IEC 60191-6-18:2010

IEC 60191-6-18 ®
Edition 1.0 2010-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6-18: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages – Design guide for ball grid array
(BGA)
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-18: Règles générales pour la préparation des dessins d’encombrement
des dispositifs à semiconducteurs pour montage en surface – Guide de
conception pour les boîtiers matriciels à billes (BGA)

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IEC 60191-6-18 ®
Edition 1.0 2010-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6-18: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages – Design guide for ball grid array
(BGA)
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-18: Règles générales pour la préparation des dessins d’encombrement
des dispositifs à semiconducteurs pour montage en surface – Guide de
conception pour les boîtiers matriciels à billes (BGA)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
R
CODE PRIX
ICS 31.080.01 ISBN 978-2-88910-065-1
– 2 – 60191-6-18 © IEC:2010
CONTENTS
FOREWORD.3
1 Scope.5
2 Normative references .5
3 Terms and definitions .5
4 Terminal position numbering.6
5 Nominal package dimension .6
6 Symbols and drawings.7
7 Dimensions .10
8 Recommended BGA variations .16
Bibliography.20

Figure 1 – Cavity down type.7
Figure 2 – Cavity up type .8
Figure 3 – Pattern of terminal position areas.9
Figure 4 – Example of the terminal depopulations.15

Table 1 – Group 1: Dimensions appropriate to mounting and interchangeability.10
Table 2 – Group 2: Dimensions appropriate to mounting and gauging.13
Table 3 – Combinations of D, E, e, M , M , and n .14
D E
Table 4 – P-BGA (Cavity up) 1,27 mm pitch.16
Table 5 – P-BGA (Cavity up) 1,0 mm pitch.16
Table 6 – P-BGA (Cavity down) 1,27 mm pitch.18
Table 7 – T-BGA 1,27 mm pitch .18
Table 8 – T-BGA 1,0 mm pitch .19
Table 9 – P-BGA and C-BGA (Flip-chip interconnection) 1,0 mm pitch.19

60191-6-18 © IEC:2010 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-18: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Design guide for ball grid array (BGA)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6-18 has been prepared by subcommittee 47D: Mechanical
standardization for semiconductor devices, of IEC technical committee 47: Semiconductor
devices.
This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition
constitutes a technical revision.
The text of this standard is based on the following documents:
FDIS Report on voting
47D/753A/FDIS 47D/758/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

– 4 – 60191-6-18 © IEC:2010
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 60191 series, under the general title Mechanical
standardization of semiconductor devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
The contents of the corrigendum of May 2010 have been included in this copy.

60191-6-18 © IEC:2010 – 5 –
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-18: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Design guide for ball grid array (BGA)

1 Scope
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended
variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or
larger.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document applies.
IEC 60191-6, Mechanical standardization of semiconductor devices – Part 6: General rules for
the preparation of outline drawings of surface mounted semiconductor device packages
3 Terms and definitions
For the purposes of this document, the terms and definitions given IEC 60191 (series) and the
following apply.
3.1
ball grid array
BGA
package that has metal balls attached to one side of a substrate in a matrix of at least three
rows and three columns; terminals may be missing from some row-column intersections
NOTE BGA stands for “Ball Grid Array” in compliance with the existing standards (See Bibliography).
3.2
plastic ball grid array
P-BGA
BGA with a rigid organic substrate
3.3
tape ball grid array
T-BGA
BGA with a polyimide tape substrate
3.4
ceramic ball grid array
C-BGA
BGA with a ceramic substrate
3.5
P-BGA (Flip chip interconnection)
BGA with an organic substrate and a die bonded to a substrate through metal bumps

– 6 – 60191-6-18 © IEC:2010
3.6
recommended BGA variation
BGA variation with the specific dimensions and ball counts as the first choice for production
packages other than recommended BGA variations are the least choice for production to
avoid endless proliferation of BGA outlines.
4 Terminal position numbering
When a package is viewed from the terminal side with the index corner in the bottom left
corner position, terminal rows are lettered from bottom to top starting with A, then B, C,,,, AA,
AB, etc., while terminal columns are numbered from left to right starting with 1. Terminal
positions are designated by a row-column grid system and shown as alphanumeric
identification, e.g., A1, B1, or AC34. The letters I, O, Q, S, X and Z are not used for naming
the terminal rows.
5 Nominal package dimension
A nominal package dimension is defined as “the package width (E) × length (D)”, which is
expressed in the tenths place in millimetre.

60191-6-18 © IEC:2010 – 7 –
6 Symbols and drawings
BGA outline is shown in the Figure 1 and 2.

v
E
B
A
(3) (7)
(4)
v
y
(1)
1 S
S
y S (11)
(2)
(10)
S
e (Z )
E
E
M
D
(7)
E
D
C
B
A
M
E
1 2 3 4 5
(6)
∅ bp
(5)
∅X M A  B
S
∅X M
S IEC  2507/09
The symbols in this figure are explained in IEC 60191-6.
Figure 1 – Cavity down type
(9)
A
(10)
(2)
(Z ) D
D e
(8)
S A
D
A
– 8 – 60191-6-18 © IEC:2010
E
v
(3)
(4)
v
y S
(1) 1
S
y
S
(10)
(2)
S
e E
(Z )
E
M
D
E
D
C
B
A
1 2 3 4 5
M
E
(6)
(5)
∅ bp
A  B
S
∅X M
S
∅X M
IEC  2508/09
The symbols in this figure are explained in IEC 60191-6.
Figure 2 – Cavity up type
(10)
(8)
(2)
A
D
(Z ) e
D
(S )
D
A
60191-6-18 © IEC:2010 – 9 –
Notes relating to Figure 1 and Figure 2:
(1) Datum S is defined as the seating plane on which a package free stands by contact of the
balls.
(2) The distance between the centrelines of any two adjacent rows or columns of balls.
(3) The hatched zone indicates the index-marking area where whole index mark will be contained.
(4) The profile tolerance that controls of package size and orientation is applied to all four sides of
the package outline.
(5) The tolerance of position that controls the relationship of the balls applies to all balls.
(6) The terminal diameter “bp” is the maximum diameter of individual balls as measured in the
plane parallel to the seating plane.
(7) It shows the lid made of mould compound, glob top resin, metal cap, ceramics, etc. It may be
flat, convex, or concave shape.
(8) The primary stand-off height is defined by the height from the seating plane to the package
substrate.
(9) The secondary stand-off height is defined by the height from the seating plane to the lid that is
the lowest surface on the cavity-down configuration.
(10) S and S are the dimensions that define the positions of balls next to the datum A and B.
D E
NOTE An array pattern of permissible terminal-existing zones including true position tolerance is shown in Figure
3.
S
e E
b
3 max
b = bp + x
3 max max
IEC  2509/09
The symbols in this figure are explained in IEC 60191-6.
Figure 3 – Pattern of terminal position areas
e
S
D
– 10 – 60191-6-18 © IEC:2010
7 Dimensions
Table 1 – Group 1: Dimensions appropriate to mounting and interchangeability
Unit: mm
Recommended
Term Symbol Specification
value
Nominal E × D (1) A nominal package dimension is defined as “the Refer to Table 4
package package width (E) × length (D)”, which is expressed in through 9
dimension
the tenths place in millimetre.
(2) Variations on nominal package dimensions are:
7,0×7,0 25,0×25,0
8,0×8,0 27,0×27,0
9,0×9,0 29,0×29,0
10,0×10,0 31,0×31,0
11,0×11,0 33,0×33,0
12,0×12,0 35,0×35,0
13,0×13,0 37,5×37,5
14,0×14,0 40,0×40,0
15,0×15,0 42,5×42,5
16,0×16,0 45,0×45,0
17,0×17,0 47,5×47,5
18,0×18,0 50,0×50,0
19,0×19,0 52,5×52,5
20,0×20,0 55,0×55,0
21,0×21,0 57,5×57,5
23,0×23,0 60,0×60,0
Package length D (1) Package length D Refer to Table 4
through 9
7,0 25,0
8,0 27,0
9,0 29,0
10,0 31,0
11,0 33,0
12,0 35,0
13,0 37,5
14,0 40,0
15,0 42,5
16,0 45,0
17,0 47,5
18,0 50,0
19,0 52,5
20,0 55,0
21,0 57,5
23,0 60,0
60191-6-18 © IEC:2010 – 11 –
Table 1 (continued)
Unit:mm
Recommended
Term Symbol Specification
value
Package width E (1) Package width E Refer to Table 4
through 9
7,0 25,0
8,0 27,0
9,0 29,0
10,0 31,0
11,0 33,0
12,0 35,0
13,0 37,5
14,0 40,0
15,0 42,5
16,0 45,0
17,0 47,5
18,0 50,0
19,0 52,5
20,0 55,0
21,0 57,5
23,0 60,0
Profile v v = 0,20 -
tolerance of
Profile tolerance includes body-edge burr
package body
Profile height A -
A
max
1,20
1,70
6,00
”A” includes heat slug thickness, package warpage and tilt
errors.
“A” does not include the height of external heat sink or chip
capacitors
Primary stand- A -
off height
A A A
e
1 min 1 nom 1 max
1,27 0,5 0,6 0,7
1,00 0,4 0,5 0,6
– 12 – 60191-6-18 © IEC:2010
Table 1 (continued)
Unit mm
Recommended
Term Symbol Specification
value
Secondary A A = 0,25
−
4 4 min
stand-off
height
Terminal grid 1,27
e −
pitch
1,00
Terminal bp −
diameter
bp bp bp
e
min nom max
1,27 0,60 0,75 0,90
1,00 0,50 0,60 0,70
Positional x −
tolerance with
e x
respect to the 1
body datum
1,27 0,30
1,00 0,25
Terminal-to- x
terminal
e x
positional 2
tolerance
1,27 0,15
1,00 0,10
Coplanarity y −
y
e
1,27 0,20
1,00 0,20
Parallelism y y = 0,35 −
1 1
tolerance of
the top surface
Center S When M is an odd number, S = 0. −
D D
D
terminal(s)
When M is an even number, SD = e /2.
position in
D
length
Center
S When M is an odd number, S = 0. −
E E
E
terminal(s)
When M is even number, S = e /2.
E
position in
E
width
60191-6-18 © IEC:2010 – 13 –
Table 1 (continued)
Unit mm
Recommended
Term Symbol Specification
value
Terminal Terminal balls will be placed on the matrix determined by –
matrix
terminal pitch e, matrix size M and M , and centre ball
D E
position S and S . Any terminal balls may be omitted from
D E
the terminal matrix
Number of n Refer to Table 3 Refer to Table 4
terminals through 9
Maximum M
D
matrix size in
length
Maximum M
E
matrix size in
width
Table 2 – Group 2: Dimensions appropriate to mounting and gauging
Unit: mm
Recommended
Term Symbol Specification
value
Overhang (Z ) –
(Z ) ={ D -(M -1) × e } / 2
D
D D
dimension in
length
Overhang (Z ) –
(Z ) ={ E -(M -1) × e } / 2
E
E E
dimension in
width
– 14 – 60191-6-18 © IEC:2010
Table 3 – Combinations of D, E, e, MD, ME, and n
D and E e = 1,27 mm e = 1,00 mm

M M M M
D max D max-1 D max D max-1
n n n n
max max max max
mm
M M M M
E max E max-1 E max E max-1
7,0 5  25 4  16 6  36 5  25
8,0 6  36 5  25 7  49 6  36
9,0 6  36 5  25 8  64 7  49
10,0 7  49 6  36 9  81 8  64
11,0 8  64 7  49 10 100 9  81
12,0 9  81 8  64 11 121 10 100
13,0 10 100 9  81 12 144 11 121
14,0 10 100 9  81 13 169 12 144
15,0 11 121 10 100 14 196 13 169
16,0 12 144 11 121 15 225 14 196
17,0 13 169 12 144 16 256 15 225
18,0 13 169 12 144 17 289 16 256
19,0 14 196 13 169 18 324 17 289
20,0 15 225 14 196 19 361 18 324
21,0 16 256 15 225 20 400 19 361
23,0 18 324 17 289 22 484 21 441
25,0 19 361 18 324 24 576 23 529
27,0 21 441 20 400 26 676 25 625
29,0 22 484 21 441 28 784 27 729
31,0 24 576 23 529 30 900 29 841
33,0 25 625 24 576 32 1024 31 961
35,0 27 729 26 676 34 1156 33 1089
37,5 29 841 28 784 37 1369 36 1296
40,0 31 961 30 900 39 1521 38 1444
42,5 33 1089 32 1024 42 1764 41 1681
45,0 35 1225 34 1156 44 1936 43 1849
47,5 37 1369 36 1296 47 2209 46 2116
50,0 39 1521 38 1444 49 2401 48 2304
52,5 41 1681 40 1600 52 2704 51 2601
55,0 43 1849 42 1764 54 2916 53 2809
57,5 45 2025 44 1936 57 3249 56 3136
60,0 47 2209 46 2116 59 3481 58 3364
NOTE n indicates the maximum number of terminals that can be accommodated in a package bottom. The
max
actual number of the terminals may be less than n by depopulating terminals from the full matrix.
max
60191-6-18 © IEC:2010 – 15 –
Full grid 4 rows in perimeter 5 rows in perimeter
matrix matrix
6 rows in perimeter 7 rows in perimeter
matrix matrix
IEC  2509/09
Index marking is in the left bottom corner.
Figure 4 – Example of the terminal depopulations

– 16 – 60191-6-18 © IEC:2010
8 Recommended BGA variations
Table 4 – P-BGA (cavity up) 1,27 mm pitch
D and E e Number of rows in Number of rows in Number of
M
mm perimeter matrix centre matrix terminals
mm
27 20 1,27 4 0 256
27 20 1,27 4 4 272
27 20 1,27 5 0 300
27 20 1,27 5 4 316
27 20 1,27 6 0 336
27 20 1,27 6 4 352
31 23 1,27 4 0 304
31 23 1,27 4 5 329
31 23 1,27 5 0 360
31 23 1,27 5 5 385
31 23 1,27 6 0 408
31 23 1,27 6 5 433
35 26 1,27 4 0 352
35 26 1,27 4 6 388
35 26 1,27 5 0 420
35 26 1,27 5 6 456
35 26 1,27 6 0 480
35 26 1,27 6 6 516
40 30 1,27 6 0 576
40 30 1,27 6 8 640
40 30 1,27 7 0 644
40 30 1,27 7 8 708
Table 5 – P-BGA (cavity up) 1,0 mm pitch
D and E e Number of rows in Number of rows in Number of
M
mm mm perimeter matrix centre matrix terminals
13 12 1,00 Full Full 144
14 13 1,00 Full Full 169
15 14 1,00 Full Full 196
16 15 1,00 Full Full 225
17 16 1,00 Full Full 256
18 17 1,00 Full Full 289
19 18 1,00 Full Full 324
20 19 1,00 Full Full 361
21 20 1,00 4 0 256
60191-6-18 © IEC:2010 – 17 –
Table 5 (continued)
D and E e
Number of rows in Number of rows in Number of
M
perimeter matrix centre matrix terminals
mm
mm
21 20 1,00 4 6 292
21 20 1,00 Full Full 400
23 22 1,00 4 0 288
23 22 1,00 4 6 324
23 22 1,00 5 0 340
23 22 1,00 5 6 376
23 22 1,00 6 0 384
23 22 1,00 6 6 420
23 22 1,00 Full Full 484
27 26 1,00 4 0 352
27 26 1,00 4 6 388
27 26 1,00 5 0 420
27 26 1,00 5 6 456
27 26 1,00 6 0 480
27 26 1,00 6 6 516
27 26 1,00 Full Full 676
31 30 1,00 4 0 416
31 30 1,00 4 6 452
31 30 1,00 5 0 500
31 30 1,00 5 6 536
31 30 1,00 6 0 576
31 30 1,00 6 6 612
31 30 1,00 Full Full 900
35 33 1,00 4 0 464
35 33 1,00 4 9 545
35 33 1,00 5 0 560
35 33 1,00 5 9 641
35 33 1,00 6 0 648
35 33 1,00 6 9 729
35 33 1,00 7 0 728
35 33 1,00 7 9 809
35 33 1,00 Full Full 1089
37,5 36 1,00 4 0 512
37,5 36 1,00 4 10 612
37,5 36 1,00 5 0 620
37,5 36 1,00 5 10 720
37,5 36 1,00 6 0 812
37,5 36 1,00 6 10 912
37,5 36 1,00 7 0 896
– 18 – 60191-6-18 © IEC:2010
Table 5 (continued)
Number of rows in Number of rows in Number of
D and E M e
perimeter matrix centre matrix terminals
37,5 36 1,00 7 10 996
37,5 36 1,00 Full Full 1296
40 38 1,00 6 0 768
40 38 1,00 6 10 868
40 38 1,00 7 0 868
40 38 1,00 7 10 968
40 38 1,00 Full Full 1444
Table 6 – P-BGA (cavity down) 1,27 mm pitch
D and E e Number of rows in Number of
M
mm mm perimeter matrix terminals
27 20 1,27 4 256
31 23 1,27 4 304
35 26 1,27 4 352
35 26 1,27 5 420
40 30 1,27 4 416
40 30 1,27 5 500
40 30 1,27 6 576
42,5 32 1,27 5 540
45 34 1,27 4 480
45 34 1,27 5 580
45 34 1,27 6 672
45 34 1,27 7 756
Table 7 – T-BGA 1,27 mm pitch
D and E e Number of rows in Number of
M
mm mm perimeter matrix terminals
27 20 1,27 4 256
31 23 1,27 4 304
35 26 1,27 4 352
35 26 1,27 5 420
35 26 1,27 6 480
40 30 1,27 5 500
40 30 1,27 6 576
40 30 1,27 7 644
60191-6-18 © IEC:2010 – 19 –
Table 8 – T-BGA 1,0 mm pitch
D and E e Number of rows in Number of
M
mm perimeter matrix terminals
mm
27 25 1,0 4 3
...