Printed electronics - Part 503-1: Quality assessment - Test method of displacement current measurement for printed thin-film transistor

IEC 62899-503-1:2020(E) specifies a test method for displacement current measurement (DCM) for printed thin film transistors (TFTs) or organic thin film transistors (OTFTs).

General Information

Status
Published
Publication Date
26-May-2020
Technical Committee
Drafting Committee
Current Stage
PPUB - Publication issued
Start Date
27-May-2020
Completion Date
19-Jun-2020
Ref Project

Overview

IEC 62899-503-1:2020 defines a standardized test method for displacement current measurement (DCM) applied to printed thin-film transistors (printed TFTs) and organic thin-film transistors (OTFTs). The standard describes the measurement setup, environmental conditioning, measurement procedure and reporting requirements used to characterize carrier behavior, charge trapping and channel capacitance in printed electronics. It is part of the IEC 62899 series on printed electronics and was prepared by IEC TC 119.

Key topics and requirements

  • Scope: Specifies DCM for printed TFTs / OTFTs as a direct method to detect charge motion between source/channel/drain and gate.
  • Measurement principle: Apply a triangular gate voltage waveform and record source and drain currents (I_S and I_D) versus gate-to-source voltage (U_GS). Compute displacement current (I_dis), trapped charge (Q_trap and ΔQ_trap) and injected/ejected carrier charges.
  • Apparatus: Typical instruments include a function generator, amplifier, oscilloscope and low-noise power/battery, plus an electronic measurement kit to minimize external parasitic capacitance introduced by probes and cables.
  • Procedure highlights:
    • Mount specimen per figure and wiring schema in the standard.
    • Apply triangle wave with constant amplitude and frequency to the gate.
    • Measure I vs U for source and drain, calculate displacement current and integrate to obtain charges and channel capacitance.
    • Use Annex A for charge trapping and channel capacitance measurement details.
  • Environmental conditions: Conditioning and testing atmospheres per ISO 291 - generally (23 ± 2) °C and (50 ± 10) % RH; tighter class-1 conditions for plastic substrates (23 ± 1 °C, 50 ± 5 % RH).
  • Reporting: Include experimental conditions, data formats, measured symbols (e.g., Q_trap, C_channel), and test frequency dependence.

Applications and users

IEC 62899-503-1 is intended for:

  • R&D teams characterizing carrier injection, trapping and mobility in printed/organic semiconductors.
  • Quality assurance and process control for printed TFT manufacturing.
  • Materials and ink suppliers validating semiconductor or dielectric performance.
  • Test labs and conformity assessors evaluating device reliability and electrical properties.
  • Designers of flexible electronics, sensors, displays and other printed-electronics products who require quantitative channel-capacitance and trapping metrics.

Practical benefits include standardized, repeatable DCM measurements that help troubleshoot contact injection issues, evaluate dielectric/semiconductor interfaces, and compare device batches.

Related standards

  • IEC 62899 series (Printed electronics) - other parts cover component and quality assessment topics (see IEC webstore for the full list).
  • ISO 291 - referenced normative standard for conditioning and test atmospheres.

Keywords: IEC 62899-503-1, displacement current measurement, DCM, printed TFT, OTFT, charge trapping, channel capacitance, printed thin-film transistor, printed electronics.

Standard
IEC 62899-503-1:2020 - Printed electronics - Part 503-1: Quality assessment - Test method of displacement current measurement for printed thin-film transistor
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IEC 62899-503-1 ®
Edition 1.0 2020-05
INTERNATIONAL
STANDARD
colour
inside
Printed electronics –
Part 503-1: Quality assessment – Test method of displacement current
measurement for printed thin-film transistor
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IEC 62899-503-1 ®
Edition 1.0 2020-05
INTERNATIONAL
STANDARD
colour
inside
Printed electronics –
Part 503-1: Quality assessment – Test method of displacement current

measurement for printed thin-film transistor

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 29.045; 31.080.30 ISBN 978-2-8322-8378-3

– 2 – IEC 62899-503-1:2020 © IEC 2020
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Abbreviated terms . 7
5 Symbols and units . 7
6 Measuring method of DCM . 8
6.1 Guidelines on measurements of printed TFT channel properties . 8
6.2 Procedure for DCM . 8
6.2.1 Measuring apparatus . 8
6.2.2 Measuring procedure . 8
7 Report . 10
7.1 Experimental conditions . 10
7.2 Appropriate data format . 10
Annex A (informative) Experimental results . 12
A.1 Charge trapping measurement method . 12
A.2 Channel capacitance measurement method . 13
Bibliography . 15

Figure 1 – Example of structure (left) and schema (right) of a measuring device . 8
Figure 2 – Plots of the printed TFT's U , I , I at U = −20V with respect to time . 9
GS s D DS
Figure 3 – Frequency dependence of DCM . 10
Figure A.1 – Plot of DCM at U = 0 V . 13
DS
Figure A.2 – Division of regions according to carrier injection . 14

Table 1 – List of symbols . 7
Table 2 – Environmental factors . 11
Table 3 – Measured properties of the TFT . 11
Table A.1 – Obtained trap charge from four cycles (accumulated) . 13

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED ELECTRONICS –
Part 503-1: Quality assessment –
Test method of displacement current
measurement for printed thin-film transistor

FOREWORD
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International Standard IEC 62899-503-1 has been prepared by IEC technical committee
119: Printed Electronics.
The text of this International Standard is based on the following documents:
FDIS Report on voting
119/303/FDIS 119/307/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – IEC 62899-503-1:2020 © IEC 2020
A list of all parts in the IEC 62899 series, published under the general title Printed electronics,
can be found on the IEC website.
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INTRODUCTION
There has been a need for a method to measure and evaluate performance and reliability that
is appropriate for printed thin-film transistors (TFTs). In the case of printed TFTs, there is
much larger parasitic capacitance than dielectric capacitance in the channel. Accordingly,
there has been a need for a method to measure and evaluate the properties for printed TFTs.
Carrier behavior is one such property, and mobility and threshold voltage (V ) for TFTs are
th
other properties. In the case of inorganic TFTs, for example complementary metal-oxide
semiconductor (CMOS) TFTs, carriers are induced by the strong inversion at the
semiconductor/dielectric interface. But in the case of organic or printed TFTs, carrier
generation takes place in the accumulation mode. The total number of carriers in the organic
semiconductor layer can often be insufficient to enrich the carrier concentration at the channel.
There exists a carrier injection. The carrier injection occurs at the interface of the organic
semiconductors' source/drain electrodes. There are three methods to investigate the carrier
injection property, that is, Kelvin probe microscopy, four-terminal measurement, and
displacement current measurement (DCM). Both Kelvin probe microscopy and four-terminal
measurement are indirect methods, but DCM is a direct method to detect charge motion in
semiconductors, molecular thin films, and nanoparticles. In this document, the DCM-based
channel charge trapping and channel capacitance measurement method is proposed as a
measuring method for the carrier properties of organic or printed TFTs.

– 6 – IEC 62899-503-1:2020 © IEC 2020
PRINTED ELECTRONICS –
Part 503-1: Quality assessment –
Test method of displacement current
measurement for printed thin-film transistor

1 Scope
This part of IEC 62899 specifies a test method for displacement current measurement (DCM)
for printed thin-film transistors (TFTs) or organic thin-film transistors (OTFTs).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced docume
...

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IEC 62899-503-1:2020 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Printed electronics - Part 503-1: Quality assessment - Test method of displacement current measurement for printed thin-film transistor". This standard covers: IEC 62899-503-1:2020(E) specifies a test method for displacement current measurement (DCM) for printed thin film transistors (TFTs) or organic thin film transistors (OTFTs).

IEC 62899-503-1:2020(E) specifies a test method for displacement current measurement (DCM) for printed thin film transistors (TFTs) or organic thin film transistors (OTFTs).

IEC 62899-503-1:2020 is classified under the following ICS (International Classification for Standards) categories: 01.040.29 - Electrical engineering (Vocabularies); 29.045 - Semiconducting materials; 29.240 - Power transmission and distribution networks; 31.080.30 - Transistors. The ICS classification helps identify the subject area and facilitates finding related standards.

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