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IEC

IEC 60191-6-18:2010/COR1:2010

(Corrigendum)

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Corrigendum 1 - Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-18: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers matriciels à billes (BGA)

General Information

Status
Published
Publication Date
30-May-2010
ICS
31.080.01 - Semiconductor devices in general
Technical Committee
SC 47D - Semiconductor devices packaging
Current Stage
PPUB - Publication issued
Start Date
30-Jun-2010
Completion Date
31-May-2010
Ref Project

Relations

Corrects
IEC 60191-6-18:2010 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Effective Date
05-Sep-2023
Corrects
IEC PAS 60191-6-18:2008 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Effective Date
05-Sep-2023
Corrected By
IEC 60191-6-18:2010/COR2:2010 - Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Effective Date
05-Sep-2023

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IEC 60191-6-18:2010/COR1:2010 - Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) Released:5/31/2010IEC 60191-6-18:2010/COR1:2010 - Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) Released:5/31/2010
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IEC 60191-6-18:2010/COR1:2010 - Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) Released:5/31/2010
English and French language
10 pages
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Standards Content (Sample)


IEC 60191-6-18 CEI 60191-6-18
(First edition – 2010) (Première édition – 2010)

MECHANICAL STANDARDIZATION OF NORMALISATION MÉCANIQUE DES DISPOSITIFS
SEMICONDUCTOR DEVICES – À SEMICONDUCTEURS –

Part 6-18: General rules for the preparation of Partie 6-18: Règles générales pour la préparation
outline drawings of surface mounted
des dessins d’encombrement des dispositifs à
semiconductor device packages –
semiconducteurs pour montage en surface –
Design guide for ball grid array (BGA)
Guide de conception pour les boîtiers matriciels
à billes (BGA)
CORRIGENDUM 1
3.1 3.1
ball grid array boîtier matriciel à billes
BGA BGA
Instead of: à la place de:
...

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