IEC 62321-2:2013

IEC 62321-2 ®
Edition 1.0 2013-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
HORIZONTAL STANDARD
NORME HORIZONTALE
Determination of certain substances in electrotechnical products –
Part 2: Disassembly, disjointment and mechanical sample preparation

Détermination de certaines substances dans les produits électrotechniques –
Partie 2: Démontage, désassemblage et préparation mécanique de l'échantillon

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IEC 62321-2 ®
Edition 1.0 2013-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
HORIZONTAL STANDARD
NORME HORIZONTALE
Determination of certain substances in electrotechnical products –

Part 2: Disassembly, disjointment and mechanical sample preparation

Détermination de certaines substances dans les produits électrotechniques –

Partie 2: Démontage, désassemblage et préparation mécanique de l'échantillon

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 13.020; 43.040.10 ISBN 978-2-83220-837-3

– 2 – 62321-2 © IEC:2013
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviations . 8
3.1 Terms and definitions . 8
3.2 Abbreviations . 8
4 Introduction to sampling . 9
4.1 Introductory remark . 9
4.2 Requirements and concerns for substances of concern . 9
4.3 Complexity of electrotechnical products and related challenges. 9
4.4 Strategies for sampling . 10
5 Sampling . 13
5.1 Introductory remark . 13
5.2 Complete product . 14
5.3 Partial disassembly . 14
5.4 Complete disassembly . 14
5.5 Partial disjointment . 14
5.6 Complete disjointment . 15
5.7 Considerations of sampling and disjointment . 15
5.7.1 Introductory remark . 15
5.7.2 Sample size required . 15
5.7.3 Sample size versus detection limit . 17
5.7.4 Composite testing of disjointable samples . 17
5.7.5 Non-uniform “homogeneous materials” . 18
5.7.6 Determination of sampling position of homogeneous materials . 19
6 Conclusions and recommendations for sampling . 19
7 Mechanical sample preparation . 20
7.1 Overview . 20
7.1.1 Field of application . 20
7.1.2 Quality assurance . 20
7.2 Apparatus, equipment and materials. 21
7.3 Procedure . 21
7.3.1 Manual cutting . 21
7.3.2 Coarse grinding/milling . 22
7.3.3 Homogenizing. 22
7.3.4 Fine grinding/milling . 22
7.3.5 Very fine grinding of polymers and organic materials . 22
Annex A (informative) Examples of procedures for sampling and disjointment . 23
Annex B (informative) Probability of the presence of certain substances . 32
Annex C (informative) Composite testing and sampling . 35
Annex D (informative) Tools used in sampling. 38
Annex E (informative) Examples of mobile phone disassembly and component
disjointment . 39
Bibliography . 50

62321-2 © IEC:2013 – 3 –
Figure 1 – Generic iterative procedure for sampling . 11
Figure 2 – Cross-section of a 900 µm wide lead oxide-based resistor (SMD) . 19
Figure A.1 – Methodology for sampling and disjointment . 24
Figure A.2 – Sampling of DVD player . 25
Figure A.3 – Sampling of CRT . 26
Figure A.4 – Sampling of LCD TV . 27
Figure A.5 – Sampling of PDA/phone . 28
Figure A.6 – Sampling of desk fan . 29
Figure A.7 – Sampling of components – Thick film resistor . 30
Figure A.8 – Sampling of components – SMD potentiometer . 31
Figure D.1 – Hot gas gun for removing the electronic components . 38
Figure D.2 – Vacuum pin to remove the target electronic devices . 38
Figure E.1 – Mobile phone type A with battery charger and camera lens cap . 39
Figure E.2 – Mobile phone type A with battery and back cover removed . 40
Figure E.3 – Partial disassembly of a mobile phone (type B) into its major components . 41
Figure E.4 – Complete disassembly of the key pad . 42
Figure E.5 – Complete disassembly of the bottom housing . 42
Figure E.6 – Complete disassembly of the other housing/frame . 43
Figure E.7 – Components of the TFT display of the mobile phoneafter partial
disjointment . 43
Figure E.8 – Components of the main PWB of the mobile phone after partial
disjointment . 44
Figure E.9 – Disjointment of lead frame component . 46
Figure E.10 – BGA package prior to disjointment . 47
Figure E.11 – BGA package disjointed by the hand removal procedure . 47
Figure E.12 – Solder ball material collected from BGA using a hand removal procedure . 48
Figure E.13 – BGA solder ball removal using the ball shear procedure . 48

Table 1 – Minimum number of lead frame samples required for analytical testing . 16
Table 2 – Levels of a certain substance in a composite sample . 18
Table B.1 – Probability of the presence of certain substances in materials and

components used in electrotechnical products (1 of 3) . 32
Table C.1 – Calculated maximum concentration for a composite sample based on
detection limit .
...