IEC 61191-2:2013

IEC 61191-2 ®
Edition 2.0 2013-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed board assemblies –
Part 2: Sectional specification – Requirements for surface mount soldered
assemblies
Ensembles de cartes imprimées –
Partie 2: Spécification intermédiaire – Exigences relatives à l’assemblage par
brasage pour montage en surface

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IEC 61191-2 ®
Edition 2.0 2013-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed board assemblies –
Part 2: Sectional specification – Requirements for surface mount soldered

assemblies
Ensembles de cartes imprimées –

Partie 2: Spécification intermédiaire – Exigences relatives à l’assemblage par

brasage pour montage en surface

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX U
ICS 31.190; 31.240 ISBN 978-2-83220-856-4

– 2 – 61191-2 © IEC:2013
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Conventions . 6
4 General requirements . 6
5 Classification . 6
6 Surface mounting of components . 7
6.1 General . 7
6.2 Alignment requirements . 7
6.3 Process control . 7
6.4 Surface mounted component requirements . 7
6.5 Flatpack lead forming . 7
6.5.1 General . 7
6.5.2 Surface mounted device lead bends . 8
6.5.3 Surface mounted device lead deformation . 8
6.5.4 Flattened leads . 8
6.5.5 Dual-in-line packages (DIPs) . 8
6.5.6 Parts not configured for surface mounting . 9
6.6 Small devices with two terminations . 9
6.6.1 General . 9
6.6.2 Stack mounting . 9
6.6.3 Devices with external deposited elements . 9
6.7 Lead component body positioning . 9
6.7.1 General . 9
6.7.2 Axial-leaded components . 9
6.7.3 Other components . 9
6.8 Parts configured for butt lead mounting . 9
6.9 Non-conductive adhesive coverage limits . 10
7 Acceptance requirements . 10
7.1 General . 10
7.2 Control and corrective actions . 10
7.3 Surface soldering of leads and terminations . 10
7.3.1 General . 10
7.3.2 Solder fillet height and heel fillets . 10
7.3.3 Flat ribbon L and gull-wing leads . 13
7.3.4 Round or flattened (coined) leads . 13
7.3.5 J leads. 15
7.3.6 Rectangular or square end components . 16
7.3.7 Cylindrical end cap terminations . 17
7.3.8 Bottom only terminations . 18
7.3.9 Leadless chip carriers with castellated terminations . 19
7.3.10 Butt joints . 20
7.3.11 Inward L-shaped ribbon leads . 21
7.3.12 Flat lug leads . 22
7.4 General post-soldering requirements applicable to all surface-mounted
assemblies . 23

61191-2 © IEC:2013 – 3 –
7.4.1 Dewetting . 23
7.4.2 Leaching. 23
7.4.3 Pits, voids, blowholes, and cavities . 23
7.4.4 Solder wicking . 23
7.4.5 Solder webs and skins . 23
7.4.6 Bridging . 23
7.4.7 Degradation of marking . 23
7.4.8 Solder spikes . 23
7.4.9 Disturbed joint . 23
7.4.10 Component damage . 24
7.4.11 Open circuit, non-wetting . 24
7.4.12 Component tilting . 24
7.4.13 Non-conducting adhesive encroachment . 24
7.4.14 Open circuit, no solder available (skip) . 24
7.4.15 Component on edge . 24
8 Rework and repair . 24
Annex A (normative) Placement requirements for surface mounted devices . 26

Figure 1 – Lead formation for surface mounted device . 8
Figure 2 – Fillet height . 12
Figure 3 – Flat ribbon L and gull-wing leads . 13
Figure 4 – Round or flattened (coined) lead joint . 14
Figure 5 – J lead joint . 15
Figure 6 – Rectangular or square end components . 16
Figure 7 – Cylindrical end-cap terminations . 17
Figure 8 – Bottom only terminations . 18
Figure 9 – Leadless chip carriers with castellated terminations . 19
Figure 10 – Butt joints . 20
Figure 11 – Inward L-shaped ribbon leads . 21
Figure 12 – Flat lug leads . 22

Table 1 – Surface mounted solder joint defects . 25

– 4 – 61191-2 © IEC:2013
INTERNATIONAL ELECTROTECHNICAL COMMISSION
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