IEC 60191-6-18:2010/COR1:2010
(Corrigendum)Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Corrigendum 1 - Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-18: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers matriciels à billes (BGA)
General Information
- Status
- Published
- Publication Date
- 30-May-2010
- Technical Committee
- SC 47D - Semiconductor devices packaging
- Current Stage
- PPUB - Publication issued
- Start Date
- 31-May-2010
- Completion Date
- 30-Jun-2010
Relations
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
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IEC 60191-6-18:2010/COR1:2010 - Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) Released:5/31/2010
Frequently Asked Questions
IEC 60191-6-18:2010/COR1:2010 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)". This standard covers: Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
IEC 60191-6-18:2010/COR1:2010 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.
IEC 60191-6-18:2010/COR1:2010 has the following relationships with other standards: It is inter standard links to IEC 60191-6-18:2010, IEC PAS 60191-6-18:2008, IEC 60191-6-18:2010/COR2:2010. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
IEC 60191-6-18:2010/COR1:2010 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
IEC 60191-6-18 CEI 60191-6-18
(First edition – 2010) (Première édition – 2010)
MECHANICAL STANDARDIZATION OF NORMALISATION MÉCANIQUE DES DISPOSITIFS
SEMICONDUCTOR DEVICES – À SEMICONDUCTEURS –
Part 6-18: General rules for the preparation of Partie 6-18: Règles générales pour la préparation
outline drawings of surface mounted
des dessins d’encombrement des dispositifs à
semiconductor device packages –
semiconducteurs pour montage en surface –
Design guide for ball grid array (BGA)
Guide de conception pour les boîtiers matriciels
à billes (BGA)
CORRIGENDUM 1
3.1 3.1
ball grid array boîtier matriciel à billes
BGA BGA
Instead of: à la place de:
...
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