IEC TS 62686-1:2012

IEC/TS 62686-1
®

Edition 1.0 2012-09
TECHNICAL
SPECIFICATION



Process management for avionics – Electronic components for aerospace,
defence and high performance (ADHP) applications –
Part 1: General requirements for high reliability integrated circuits and discrete
semiconductors

IEC/TS 62686-1:2012(E)

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IEC/TS 62686-1

®

Edition 1.0 2012-09




TECHNICAL



SPECIFICATION



















Process management for avionics – Electronic components for aerospace,

defence and high performance (ADHP) applications –

Part 1: General requirements for high reliability integrated circuits and discrete


semiconductors
























INTERNATIONAL

ELECTROTECHNICAL

COMMISSION

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ICS 03.100.50; 31.020; 49.060 ISBN 978-2-83220-345-3



  Warning! Make sure that you obtained this publication from an authorized distributor.


® Registered trademark of the International Electrotechnical Commission

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– 2 – TS 62686-1 © IEC:2012(E)
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviations . 12
3.1 Terms and definitions . 12
3.2 Abbreviations . 14
4 Technical requirements . 16
4.1 General . 16
4.2 Procedures . 16
4.2.1 General . 16
4.2.2 Product discontinuance . 16
4.2.3 ESD protection during manufacture . 16
4.2.4 Specification control . 17
4.2.5 Traceability . 17
4.3 Product or process change notification (PCN) . 17
4.3.1 General . 17
4.3.2 Notification . 17
4.3.3 Notification details . 17
4.3.4 Notifiable changes . 18
4.4 Shipment controls . 18
4.4.1 General . 18
4.4.2 Shipping container and date code marking . 18
4.4.3 Date code remarking . 18
4.4.4 Inner container formation . 18
4.4.5 Date code age on delivery . 19
4.4.6 ESD marking . 19
4.4.7 MSL . 19
4.4.8 Lead-free marking . 19
4.4.9 Labels . 19
4.5 Electrical . 20
4.5.1 General . 20
4.5.2 Electrical test. 20
4.5.3 Electrical parameter assessment . 20
4.5.4 SDRAM memories . 20
4.5.5 Logic families . 21
4.5.6 Power MOSFETs . 21
4.5.7 Silicon rectifier diodes . 21
4.6 Mechanical . 21
4.6.1 General . 21
4.6.2 Device or shipping container marking . 21
4.6.3 Small packages . 21
4.6.4 Moisture sensitivity . 21
4.6.5 Robustness of hermetic seals . 21
4.6.6 Termination finishes . 22
4.7 Audit capability . 22

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TS 62686-1 © IEC:2012(E) – 3 –
4.7.1 General . 22
4.7.2 Internal quality audits . 22
4.7.3 Subcontract manufacturing . 22
4.8 Quality assurance . 23
4.8.1 General . 23
4.8.2 Quality system . 23
4.8.3 Sampling plans . 23
4.8.4 Failure analysis support . 23
4.8.5 Outgoing quality . 23
4.9 Supplier performance monitoring by the user . 24
4.9.1 General . 24
4.9.2 Lot acceptance . 24
4.9.3 Suspension of deliveries . 25
4.9.4 Loss of approval . 25
4.9.5 AQL figures . 25
4.9.6 100 % screening . 25
4.9.7 Termination determination . 25
4.10 Qualification . 25
4.10.1 General . 25
4.10.2 Methodology . 26
4.10.3 Test samples . 27
4.10.4 Qualification categories . 28
4.10.5 Maintenance of qualification standard . 28
4.10.6 In-process test results . 28
4.10.7 Product monitor results . 32
4.10.8 References . 32
4.10.9 Qualification report . 32
4.10.10 Archiving . 32
4.10.11 Qualification by similarity . 32
4.10.12 Similarity assessment . 32
4.11 Reliability . 33
4.11.1 General . 33
4.11.2 Operating reliability . 33
4.11.3 Failure criteria . 33
4.11.4 Corrective action . 34
4.11.5 Warranty . 34
4.11.6 Suspension of certification . 34
4.11.7 Single event effects (SEE) . 34
4.12 Product monitor . 34
4.12.1 General . 34
4.12.2 Monitor programme . 34
4.12.3 Problem notification . 35
4.12.4 Data reporting . 35
4.12.5 Samples . 35
4.12.6 Production maturity factors . 35
4.12.7 Device dissipation . 35
4.12.8 Corrective action . 36
4.12.9 Product monitor results . 36
4.12.10 Accumulated test data . 36

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– 4 – TS 62686-1 © IEC:2012(E)
4.13 Environmental, health and safety (EHS) . 36
4.13.1 General . 36
4.13.2 EHS compliance . 37
4.13.3 Device handling . 37
4.13.4 Device materials . 37
4.14 Shipping container . 37
4.14.1 General . 37
4.14.2 ESD requirements . 37
4.14.3 Magazine reuse . 38
4.14.4 Tubes . 38
4.14.5 Trays . 39
4.15 Compliance with internal standards . 39
Annex A (informative) Test code (TC) information . 40
Annex B (informative) Cross-reference to STACK specification S/0001 revision 14 . 54
Bibliography . 61

Table 1 – Label requirements . 20
Table 2 – Internal quality audit requirements . 22
Table 3 – Outgoing quality . 24
Table 4 – Incoming test. 24
Table 5 – Technology/family qualification and device qualification . 29
Table 6 – Operating life failure rates . 34
Table 7 – Production maturity factors . 35
Table 8 – Product monitor tests . 36
Table A.1 – Conditions of the DC over voltage stress method of JP001.01 or
IEC 62416 test . 42
Table A.2 – Examples of temperature acceleration factors . 44
Table A.3 – Test conditions . 45
Table A.4 – Relationship between write/erase cycle and data retention. 47

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TS 62686-1 © IEC:2012(E) – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

PROCESS MANAGEMENT FOR AVIONICS –
ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE
AND HIGH PERFORMANCE (ADHP) APPLICATIONS –

Part 1: General requirements for high reliability
integrated circuits and discrete semiconductors


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. However, a
technical committee may propose the publication of a Technical Specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC/TS 62686-1 which is a Technical Specification, has been prepared by IEC technical
committee 107: Process management for avionics.

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– 6 – TS 62686-1 © IEC:2012(E)
This Technical Specification cancels and replaces IEC/PAS 62686-1. It includes the following
significant technical changes with respect to IEC/PAS 62686-1:
a) adoption and modification of STACK Specification S/0001 revision 14, General
requirements for integrated circuits and discrete semiconductors;
b) addition of alternative IEC semiconductor test methods;
c) update of JEDEC semiconductor test methods;
d) update of Annex A additional JEDEC and IEC test information;
e) certification of the OCM according to ISO 9001;
f) addition of lead-free termination finish requirements;
g) addition of request for OCMs to make the data for device lifetime calculations available;
h) update of the IEC and JEDEC test methods for the following semiconductor wear-out
mechanisms: TDDB, electro-migration, HCL and NBTI;
i) addition of request for OCMs to provide single event effects (SEE) data;
j) update of moisture sensitivity level (MSL) marking requirements.

The text of this Technical Specification is based on the following documents:

Enquiry draft Report on voting
107/167/DTS 107/184/RVC

Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62686 series, published under the general title Process
management for avionics – Electronic components for aerospace, defence and high
performance (ADHP) applications, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

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TS 62686-1 © IEC:2012(E) – 7 –
INTRODUCTION
This part of IEC 62686 includes all the requirements of STACK Specification S/0001 revision
14 and contains revisions for alternative IEC qualification test methods and additional test
information.
This Technical Specification complements IEC/TS 62564-1 which is used for ADHP
applications when additional manufacturer’s data is required beyond the publicly available
manufacturer published datasheets (e.g. when additional thermal performance data is
required for thermally challenging applications or when additional verification data are needed
for example to comply with the requirements of RTCA DO-254/EUROCAE ED-80 for complex
components for flight critical applications, etc.).
This Technical Specification can also be used to comply with the typical qualification
requirements of IEC/TS 62564-1. Further guidance is given in IEC/TS 62239-1.
NOTE With the adoption of the STACK Specification S/0001 revision 14 it will be possible for all existing STACK
certified manufacturers to be audited by IECQ under the new STACK-IECQ joint venture.

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– 8 – TS 62686-1 © IEC:2012(E)
PROCESS MANAGEMENT FOR AVIONICS –
ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE
AND HIGH PERFORMANCE (ADHP) APPLICATIONS –

Part 1: General requirements for high reliability
integrated circuits and discrete semiconductors



1 Scope
This part of IEC 62686 defines the minimum requirements for general purpose "off the shelf"
COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP
(Aerospace, Defence and High Performance) applications.
This Technical Specification applies to all components that can be operated in ADHP
applications within the manufacturers’ publicly available datasheet limits in conjunction with
IEC/TS 62239-1. It may be used by other high performance and high reliability industries, at
their discretion.
ADHP application requirements may not necessarily be fulfilled by this specification alone.
ADHP OEMs (original equipment manufacturers) may need to consider redesigning their
products or conducting further testing to verify suitability in ADHP applications using their
IEC/TS 62239-1 ECMP procedures. Alternatively a component in accordance with
IEC/TS 62564-1 may be more suitable.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60749-3, Semiconductor devices – Mechanical and climatic test methods – Part 3:
External visual inspection
IEC 60749-4, Semiconductor devices – Mechanical and climatic test methods – Part 4: Damp
heat, steady state, highly accelerated stress test (HAST)
IEC 60749-5, Semiconductor devices – Mechanical and climatic test methods – Part 5:
Steady-state temperature humidity bias life test
IEC 60749-6, Semiconductor devices – Mechanical and climatic test methods – Part 6:
Storage at high temperature
IEC 60749-7, Semiconductor devices – Mechanical and climatic test methods – Part 7:
Internal moisture content measurement and the analysis of other residual gases
IEC 60749-8, Semiconductor devices – Mechanical and climatic test methods – Part 8:
Sealing
IEC 60749-9, Semiconductor devices – Mechanical and climatic test methods – Part 9:
Permanence of marking

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TS 62686-1 © IEC:2012(E) – 9 –
IEC 60749-14, Semiconductor devices – Mechanical and climatic test methods – Part 14:
Robustness of terminations (lead integrity)
IEC 60749-15, Semiconductor devices – Mechanical and climatic test methods – Part 15:
Resistance to soldering temperature for through hole mounted devices
IEC 60749-17, Semiconductors devices – Mechanical and climatic tests – Part 17: Neutron
irradiation
IEC 60749-19, Semiconductor devices – Mechanical and climatic test methods – Part 19: Die
shear strength
IEC 60749-20, Semiconductor devices – Mechanical and climatic test methods – Part 20:
Resistance of plastic encapsulated SMDs to the combined effects of moisture and soldering
heat
IEC 60749-20-1, Semiconductor devices – Mechanical and climatic test methods – Part 20-1:
Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined
effect of moisture and soldering heat
IEC 60749-21, Semiconductor devices – Mechanical and climatic test methods – Part 21:
Solderability
IEC 60749-22, Semiconductor devices – Mechanical and climatic test methods – Part 22:
Bond strength
IEC 60749-23, Semiconductor devices – Mechanical and climatic test methods – Part 23: High
temperature operating life
IEC 60749-25, Semiconductor devices – Mechanical and climatic test methods – Part 25:
Temperature cycling
IEC 60749-26, Semiconductor devices – Mechanical and climatic test methods – Part 26:
Electrostatic discharge (ESD) sensitivity testing – Human body model (HBM)
IEC 60749-29, Semiconductor devices – Mechanical and climatic test methods – Part 29:
Latch-up test
IEC 60749-32, Semic
...