without testing
at the component level.
Component qualification with completion tests at equipment level shall be documented and
used only when none of the other methods specified are possible.
4.3.5 Qualification of components from a supplier that is not qualified
If the component supplier is not qualified, then the plan shall document how the components
are qualified.
NOTE Examples of such processes are the development and implementation of a component qualification
process conducted by the plan owner, the component distributor, component manufacturer or a third party.
4.3.6 Distributor quality and process management approval
The plan owner shall verify that the distributors have a documented quality management
system.
The distributor quality management system shall be assessed in a similar way to either
4.3.2.1 or 4.3.2.2 and applicable to distributors. The distributor shall have an approved
process management system in a similar way to 4.3.3, for all its activ
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