IEC 60747-18-1:2019

IEC 60747-18-1 ®
Edition 1.0 2019-05
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices –
Part 18-1: Semiconductor bio sensors – Test method and data analysis for
calibration of lens-free CMOS photonic array sensors

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IEC 60747-18-1 ®
Edition 1.0 2019-05
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices –
Part 18-1: Semiconductor bio sensors – Test method and data analysis for

calibration of lens-free CMOS photonic array sensors

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-6909-1

– 2 – IEC 60747-18-1:2019 © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 8
4 Measurement setup . 9
4.1 General . 9
4.2 Measurement system . 9
4.2.1 Overall system . 9
4.2.2 Dark box . 11
4.2.3 Light source . 11
4.2.4 Sensor board . 11
4.2.5 Configuration parameters . 12
5 Measurement . 12
5.1 General . 12
5.2 Case 1: Fixed wavelength (λ) of light . 12
5.2.1 Planarization: At fixed λ and incident light intensity . 12
5.2.2 Linearity: Varying the incident light intensity with a fixed wavelength . 14
5.3 Case 2: Various wavelength (λ) of light . 14
6 Data analysis . 14
6.1 Data plot . 14
6.1.1 General . 14
6.1.2 Sensor screening . 16
6.2 Planarization characteristics . 16
6.2.1 Criterion of determining the reference pixel . 16
6.2.2 Lookup table of representative value for planarization calibration of
each pixel . 17
6.3 Linearity . 17
6.3.1 Criterion of linear region of each pixel . 17
6.3.2 Criterion of light intensity effective area for linearity. 18
6.3.3 Lookup table of the representative value for linearity calibration of each
pixel . 18
7 Calibration . 19
7.1 Calibration lookup table . 19
7.2 Reference for establishing the representative output value in the effective
area . 20
8 Test report . 21
Annex A (informative) Test report . 23
Test environment specification . 23
Specification of CMOS photonic array sensor . 24
A.3 Calibration lookup table . 24
Representative value look up table for planarization calibration of the sensor . 24
Representative value look up table for linearity calibration of the sensor . 25
Bibliography . 26

Figure 1 – Example of box plot. 9

Figure 2 – Example of measurement system with integrating sphere . 10
Figure 3 – Example of measurement system with incident parallel light . 10
Figure 4 – Example of photoelectric measurement schematic . 11
Figure 5 – Measurement flow . 12
Figure 6 – n trial data of frame capture . 13
Figure 7 – Two frame subtracted data . 13
Figure 8 – Dark frame subtracted data . 14
Figure 9 – Example of output electric signal non-linearity of 2D pixel array . 15
Figure 10 – Example of output electric signal non-linearity of one row of pixels . 15
Figure 11 – Example of one pixel’s output electric signal according to input light power . 16
Figure 12 – Example of determining the reference pixel . 17
Figure 13 – Example of the representative value for planarization . 17
Figure 14 – Example of light intensity effective area for linearity . 18
Figure 15 – Example of the representative value for linearity . 19
Figure 16 – Example of a simplified pixel structure and cross-sectional view with bio
reaction . 19
Figure 17 – Example of the representative value of the sensor . 21

Table 1 – Calibration lookup table . 20
Table 2 – Representative value table of the sensor . 21

– 4 – IEC 60747-18-1:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 18-1: Semiconductor bio sensors – Test method and data analysis
for calibration of lens-free CMOS photonic array sensors

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-18-1 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47E/643A/FDIS 47E/657/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts of the IEC 60747 series, published under the general title Semiconductor
devices, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

– 6 – IEC 60747-18-1:2019 © IEC 2019
INTRODUCTION
The IEC 60747-18 series on semiconductor bio sensors is expected to be composed of the
following parts:
• IEC 60747-18-1 defines the test method and data analysis for calibration of lens-free
CMOS photonic array sensor
• IEC 60747-18-2 defines the evaluation process of lens-free CMOS photonic array sensor
package module
• IEC 60747-18-3 defines the fluid flow characteristics of lens-free CMOS photonic array
sensor package module with fluidic system
The IEC 60747-18 series includes subjects such as noise analysis, long-term reliability tests,
test methods for lens-free CMOS photonic array sensor package module under patchable
environments, test methods under implantable environments, etc.
The International Electrotechnical Commission (IEC) draws attention to the fact that it is
claimed that compliance with this document may involve the use of patents given in several
subclauses as indicated in the table below. These patents are held by their respective
inventors under license to SOL Inc.:

The method of calibration of photon sensor pixel Subclauses 5.1, 5.2.1,
KR1020150081134 [SOL]
array by evaluating its characteristic 5.2.2, 5.3, 7.1
PCT/KR2016/006109
Subclauses 5.1, 5.2.1,
METHOD FOR CORRECTING OPTICAL SENSOR
5.2.2, 5.3, 7.1
[SOL] ARRAY MODULE THROUGH CHARACTERISTIC
US15/577586
EVALUATION
Clause 6
JP2017562062
IEC takes no position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured the IEC that he/she is willing to negotiate licences
under reasonable and non-discriminatory terms and conditions with applicants throughout the
world. In this respect, the statement of the holder of this patent right is registered with IEC.
Information may be obtained from:
SOL Inc.
H Business Park
C1010, 26, Beobwon-ro 9-gil, SongPa-Gu
Seoul 05838
Republic of Korea
Attention is drawn to the possibility that some of the elements of this document may be the
subject of patent rights other than those identified above. IEC shall not be held responsible for
identifying any or all such patent rights.
—————————
Under preparation. Stage at the time of publication: IEC/PRVC 60747-18-2:2019.
Under preparation. Stage at the time of publication: IEC/PRVC 60747-18-3:2019.

ISO (www.iso.org/patents) and IEC (http://patents.iec.ch) maintain on-line data bases of
patents relevant to their standards. Users are encouraged to consult the data bases for the
most up to date information concerning patents.

– 8 – IEC 60747-18-1:2019 © IEC 2019
SEMICONDUCTOR DEVICES –
Part 18-1: Semiconductor bio sensors – Test method and data analysis
for calibration of lens-free CMOS photonic array sensors

1 Scope
This part of IEC 60747 specifies the test methods and data analysis for the calibration of lens-
free CMOS photonic array sensors. This document includes the test conditions of each
process, configuration of lens-free CMOS photonic array sensors, statistical analysis of test
data, calibration for planarization and linearity, and test reports.
2 Normative references
There are no normative references in this document.
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
lens-free CMOS photonic array sensor
semiconductor-based optical detector or sensor whose sensing elements are arrayed in a
two-dimensional way and integrated with processing circuits on a chip
Note 1 to entry: Lens-free CMOS photonic array sensors are extensively utilized in bio diagnostic devices,
healthcare devices, lens-free microscopes, and patchable/implantable medical devices.
Note 2 to entry: The sensing environments of such a lens-free CMOS photonic array sensor are typically different
from those of general-purpose image sensors which are normally mounted with an external lens in module
housings.
3.2
quantum efficiency
QE
ratio of the number of elementary events (such as release of an electron) contributing to the
detector output, to the number of incident photons
Note 1 to entry: QE is the ability of a semiconductor to produce electron from incident photons.
Note 2 to entry: QE in general depends on the wavelength of the incident photon and can be obtained from
spectral responsivity and conversion gain of the sensor.
[SOURCE: IEC 60050-845:1987, 845-05-67, modified – The abbreviated term and the notes
to entry have been added.]
3.3
linearity
ability of a pixel of an array sensor to provide an output having a linear relationship with an
input light power
3.4
box plot
graphically depicting group of numerical data through their quartiles Q1, Q2, and Q3
SEE: Figure 1.
Note 1 to entry: In this document, the noise RMS (root mean square) and average signal are added. The average
signal is different from the median value, which is real measured data, whereas the average is calculated. Noise
RMS is the root mean square value of the difference between the incident signal and average signal.
Max
Whisker
Q3
Average + noise RMS
Average
Box
Median (Q2)
Q1
Whisker
Min
IEC
Figure 1 – Example of box plot
4 Measurement setup
4.1 General
Input factors and environmental factors affecting sensor performance are: (1) input
component: light power (wavelength, intensity, incident angle, polarization) and its
two-dimensional distribution as well as stability over time; electric inputs (drive pulses, bias
voltages, etc.); and (2) environmental factor: temperature. The evaluation environment
provides a method that allows us to control these factors and to obtain numerical results with
the necessary accuracy. The performance of the lens-free CMOS photonic array sensor
depends on the resolution, pixel size, pixel type, fill factor, quantum efficiency, conversion
gain, sensitivity, saturation level, dynamic range, image lag, black level, dark signal, temporal
noise, fixed-pattern noise, cross talk, etc. Clause A.1 and Clause A.2 show the required
parameters.
4.2 Measurement system
4.2.1 Overall system
All tests shall be performed under well certified and defined conditions to avoid any external
disturbances. Basic measurement setup schematics are depicted in Figure 2 or Figure 3.

– 10 – IEC 60747-18-1:2019 © IEC 2019
Light source
Sensor board
Jig
Jig for alignment of sensor's position
- x, y, z, azimuth, rotation
Integrating sphere
Source
Light
source
θ
PC
Baffle
Sensor θ
Detection
Sensor
plane
(pixel)
Incident light Sensor board
- Wavelength - Temperature
- Intensity - Clocks
Dark box
- Biases
- Incident angle
- Two-dimensional distribution
- Temporal variation
- Polarization
IEC
Figure 2 – Example of measurement system with integrating sphere
Light source
Sensor board
Jig
Jig for alignment of sensor's position
- x, y, z, azimuth, rotation
Parallel light
Light
source
θ
Sensor θ
Sensor
(pixel)
PC
Dark box
Incident light Sensor board
- Wavelength - Temperature
- Intensity - Clocks
- Incident angle - Biases
- Two-dimensional distribution
- Temporal variation
- Polarization
IEC
Figure 3 – Example of measurement system with incident parallel light

The photoelectric characteristics of a sensor board can be measured using the measurement
setup shown in Figure 4. This measurement setup utilizes a collimated light beam. The
temperature of the sensor array is measured to calibrate the thermal effect on the array
sensor. A calibrated photonic sensor will be used to provide a reference signal for the
collimated light.
Collimated light
V
I =
d
R
t
Digital number
V
ADC
Signal
R
t
chain
Temperature
sensor
I
d
CMOS Photonic
array sensor
Calibrated
photonic sensor
IEC
Figure 4 – Example of photoelectric measurement schematic
4.2.2 Dark box
A dark box shall block all other light sources that may affect the sensor under test except the
certified light source for
...