IEC 60747-16-6:2019

IEC 60747-16-6 ®
Edition 1.0 2019-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 16-6: Microwave integrated circuits – Frequency multipliers

Dispositifs à semiconducteurs –
Partie 16-6: Circuits intégrés hyperfréquences – Multiplicateurs de fréquence

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IEC 60747-16-6 ®
Edition 1.0 2019-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 16-6: Microwave integrated circuits – Frequency multipliers

Dispositifs à semiconducteurs –

Partie 16-6: Circuits intégrés hyperfréquences – Multiplicateurs de fréquence

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-7081-3

– 2 – IEC 60747-16-6:2019  IEC 2019
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Essential ratings and characteristics . 8
4.1 General requirements . 8
4.1.1 Circuit identification and types . 8
4.1.2 General function description . 8
4.1.3 Manufacturing technology . 8
4.1.4 Package identification . 8
4.2 Application description . 8
4.2.1 Conformance to system and/or interface information . 8
4.2.2 Overall block diagram . 8
4.2.3 Reference data . 8
4.2.4 Electrical compatibility . 8
4.2.5 Associated devices . 9
4.3 Specification of the function . 9
4.3.1 Detailed block diagram – Functional blocks . 9
4.3.2 Identification and function of terminals . 9
4.3.3 Function description . 10
4.4 Limiting values (absolute maximum rating system) . 10
4.4.1 Requirements . 10
4.4.2 Electrical limiting values . 10
4.4.3 Temperatures . 11
4.5 Operating conditions (within the specified operating temperature range) . 11
4.6 Electrical characteristics . 12
4.7 Mechanical and environmental ratings, characteristics and data . 12
4.8 Additional information . 12
5 Measuring methods . 13
5.1 General . 13
5.1.1 General precautions . 13
5.1.2 Characteristic impedance . 13
5.1.3 Handling precautions . 13
5.1.4 Types . 13
5.2 Output power (P ) . 13
o
5.2.1 Purpose . 13
5.2.2 Circuit diagram . 13
5.2.3 Principle of measurement . 13
5.2.4 Circuit description and requirements . 14
5.2.5 Precautions to be observed . 14
5.2.6 Measurement procedure . 14
5.2.7 Specified conditions . 14
5.3 Conversion gain (G ) . 14
c
5.3.1 Purpose . 14
5.3.2 Circuit diagram . 15
5.3.3 Principle of measurement . 15
5.3.4 Circuit description and requirements . 15

5.3.5 Precautions to be observed . 15
5.3.6 Measurement procedure . 15
5.3.7 Specified conditions . 15
5.4 Input return loss (L ) . 15
ret(in)
5.4.1 Purpose . 15
5.4.2 Circuit diagram . 15
5.4.3 Principle of measurement . 16
5.4.4 Circuit description and requirements . 16
5.4.5 Precautions to be observed . 16
5.4.6 Measurement procedure . 16
5.4.7 Specified conditions . 17
5.5 Output return loss (L ) . 17
ret(out)
5.5.1 Purpose . 17
5.5.2 Circuit diagram . 17
5.5.3 Principle of measurement . 17
5.5.4 Circuit description and requirements . 18
5.5.5 Precautions to be observed . 18
5.5.6 Measurement procedure . 18
5.5.7 Specified conditions . 18
5.6 Fundamental isolation (P /P ) . 19
o 1
5.6.1 Purpose . 19
5.6.2 Circuit diagram . 19
5.6.3 Principle of measurement . 19
5.6.4 Circuit description and requirements . 19
5.6.5 Precautions to be observed . 19
5.6.6 Measurement procedure . 19
5.6.7 Specified conditions . 20
5.7 n-th order harmonic isolation (P /P ) . 20
o nth
5.7.1 Purpose . 20
5.7.2 Circuit diagram . 20
5.7.3 Principle of measurement . 20
5.7.4 Circuit description and requirements . 20
5.7.5 Precautions to be observed . 20
5.7.6 Measurement procedure . 20
5.7.7 Specified conditions . 21
5.8 Phase noise (L (f)) . 21
5.8.1 Purpose . 21
5.8.2 Measuring methods . 21

Figure 1 – Circuit diagram for the measurement of the output power . 13
Figure 2 – Circuit diagram for the measurement of the input return loss . 16
Figure 3 – Circuit diagram for the measurement of the output return loss . 17
Figure 4 – Circuit diagram for the measurement of the phase noise L (f) (method 1) . 22
Figure 5 – Circuit diagram for the measurement of the phase noise L (f) (method 2) . 23
Figure 6 – Circuit diagram for the measurement of the phase noise L (f) (method 3) . 24

Table 1 – Comparison of phase noise measuring methods . 21

– 4 – IEC 60747-16-6:2019  IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-6: Microwave integrated circuits –
Frequency multipliers
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-16-6 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this International Standard is based on the following documents:
CDV Report on voting
47E/602/CDV 47E/622A/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
The French version of this standard has not been voted upon.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 60747 series, published under the general title Semiconductor
devices, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – IEC 60747-16-6:2019  IEC 2019
SEMICONDUCTOR DEVICES –
Part 16-6: Microwave integrated circuits –
Frequency multipliers
1 Scope
This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and
measuring methods of microwave integrated circuit frequency multipliers.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60617, Graphical symbols for diagrams (available at http://std.iec.ch/iec60617>)
IEC 60747-1:2006, Semiconductor devices – Part 1: General
IEC 60747-1:2006/AMD 1:2010
IEC 60747-4, Semiconductor devices – Discrete devices – Part 4: Microwave diodes and
transistors
IEC 60747-16-3:2002, Semiconductor devices – Part 16-3: Microwave integrated circuits –
Frequency converters
IEC 60747-16-3:2002/AMD 1:2009
IEC 60747-16-3:2002/AMD 2:2017
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
output frequency
f
o
frequency which equals the input frequency multiplied by the multiplying factor N, where N is
an integer
3.2
output power
P
o
RF power measured at the output port at the output frequency
3.3
conversion gain
G
c
ratio of the output power to the input power
3.4
input return loss
L
ret(in)
ratio of the incident power at the input port to the reflected power at the input port
3.5
output return loss
L
ret(out)
ratio of the incident power at the output port to the reflected power at the output port
3.6
fundamental isolation
P /P
o 1
ratio of the output power to the power of fundamental component at the input frequency at the
output port
3.7
n-th order harmonic isolation
/P
P
o nth
ratio of the output power to the power of the n-th order harmonic component at the output port
3.8
phase noise
L (f)
frequency-domain measure of the short-term frequency stability of an output
Note 1 to entry: This phase noise is normally expressed as the power spectral density of the phase fluctuations,
S (f), where the phase fluctuation function is φ(t) = 2πFt − 2πF t. The spectral density of phase fluctuation can be
φ 0
directly related to the spectral density of frequency fluctuation by the following formula:
F
Sf = S f rad /Hz
( ) ( )
φ  y
f

where
F is the output frequency;
F is the average output frequency;
f is the Fourier frequency.
Note 2 to entry: L (f) is pronounced "script-ell of f".
[SOURCE: IEC 60050-561:2014, 561-03-22, modified – A symbol and Note 2 to entry have
been added. "Oscillator" has been replaced by "output."]

– 8 – IEC 60747-16-6:2019  IEC 2019
4 Essential ratings and characteristics
4.1 General requirements
4.1.1 Circuit identification and types
The identification of type (device name), the category of circuit and technology applied shall
be given.
Microwave frequency multipliers comprise one category.
4.1.2 General function description
A general description of the function performed by the integrated circuit microwave frequency
multipliers and the features for the application shall be made.
4.1.3 Manufacturing technology
The manufacturing technology, for example semiconductor monolithic integrated circuit, thin
film integrated circuit, micro-assembly. shall be stated. This statement shall include details of
the semiconductor technologies such as Schottky-barrier diode, metal-semi-conductor-field-
effect-transistor (MESFET), Si bipolar transistor.
IEC 60747-4 shall be referred to for terminology and letter symbols, essential ratings and
characteristics and measuring methods of such microwave devices.
4.1.4 Package identification
The following statements shall be made:
a) chip or packaged form;
b) IEC and/or national reference number of the outline drawing, or drawing of non-standard
package including terminal numbering;
c) principal package material, for example, metal, ceramic, plastic.
4.2 Application description
4.2.1 Conformance to system and/or interface information
It should be stated whether the integrated circuit conforms to an application system and/or an
interface standard or a recommendation.
Detailed information concerning application systems, equipment and circuits such as very
small aperture terminal (VSAT) systems, broadcasting satellite (BS) receivers, microwave
landing systems should also be given.
4.2.2 Overall block diagram
A block diagram of the applied systems should be given if necessary.
4.2.3 Reference data
The most important properties that permit comparison between derivative types should be
given.
4.2.4 Electrical compatibility
It should be stated whether the integrated circuit is electrically compatible with other particular
integrated circuits, or families of integrated circuits, or whether special interfaces are required.

Details should be given concerning the type of input and output circuits, for example
input/output impedances, DC block, open-drain. Interchangeability with other devices, if any,
should also be given.
4.2.5 Associated devices
If applicable, the following should be stated:
– devices necessary for correct operation (list with type number, name and function);
– peripheral devices with direct interfacing (list with type number, name and function).
4.3 Specification of the function
4.3.1 Detailed block diagram – Functional blocks
A detail block diagram or equivalent circuit information of the integrated circuit microwave
frequency multipliers shall be given. The block diagram shall be composed of the following:
a) functional blocks;
b) mutual interconnections among the functional blocks;
c) individual functional units within the functional blocks;
d) mutual interconnections among the individual functional blocks;
e) function of each external connection;
f) inter-dependence between the separate functional blocks.
The block diagram shall identify the function of each external connection and, where no
ambiguity can arise, also show the terminal symbols and/or numbers. If the encapsulation has
metallic parts, any connection to them from external terminals shall be indicated. The
connections with any associated external electrical elements shall be stated, where necessary.
As additional information, the complete electrical circuit diagram can be reproduced, but not
necessarily with indications of the values of the circuit components. The graphical symbol for
the function shall be given. With respect to the rules governing such diagrams, IEC 60617
applies.
4.3.2 Identification and function of terminals
All terminals shall be identified on the block diagram (supply terminals, input or output
terminals, input/output terminals).
The terminal functions 1) to 4) shall be indicated in a table as follows:
Terminal Terminal 1) Terminal 2) Function Function of terminal
number symbol designation
3) Input/output 4) Type of
identification input/output circuits

1) Terminal designation
A terminal designation to indicate the function of the terminal shall be given. Supply
terminals, ground terminals, blank terminals (with abbreviation NC), non-usable terminals
(with abbreviation NU) shall be distinguished.
2) Function
A brief indication of the terminal function shall be given:
– each function of multi-role terminals, i.e. terminals having multiple functions;

– 10 – IEC 60747-16-6:2019  IEC 2019
– each function of integrated circuit selected by mutual pin connections, programming
and/or application of function selection data to the function selection pin, such as
mode selection pin.
3) Input/output identification
Input, output, input/output and multiplex output terminals shall be distinguished.
4) Type of input/output circuits
The type of input and output circuit, for example input/output impedances, with or without
DC block, shall be distinguished.
If the baseplate of the package is used as a ground terminal, the type of ground, for example
analog ground, digital ground, shall be stated in the column of 2) Function.
EXAMPLE
4.3.3 Function description
The function performed by the circuit shall be specified, including the following information:
– basic function;
– relation to external terminals;
– operation mode (e.g. set-up method, preference).
4.4 Limiting values (absolute maximum rating system)
4.4.1 Requirements
The table for these values shall contain the following:
– Any interdependence of limiting conditions shall be specified.
– If externally connected and/or attached elements, for example heatsinks, have an
influence on the values of the ratings, the ratings shall be specified for the integrated
circuit with the elements connected and/or attached.
– If limiting values are exceeded for transient overload, the permissible excess and their
durations shall be specified.
– Where minimum and maximum values differ during programming of the device, this shall
be stated.
– All voltages are referenced to a specified reference terminal (Vss, ground, etc.).
– If maximum and/or minimum values are quoted, the manufacturer shall indicate whether
he refers to the absolute magnitude or to the algebraic value of the quantity.
– The ratings given shall cover the operation of the multi-function integrated circuit over the
specified range of operating temperatures. Where such ratings are temperature-dependent,
this dependence shall be indicated.
4.4.2 Electrical limiting values
Limiting values shall be specified as follows:

Parameters Min. Max.
Bias voltage(s) (where appropriate) +
Bias current(s) (where appropriate) +
Terminal voltage(s) (where appropriate) + +
Terminal current(s) (where appropriate) +
Input power +
Power dissipation +
It is necessary to select either bias voltage(s) or bias current(s), either terminal
voltage(s) or terminal current(s).

The detail specification may indicate those values within the table including footnotes a and b.
a, b
Parameters Symbols Min. Max. Unit

a
Where appropriate, in accordance with the type of circuit considered.
b
For power supply voltage range:
– limiting value(s) of the continuous voltage(s) at the supply terminal(s) with
respect to a special electrical reference point;
– where appropriate, limiting value between specified supply terminals;
– when more than one voltage supply is required, a statement shall be made
as to whether the sequence in which these supplies are applied is
significant: if so, the sequence shall be stated;
– when more than one supply is needed, it may be necessary to state the
combinations of ratings for these supply voltages and currents.

4.4.3 Temperatures
The detail specification may indicate the following temperature values within the table
including the note:
a) operating temperature (ambient or reference-point temperature);
b) storage temperature;
c) channel temperature;
d) lead temperature (for soldering).
Parameters (Note) Symbols Min. Max. Unit

NOTE Where appropriate, in accordance with the type of circuit considered.

4.5 Operating conditions (within the specified operating temperature range)
Operating conditions are not to be inspected, but may be used for quality assessment
purposes.
a) power supplies – positive and/or negative values;
b) initialization sequences (where appropriate);
If special initialization sequences are necessary, power supply sequencing and
initialization procedure shall be specified.
c) input voltage(s) (where appropriate);
d) output current(s) (where appropriate);

– 12 – IEC 60747-16-6:2019  IEC 2019
e) voltage and/or current of other terminal(s);
f) external elements (where appropriate);
g) operating temperature range.
4.6 Electrical characteristics
The characteristics shall apply over the full operating temperature range, unless otherwise
specified. Each characteristic shall be stated either
a) over the specified range of operating temperatures, or
b) at a temperature of 25 °C, and at maximum and minimum operating temperatures.
Parameters Min. Typ. Max.
Bias operating current + +
Conversion gain (G ) + + +
c
Output power (P ) + + +
o
Input return loss (L ) + +
ret(in)
Output return loss (L ) + +
ret(out)
Fundamental isolation (P /P ) + +
o 1
n-th order harmonic isolation (P /P ) + +
o nth
Phase noise (L (f)) + +
4.7 Mechanical and environmental ratings, characteristics and data
Any specific mechanical and environmental ratings applicable shall be stated (see also 5.10
and 5.11 of IEC 60747-1:2006).
4.8 Additional information
Where appropriate, the following information shall be given:
a) Equivalent input and output circuit: Detail information shall be given regarding the type of
input and output circuits, for example input/output impedances, DC block, open-drain.
b) Internal protection: A statement shall be given to indicate whether the integrated circuit
contains internal protection against high static voltages or electrical fields.
c) Capacitors at terminals: If capacitors for the input/output DC block are needed, these
capacitances shall be stated.
d) Thermal resistance.
e) Interconnections to other types of circuit: Where appropriate, details of the
interconnections to other circuits shall be given.
f) Effects of externally connected component(s): Curves or data indicating the effect of
externally connected component(s) that influence the characteristics may be given.
g) Recommendations for any associated device(s): For example, decoupling of power supply
to a high-frequency device shall be stated.
h) Handling precautions: Where appropriate, handling precautions specific to the circuit shall
be stated (see also IEC 61340-5-1 and IEC TR 61340-5-2).
i) Application data.
j) Other application information.
k) Date of issue of the data sheet.

5 Measuring methods
5.1 General
5.1.1 General precautions
The general precautions listed in 6.3, 6.4 and 6.6 of IEC 60747-1:2006 shall be applied. In
addition, special care shall be taken to use low-ripple DC power supplies and to decouple
adequately all supply terminals at the frequency of measurement. Although the level of the
signal can be specified in either power or voltage, in this document it is expressed in power
unless otherwise specified.
5.1.2 Characteristic impedance
The characteristic impedance of the measurement system, shown in the circuit in this
document, is 50 Ω. If it is not 50 Ω, it shall be specified.
5.1.3 Handling precautions
When handling electrostatic-sensitive devices, the handling precautions given in
IEC 61340-5-1 and IEC TR 61340-5-2 shall be observed.
5.1.4 Types
The devices in this document are both packaged and chip types, measured using suitable test
fixtures.
)
5.2 Output power (P
o
5.2.1 Purpose
To measure the output power under specified conditions.
5.2.2 Circuit diagram
The measuring circuit is shown in Figure 1.

Figure 1 – Circuit diagram for the measurement of the output power
5.2.3 Principle of measurement
In the circuit diagram shown in Figure 1, the input power P and output power P of the device
i o
being measured are derived from the following equations:

– 14 – IEC 60747-16-6:2019  IEC 2019
P = P + L (1)
i m1 1
P = P + L (2)
o m2 2
where
P is the value indicated by the power meter 1;
m1
P is the value indicated by the power meter 2;
m2
L is the difference of the circuit losses, from point A to point B, and from point A to
point C, at the input frequency f ;
i
L is the circuit loss from point D to point F at the output frequency f .
2 o
P , P , P and P are expressed in dBm. L and L are expressed in dB.
i o m1 m2 1 2
5.2.4 Circuit description and requirements
The circuit losses L and L shall be measured beforehand. The band pass filter is introduced
1 2
before the power meter 2 in order to eliminate frequency components except at f . The
o
purpose of the isolator is to enable the power level to the device being measured to be kept
constant irrespective of impedance mismatched at its input.
5.2.5 Precautions to be observed
The output signal and oscillation shall be checked by a spectrum analyser. Oscillation shall be
eliminated during these measurements. Harmonics or spurious responses of the signal
generator should be reduced to negligible. An adequate attenuator should be inserted at the
input of the spectrum analyser when the output power is high.
5.2.6 Measurement procedure
The frequency of the signal generator is set to the specified value.
The bias under specified conditions is applied.
The specified input power P is applied to the device being measured by monitoring the value
i
P measured by the power meter 1. P is derived from Equation (1).
m1 i
is measured by the power meter 2, and then P is derived from Equation (2).
The value P
m2 o
5.2.7 Specified conditions
The following conditions shall be specified.
– ambient or reference-point temperature;
– bias conditions;
– input frequency;
– input power;
– multiplying factor, N.
5.3 Conversion gain (G )
c
5.3.1 Purpose
To measure the conversion gain under specified conditions.

5.3.2 Circuit diagram
See the circuit diagram shown in Figure 1.
5.3.3 Principle of measurement
See the principle of measurement in 5.2.3.
The conversion gain G is derived from the following equations:
c
G = P – P (3)
c o i
where
P is the input power and P is the output power of the device being measured (see 5.2).
i o
P and P are expressed in dBm. G is expressed in dB.
i o c
5.3.4 Circuit description and requirements
See the circuit description and requirements in 5.2.4.
5.3.5 Precautions to be observed
See the precautions to be observed of 5.2.5.
5.3.6 Measurement procedure
The frequency of the signal generator is set to the specified value.
The bias under specified conditions is applied.
The specified input power P is applied to the device being measured by monitoring the value
i
P measured by the power meter 1. P is derived from Equation (1).
m1 i
The value P is measured by the power meter 2, and then G is derived from Equations (1),
m2 c
(2) and (3).
5.3.7 Specified conditions
See the circuit description and requirements in 5.2.7.
5.4 Input return loss (L )
ret(in)
5.4.1 Purpose
To measure the input return loss under specified conditions.
5.4.2 Circuit diagram
The measuring circuit is shown in Figure 2.

– 16 – IEC 60747-16-6:2019  IEC 2019

Figure 2 – Circuit diagram for the measurement of the input return loss
NOTE 1 A network analyser can be used to measure the input return loss.
NOTE 2 Directional couplers 2 and 3 are connected in opposite directions.
5.4.3 Principle of measurement
The input return loss is derived from the following equation:
L = P (|Γ|=1) – P (4)
ret(in) m2 m2
where
P (|Γ|=1) is the value indicated by the power meter 2, when the line at point A is either
m2
short-circuited or open-circuited;
P is the value indicated by the power meter 2, when the device being measured
m2
is inserted between point A and point B.
P (|Γ|=1) and P are expressed in dBm. L is expressed in dB.
m2 m2 ret(in)
5.4.4 Circuit description and requirements
The purpose of the isolator is to enable the power level to the device being measured to be
kept constant, irrespective of impedance mismatches at its input.
The directivity of the directional coupler shall be sufficient to avoid undue error in the value of
the return loss of the device being measured.
5.4.5 Precautions to be observed
See the precautions to be observed of 5.2.5.
5.4.6 Measurement procedure
The frequency and power of the signal generator are set to the specified input value.
Points A and B are disconnected.
The line at point A is either short-circuited or open-circuited.
The value P (|Γ|=1) is measured by the power meter 2.
m2
The device being measured is inserted between points A and B.

The bias under specified conditions is applied.
The value P is measured by the power meter 2.
m2
The input return loss L is derived from Equation (4).
ret(in)
5.4.7 Specified conditions
See the circuit description and requirements in 5.2.7.
5.5 Output return loss (L )
ret(out)
5.5.1 Purpose
To measure the output return loss under specified conditions.
5.5.2 Circuit diagram
The measuring circuit is shown in Figure 3.

Figure 3 – Circuit diagram for the measurement of the output return loss
5.5.3 Principle of measurement
The output return loss is derived from the following equation:
L = P(f ,|Γ|=1) – P(f ) (5)
ret(out) 2 2
where
f is the frequency of the signal generator 2;
P(f ,|Γ|=1) is the value indicated by the spectrum analyser in dBm at the frequency f , when
2 2
the RF switch is turned to Y (short-circuited);

– 18 – IEC 60747-16-6:2019  IEC 2019
P(f ) is the value indicated by the spectrum analyser in dBm at the frequency f , when
2 2
the RF switch is turned to A.
P(f ,|Γ|=1) and P(f ) are expressed in dBm. L is expressed in dB.
2 2 ret(out)
5.5.4 Circuit description and requirements
The purposes of the isolators are to enable the power level to the device being measured to
be kept constant irrespective of impedance mismatched at its input.
The directivity of the directional coupler is sufficient compared to the return loss of the device
being measured.
The signal generator 1 supplies specified power to the device being measured, and the signal
generator 2 is the signal source to measure the output return loss.
5.5.5 Precautions to be observed
See the precautions to be observed of 5.2.5.
The frequency of generator
...