IEC 61191-2:2017/COR1:2019
(Corrigendum)Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
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Standards Content (Sample)
IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
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IEC 61191-2
Edition 3.0 2017-05
PRINTED BOARD ASSEMBLIES –
Part 2: Sectional specification –
Requirements for surface mount s
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- the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
- the term "assembly drawing" has been changed to "assembly documentation" throughout;
- references to IEC standards have been corrected;
- Clause 9 was completely rewritten;
- Annex B was removed because there are already procedures for circuit board assemblies.
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IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
b) some of the terminology used in the document has been updated;
c) references to IEC standards have been corrected;
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The contents of the corrigendum of September 2019 have been included in this copy.
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